A new type of high-efficiency low-emission dust and mist removal washing device for semiconductor process

Abstract

A novel high efficiency low emission dust and mist removal washing device for semiconductor process, including washing cylinder body, primary dust and mist removal cylinder body and secondary mist removal cylinder body connected in sequence from bottom to top, the lower part of washing cylinder body is equipped with circulating spray layer, the upper part is equipped with double fluid atomization spray layer, the upper part of primary dust and mist removal cylinder body is equipped with automatic flushing spray layer, the novel high efficiency low emission dust and mist removal washing device for semiconductor process, through the high efficiency collision of circulating spray, double fluid atomization and turbulent mixer, through the combination of Brown diffusion and direct interception, the removal effect of dust is PM10>99%, PM2.5>85%, PM1>40%, and the differential pressure gauge is used for monitoring, when the pressure loss is higher than the set upper limit, the automatic flushing spray layer is automatically opened to flush until the pressure loss is lower than the set lower limit, the maintenance cycle can be effectively prolonged, the corrosion resistant material is used as tower body, and the service life of the whole washing device is also prolonged.

Description

Technical Field

[0001] This utility model relates to the field of waste gas treatment devices for the semiconductor industry, and in particular to a novel high-efficiency, low-emission dust removal and demisting washing device for semiconductor manufacturing processes. Background Technology

[0002] In the production processes of the semiconductor industry (semiconductors, panels, solar energy, LEDs), fluorides, chlorides, hydrides, silicides and general harmful gases are generated. These special gases are generally treated by using plasma torches, combustion guns, electric heating rods to provide heat sources for pyrolysis or combustion. Some waste gases can also be removed by hydrolysis reaction with water.

[0003] After these special gases are pyrolyzed, combusted, or hydrolyzed, dust and acid mist are generated, requiring the use of scrubbing equipment for acid removal, dust removal, and demisting. During the scrubbing process, poor dust and mist removal efficiency can lead to severe dust and acid entrainment at the scrubbing tower outlet, causing blockages and corrosion of acid discharge pipes. This problem is particularly pronounced when treating waste gases containing large amounts of silicides and fluorides, resulting in shorter maintenance cycles for acid discharge pipes and the need for replacement due to corrosion and perforation, thus impacting daily production.

[0004] To address the aforementioned issues, this application provides a novel high-efficiency, low-emission dust removal and demisting cleaning device for semiconductor manufacturing processes. Utility Model Content

[0005] The technical problem to be solved by this utility model is: in order to solve the problems of poor dust removal and demisting effect of existing washing devices and easy corrosion and short service life of acid discharge pipes, this utility model provides a new type of high-efficiency, low-emission dust removal and demisting washing device for semiconductor manufacturing processes.

[0006] The technical solution adopted by this utility model to solve its technical problem is: a novel high-efficiency low-emission dust removal and demisting washing device for semiconductor manufacturing process, comprising a washing cylinder, a primary dust removal and demisting cylinder and a secondary demisting cylinder connected sequentially from bottom to top; a circulating spray layer is provided below the washing cylinder and a dual-fluid atomizing spray layer is provided above the washing cylinder; an automatic rinsing spray layer is provided above the primary dust removal and demisting cylinder.

[0007] Furthermore, an air inlet is provided at the bottom of the washing drum, and a first air distribution plate is provided in the middle of the washing drum. Below the first air distribution plate is a circulating spray layer, and above the first air distribution plate is a dual-fluid atomizing spray layer. The air distribution plate can make the exhaust gas enter the dual-fluid atomizing spray layer evenly, so that the exhaust gas can fully contact it to capture dust.

[0008] Furthermore, the circulating spray layer includes a first spray pipe and a first nozzle; the first nozzle is located on the side of the first spray pipe away from the washing cylinder; the first nozzle is a large-diameter solid cone nozzle; through the circulating spray layer, circulating water is sprayed out from the first nozzle to fully contact the exhaust gas for preliminary washing and deacidification, removing larger particles.

[0009] Furthermore, the dual-fluid atomizing spray layer includes a second spray pipe and a second nozzle; the second nozzle is evenly distributed at the end of the second spray pipe away from the washing drum; the second nozzle adopts a dual-fluid atomizing solid cone nozzle; the water source for the dual-fluid atomizing spray layer is industrial water, and the air source is compressed air. The industrial water replenishes the water consumption of the system. Flow meters and control valves are installed in both the industrial water and compressed air pipelines to automatically adjust the gas-liquid ratio; the industrial water is atomized into fine droplets of 50-300μm by compressed air. These fine droplets come into full contact with the exhaust gas, capturing the dust in it. The dust-laden droplets collide and aggregate into larger droplets inside the washing drum and fall into the water tank below the washing drum.

[0010] Furthermore, a turbulent mixer is provided below the primary dust removal and demisting cylinder, and the automatic flushing spray layer is located above the turbulent mixer. The automatic flushing spray layer includes a third spray pipe and a third nozzle. After the dust-laden droplets and exhaust gas enter the primary demisting cylinder from the washing cylinder, the dust-laden droplets enter the turbulent mixer, where they undergo efficient collisions through turbulent vortices, agglomerating and growing the droplets into large liquids of 300-500 μm, thereby improving the inertial separation efficiency.

[0011] Furthermore, the third nozzle is located at the end of the third spray pipe away from the primary dust and mist removal cylinder, and the third nozzle is a solid cone nozzle; the third nozzle of the automatic rinsing spray layer automatically switches on and off according to the pressure difference between the primary dust and mist removal cylinder and the secondary mist removal cylinder to prevent dust from accumulating on the turbulent mixer and the secondary mist removal cylinder; the water source used for the automatic rinsing spray layer is industrial water, and the industrial water pipeline is equipped with flow meters and electric valves, which automatically switch on and off to rinse, replenish system water consumption, and monitor water consumption.

[0012] Furthermore, a second gas equalization plate and a third gas equalization plate are sequentially arranged below the secondary demister body, and a wire mesh demister and a Pall ring are arranged between the second and third gas equalization plates; the exhaust gas is demisted by the wire mesh demister and the Pall ring to achieve the standard of clean emission.

[0013] Furthermore, a first differential pressure detection port is provided on the upper side of the washing drum, and a second differential pressure detection port is provided in the middle of the secondary demisting drum.

[0014] Furthermore, the washing drum, the primary dust and mist removal drum, and the secondary mist removal drum are connected by ISO clamp flanges; the washing drum, the primary dust and mist removal drum, and the secondary mist removal drum are made of stainless steel with a Teflon coating or made of C276 material.

[0015] The beneficial effects of this utility model are:

[0016] The novel high-efficiency, low-emission dust removal and demisting washing device for semiconductor manufacturing processes described in this utility model achieves dust removal efficiency of PM10 > 99%, PM2.5 > 85%, and PM1 > 40% through efficient collision of circulating spray, dual-fluid atomization, and turbulent mixer, combined with Brownian diffusion and direct interception. It is equipped with a differential pressure gauge for monitoring; when the pressure loss exceeds the set upper limit, the automatic flushing spray layer automatically opens until the pressure loss falls below the set lower limit, effectively extending the maintenance cycle. The use of corrosion-resistant materials for the tower body also extends the lifespan of the entire washing device. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Figure 1 This is a schematic diagram of the novel high-efficiency, low-emission dust removal and demisting washing device for semiconductor manufacturing processes according to a preferred embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the structure of the washing drum according to a preferred embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of the structure of the primary dust removal and demisting cylinder according to a preferred embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the structure of the secondary demister cylinder according to a preferred embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the external appearance of the washing drum body according to a preferred embodiment of the present invention;

[0023] In the diagram, 1 is the washing cylinder, 2 is the primary dust and mist removal cylinder, 3 is the secondary mist removal cylinder, 4 is the circulating spray layer, 41 is the first spray pipe, 42 is the first nozzle, 5 is the dual-fluid atomizing spray layer, 51 is the second spray pipe, 52 is the second nozzle, 6 is the automatic rinsing spray layer, 61 is the third spray pipe, 62 is the third nozzle, 7 is the air inlet, 8 is the first air distribution plate, 9 is the turbulent mixer, 10 is the second air distribution plate, 11 is the third air distribution plate, 12 is the first differential pressure detection port, and 13 is the second differential pressure detection port. Detailed Implementation

[0024] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0025] In the description of this utility model, it should be understood that the terms "upper", "lower", "horizontal", "top", "inner", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] like Figure 1 As shown, a novel high-efficiency, low-emission dust removal and demisting washing device for semiconductor manufacturing processes includes a washing cylinder 1, a primary dust removal and demisting cylinder 2, and a secondary demisting cylinder 3 connected sequentially from bottom to top; a circulating spray layer 4 is provided below the washing cylinder 1, and a dual-fluid atomizing spray layer 5 is provided above it; an automatic rinsing spray layer 6 is provided above the primary dust removal and demisting cylinder 2.

[0028] like Figure 2 As shown, an air inlet 7 is provided at the bottom of the washing drum 1, and a first air distribution plate 8 is provided in the middle of the washing drum 1. Below the first air distribution plate 8 is a circulating spray layer 4, and above the first air distribution plate 8 is a dual-fluid atomizing spray layer 5. The air distribution plate can make the exhaust gas enter the dual-fluid atomizing spray layer 5 evenly, so that the exhaust gas can fully contact it to capture dust.

[0029] The circulating spray layer 4 includes a first spray pipe 41 and a first nozzle 42; the first nozzle 42 is located on the side of the first spray pipe 41 away from the washing cylinder 1; the first nozzle 42 is a large-diameter solid cone nozzle; through the circulating spray layer 4, circulating water is sprayed out from the first nozzle 42 and comes into full contact with the exhaust gas for preliminary washing and deacidification, removing larger particles. The dual-fluid atomizing spray layer 5 includes a second spray pipe 51 and a second nozzle 52; the second nozzle 52 is evenly distributed at the end of the second spray pipe 51 away from the washing drum 1; the second nozzle 52 adopts a dual-fluid atomizing solid cone nozzle; the water source of the dual-fluid atomizing spray layer 5 is industrial water, and the air source is compressed air. The industrial water replenishment system consumes water. The industrial water and compressed air pipelines are equipped with flow meters and control valves to automatically adjust the gas-liquid ratio; the industrial water is atomized into fine droplets of 50-300μm by compressed air. These fine droplets come into full contact with the exhaust gas and capture the dust in it. The dust-laden droplets collide and aggregate into large droplets in the washing drum 1 and fall into the water tank below the washing drum 1.

[0030] like Figure 3 As shown, a turbulent mixer 9 is provided below the primary dust removal and demisting cylinder 2, and an automatic flushing spray layer 6 is arranged above the turbulent mixer 9. The automatic flushing spray layer 6 includes a third spray pipe 61 and a third nozzle 62. After the dust-laden droplets and exhaust gas enter the primary demisting cylinder from the washing cylinder 1, the dust-laden droplets enter the turbulent mixer 9, where they undergo efficient collisions through turbulent vortices, agglomerating and growing the droplets into large liquids of 300-500 μm, thereby improving the inertial separation efficiency. The third nozzle 62 is located at the end of the third spray pipe 61 away from the primary dust removal and demisting cylinder 2. The third nozzle 62 is a solid cone nozzle. The third nozzle 62 of the automatic rinsing spray layer 6 automatically switches on and off according to the pressure difference between the primary dust removal and demisting cylinder 2 and the secondary demisting cylinder 3 to prevent dust from accumulating on the turbulent mixer 9 and the secondary demisting cylinder 3. The water source used for the automatic rinsing spray layer 6 is industrial water. The industrial water pipeline is equipped with flow meters and electric valves. The system water consumption is replenished and the water consumption is monitored by automatically switching the electric valves on and off.

[0031] like Figure 4 As shown, a second gas equalization plate 10 and a third gas equalization plate 11 are arranged sequentially below the secondary demister cylinder 3. A wire mesh demister and a Pall ring are arranged between the second gas equalization plate 10 and the third gas equalization plate 11. The exhaust gas is demisted by the wire mesh demister and the Pall ring to achieve the standard of clean emission.

[0032] The washing drum 1 is provided with a first differential pressure detection port 12 on its upper side, and the secondary demisting drum 3 is provided with a second differential pressure detection port 13 in its middle. The washing drum 1, the primary dust removal and demisting drum 2, and the secondary demisting drum 3 are connected by ISO clamp flanges; the washing drum 1, the primary dust removal and demisting drum 2, and the secondary demisting drum 3 are made of stainless steel with a Teflon coating or of C276 material.

[0033] The system employs a combination of Brownian diffusion and direct interception, employing a preliminary washing process in the circulating spray layer 4, atomized washing in the dual-fluid atomized spray layer 5, and high-efficiency collision in the turbulent mixer 9 to achieve dust removal efficiency of PM10 > 99%, PM2.5 > 85%, and PM1 > 40%, exceeding the 65-75% dust removal efficiency of traditional demisters for PM2.5. The pressure loss in the washing section of the washing cylinder 1 is 55 Pa, the pressure loss in the turbulent dust and mist removal section of the primary dust and mist removal cylinder 2 is 100 Pa, and the pressure loss in the mist removal section of the secondary mist removal cylinder 3 is 135 Pa. The overall pressure loss of the washing device is < 300 Pa, lower than the 500-800 Pa pressure loss requirement of traditional demisters with similar efficiency. Through dual-fluid atomization, the required liquid-to-gas ratio of industrial water is 0.8 L / m³. 3 It is less than the liquid-to-gas ratio requirement of 1.5-2L / min for traditional demisters with the same efficiency; by monitoring the differential pressure gauges installed on the primary dust and mist removal cylinder 2 and the secondary mist removal cylinder 3, if the pressure loss is higher than the set upper limit, the third nozzle of the automatic flushing spray layer 6 will automatically open and flush until the pressure loss is lower than the set lower limit, thus extending the maintenance cycle.

[0034] During operation, the exhaust gas, after combustion and water washing for cooling, passes through the washing cylinder 1. Inside the washing cylinder 1, circulating liquid is sprayed through the circulating spray layer 4, ensuring full contact with the exhaust gas for preliminary washing, acid removal, and removal of larger particles. After preliminary washing, the exhaust gas is evenly distributed by the first gas equalization plate 8 and then enters the next section of the cylinder. Industrial water is atomized into fine droplets of 50–300 μm by compressed air in the dual-fluid atomizing spray layer 5. These fine droplets fully contact the exhaust gas within the washing cylinder 1, capturing dust. Some dust-laden droplets collide and coalesce into larger droplets within the washing cylinder 1, falling into the water tank. Most of the dust-laden droplets enter the primary dust and mist removal cylinder 2 along with the exhaust gas. After passing through the turbulent mixer 9, the droplets undergo efficient collisions through turbulent vortices (Reynolds number Re>6000), coalescing and growing into large liquids of 300-500 μm, thus improving inertial separation efficiency. The automatic flushing spray layer 6 automatically switches on and off based on the pressure difference between the primary dust and mist removal cylinder 2 and the secondary mist removal cylinder 3, preventing dust from accumulating on the turbulent mixer 9 and the secondary mist removal cylinder 3. After being treated by the primary dust and mist removal cylinder 2, the exhaust gas enters the secondary mist removal cylinder 3, which contains a built-in wire mesh demister and Pall rings. The exhaust gas is then discharged cleanly after being demisted in this layer.

[0035] In this specification, the illustrative expressions of the terms do not necessarily refer to the same embodiments. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments.

[0036] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A novel high-efficiency low-emission dust and mist removal washing device for semiconductor processing, characterized in that, It includes a washing drum (1), a primary dust removal and demisting drum (2), and a secondary demisting drum (3) connected sequentially from bottom to top; the washing drum (1) is provided with a circulating spray layer (4) at the bottom and a dual-fluid atomizing spray layer (5) at the top; the primary dust removal and demisting drum (2) is provided with an automatic rinsing spray layer (6) at the top.

2. The novel high-efficiency, low-emission dust removal and demisting washing device for semiconductor manufacturing processes according to claim 1, characterized in that, The washing drum (1) has an air inlet (7) at the bottom and a first air distribution plate (8) in the middle. Below the first air distribution plate (8) is a circulating spray layer (4) and above the first air distribution plate (8) is a dual-fluid atomizing spray layer (5).

3. The novel high-efficiency, low-emission dust removal and demisting washing device for semiconductor manufacturing processes according to claim 2, characterized in that, The circulating spray layer (4) includes a first spray pipe (41) and a first nozzle (42); the first nozzle (42) is located on the side of the first spray pipe (41) away from the washing drum (1); the first nozzle (42) is a large-diameter solid cone nozzle.

4. The novel high-efficiency, low-emission dust removal and demisting washing device for semiconductor manufacturing processes according to claim 2, characterized in that, The dual-fluid atomizing spray layer (5) includes a second spray pipe (51) and a second nozzle (52); the second nozzle (52) is evenly distributed at one end of the second spray pipe (51) away from the washing cylinder (1); the second nozzle (52) is a dual-fluid atomizing solid cone nozzle.

5. The novel high-efficiency, low-emission dust removal and demisting washing device for semiconductor manufacturing processes according to claim 1, characterized in that, A turbulent mixer (9) is provided below the primary dust removal and demisting cylinder (2), and an automatic flushing spray layer (6) is provided above the turbulent mixer (9). The automatic flushing spray layer (6) includes a third spray pipe (61) and a third nozzle (62).

6. The novel high-efficiency, low-emission dust removal and demisting washing device for semiconductor manufacturing processes according to claim 5, characterized in that, The third nozzle (62) is located at the end of the third spray pipe (61) away from the primary dust removal and demisting cylinder (2), and the third nozzle (62) is a solid cone nozzle.

7. The novel high-efficiency, low-emission dust removal and demisting washing device for semiconductor manufacturing processes according to claim 1, characterized in that, The second air distribution plate (10) and the third air distribution plate (11) are arranged in sequence below the secondary demister cylinder (3), and a wire mesh demister and a Pall ring are arranged between the second air distribution plate (10) and the third air distribution plate (11).

8. The novel high-efficiency, low-emission dust removal and demisting washing device for semiconductor manufacturing processes according to claim 1, characterized in that, The washing drum (1) is provided with a first differential pressure detection port (12) on its upper side, and the secondary demisting drum (3) is provided with a second differential pressure detection port (13) in its middle part.

9. The novel high-efficiency, low-emission dust removal and demisting washing device for semiconductor manufacturing processes according to claim 1, characterized in that, The washing drum (1), the primary dust removal and demisting drum (2), and the secondary demisting drum (3) are connected by ISO clamp flanges; the washing drum (1), the primary dust removal and demisting drum (2), and the secondary demisting drum (3) are made of stainless steel with Teflon coating or made of C276 material.

Images