An adhering device for processing electronic component magnets
Patent Information
- Application Number
- CN202521647449.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-05
- Publication Date
- 2026-08-18
- Estimated Expiration
- 2035-08-05
AI Technical Summary
[0004]然而上述公开文献的一种电子元件磁铁加工用粘连装置主要考虑对不同高度的磁铁进行涂胶,不便于对粘连后的工件进行快速风干使得粘附的问题
[0016]1. This utility model uses a drying mechanism to quickly dry the bonded workpieces, ensuring adhesion. Existing methods for bonding electronic components and covers often result in unstable connections and positional shifts due to the inability of the adhesive to dry quickly enough. Therefore, this needs improvement. Firstly, the drying box is always positioned on one side of the clamping plate and moves with it. When the clamping plate moves close to the electronic components, and the bonding process is complete, the drying fan in the drying box blows air to dry the electronic components, allowing the adhesive to solidify and dry quickly, preventing positional shifts. Simultaneously, to prevent the weight of the drying box from affecting the normal movement of the clamping plate, the assembly plate is placed on top of the bonding device body and fixed in the assembly screw groove. At this time, the support block supports the bottom of the drying box, providing upward lifting force. Furthermore, when the drying box moves, the sliding plate moves on the sliding rod, compressing the spring and ensuring the normal movement of the drying box is not affected.
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Figure CN224641537U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of adhesive devices, specifically an adhesive device for processing magnets for electronic components. Background Technology
[0002] An adhesive bonding device for electronic component magnet processing refers to a device specifically used to fix magnets to other components or materials through adhesive bonding during the production or assembly of magnets. Its core function is to ensure stable and precise bonding of magnets during processing, while maintaining magnetic properties and mechanical strength. The adhesive bonding device uses adhesives (such as epoxy resin, acrylic glue, etc.) to bond the molded magnet cover to other parts to form composite magnetic materials or components.
[0003] Patent document CN216800428U discloses an adhesive bonding device for processing magnets of electronic components. It discloses a device comprising a processing base, a first conveyor belt, a second conveyor belt, a clamping mechanism, and a glue-applying mechanism. The first conveyor belt is rotatably mounted on the right side of the upper end of the processing base, and the second conveyor belt is rotatably mounted on the left side of the upper end of the processing base. The first and second conveyor belts rotate in opposite directions. The clamping mechanism is located on the left side above the processing base, and the glue-applying mechanism is located on the right side above the processing base. This adhesive bonding device for processing magnets of electronic components, by setting a piston, allows a small electric push rod to drive a connecting column to move up and down, thereby driving the piston to move up and down and compress the glue inside the glue-applying cylinder, resulting in more uniform glue application and improved glue quality. By setting a first hydraulic cylinder, a first transmission rod, a support plate, and the glue-applying cylinder can be driven to move up and down, thereby controlling the height of the glue-applying cylinder and applying glue to magnets of different heights.
[0004] However, the aforementioned published document on the bonding device for processing magnets for electronic components mainly considers applying glue to magnets of different heights, which makes it inconvenient to quickly air dry the bonded workpieces, thus causing adhesion problems.
[0005] Therefore, it is necessary to develop a drying mechanism that can quickly dry the adhered workpieces to prevent them from sticking together. Utility Model Content
[0006] The purpose of this invention is to provide an adhesive device for processing magnets for electronic components, so as to solve the technical problem mentioned in the background art of enabling the adhesive device for processing magnets for electronic components to have a drying function.
[0007] To achieve the above objectives, this utility model provides the following technical solution: an adhesive device for processing magnets for electronic components, comprising: an adhesive device body, a functional plate, a clamping plate and a pneumatic clamping block, wherein the outer wall of the clamping plate is provided with a drying mechanism, which is used to quickly dry the bonded workpiece to achieve adhesion.
[0008] The air-drying mechanism includes a connecting rod and an air-drying box. The connecting rod is located at the top of the clamping plate, and the air-drying box is installed at the bottom of the connecting rod. A drying fan is installed on the inner wall of the air-drying box, and ventilation holes are provided on the inner wall of the air-drying box. A protective net is installed on the inner wall of the air-drying box. An assembly plate is installed on the top of the adhesive device body, and an assembly screw groove is provided on the top of the adhesive device body. An assembly screw is installed on the outer wall of the assembly plate, and one end of the assembly screw extends into the interior of the assembly screw groove. A sliding rod is installed on the top of the assembly plate, and a sliding plate is installed around the outer wall of the sliding rod. A spring is installed on the top of the assembly plate, and one end of the spring extends to the bottom of the sliding plate. A support block is installed on the top of the sliding plate.
[0009] Preferably, a control panel is installed on the outer wall of the adhesive device body, a support rod is installed on the top of the adhesive device body, a function plate is installed on the top of the support rod, a first electric telescopic rod is installed at the bottom of the function plate, a dispensing head is installed at the output end of the first electric telescopic rod, a pump body is installed at the bottom of the function plate, and the liquid outlet end of the pump body extends into the interior of the dispensing head, an electric slide rail is installed at the bottom of the function plate, a second electric telescopic rod is installed at the output end of the electric slide rail, a clamping plate is installed at the output end of the second electric telescopic rod, and a pneumatic clamping block is installed at the bottom of the clamping plate.
[0010] Preferably, the outer wall of the clamping plate is provided with a pressing mechanism, which is used to make the electronic component magnets more tightly assembled.
[0011] Preferably, the pressing mechanism includes a pressing rod and a pressing plate, the pressing rod is located on top of the clamping plate, and the pressing plate is installed at the output end of the pressing rod.
[0012] Preferably, a rubber pad layer is installed on the bottom of the pressing plate.
[0013] Preferably, the inner wall of the pneumatic clamping block is provided with a pressing groove.
[0014] Preferably, a linkage rod is installed on the outer wall of the pressing plate.
[0015] Compared with the prior art, the beneficial effects of this utility model are:
[0016] 1. This utility model uses a drying mechanism to quickly dry the bonded workpieces, ensuring adhesion. Existing methods for bonding electronic components and covers often result in unstable connections and positional shifts due to the inability of the adhesive to dry quickly enough. Therefore, this needs improvement. Firstly, the drying box is always positioned on one side of the clamping plate and moves with it. When the clamping plate moves close to the electronic components, and the bonding process is complete, the drying fan in the drying box blows air to dry the electronic components, allowing the adhesive to solidify and dry quickly, preventing positional shifts. Simultaneously, to prevent the weight of the drying box from affecting the normal movement of the clamping plate, the assembly plate is placed on top of the bonding device body and fixed in the assembly screw groove. At this time, the support block supports the bottom of the drying box, providing upward lifting force. Furthermore, when the drying box moves, the sliding plate moves on the sliding rod, compressing the spring and ensuring the normal movement of the drying box is not affected.
[0017] 2. This utility model, by installing a pressing mechanism, makes the assembly of electronic component magnets more compact. In the existing assembly of the cover and electronic component, the gap between them cannot be eliminated. Therefore, this needs to be improved. First, when the cover comes into contact with the electronic component, the pressing rod drives the pressing plate to move. The linkage rod causes multiple sets of pressing plates to move synchronously. The pressing plate then squeezes the cover with a fixed force, thereby reducing the gap between the cover and the electronic component and avoiding the impact on the quality of the electronic component magnet due to a large gap. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of the adhesive device body of this utility model;
[0019] Figure 2 This is a schematic diagram of the front structure of the adhesive device body of this utility model;
[0020] Figure 3 This is a schematic diagram of the side structure of the drying box of this utility model;
[0021] Figure 4 This is a schematic diagram of the front structure of the pressing plate of this utility model.
[0022] In the diagram: 1. Adhesive device body; 2. Control panel; 3. Support rod; 4. Function panel; 5. First electric telescopic rod; 6. Dispensing head; 7. Pump body; 8. Electric slide rail; 9. Second electric telescopic rod; 10. Clamping plate; 11. Pneumatic clamping block; 12. Connecting rod; 13. Drying box; 14. Drying fan; 15. Ventilation hole; 16. Protective net; 17. Assembly plate; 18. Assembly screw groove; 19. Assembly screw; 20. Slide rod; 21. Spring; 22. Slide plate; 23. Support block; 24. Pressing rod; 25. Pressing plate; 26. Rubber pad layer; 27. Pressing through groove; 28. Linkage rod. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0024] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0025] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0026] Please see Figure 1 and Figure 2An adhesive bonding device for processing magnets for electronic components includes: an adhesive bonding device body 1, a functional plate 4, a clamping plate 10, and a pneumatic clamping block 11. A control panel 2 is mounted on the outer wall of the adhesive bonding device body 1. A support rod 3 is mounted on the top of the adhesive bonding device body 1, and the functional plate 4 is mounted on the top of the support rod 3. A first electric telescopic rod 5 is mounted on the bottom of the functional plate 4, and a dispensing head 6 is mounted on the output end of the first electric telescopic rod 5. A pump body 7 is mounted on the bottom of the functional plate 4, and the outlet end of the pump body 7 extends into the interior of the dispensing head 6. An electric slide rail 8 is mounted on the bottom of the functional plate 4, and a second electric telescopic rod 9 is mounted on the output end of the electric slide rail 8. The clamping plate 10 is mounted on the output end of the second electric telescopic rod 9, and a pneumatic clamping block 11 is mounted on the bottom of the clamping plate 10. 1. Place the electronic component onto the conveyor belt on the adhesive bonding device body 1. Then, the position sensor on the adhesive bonding device body 1 senses the position of the electronic component. When it moves to below the dispensing head 6, the conveyor belt stops working. The liquid inlet end of the pump body 7 is connected to the external power supply. The pump body 7 then absorbs and delivers the liquid to the dispensing head 6 and dispenses the adhesive onto the designated position of the electronic component. Then, the conveyor belt continues to work and moves the electronic component to below the clamping plate 10. The cover on top of the electronic component is then clamped by the pneumatic clamping block 11. The electric slide rail 8 works to drive the pneumatic clamping block 11 to move left and right. Then, the second electric telescopic rod 9 works to drive the pneumatic clamping block 11 to move up and down, thus covering the dispensed electronic component with the cover, completing the bonding work.
[0027] Please see Figure 2 and Figure 3The outer wall of the clamping plate 10 is provided with a drying mechanism, which is used to quickly dry the bonded workpieces to ensure adhesion. The drying mechanism includes a connecting rod 12 and a drying box 13. The connecting rod 12 is located at the top of the clamping plate 10, and the drying box 13 is installed at the bottom of the connecting rod 12. A drying fan 14 is installed on the inner wall of the drying box 13, and the inner wall of the drying box 13 is provided with ventilation holes 15. A protective net 16 is installed on the inner wall of the drying box 13. An assembly plate 17 is installed on the top of the bonding device body 1. The top of the adhesive device body 1 is provided with an assembly screw groove 18. An assembly screw 19 is installed on the outer wall of the assembly plate 17, and one end of the assembly screw 19 extends into the interior of the assembly screw groove 18. A slide bar 20 is installed on the top of the assembly plate 17. A slide plate 22 is installed around the outer wall of the slide bar 20. A spring 21 is installed on the top of the assembly plate 17, and one end of the spring 21 extends to the bottom of the slide plate 22. A support block 23 is installed on the top of the slide plate 22. Existing electronic components and covers are connected by an adhesive. After adsorption, the colloid cannot dry immediately, leading to unstable connection and positional displacement. Therefore, this needs to be improved. First, the drying box 13 is always located on one side of the clamping plate 10 and moves with the clamping plate 10. When the clamping plate 10 moves close to the electronic components and the electronic components are bonded, the drying fan 14 in the drying box 13 blows air to dry the electronic components, allowing the colloid to solidify and dry quickly, avoiding positional displacement. At the same time, due to the installation of the drying box 13, to prevent the weight of the drying box 13 from affecting the normal movement of the clamping plate 10, the assembly plate 17 is placed on the top of the bonding device body 1 and fixed in the assembly screw groove 18 by the assembly screw 19. At this time, the support block 23 supports the bottom of the drying box 13, providing an upward lifting force. At the same time, when the drying box 13 moves, the slide plate 22 moves on the slide rod 20, and the spring 21 is compressed, which does not affect the normal movement of the drying box 13.
[0028] Please see Figure 3 and Figure 4 The outer wall of the clamping plate 10 is provided with a pressing mechanism, which is used to make the electronic component magnets more tightly assembled. The pressing mechanism includes a pressing rod 24 and a pressing plate 25. The pressing rod 24 is located at the top of the clamping plate 10, and the pressing plate 25 is installed at the output end of the pressing rod 24. A rubber pad layer 26 is installed at the bottom of the pressing plate 25. The inner wall of the pneumatic clamping block 11 is provided with a pressing through groove 27, and a linkage rod 28 is installed on the outer wall of the pressing plate 25. When the existing cover is bonded and assembled with the electronic component, it is impossible to eliminate the gap between them. Therefore, this needs to be improved. First, when the cover comes into contact with the electronic component, the pressing rod 24 works to drive the pressing plate 25 to move. The linkage rod 28 makes multiple sets of pressing plates 25 move synchronously. Then the pressing plate 25 squeezes the cover with a fixed force, thereby reducing the gap between the cover and the electronic component and avoiding the quality of the electronic component magnet due to the large gap.
[0029] Working principle: Electronic components are placed on the conveyor belt of the bonding device body 1. The position sensor on the bonding device body 1 then senses the position of the electronic components. When the components move below the dispensing head 6, the conveyor belt stops working. The liquid inlet of the pump body 7 is connected to an external power source, and the pump body 7 draws in liquid and delivers it to the dispensing head 6, dispensing the adhesive onto the designated position on the electronic components. The conveyor belt then continues working, moving the electronic components below the clamping plate 10. The top cover of the electronic components is then clamped by the pneumatic clamping block 11. The electric slide rail 8... The operation drives the pneumatic clamping block 11 to move left and right, and then the second electric telescopic rod 9 drives the pneumatic clamping block 11 to move up and down, thus covering the cover onto the glued electronic component and completing the bonding process. Currently, after the electronic component and cover are bonded by the adhesive, the adhesive cannot dry quickly enough, leading to unstable connections and positional shifts. Therefore, this needs to be improved. First, the drying box 13 should always be located on one side of the clamping plate 10 and move with the clamping plate 10. Then, when the clamping plate 10 moves close to the electronic component, and the electronic component has been bonded, the drying process can begin. When the drying fan 14 in box 13 operates, it blows air to dry the electronic components, causing the colloid to solidify and dry quickly, preventing positional displacement. Simultaneously, to prevent the weight of the drying box 13 from affecting the normal movement of the clamping plate 10, the assembly plate 17 is placed on top of the adhesive device body 1 and fixed in the assembly screw groove 18 by the assembly screw 19. At this time, the support block 23 supports the bottom of the drying box 13, providing an upward lifting force. Simultaneously, when the drying box 13 moves, the sliding plate 22... When the slide bar 20 moves, the spring 21 is compressed, which does not affect the normal movement of the drying box 13. When the existing cover is glued and assembled with electronic components, it is impossible to eliminate the gap between them. Therefore, this needs to be improved. First, when the cover comes into contact with the electronic components, the pressing rod 24 works to drive the pressing plate 25 to move. The linkage rod 28 makes multiple sets of pressing plates 25 move synchronously. Then the pressing plate 25 squeezes the cover with a fixed force, which reduces the gap between the cover and the electronic components and avoids affecting the quality of the magnet of the electronic components due to the large gap between them.
[0030] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. An adhesive device for processing magnets for electronic components, characterized in that, include: The adhesive device body (1), functional plate (4), clamping plate (10) and pneumatic clamping block (11) are provided. The outer wall of the clamping plate (10) is provided with a drying mechanism, which is used to quickly dry the adhesive workpiece to make it adhere. The air-drying mechanism includes a connecting rod (12) and an air-drying box (13). The connecting rod (12) is located at the top of the clamping plate (10). The air-drying box (13) is installed at the bottom of the connecting rod (12). An air-drying fan (14) is installed on the inner wall of the air-drying box (13). The inner wall of the air-drying box (13) is provided with ventilation holes (15). A protective net (16) is installed on the inner wall of the air-drying box (13). An assembly plate (17) is installed on the top of the adhesive device body (1). An assembly screw groove (18) is provided. An assembly screw (19) is installed on the outer wall of the assembly plate (17), and one end of the assembly screw (19) extends into the interior of the assembly screw groove (18). A slide rod (20) is installed on the top of the assembly plate (17). A slide plate (22) is installed around the outer wall of the slide rod (20). A spring (21) is installed on the top of the assembly plate (17), and one end of the spring (21) extends to the bottom of the slide plate (22). A support block (23) is installed on the top of the slide plate (22).
2. The bonding device for processing magnets for electronic components according to claim 1, characterized in that: The outer wall of the adhesive device body (1) is equipped with a control panel (2), the top of the adhesive device body (1) is equipped with a support rod (3), the top of the support rod (3) is equipped with a function plate (4), the bottom of the function plate (4) is equipped with a first electric telescopic rod (5), the output end of the first electric telescopic rod (5) is equipped with a dispensing head (6), the bottom of the function plate (4) is equipped with a pump body (7), and the liquid outlet end of the pump body (7) extends into the interior of the dispensing head (6), the bottom of the function plate (4) is equipped with an electric slide rail (8), the output end of the electric slide rail (8) is equipped with a second electric telescopic rod (9), the output end of the second electric telescopic rod (9) is equipped with a clamping plate (10), and the bottom of the clamping plate (10) is equipped with a pneumatic clamping block (11).
3. The bonding device for processing magnets for electronic components according to claim 1, characterized in that: The outer wall of the clamping plate (10) is provided with a pressing mechanism, which is used to make the electronic component magnets more tightly assembled.
4. The bonding device for processing magnets for electronic components according to claim 3, characterized in that: The pressing mechanism includes a pressing rod (24) and a pressing plate (25). The pressing rod (24) is located on top of the clamping plate (10), and the pressing plate (25) is installed at the output end of the pressing rod (24).
5. The bonding device for processing magnets for electronic components according to claim 4, characterized in that: A rubber pad layer (26) is installed on the bottom of the pressing plate (25).
6. The bonding device for processing magnets for electronic components according to claim 1, characterized in that: The inner wall of the pneumatic clamping block (11) is provided with a pressing groove (27).
7. The bonding device for processing magnets for electronic components according to claim 4, characterized in that: A linkage rod (28) is installed on the outer wall of the pressing plate (25).
Citation Information
Patent Citations
Adhesion device for processing electronic element magnet
CN216800428U