Curing device and chip preparation system

Abstract

The application discloses a curing device, which comprises a box body, a cover body, a first ventilation assembly, a second ventilation assembly, a heating assembly and a fan. The box body is provided with a curing cavity, a cooling air duct and a circulating air duct. An air inlet of the cooling air duct is formed on an outer wall of the box body as an air inlet, and an air inlet of the circulating air duct is communicated with a bottom of the curing cavity. An outer wall of the box body is also provided with a taking and placing opening communicated with the curing cavity. The first ventilation assembly can open and close the air inlet, and the second ventilation assembly can conduct and cut off the circulating air duct. During the curing process, the first ventilation assembly closes the air inlet, the second ventilation assembly conducts the circulating air duct, and the fan can make the gas in the curing cavity circulate and flow, so that the substrate is uniformly heated, and the curing speed is improved. After the curing is completed, the first ventilation assembly opens the air inlet, the fan guides the external cold air into the curing cavity and blows it to the substrate below, so that the cooling speed of the photoresist is accelerated, and the efficiency is improved. The application also discloses a chip preparation system.

Description

Technical Field

[0001] This application belongs to the field of semiconductor manufacturing equipment technology, specifically relating to a curing device and a chip fabrication system. Background Technology

[0002] Cooled detector chips, as key components in the semiconductor field, play an indispensable role in many cutting-edge fields such as infrared detection, astronomical observation, and medical imaging. The curing of photoresist is a crucial step in the fabrication process, serving as a bridge between pattern exposure and pattern transfer to the substrate. Its curing effect directly determines the precision of the chip pattern and the final performance of the device.

[0003] Existing photoresist curing equipment typically uses heat for thermal curing. Specifically, a substrate coated with photoresist is placed in a sealed chamber, and heating is applied via heating wires within the chamber. After curing, both the substrate and the photoresist usually need to cool to room temperature. Current cooling methods typically involve natural cooling, which is time-consuming and inefficient. Utility Model Content

[0004] The technical problem to be solved by this application is that the efficiency of natural cooling after photoresist thermal curing is low. In order to solve this technical problem, a curing device and chip fabrication system that can accelerate the cooling speed of photoresist are provided.

[0005] The technical solution proposed in this application is as follows:

[0006] A curing apparatus, comprising:

[0007] The housing has a curing chamber, a cooling air duct, and a circulating air duct. The air inlet of the cooling air duct forms an air inlet on the outer wall of the housing. The air inlet of the circulating air duct is connected to the bottom of the curing chamber. The outer wall of the housing is also provided with a loading and unloading port that communicates with the curing chamber.

[0008] The cover is movably configured relative to the box body to open and close the loading / unloading port during movement;

[0009] Both the first ventilation component and the second ventilation component are disposed in the housing. The first ventilation component can open and close the air inlet, and the second ventilation component can open and close the circulating air duct.

[0010] A heating component, disposed in the housing, is used to heat the curing chamber;

[0011] A fan is installed at the top of the curing chamber. The air outlets of the cooling air duct and the circulating air duct are both directed toward the fan. The fan can guide the gas in the cooling air duct and the circulating air duct to blow towards the bottom of the curing chamber.

[0012] Using the aforementioned curing apparatus, during the curing process of the photoresist-coated substrate within the curing chamber, the first ventilation component seals the air inlet, while the second ventilation component opens the circulation duct. The fan enables gas circulation within the curing chamber, improving the uniformity of temperature distribution and achieving uniform heating of the substrate, thus increasing the curing speed. After curing, the first ventilation component opens the air inlet, and the second ventilation component closes the circulation duct. The fan guides outside cold air into the curing chamber and blows it onto the substrate below, accelerating the cooling rate of the photoresist, shortening the cooling time, and improving efficiency.

[0013] Furthermore, the air outlet of the circulating air duct penetrates the inner wall of the cooling air duct and forms a connecting opening, and the second ventilation component can open and close the connecting opening.

[0014] Furthermore, it also includes a carrier member connected to the cover, and the carrier member is located inside the curing cavity when the cover closes the opening.

[0015] Furthermore, when the carrier is located inside the curing chamber, the heating assembly is located below the carrier, and the fan is located above the carrier.

[0016] Furthermore, the bottom wall of the curing chamber is provided with an installation groove, and the heating component is installed in the installation groove.

[0017] Furthermore, the heating assembly includes a mounting base, a heating element, and a perforated mesh. The mounting base is installed in the mounting groove, and both the heating element and the perforated mesh are disposed on the mounting base, with the perforated mesh located above the heating element.

[0018] Furthermore, the first ventilation component includes a first driving member and a baffle module. The first driving member is connected to the baffle module to drive the baffle module to open and close the air inlet.

[0019] Furthermore, the baffle module includes a first baffle, a connector, and a second baffle. The first driving member is connected to one end of the first baffle to drive the first baffle to rotate around a first axis. The connector is rotatably connected to the end of the first baffle away from the first driving member around a second axis. The second baffle is connected to the connector.

[0020] Wherein, the first axis is parallel to the outer wall of the box, the first axis and the second axis are parallel, and the first baffle can pass through the open position and the closed position during the rotation process;

[0021] When the first baffle is rotated to the open position, the first baffle is set at an angle to the outer wall of the housing, and the second baffle is located at the end of the first baffle away from the housing, and the second baffle is set at an angle to the first baffle; when the first baffle is rotated to the closed position, both the first baffle and the second baffle are abutted against the outer wall of the housing and arranged in a direction perpendicular to the first axis to close the air inlet.

[0022] Furthermore, it also includes a filter element disposed in the cooling air duct.

[0023] A chip fabrication system, including the curing apparatus described above.

[0024] In summary, the curing apparatus and chip fabrication system provided in this application have at least the following advantages:

[0025] 1. During the curing process, the fan guides the gas circulation within the curing chamber, ensuring uniform heating of the substrate and increasing the curing speed. Simultaneously, it prevents localized overheating that could cause photoresist deformation or cracking. During cooling, the fan guides cool air from outside into the curing chamber and directs it towards the substrate, increasing the substrate's cooling rate. This effectively improves efficiency.

[0026] 2. The carrier is connected to the inner side of the cover, and the carrier can be moved out of the curing cavity during the movement of the cover, which facilitates the removal and placement of the substrate;

[0027] 3. When the first driving component drives the first baffle to open the air inlet, the second baffle is tilted relative to the first baffle. Compared with the method of closing the air inlet with a baffle, the method of using the first baffle and the second baffle can reduce the distance of the device extending out of the box, making the curing device suitable for use in confined spaces. Attached Figure Description

[0028] The accompanying drawings are provided to further understand this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof.

[0029] Figure 1 This is a schematic diagram of the curing apparatus provided in one embodiment of this application;

[0030] Figure 2 for Figure 1 The diagram shows the internal structure of the curing device.

[0031] Figure 3 for Figure 1 A schematic diagram of the curing device from another angle;

[0032] Figure 4 for Figure 3A schematic diagram of the structure of the first ventilation component in the curing device shown;

[0033] Figure 5 for Figure 1 A schematic diagram of the internal structure of the curing device from another angle;

[0034] Figure 6 for Figure 5 An enlarged schematic diagram of point A in the curing device shown.

[0035] Label Explanation:

[0036] 100. Curing device; 200. Substrate; 110. Box; 111. Curing chamber; 112. Loading / unloading port; 113. Cooling air duct; 114. Connecting port; 115. Exhaust port; 120. Cover; 121. Sliding rod; 122. Handle; 123. Bearing component; 130. Heating assembly; 131. Mounting base; 132. Heating element; 133. Perforated mesh; 140. Fan; 150. First ventilation assembly; 151. First driving element; 152. First baffle; 153. Connecting element; 1531. Slide groove; 154. Second baffle; 160. Filter element. Detailed Implementation

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0038] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0043] like Figure 1 and Figure 2As shown, this application provides a curing apparatus 100, including a housing 110, a cover 120, and a heating assembly 130. The housing 110 has a curing cavity 111 and a loading / unloading port 112 communicating with the curing cavity 111, the loading / unloading port 112 being located on the outer wall of the housing 110. The cover 120 is movably disposed relative to the housing 110 to open and close the loading / unloading port 112 during movement. The heating assembly 130 is disposed in the housing 110 for heating the curing cavity 111. Thus, the loading / unloading port 112 can be opened through the cover 120, and a substrate 200 coated with photoresist can be placed into the curing cavity 111 through the loading / unloading port 112. Then, the curing cavity 111 is heated by the heating assembly 130 to achieve thermal curing of the photoresist.

[0044] Furthermore, the curing apparatus 100 also includes a fan 140. The housing 110 is also provided with a cooling air duct 113 and a circulating air duct. The air inlet of the cooling air duct 113 forms an air inlet on the outer wall of the housing 110, and the air inlet of the circulating air duct is connected to the bottom of the curing chamber 111. The fan 140 is located at the top of the curing chamber 111, and the air outlets of both the cooling air duct 113 and the circulating air duct face the fan 140, so that the fan 140 can guide the gas in the cooling air duct 113 and the circulating air duct towards the bottom of the curing chamber 111, that is, towards the substrate 200 at the bottom.

[0045] Please also refer to Figure 3 Furthermore, the curing apparatus 100 also includes a first ventilation component 150 and a second ventilation component. Both the first and second ventilation components are disposed within the housing 110. The first ventilation component 150 is used to open and close the air inlet to conduct and block the cooling air duct 113; the second ventilation component can conduct and block the circulating air duct. Thus, during the photoresist thermal curing process, the air inlet can be closed by the first ventilation component 150, and the fan 140 guides the gas from the circulating air duct to the bottom of the curing chamber 111. Subsequently, the gas at the bottom of the curing chamber 111 re-enters the air inlet of the circulating air duct, achieving gas circulation within the curing chamber 111 and ensuring uniform temperature distribution within the curing chamber 111. After the photoresist thermal curing is complete, the air inlet is opened by the first ventilation component 150, and the circulating air duct is blocked by the second ventilation component. The fan 140 guides external cold air into the curing chamber 111, and the cold air is blown towards the substrate 200 below, thereby accelerating the cooling speed of the photoresist and improving efficiency.

[0046] To facilitate understanding of the technical solution of the curing apparatus 100, the workflow of the curing apparatus 100 is described below: Initially, the first ventilation component 150 closes the air inlet, and the second ventilation component opens the circulation air duct. First, the cover 120 is removed from the pick-up and drop-off port 112, and the operator places the substrate 200 into the bottom of the curing chamber 111 through the pick-up and drop-off port 112, and then the cover 120 closes the pick-up and drop-off port 112. Next, the heating component 130 is activated to heat the curing chamber 111, and then the fan 140 is activated to circulate the gas in the curing chamber 111, ensuring uniform temperature distribution and uniform heating of the photoresist. This improves the curing speed while avoiding localized overheating that could cause deformation or cracking of the photoresist. After the photoresist has cured, the heating component 130 is turned off, the air inlet is opened through the first ventilation component 150, and the circulation air duct is blocked through the second ventilation component. The fan 140 guides the outside cold air into the curing chamber 111 through the cooling air duct 113, and blows the cold air toward the substrate 200 below, so that the photoresist is cooled to room temperature.

[0047] It should be explained that, in this embodiment, when the fan 140 guides the outside cold air into the curing chamber 111, it can slightly move the cover 120 so that the loading and unloading port 112 opens a little, thereby replacing the gas in the curing chamber 111 and causing the temperature in the curing chamber 111 to drop rapidly.

[0048] In other embodiments, the housing 110 may also have an exhaust port 115 communicating with the curing chamber 111 (see [reference]). Figure 5 This design allows hot air to escape from the curing chamber 111 during the cooling process, eliminating the need to move the cover 120 to open the access port 112. Furthermore, the diameter of the vent 115 is smaller than that of the access port 112 and the air inlet to prevent a large amount of cold air from entering the curing chamber 111 during the curing process and affecting the heating effect. It should also be noted that when the vent 115 is provided, a sealing ring can be installed on the inner side of the cover 120 (i.e., the side facing the housing 110) to ensure a tight seal when the cover 120 closes the access port 112.

[0049] Using the curing apparatus 100 described above, during the curing process of the photoresist-coated substrate 200 in the curing chamber 111, the first ventilation component 150 closes the air inlet, the second ventilation component opens the circulation duct, and the fan 140 enables the gas to circulate within the curing chamber 111, improving the uniformity of temperature distribution within the curing chamber 111, achieving uniform heating of the substrate 200, and increasing the curing speed. After curing is complete, the first ventilation component 150 opens the air inlet, the second ventilation component closes the circulation duct, and the fan 140 guides outside cold air into the curing chamber 111 and blows it onto the substrate 200 below, which can accelerate the cooling rate of the photoresist, shorten the cooling time, and improve efficiency.

[0050] In one embodiment, the curing apparatus 100 further includes a carrier 123 for supporting the substrate 200. The carrier 123 is connected to the cover 120, and when the cover 120 closes the access port 112, the carrier 123 is located within the curing chamber 111 to cure the substrate 200 on the carrier 123. Similarly, when the cover 120 moves away from the housing 110 to open the access port 112, i.e., when the cover 120 is pulled open from the housing 110, the carrier 123 can be moved out from the access port 112, thereby facilitating the removal and placement of the substrate 200. As an example, the carrier 123 is disposed inside the cover 120 to enter the curing chamber 111 when the cover 120 closes the access port 112; the carrier 123 is detachably disposed from the cover 120 to facilitate replacement of the carrier 123.

[0051] In practical applications, when the carrier 123 is located within the curing chamber 111, the heating assembly 130 is positioned below the carrier 123, and the fan 140 is positioned above the carrier 123. Of course, both the heating assembly 130 and the fan 140 are spaced apart from the carrier 123. During the curing process, the photoresist on the substrate 200 faces the fan 140, which guides hot air towards the photoresist to increase the curing speed. During the cooling process, the fan 140 guides cold air towards the photoresist to increase the cooling speed.

[0052] Please see Figure 2 In one embodiment, the air outlet of the circulating air duct penetrates the inner wall of the cooling air duct 113 and forms a connecting port 114, and the second ventilation component can open and close the connecting port 114. Therefore, in this embodiment, the circulating air duct is connected to the location of the fan 140 through the cooling air duct 113.

[0053] During the curing process, the first ventilation component 150 closes the air inlet, and the second ventilation component opens the connecting port 114. The gas circulation channel at the bottom of the curing chamber 111 enters the cooling channel 113, then flows to the fan 140, and under the action of the fan 140, flows to the substrate 200 at the bottom, realizing gas circulation. After curing is completed, the first ventilation component 150 opens the air inlet, and the second ventilation component closes the connecting port 114. The outside gas enters the curing chamber 111 through the cooling channel 113 under the action of the fan 140 and blows towards the substrate 200, realizing rapid cooling of the substrate 200 and the photoresist.

[0054] In other embodiments, the cooling air duct 113 and the circulating air duct can also be two independent air ducts. Of course, it is preferable that the circulating air duct is connected to the cooling air duct 113.

[0055] Please continue reading. Figure 2In one embodiment, the curing device 100 further includes a filter element 160, which is disposed in the cooling air duct 113 to filter the gas passing through the cooling air duct 113 and prevent external impurities from entering. In practical applications, the filter element 160 is a filter screen and is disposed at the air inlet of the cooling air duct 113.

[0056] Understandably, in combination Figure 3 As can be seen, the filter element 160 is disposed at the air inlet and located within the cooling air duct 113. The first ventilation assembly 150 can cover the air inlet on the outer wall of the housing 110, thereby sealing the air inlet. For further example, please refer to [reference needed]. Figure 4 The first ventilation assembly 150 includes a first drive member 151 and a baffle module. The first drive member 151 is disposed on the housing 110 and located on the outer wall of the housing 110. The first drive member 151 is connected to the baffle module to drive the baffle module to open and close the air inlet.

[0057] Furthermore, the baffle module includes a first baffle 152, a connector 153, and a second baffle 154. A first driving member 151 is connected to one end of the first baffle 152 to drive the first baffle 152 to rotate around a first axis; the connector 153 is rotatably connected to the end of the first baffle 152 away from the first driving member 151 around a second axis, and the second baffle 154 is connected to the connector 153.

[0058] The first axis is parallel to the outer wall of the box 110, the first axis is parallel to the second axis, and the first baffle 152 can pass through the open position and the closed position during the rotation.

[0059] When the first baffle 152 is rotated to the open position, the first baffle 152 is set at an angle to the outer wall of the housing 110, and the second baffle 154 is located at the end of the first baffle 152 away from the housing 110, and the second baffle 154 is set at an angle to the first baffle 152 to avoid obstructing the air inlet and to open the air inlet; when the first baffle 152 is rotated to the closed position, the first baffle 152 and the second baffle 154 are both abutted against the outer wall of the housing 110 and arranged in a direction perpendicular to the first axis to close the air inlet.

[0060] Specifically Figure 4 In the embodiment shown, when the first baffle 152 is rotated to the open position, the first baffle 152 can be perpendicular to the outer wall of the housing 110, while the second baffle 154 is perpendicular to the first baffle 152 under the action of gravity and parallel to the outer wall of the housing 110; when the first baffle 152 is rotated to the closed position, the first baffle 152 is located above the second baffle 154, and the two cooperate to close the air inlet.

[0061] It is understandable that in other embodiments, a separate baffle can also be provided to seal the air inlet. For example, a baffle with a large area can be provided, and the first driving member 151 is connected to the baffle. The baffle moves in the same way as the first baffle 152, and can completely block the air inlet during its movement, thereby sealing the air inlet. Of course, using Figure 4 The baffle module can reduce the distance that the first baffle 152 and the second baffle 154 extend out of the box 110 when they are opened. Using a single baffle can facilitate design and manufacturing. Those skilled in the art can choose according to the actual application situation, and there is no limitation here.

[0062] In one embodiment, connecting protrusions are formed on opposite sides of the end of the first baffle 152 away from the first driving member 151; there are two connecting members 153, each rotatably connected to one of the two connecting protrusions, and the ends of both connecting members 153 away from the first baffle 152 are connected to opposite sides of the second baffle 154. Figure 4 It can be determined that the opposite sides of the first baffle 152 and the opposite sides of the second baffle 154 mentioned above refer to the two sides of the first baffle 152 and the second baffle 154 along a direction parallel to the first axis. Specifically... Figure 4 In the middle, both connectors 153 are provided with sliding grooves 1531, and two connecting protrusions extend into the sliding grooves 1531 of the two connectors 153 respectively, so that the second baffle 154 can rotate relative to the first baffle 152; at the same time, since the connecting protrusions can slide in the sliding grooves 1531, the second baffle 154 can also slide relative to the first baffle 152.

[0063] In a preferred embodiment, the two ends of the first baffle 152 and the second baffle 154 facing each other are rounded corner structures to facilitate relative rotation of the two and ensure that the two rounded corner structures fit more tightly during rotation, thereby improving the sealing effect when sealing the air inlet.

[0064] Furthermore, regarding the second ventilation assembly, it should be noted that its general structure can be similar to that of the first ventilation assembly 150. For example, the second ventilation assembly may include a second driving member and a third baffle. The second driving member drives the third baffle to move, thereby opening and closing the communication port 114 during the movement of the third baffle. Specifically, the first driving member 151 is a motor, and the second driving member can be a cylinder. The cylinder drives the third baffle to move in a linear direction, and the third baffle can close the communication port 114 during its movement.

[0065] In one embodiment, the curing device 100 further includes a slide rod 121. The cover 120 is slidably mounted on the housing 110 via the slide rod 121. Figure 2It can be seen that the cover 120 is connected to the box 110 by a pull-out method. To ensure the stability of the pull-out, there are two sliding rods 121. Furthermore, the sliding rods 121 are connected to the inner side of the cover 120, and the outer side of the cover 120 is also provided with a handle 122.

[0066] Please see Figure 5 and Figure 6 In one embodiment, the bottom wall of the curing chamber 111 is provided with an installation groove, and the heating component 130 is installed in the installation groove to ensure that the heating component 130 is located below the support member 123.

[0067] Furthermore, the heating assembly 130 includes a mounting base 131, a heating element 132, and a perforated mesh 133. The mounting base 131 is installed in the mounting groove, and both the heating element 132 and the perforated mesh 133 are disposed on the mounting base 131, with the perforated mesh 133 located above the heating element 132, i.e., between the heating element 132 and the support member 123. By providing the perforated mesh 133, the heating element 132 can be prevented from directly heating the support member 123, thus preventing the temperature of the support member 123 from becoming too high; at the same time, combined with the air circulation driven by the fan 140 in the curing chamber 111, the temperature in the curing chamber 111 is evenly distributed, and the substrate 200 on the support member 123 is heated evenly.

[0068] In practical applications, the heating element 132 includes a mounting plate and multiple heating rods. The mounting plate is installed on the mounting base 131. The multiple heating rods are divided into multiple layers. The multiple layers of heating rods are arranged radially at intervals along the mounting plate. The multiple heating rods in each layer are arranged circumferentially at intervals along the mounting plate, thereby further achieving uniform heating.

[0069] To facilitate understanding of the technical solution of this application, this document combines... Figure 1 and Figure 2 The working process of the curing apparatus 100 in the above embodiments will be described as follows:

[0070] Initially, the first ventilation component 150 closes the air inlet, and the second ventilation component opens the connection port 114. The operator pulls out the cover 120, and then places the carrier 123 carrying the substrate 200 (coated with photoresist, the same below) inside the cover 120, or places the substrate 200 on the carrier 123 inside the cover 120, and then pushes the cover 120 to close the access port 112, and the carrier 123 moves between the heating component 130 and the fan 140.

[0071] Next, the heating assembly 130 and the fan 140 are activated. The heating assembly 130 heats the curing chamber 111, while the fan 140 simultaneously drives the gas circulation within the curing chamber 111, ensuring uniform heating of the substrate 200 and increasing the curing speed of the photoresist. After the photoresist has cured, the heating assembly 130 is turned off. The first ventilation assembly 150 opens the air inlet, and the second ventilation assembly closes the connecting port 114. The fan 140 guides outside cold air, filtered by the filter 160, into the curing chamber 111 and blows it towards the substrate 200 at the bottom, achieving rapid cooling of the substrate 200. The gas within the curing chamber 111 can be exhausted through the exhaust port 115. After the substrate 200 has cooled, the fan 140 can be turned off, the cover 120 can be pulled out, and then the carrier 123 or the substrate 200 on the carrier 123 can be removed.

[0072] In one embodiment, this application also provides a chip fabrication system, including the curing apparatus 100 in the above embodiments. It is understood that the chip fabrication system also includes apparatus corresponding to each step of the chip fabrication process. The chip fabrication process is prior art, and those skilled in the art can select appropriate apparatus based on the process; therefore, it will not be elaborated upon here.

[0073] In summary, the curing apparatus 100 and chip fabrication system provided in this application have at least the following advantages:

[0074] 1. During the curing process, the fan 140 guides the gas circulation within the curing chamber 111, ensuring uniform heating of the substrate 200, increasing the curing speed, and preventing localized overheating that could cause photoresist deformation or cracking. During the cooling process, the fan 140 guides cool air from the outside into the curing chamber 111 and blows it onto the substrate 200, increasing the cooling rate of the substrate 200. This effectively improves efficiency.

[0075] 2. The support member 123 is connected to the inner side of the cover 120, and the support member 123 can be moved out of the curing cavity 111 during the movement of the cover 120, which facilitates the removal and placement of the substrate 200.

[0076] 3. When the first drive unit 151 drives the first baffle 152 to open the air inlet, the second baffle 154 is tilted relative to the first baffle 152. Compared with the method of closing the air inlet with a baffle, the method of using the first baffle 152 and the second baffle 154 can reduce the distance of the device extending out of the box 110, making the curing device 100 suitable for use in confined spaces.

[0077] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A curing device, characterized in that, include: The housing has a curing chamber, a cooling air duct, and a circulating air duct. The air inlet of the cooling air duct forms an air inlet on the outer wall of the housing. The air inlet of the circulating air duct is connected to the bottom of the curing chamber. The outer wall of the housing is also provided with a loading and unloading port that communicates with the curing chamber. The cover is movably configured relative to the box body to open and close the loading / unloading port during movement; Both the first ventilation component and the second ventilation component are disposed in the housing. The first ventilation component can open and close the air inlet, and the second ventilation component can open and close the circulating air duct. A heating component, disposed in the housing, is used to heat the curing chamber; A fan is installed at the top of the curing chamber. The air outlets of the cooling air duct and the circulating air duct are both directed toward the fan. The fan can guide the gas in the cooling air duct and the circulating air duct to blow towards the bottom of the curing chamber.

2. The curing apparatus according to claim 1, characterized in that, The air outlet of the circulating air duct penetrates the inner wall of the cooling air duct and forms a connecting opening, and the second ventilation component can open and close the connecting opening.

3. The curing apparatus according to claim 1, characterized in that, It also includes a carrier, which is connected to the cover, and when the cover closes the opening, the carrier is located inside the curing cavity.

4. The curing apparatus according to claim 3, characterized in that, When the carrier is located inside the curing chamber, the heating assembly is located below the carrier, and the fan is located above the carrier.

5. The curing apparatus according to claim 1, characterized in that, The bottom wall of the curing chamber is provided with an installation groove, and the heating component is installed in the installation groove.

6. The curing apparatus according to claim 5, characterized in that, The heating assembly includes a mounting base, a heating element, and a perforated mesh. The mounting base is installed in the mounting groove, and both the heating element and the perforated mesh are disposed on the mounting base, with the perforated mesh located above the heating element.

7. The curing apparatus according to claim 1, characterized in that, The first ventilation component includes a first driving element and a baffle module. The first driving element is connected to the baffle module to drive the baffle module to open and close the air inlet.

8. The curing apparatus according to claim 7, characterized in that, The baffle module includes a first baffle, a connector, and a second baffle. The first driving member is connected to one end of the first baffle to drive the first baffle to rotate around a first axis. The connector is rotatably connected to the end of the first baffle away from the first driving member around a second axis. The second baffle is connected to the connector. Wherein, the first axis is parallel to the outer wall of the box, the first axis and the second axis are parallel, and the first baffle can pass through the open position and the closed position during the rotation process; When the first baffle is rotated to the open position, the first baffle is set at an angle to the outer wall of the housing, and the second baffle is located at the end of the first baffle away from the housing, and the second baffle is set at an angle to the first baffle; when the first baffle is rotated to the closed position, both the first baffle and the second baffle are abutted against the outer wall of the housing and arranged in a direction perpendicular to the first axis to close the air inlet.

9. The curing apparatus according to claim 1, characterized in that, It also includes a filter element disposed in the cooling air duct.

10. A chip fabrication system, characterized in that, Includes the curing apparatus according to any one of claims 1-9.

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