A low-temperature forming device for a protective film

Abstract

This utility model relates to the field of protective film production technology, specifically a low-temperature forming device for protective films, including a bottom cooling mechanism and a top coating mechanism mounted on the bottom cooling mechanism. The bottom cooling mechanism includes a base with a slide rail inside, and a sliding plate is movably mounted within the slide rail. By incorporating the bottom cooling mechanism and the top coating mechanism in the low-temperature coating process of the protective film, as the protective film is delivered at a uniform speed along the gap between the two mechanisms, the semiconductor cooling chip cools the sliding plate, effectively coating the top of the protective film with the adhesive extruded from the coating roller. The hot melt adhesive cools rapidly and initially solidifies upon contact with the surface of the sliding plate. Therefore, the coating of the adhesive on the protective film surface avoids the problem of reduced fluidity due to prolonged adhesive retention.

Description

Technical Field

[0001] This utility model relates to the field of protective film production technology, specifically a low-temperature forming device for protective films. Background Technology

[0002] The low-temperature forming process for protective films is mainly used in chip manufacturing. The main reason for using low-temperature processes is to avoid damaging the manufactured components in the final step of chip manufacturing.

[0003] In the low-temperature molding process of protective film, there are certain defects in the coating on the film surface. Because the protective film is coated at low temperature, the viscosity of the adhesive is relatively high. As the viscosity of the adhesive increases, the fluidity of the adhesive coating on the film surface will decrease, which may cause the adhesive to bubble in severe cases.

[0004] In view of this, a low-temperature forming device for protective film was designed to solve the above problems. Utility Model Content

[0005] This utility model aims to solve one of the technical problems existing in the prior art or related technologies.

[0006] Therefore, the technical solution adopted by this utility model is as follows: A low-temperature forming apparatus for a protective film includes a bottom cooling mechanism and a top coating mechanism mounted on the bottom cooling mechanism. The bottom cooling mechanism includes a base with a slide rail inside, and a sliding plate movably mounted within the slide rail. A semiconductor cooling chip and a connector fixedly mounted on the bottom of the semiconductor cooling chip are fixedly mounted on the bottom of the sliding plate. A first cover plate is mounted on one end of the base, and a second cover plate is fixedly mounted on the other end of the base. The top coating mechanism includes a box plate mounted between the base and the first cover plate and located directly above the base, a heat insulation tube fixedly mounted inside the box plate, two sealing gaskets fixedly mounted at both ends of the heat insulation tube, and a coating roller and a hot flow roller movably mounted between the two sealing gaskets. The hot flow roller is located in the middle of the inner cavity of the heat insulation tube. The bottom of the coating roller is adapted to fit into a groove at the bottom of the heat insulation tube.

[0007] In a preferred embodiment, the present invention can be further configured such that the membrane bottom cooling mechanism further includes four bolts, two of which are inserted into the interior of the first cover plate and the other two bolts are inserted into the interior of the second cover plate; The inner side of the second cover plate has a cylindrical hole.

[0008] In a preferred embodiment, the present invention can be further configured such that: four pressure-bearing pads are fixedly installed inside the base, and the four pressure-bearing pads are adapted to bear pressure on the bottom of the skateboard; The base has a housing installed at its bottom, and a motor, a main drive pulley, and a secondary drive pulley are fixedly installed inside the housing.

[0009] In a preferred embodiment, the present invention can be further configured such that: an impeller shaft is movably installed inside the cylindrical hole, a first transmission belt is driven to the impeller shaft, and the other end of the first transmission belt is driven to the auxiliary drive pulley; The main drive pulley is connected to a second drive belt, and the other end of the second drive belt is driven by a hot flow roller.

[0010] In a preferred embodiment, the present invention can be further configured as follows: an exhaust cavity is provided inside the box panel, and a vertically downward groove is provided on the inner wall of the exhaust cavity; a slot is provided at the bottom of the box panel, and an adhesive scraper is adapted to be engaged in the slot.

[0011] In a preferred embodiment, the present invention can be further configured such that the membrane top coating mechanism includes two gears, one of which is fixedly mounted on the hot flow roller and the other gear is fixedly mounted on the coating roller.

[0012] In a preferred embodiment, the present invention can be further configured such that a glue injection tube is movably mounted on the tube body at the end of the hot flow roller away from the second cover plate.

[0013] In a preferred embodiment, the present invention can be further configured such that: the outer wall of the hot flow roller has a guide groove, and the interior of the hot flow roller has a cylindrical hole.

[0014] By adopting the above technical solution, the beneficial effects achieved by this utility model are as follows: 1. This utility model sets up a film bottom cooling mechanism and a film top adhesive coating mechanism in the low-temperature coating process of the protective film. As the protective film is delivered at a constant speed along the gap between the two, the semiconductor cooling chip cools the slide plate, and the adhesive squeezed out from the coating roller will be effectively coated on the top of the protective film. The hot melt adhesive will be rapidly cooled and initially solidified the moment it comes into contact with the surface of the slide plate. At this time, the coating of adhesive on the surface of the protective film can avoid the problem of poor fluidity caused by the adhesive staying for too long. Attached Figure Description

[0015] Figure 1 This is a schematic diagram illustrating the use of this utility model; Figure 2 This is a schematic diagram of the membrane bottom cooling mechanism of this utility model; Figure 3 This is a schematic diagram of the membrane top coating mechanism of this utility model; Figure 4 This is a cross-sectional schematic diagram of the base of this utility model.

[0016] Figure label: 100. Membrane bottom cooling mechanism; 110. Base; 1101. Pressure-bearing base pad; 1102. Slide plate; 120. First cover plate; 130. Second cover plate; 1301. Cylindrical hole; 140. Impeller shaft; 150. Bolt; 160. First drive belt; 170. Second drive belt; 180. Semiconductor cooling chip; 1801. Connector; 190. Chassis; 1901. Motor; 1902. Main drive pulley; 1903. Secondary drive pulley; 200. Membrane top coating mechanism; 210. Box panel; 2101. Exhaust cavity; 2102. Groove; 220. Glue surface scraper; 230. Heat insulation pipe; 2301. Sealing gasket; 2302. Glue coating roller; 2303. Hot flow roller; 2304. Gear; 2305. Glue injection pipe. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features of the present utility model can be combined with each other.

[0018] It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this invention.

[0019] The following describes, with reference to the accompanying drawings, some embodiments of a protective film low-temperature forming apparatus provided by this utility model. Example

[0020] Combination Figures 1 to 4 As shown, the present invention provides a low-temperature forming device for protective film, including a bottom cooling mechanism 100 and a top coating mechanism 200 mounted on the bottom cooling mechanism 100. The bottom cooling mechanism 100 is used to ensure the flowability of the input adhesive liquid, and the top coating mechanism 200 is used to provide cooling protection for the uniform delivery of the protective film.

[0021] The membrane bottom cooling mechanism 100 includes a base 110 and four bolts 150. The base 110 has a slide rail inside, and a slide plate 1102 is movably installed in the slide rail. A semiconductor cooling chip 180 and a connector 1801 are fixedly installed at the bottom of the slide plate 1102. A first cover plate 120 is installed at one end of the base 110, and a second cover plate 130 is fixedly installed at the other end of the base 110. Two bolts 150 are inserted into the interior of the first cover plate 120, and the other two bolts 150 are inserted into the interior of the second cover plate 130; The inner side of the second cover plate 130 is provided with a cylindrical hole 1301; Four pressure-bearing pads 1101 are fixedly installed inside the base 110, and the four pressure-bearing pads 1101 are adapted to bear pressure on the bottom of the slide plate 1102; A chassis 190 is installed at the bottom of the base 110, and a motor 1901, a main drive pulley 1902, and a secondary drive pulley 1903 are fixedly installed inside the chassis 190. An impeller shaft 140 is movably installed inside the cylindrical hole 1301. A first transmission belt 160 is connected to the impeller shaft 140, and the other end of the first transmission belt 160 is driven by the auxiliary drive pulley 1903. The membrane top coating mechanism 200 includes a box plate 210 installed between the base 110 and the first cover plate 120 and located directly above the base 110, a heat insulation pipe 230 fixedly installed inside the box plate 210, two sealing gaskets 2301 fixedly installed at both ends of the heat insulation pipe 230, and a coating roller 2302 and a hot flow roller 2303 movably installed between the two sealing gaskets 2301. A second drive belt 170 is connected to the main drive pulley 1902, and the other end of the second drive belt 170 is driven by the hot flow roller 2303. The hot flow roller 2303 is located in the middle of the inner cavity of the heat insulation tube 230; The bottom of the adhesive roller 2302 is fitted into the groove at the bottom of the heat insulation tube 230.

[0022] When the bottom wire of connector 1801 is connected to the power supply and energized, the semiconductor cooling chip 180 will force the slide plate 1102 to cool. The protective film will be protected by low temperature after passing the top surface of the slide plate 1102. As the hot flow roller 2303 rotates at a constant speed, the final adhesive roller 2302 will rotate at a constant speed along the groove at the bottom of the heat insulation tube 230. The adhesive squeezed out from the inner cavity of the heat insulation tube 230 will coat the protective film on the top of the slide plate 1102. As soon as the adhesive is applied to the top surface of the protective film, the slide plate 1102 will force the adhesive on the film surface to condense until it is cured. Example

[0023] Combination Figures 3 to 4 As shown, based on Embodiment 1, the membrane top coating mechanism 200 further includes two gears 2304, one of which is fixedly mounted on the hot flow roller 2303, and the other gear 2304 is fixedly mounted on the coating roller 2302. The box panel 210 has an exhaust cavity 2101 inside, and the inner wall of the exhaust cavity 2101 has a vertically downward slot 2102. The bottom of the box panel 210 has a slot, and a rubber scraper 220 is adapted to be snapped into the slot. A glue injection tube 2305 is movably installed on the tube body of the hot flow roller 2303 at the end away from the second cover plate 130; The outer wall of the hot flow roller 2303 is provided with a guide groove, and the interior of the hot flow roller 2303 is provided with a cylindrical hole.

[0024] Specifically, the running motor 1901, together with the main drive pulley 1902 and the auxiliary drive pulley 1903, will simultaneously drive the first drive belt 160 and the second drive belt 170. The first drive belt 160 will assist in rotating the impeller shaft 140. At this time, the airflow continuously enters the inner cavity of the exhaust cavity 2101 and will eventually be transferred downward from the slot 2102. The gap between the base 110 and the box plate 210 will cool the airflow. Until the protective film after the adhesive is applied passes through the bottom of the adhesive scraper 220, the adhesive on the top of the protective film can be effectively condensed and cured, thus avoiding the phenomenon of poor fluidity of the adhesive on the surface of the protective film.

[0025] The working principle and usage process of this utility model are as follows: The protective film is delivered in advance along the gap between the box plate 210 and the base 110 until the bottom of the protective film fits and adheres to the top of the slide plate 1102. As the protective film passes through the slide plate 1102, the running motor 1901, together with the main drive pulley 1902 and the auxiliary drive pulley 1903, will respectively drive the first drive belt 160 and the second drive belt 170. When the other end of the second drive belt 170 drives the hot melt roller 2303, the hot melt adhesive that is fed into the inner cavity of the hot melt roller 2303 through the glue injection tube 2305 will overflow through the slots on the outer wall. The overflowing hot melt adhesive will immerse the coating roller 2302. The coating roller 2302 and the hot melt roller 2303 are meshed through two gears 2304. Therefore, while the hot melt roller 2303 is rotating, the coating roller 2302 will squeeze the hot melt adhesive through the gap at the bottom of the heat insulation tube 230. Finally, the squeezed adhesive will be printed on the top surface of the protective film. The slide plate 1102 provides a wide carrier for the printing part of the protective film. Therefore, the slide plate 1102, which is in a low temperature state, will provide heat-free deformation protection for the protective film. When the hot melt adhesive transferred by the coating roller 2302 comes into contact with the sliding plate 1102, the adhesive adhering to the top of the protective film will quickly solidify due to the low temperature of the sliding plate 1102. The adhesive that has initially solidified on top of the protective film continues to be delivered and passes through the adhesive scraper 220. The impeller shaft 140, driven by the first transmission belt 160, sends air into the inner cavity of the exhaust cavity 2101. The airflow is released outward along the slot 2102. Finally, the airflow will perform a secondary curing process on the protective film and the adhesive on top of it along the arc surface of the adhesive scraper 220.

[0026] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A low-temperature forming apparatus for a protective film, comprising a film bottom cooling mechanism (100), characterized in that, It also includes a membrane top coating mechanism (200) installed on the membrane bottom cooling mechanism (100). The membrane bottom cooling mechanism (100) includes a base (110), the base (110) has a slide rail inside, and a slide plate (1102) is movably installed in the slide rail. A semiconductor cooling chip (180) and a connector (1801) are fixedly installed at the bottom of the slide plate (1102). A first cover plate (120) is installed at one end of the base (110), and a second cover plate (130) is fixedly installed at the other end of the base (110). The membrane top coating mechanism (200) includes a box plate (210) installed between the base (110) and the first cover plate (120) and located directly above the base (110), a heat insulation tube (230) fixedly installed inside the box plate (210), two sealing gaskets (2301) fixedly installed at both ends of the heat insulation tube (230), and a coating roller (2302) and a heat transfer roller (2303) movably installed between the two sealing gaskets (2301). The heat transfer roller (2303) is located in the middle of the inner cavity of the heat insulation tube (230); The bottom of the coating roller (2302) is adapted to fit into the groove at the bottom of the heat insulation tube (230).

2. The low-temperature forming apparatus for a protective film according to claim 1, characterized in that, The membrane bottom cooling mechanism (100) also includes four bolts (150), two of which are inserted into the interior of the first cover plate (120), and the other two bolts (150) are inserted into the interior of the second cover plate (130); The inner side of the second cover plate (130) is provided with a cylindrical hole (1301).

3. The low-temperature forming apparatus for a protective film according to claim 1, characterized in that, The base (110) is internally fixedly equipped with four pressure-bearing pads (1101), and the four pressure-bearing pads (1101) are adapted to bear pressure on the bottom of the slide plate (1102); The bottom of the base (110) is equipped with a housing (190), a motor (1901) is fixedly installed inside the housing (190), and a main drive pulley (1902) and a secondary drive pulley (1903) are installed on the motor (1901). A second drive belt (170) is connected to the main drive pulley (1902), and the other end of the second drive belt (170) is driven by the hot flow roller (2303).

4. The low-temperature forming apparatus for a protective film according to claim 2, characterized in that, An impeller shaft (140) is movably installed inside the cylindrical hole (1301). A first transmission belt (160) is connected to the impeller shaft (140), and the other end of the first transmission belt (160) is driven by the auxiliary drive pulley (1903).

5. The low-temperature forming apparatus for a protective film according to claim 1, characterized in that, The box panel (210) has an exhaust cavity (2101) inside, and the inner wall of the exhaust cavity (2101) has a vertically downward slot (2102). The bottom of the box panel (210) has a slot, and a rubber scraper (220) is adapted to be snapped into the slot.

6. The low-temperature forming apparatus for a protective film according to claim 1, characterized in that, The membrane top coating mechanism (200) also includes two gears (2304), one of which is fixedly mounted on the hot flow roller (2303) and the other gear (2304) is fixedly mounted on the coating roller (2302).

7. The low-temperature forming apparatus for a protective film according to claim 1, characterized in that, A glue injection tube (2305) is movably installed on the tube body at the end of the hot flow roller (2303) away from the second cover plate (130).

8. The low-temperature forming apparatus for a protective film according to claim 1, characterized in that, The outer wall of the hot flow roller (2303) is provided with a guide groove, and the interior of the hot flow roller (2303) is provided with a cylindrical hole.

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