Calibration positioning structure of wafer test handler

Abstract

The utility model relates to the technical field of semiconductor manufacturing equipment, concretely is the calibration positioning structure of wafer test sorting machine, including the cabinet body and the sorting machine body of installation above cabinet body, the cabinet body top is fixed with an adjusting mechanism, the adjusting mechanism is located the sorting machine body directly below, the adjusting mechanism includes the base fixed in the cabinet body top, the base top is equipped with an installation ring, a movable ring is rotatably installed on the installation ring. The utility model discloses setting adjusting mechanism on the cabinet body top, utilizes the movable ring of installation ring rotation and drives the adjusting hydraulic cylinder, makes the position adjustment and rotation adjustment of the placing rack connected on the hydraulic cylinder piston rod can be realized in horizontal direction, to accurately adjust the position of wafer body in the placing rack, satisfies the calibration positioning demand of wafer test sorting machine to wafer, improves the positioning accuracy and flexibility when wafer testing.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically to a calibration and positioning structure for a wafer testing and sorting machine. Background Technology

[0002] In the semiconductor manufacturing industry, wafer testing and sorting are critical steps to ensure wafer quality. This requires inspecting each chip on the wafer and classifying and screening them based on the inspection results. Precise wafer positioning is a core prerequisite for ensuring testing accuracy and sorting efficiency in this process.

[0003] Currently, the wafer positioning structures in existing wafer testing and sorting machines often suffer from insufficient positioning accuracy and poor adjustment flexibility. Some positioning structures can only adjust the wafer's position in a single direction, failing to meet the multi-angle and multi-directional positioning requirements during testing. This results in inaccurate contact between the test probe and the chip on the wafer, affecting the accuracy of the test results.

[0004] Meanwhile, some positioning structures are prone to causing scratches and damage to the wafer surface due to improper clamping force control or lack of effective protective measures when clamping and fixing wafers. This damage is especially problematic for high-precision wafers, as it can directly lead to wafer scrap and increase production costs. Therefore, we propose a calibration positioning structure for wafer testing and sorting machines. Utility Model Content

[0005] To overcome the above deficiencies, this utility model provides a calibration and positioning structure for a wafer testing and sorting machine.

[0006] The technical solution of this utility model is: The calibration and positioning structure of a wafer testing and sorting machine includes a cabinet and a sorting machine body mounted on top of the cabinet. An adjustment mechanism is fixedly installed on the top of the cabinet, located directly below the sorting machine body. The adjustment mechanism includes a base fixed to the top of the cabinet, a mounting ring on top of the base, and a movable ring rotatably mounted on the mounting ring. A horizontally positioned adjusting hydraulic cylinder is fixedly connected to the inner wall of the movable ring. A placement frame is fixedly connected to the piston rod of the adjusting hydraulic cylinder, and the wafer body is placed inside the placement frame. By setting an adjustment mechanism on the top of the cabinet, the rotating movable ring on the mounting ring drives the adjusting hydraulic cylinder, enabling the placement frame connected to the piston rod of the hydraulic cylinder to achieve horizontal and rotational position adjustment. This precisely adjusts the position of the wafer body within the placement frame, meeting the calibration and positioning requirements of the wafer testing and sorting machine, and improving the positioning accuracy and flexibility during wafer testing.

[0007] As a preferred technical solution, a support column is fixedly connected to the center of the top of the base, and several support frames are fixedly installed on the top of the support column. The top of the support frames is fixedly connected to the bottom of the mounting ring. The support column and support frames provide stable support for the mounting ring, ensuring the stability of the mounting ring and the components above it during operation and preventing structural shaking from affecting the positioning accuracy of the wafer.

[0008] As a preferred technical solution, a toothed ring is coaxially welded to the bottom of the movable ring, and a drive gear meshes with one side of the toothed ring. An adjusting motor with an output shaft coaxially fixed to the drive gear is mounted below the drive gear. Utilizing the meshing transmission between the toothed ring and the drive gear, the movable ring can be stably rotated under the drive of the adjusting motor, achieving angle adjustment of the wafer body. The transmission method is precise and reliable, facilitating control of the rotation angle of the movable ring.

[0009] As a preferred technical solution, an extension plate is integrally formed on the outer circumference of the mounting ring. The drive gear is rotatably mounted on the top of the extension plate, and the adjusting motor is fixed to the bottom of the extension plate. The extension plate provides mounting positions for the drive gear and the adjusting motor, making their installation more stable and ensuring precise meshing between the drive gear and the gear ring, thus ensuring the stability of the transmission process.

[0010] As a preferred technical solution, the placement rack is symmetrically provided with two arc-shaped clamping plates, and two clamping hydraulic cylinders are symmetrically fixedly installed on the placement rack. The piston rods of the two clamping hydraulic cylinders are respectively fixedly connected to the two arc-shaped clamping plates. The two clamping hydraulic cylinders drive the arc-shaped clamping plates to firmly clamp the wafer body in the placement rack, preventing the wafer from shifting or falling during the adjustment process, and ensuring the stability of the wafer positioning.

[0011] As a preferred technical solution, the wafer body is disposed between two arc-shaped clamping plates, and a protective pad is fixedly connected to the outer wall of the arc-shaped clamping plates on the side closest to the wafer body. The protective pad can play a buffering and protective role when the arc-shaped clamping plates hold the wafer body, avoiding direct contact between the clamping plates and the wafer to prevent surface scratches or damage, thus protecting the integrity of the wafer.

[0012] As a preferred technical solution, a support plate is fixedly connected to the top near the rear side, and the sorting machine body is fixed to the top of the support plate. The support plate provides a stable mounting base for the sorting machine body, enabling the sorting machine body to be firmly fixed above the cabinet, thus ensuring the stability of the sorting machine during operation.

[0013] As a preferred technical solution, a cabinet door is hinged to the front of the cabinet, and a handle is installed on the cabinet door. A support leg is fixedly installed at each of the four corners of the bottom of the cabinet. The cabinet door facilitates maintenance and operation of the internal structure, while the support legs ensure the cabinet is placed more stably, preventing wobbling that could affect the overall structural stability.

[0014] Compared with the prior art, the beneficial effects of this utility model are: This invention features an adjustment mechanism at the top of the cabinet. The rotating movable ring on the mounting ring drives the adjusting hydraulic cylinder, enabling the placement rack connected to the piston rod of the hydraulic cylinder to achieve horizontal position and rotation adjustment. This allows for precise adjustment of the position of the wafer body within the placement rack, meeting the calibration and positioning requirements of the wafer testing and sorting machine, and improving the positioning accuracy and flexibility during wafer testing. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is one of the structural schematic diagrams of the adjustment mechanism in this utility model; Figure 3 This is the second schematic diagram of the adjustment mechanism in this utility model; Figure 4 This is a schematic diagram of the structure of the placement rack and the adjusting hydraulic cylinder in this utility model; The meanings of the labels in the diagram are as follows: 1. Cabinet body; 10. Support plate; 11. Cabinet door; 110. Handle; 2. Adjustment mechanism; 20. Base; 21. Support column; 22. Mounting ring; 23. Support frame; 24. Placement rack; 240. Arc-shaped clamping plate; 241. Clamping hydraulic cylinder; 25. Adjusting hydraulic cylinder; 26. Movable ring; 27. Extension plate; 28. Adjusting motor; 29. ​​Drive gear; 210. Gear ring; 3. Sorter body; 4. Support leg; 5. Wafer body. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figures 1-4 This utility model provides a technical solution: The calibration and positioning structure of the wafer testing and sorting machine includes a cabinet 1 and a sorting machine body 3 mounted on top of the cabinet 1. An adjustment mechanism 2 is fixedly installed on the top of the cabinet 1, located directly below the sorting machine body 3. The adjustment mechanism 2 includes a base 20 fixed to the top of the cabinet 1, with a mounting ring 22 above the base 20. A movable ring 26 is rotatably mounted on the mounting ring 22. A horizontally positioned adjusting hydraulic cylinder 25 is fixedly connected to the inner wall of the movable ring 26. A placement frame 24 is fixedly connected to the piston rod of the adjusting hydraulic cylinder 25, and a wafer body 5 is placed inside the placement frame 24. By setting the adjustment mechanism 2 on the top of the cabinet 1, the movable ring 26 rotating on the mounting ring 22 drives the adjusting hydraulic cylinder 25, enabling the placement frame 24 connected to the piston rod of the hydraulic cylinder to achieve horizontal position and rotation adjustment. This precisely adjusts the position of the wafer body 5 within the placement frame 24, meeting the calibration and positioning requirements of the wafer testing and sorting machine, and improving the positioning accuracy and flexibility during wafer testing.

[0018] In a preferred embodiment, a support column 21 is fixedly connected to the center of the top of the base 20. Several support frames 23 are fixedly installed on the top of the support column 21, and the top of the support frames 23 is fixedly connected to the bottom of the mounting ring 22. The mounting ring 22 is stably supported by the support column 21 and the support frames 23, ensuring the stability of the mounting ring 22 and the components above it during operation, and avoiding the impact of structural shaking on the positioning accuracy of the wafer.

[0019] In a preferred embodiment, a toothed ring 210 is coaxially welded to the bottom of the movable ring 26. A drive gear 29 meshes with one side of the toothed ring 210. An adjustment motor 28, with its output shaft coaxially fixed to the drive gear 29, is mounted below the drive gear 29. Utilizing the meshing transmission between the toothed ring 210 and the drive gear 29, the movable ring 26 can be stably rotated under the drive of the adjustment motor 28, achieving angle adjustment of the wafer body 5. The transmission method is precise and reliable, facilitating control of the rotation angle of the movable ring 26.

[0020] In a preferred embodiment, an extension plate 27 is integrally formed on the outer circumference of the mounting ring 22. The drive gear 29 is rotatably mounted on the top of the extension plate 27, and the adjusting motor 28 is fixed to the bottom of the extension plate 27. The extension plate 27 provides mounting positions for the drive gear 29 and the adjusting motor 28, making their installation more stable, while ensuring precise meshing between the drive gear 29 and the gear ring 210, thus ensuring the stability of the transmission process.

[0021] In a preferred embodiment, the placement frame 24 is symmetrically provided with two arc-shaped clamping plates 240, and two clamping hydraulic cylinders 241 are symmetrically fixedly installed on the placement frame 24. The piston rods of the two clamping hydraulic cylinders 241 are respectively fixedly connected to the two arc-shaped clamping plates 240. The two clamping hydraulic cylinders 241 drive the arc-shaped clamping plates 240 to firmly clamp the wafer body 5 in the placement frame 24, preventing the wafer from shifting or falling during the adjustment process, and ensuring the stability of the wafer positioning.

[0022] In a preferred embodiment, the wafer body 5 is disposed between two arc-shaped clamping plates 240, and a protective pad is fixedly connected to the outer wall of the arc-shaped clamping plates 240 near the wafer body 5. The protective pad can provide buffer protection when the arc-shaped clamping plates 240 clamp the wafer body 5, preventing the clamping plates from directly contacting the wafer and causing surface scratches or damage, thus protecting the integrity of the wafer.

[0023] In a preferred embodiment, a support plate 10 is fixedly connected to the top near the rear side, and the sorting machine body 3 is fixed to the top of the support plate 10. The support plate 10 provides a stable mounting base for the sorting machine body 3, enabling the sorting machine body 3 to be firmly fixed above the cabinet 1, thus ensuring the stability of the sorting machine during operation.

[0024] In a preferred embodiment, a cabinet door 11 is hinged to the front of the cabinet 1, and a handle 110 is installed on the cabinet door 11. A support leg 4 is fixedly installed at each of the four corners of the bottom of the cabinet 1. The cabinet door 11 facilitates the maintenance and operation of the internal structure of the cabinet 1, while the support legs 4 make the cabinet 1 more stable and prevent the cabinet 1 from shaking and affecting the working stability of the overall structure.

[0025] When using the calibration and positioning structure of the wafer testing and sorting machine of this utility model, firstly, the operator places the wafer body 5 in the placement rack 24, and then activates the two clamping hydraulic cylinders 241 on the placement rack 24. The piston rods of the clamping hydraulic cylinders 241 extend, driving the two arc-shaped clamping plates 240 to approach the wafer body 5 and clamp it securely. The protective pads on the arc-shaped clamping plates 240 can prevent damage to the wafer body 5 and ensure that the wafer will not be displaced or fall off during subsequent adjustment.

[0026] To adjust the position of the wafer body 5, the adjustment motor 28 mounted at the bottom of the extension plate 27 is activated. The output shaft of the adjustment motor 28 drives the drive gear 29 to rotate. Since the drive gear 29 meshes with the gear ring 210 at the bottom of the movable ring 26, the rotation of the drive gear 29 will cause the gear ring 210 and the movable ring 26 to rotate together around the mounting ring 22. This, in turn, drives the wafer body 5 to rotate through the adjustment hydraulic cylinder 25 and the placement frame 24, achieving precise angle adjustment. When horizontal position adjustment of the wafer body 5 is required, the adjustment hydraulic cylinder 25 on the inner ring wall of the movable ring 26 is activated. Adjusting the extension and retraction of the piston rod of the hydraulic cylinder 25 drives the placement frame 24 and the wafer body 5 to move horizontally, thereby achieving position calibration of the wafer body 5 in this direction.

[0027] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A calibration and positioning structure for a wafer testing and sorting machine, comprising a cabinet (1) and a sorting machine body (3) mounted on top of the cabinet (1), characterized in that: An adjustment mechanism (2) is fixedly installed on the top of the cabinet (1). The adjustment mechanism (2) is located directly below the sorting machine body (3). The adjustment mechanism (2) includes a base (20) fixed on the top of the cabinet (1). An installation ring (22) is provided above the base (20). A movable ring (26) is rotatably installed on the installation ring (22). A horizontally arranged adjustment hydraulic cylinder (25) is fixedly connected to the inner ring wall of the movable ring (26). A placement frame (24) is fixedly connected to the piston rod of the adjustment hydraulic cylinder (25). A wafer body (5) is provided inside the placement frame (24).

2. The calibration and positioning structure of the wafer testing and sorting machine as described in claim 1, characterized in that: A support column (21) is fixedly connected to the center of the top of the base (20). Several support frames (23) are fixedly installed on the top of the support column (21). The top of the support frame (23) is fixedly connected to the bottom of the mounting ring (22).

3. The calibration and positioning structure of the wafer testing and sorting machine as described in claim 2, characterized in that: A toothed ring (210) is coaxially welded to the bottom of the movable ring (26). A drive gear (29) meshes with one side of the toothed ring (210). An adjustment motor (28) with an output shaft coaxially fixed to the drive gear (29) is installed below the drive gear (29).

4. The calibration and positioning structure of the wafer testing and sorting machine as described in claim 3, characterized in that: An extension plate (27) is integrally formed on the outer circumference of the mounting ring (22). The drive gear (29) is rotatably mounted on the top of the extension plate (27), and the adjustment motor (28) is fixed to the bottom of the extension plate (27).

5. The calibration and positioning structure of the wafer testing and sorting machine as described in claim 4, characterized in that: The placement frame (24) is symmetrically provided with two arc-shaped clamping plates (240), and two clamping hydraulic cylinders (241) are symmetrically fixedly installed on the placement frame (24). The piston rods of the two clamping hydraulic cylinders (241) are respectively fixedly connected to the two arc-shaped clamping plates (240).

6. The calibration and positioning structure of the wafer testing and sorting machine as described in claim 5, characterized in that: The wafer body (5) is located between two arc-shaped clamps (240), and a protective pad is fixedly connected to the outer wall of the arc-shaped clamps (240) on the side closest to the wafer body (5).

7. The calibration and positioning structure of the wafer testing and sorting machine as described in claim 6, characterized in that: A support plate (10) is fixedly connected to the top near the rear side, and the sorting machine body (3) is fixed to the top of the support plate (10).

8. The calibration and positioning structure of the wafer testing and sorting machine as described in claim 7, characterized in that: A cabinet door (11) is hinged to the front of the cabinet (1), and a handle (110) is installed on the cabinet door (11). A support leg (4) is fixedly installed at each of the four corners of the bottom of the cabinet (1).

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