A chip detection apparatus

Abstract

This application provides a chip inspection device, comprising: a first conveyor line for conveying a waffle box, the waffle box having holes for placing chips; a second conveyor line for conveying chips; a first inspection unit disposed above the first conveyor line for inspecting whether a chip is missing from a hole; a first transport unit for transporting chips conveyed by the second conveyor line to the missing chip holes; a second inspection unit disposed above the first conveyor line and downstream of the first inspection unit for inspecting whether the bump surface of the chip in the hole is damaged; and a second transport unit for removing chips with damaged bump surfaces from the holes and transporting them to a defective product unloading area. This inspection device can fill in missing chip holes before chip inspection, preventing error alarms from being triggered during subsequent inspection, thus reducing the need for manual intervention and improving inspection efficiency.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and more specifically, to a chip testing device. Background Technology

[0002] In semiconductor chip manufacturing and testing, chip inspection equipment typically uses waffle cassettes as containers to hold and position chips. Waffle cassettes are designed with multiple slots for precise chip placement, facilitating subsequent automated pick-up, inspection, and sorting operations. However, in actual production, chip loss may occur in the waffle cassette slots, meaning some slots may not be filled with chips as specified. This chip loss issue can cause the inspection equipment to misidentify it as chips falling out or being mixed up, triggering false alarms. This not only increases the need for manual intervention but also results in significant downtime. Utility Model Content

[0003] This application provides at least one chip testing device that can fill in the missing holes of a chip before testing it, so that no error alarms are triggered during subsequent testing, which helps to reduce the need for manual intervention and improve testing efficiency.

[0004] This application provides a chip testing device, including:

[0005] The first conveyor line is used to convey waffle boxes, which are provided with holes for placing chips.

[0006] The second conveyor line is used to transport chips;

[0007] The first detection unit is located above the first conveyor line and is used to detect whether the hole position is missing a chip;

[0008] A first transport unit is used to transport the chip conveyed by the second transport line to the hole where the chip is missing;

[0009] The second detection unit is located above the first conveyor line and downstream of the first detection unit, and is used to detect whether the bump surface of the chip in the hole is damaged.

[0010] The second handling unit is used to remove the chip with the bump surface damaged from the hole and transport it to the defective product unloading area.

[0011] In one optional implementation, both the first detection unit and the second detection unit include a first fixed base, a first lifting module, and a first camera;

[0012] The first fixing seat is disposed above the first conveyor line;

[0013] The first lifting module is disposed on the first fixed base, and the first lifting module is used to drive the first camera to move along the height direction;

[0014] The first camera is mounted on the first lifting module and is used to capture images of the chip in the waffle box.

[0015] In one optional implementation, the first detection unit and the second detection unit are respectively disposed in the first transport unit and the second transport unit.

[0016] In one optional embodiment, both the first transport unit and the second transport unit include a second fixed base, a second lifting module, a picking mechanism, a first linear module, and a second linear module.

[0017] The second fixing seat is disposed above the first conveyor line;

[0018] The second lifting module is disposed on the second fixed base, and the second lifting module is used to drive the picking mechanism to reciprocate along the height direction;

[0019] The picking mechanism is disposed in the second lifting module, and the picking mechanism is used to pick up and place chips;

[0020] The first linear module is mounted above the first conveyor line and connected to the second fixed base. The first linear module is used to drive the second fixed base to move in a direction perpendicular to the conveying direction of the first conveyor line.

[0021] The second linear module is disposed on both sides of the first conveyor line and is respectively connected to the two ends of the first linear module. The second linear module is used to drive the first linear module to move in a direction parallel to the conveying direction of the first conveyor line.

[0022] In one alternative implementation, the pickup mechanism includes a third lifting module and a suction nozzle;

[0023] The third lifting module is disposed on the second lifting module, and the third lifting module is used to adjust the height of the suction nozzle;

[0024] The suction nozzle is disposed on the third lifting module, and the suction nozzle is used to adsorb and release the chip.

[0025] In one alternative embodiment, the picking mechanism further includes a mounting base and a rotary motor;

[0026] The mounting base is disposed on the third lifting module, and the suction nozzle is rotatably disposed on the mounting base;

[0027] The rotary motor is mounted on the mounting base and connected to the suction nozzle. The rotary motor is used to drive the suction nozzle to rotate relative to the connecting frame in order to adjust the chip feeding angle.

[0028] In one alternative implementation, the number of the picking mechanisms is multiple.

[0029] In one alternative implementation, the first transport unit and the second transport unit share the second linear module.

[0030] In one optional embodiment, the chip inspection device further includes:

[0031] A positioning unit is disposed in the activity trajectory of the first transport unit and is used to position the chip transported by the first transport unit so that the first transport unit can adjust the chip placement position according to the positioning information.

[0032] In one alternative implementation, the positioning unit includes a third mounting base and a second camera;

[0033] The third fixing seat is disposed below the first transport unit;

[0034] The second camera is mounted on the third mounting base and is used to capture images of the chip during the handling process.

[0035] The above-mentioned technical solution of this application has the following beneficial technical effects:

[0036] The testing equipment in this application embodiment, by adding a second conveyor line, a first testing unit, and a first handling unit to the original equipment, can fill in the missing holes of the chip before testing the chip, so that no error alarms will be triggered during subsequent testing, which helps to reduce the need for manual intervention and improve testing efficiency.

[0037] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0038] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0039] Figure 1 This paper shows a plan view of a chip testing device provided in an embodiment of this application;

[0040] Figure 2 A schematic diagram of the installation of the first detection unit provided in an embodiment of this application is shown;

[0041] Figure 3 This paper shows a schematic diagram of the defective product unloading unit provided in an embodiment of this application;

[0042] In the picture:

[0043] 100. First conveyor line; 110. First loading module; 120. First unloading module; 200. Second conveyor line; 210. Second loading module; 220. Second unloading module; 300. First detection unit; 310. First fixed base; 320. First lifting module; 330. First camera; 340. Light source; 400. First handling unit; 410. Second fixed base; 420. Second lifting module; 430. Picking mechanism; 43 1. Third lifting module; 432. Suction nozzle; 433. Mounting base; 434. Rotary motor; 440. First linear module; 450. Second linear module; 500. Second detection unit; 600. Second handling unit; 700. Positioning unit; 710. Third fixed base; 720. Second camera; 800. Defective product unloading unit; 810. Waffle box fixing base; 820. First lifting platform; 830. Second lifting platform; 840. Robotic arm. Detailed Implementation

[0044] Various exemplary embodiments of this application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this application.

[0045] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0046] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0047] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0048] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0049] refer to Figures 1 to 3 This application provides a chip testing device that can fill in the missing holes of a chip before testing it, so that no error alarms are triggered during subsequent testing, which helps to reduce the need for manual intervention and improve testing efficiency.

[0050] Specifically, the chip testing equipment includes a base plate and a first conveyor line 100, a second conveyor line 200, a first testing unit 300, a first handling unit 400, a second testing unit 500, and a second handling unit 600 disposed on the base plate. The first conveyor line 100 conveys a waffle box with holes for placing chips. The second conveyor line 200 conveys a tray for placing chips. The first testing unit 300 is positioned above the first conveyor line 100 and detects whether any holes are missing chips. The first handling unit 400 handles chips (from the tray) conveyed by the second conveyor line 200 to the missing holes. The second testing unit 500 is positioned above the first conveyor line 100 and downstream of the first testing unit 300, and detects whether the bump surface of the chip in the hole is damaged. The second handling unit 600 removes chips with damaged bump surfaces from the holes and handles them to a defective product unloading area.

[0051] The testing equipment in this application embodiment, by adding a second conveyor line 200, a first testing unit 300 and a first handling unit 400 to the original equipment, can fill the missing holes of the chip before testing the chip, so that no error alarm will be triggered during the subsequent testing process, which helps to reduce the need for manual intervention and improve testing efficiency.

[0052] refer to Figure 1 In some embodiments, the first conveyor line 100 and the second conveyor line 200 are arranged parallel to each other. That is, the conveying direction of the first conveyor line 100 is the same as the conveying direction of the second conveyor line 200. Of course, the arrangement of the first conveyor line 100 and the second conveyor line 200 can be selected according to the actual situation and is not limited to the arrangement discussed above.

[0053] In some embodiments, both the first conveyor line 100 and the second conveyor line 200 are provided with liftable stops. For example, when the stop of the first conveyor line 100 is raised, it can block the waffle box, stopping it below the first detection unit 300 / second detection unit 500; when the stop of the second conveyor line 200 is raised, it can prevent the tray from stopping the waffle box at the pick-up position of the first handling unit 400. Of course, in other embodiments, the first conveyor line 100 and the second conveyor line 200 can also stop the waffle box and tray at a designated position by stopping the machine.

[0054] In some embodiments, the loading end and unloading end of the first conveyor line 100 and the second conveyor line 200 are respectively provided with a loading module and an unloading module. For example, Figure 2As shown, the first conveyor line 100 is provided with a first feeding module 110 and a first discharging module 120 at its feeding end and discharging end, respectively. The first feeding module 110 is used to feed waffle boxes into the first conveyor line 100, and the first discharging module 120 is used to collect the tested waffle boxes and send them out. The second conveyor line 200 is provided with a second feeding module 210 and a second discharging module 220 at its feeding end and discharging end, respectively. The second feeding module 210 is used to feed trays into the second conveyor line 200, and the second discharging module 220 is used to collect empty trays and send them out.

[0055] In some embodiments, the first feeding module 110, the first unloading module 120, the second feeding module 210, and the second unloading module 220 all include a lifting platform and an electric lever. The lifting platform is used to transport waffle boxes or trays along the height direction, and the electric lever is disposed on the lifting platform and used to move the waffle boxes or trays laterally to realize the loading and unloading of waffle boxes or trays. Of course, the arrangement of the first feeding module 110, the first unloading module 120, the second feeding module 210, and the second unloading module 220 can be selected according to the actual situation and is not limited to the arrangement discussed above.

[0056] refer to Figure 2 In some embodiments, the first detection unit 300 includes a first fixed base 310, a first lifting module 320, and a first camera 330. The first fixed base 310 is disposed above the first conveyor line 100. The first lifting module 320 is disposed on the first fixed base 310 and is used to drive the first camera 330 to move along the height direction. The first camera 330 is disposed on the first lifting module 320 and is used to capture images of the chips in the waffle box. In specific use, after the first conveyor line 100 conveys the waffle box to the area below the first detection unit 300, the first lifting module 320 drives the first camera 330 to move along the height direction to adjust the shooting height of the first camera 330. The first camera 330 captures images of the chips in the waffle box from top to bottom, and the processing system can then determine whether there are missing chip holes in the waffle box based on the captured images. Furthermore, to improve image quality, the first detection unit 300 also includes a light source 340, which is disposed on the first fixed base 310 and used to illuminate the shooting area of ​​the first camera 330. In a specific implementation, the first lifting module 320 can be a linear module or other linear movement mechanism. In this embodiment, the second detection unit 500 has the same structure as the first detection unit 300, and the images it captures can be transmitted to the processing system, allowing the processing system to determine whether the bump surfaces of each chip in the waffle box are damaged based on the captured images.

[0057] refer to Figure 2In some embodiments, the first detection unit 300 is disposed on the first transport unit 400. That is, the first detection unit 300 is indirectly disposed on the base plate through the first transport unit 400. For installation methods using additional brackets, this arrangement can reduce the number of brackets used, save costs, and reduce the size of the equipment. Similarly, the second detection unit 500 can also be disposed on the second transport unit 600 to achieve the above effects.

[0058] refer to Figure 1 and Figure 2 In some embodiments, the first conveying unit 400 includes a second fixed base 410, a second lifting module 420, a picking mechanism 430, a first linear module 440, and a second linear module 450. The second fixed base 410 is disposed above the first conveyor line 100. The second lifting module 420 is disposed on the second fixed base 410 and is used to drive the picking mechanism 430 to reciprocate along the height direction. The picking mechanism 430 is disposed on the second lifting module 420 and is used to pick up and place chips. The first linear module 440 spans above the first conveyor line 100 and is connected to the second fixed base 410. The first linear module 440 is used to drive the second fixed base 410 to move in a direction perpendicular to the conveying direction of the first conveyor line 100. The second linear module 450 is disposed on both sides of the first conveyor line 100 and connected to the two ends of the first linear module 440 respectively. The second linear module 450 is used to drive the first linear module 440 to move in a direction parallel to the conveying direction of the first conveyor line 100. That is, the second lifting module 420, the first linear module 440, and the second linear module 450 constitute a three-axis robot, and the picking mechanism 430 is disposed at the end of the three-axis robot. During use, the first linear module 440 and the second linear module 450 are used to adjust the horizontal position of the picking mechanism 430, and the second lifting module 420 is used to adjust the vertical position of the picking mechanism 430. The picking mechanism 430 is used to pick up and release chips to realize the picking, handling, and unloading of chips. In specific implementations, the second lifting module 420 can be a linear module or other linear movement mechanism. In this embodiment, the second handling unit 600 and the first handling unit 400 have the same structure.

[0059] In some embodiments, the second fixing base 410 and the first fixing base 310 are an integral structure.

[0060] refer to Figure 2In some embodiments, the pickup mechanism 430 includes a third lifting module 431 and a suction nozzle 432. The third lifting module 431 is disposed on the second lifting module 420 and is used to adjust the height of the suction nozzle 432. The suction nozzle 432 is disposed on the third lifting module 431 and is used to adsorb and release the chip. That is, the pickup mechanism 430 picks up the chip through the adsorption of the suction nozzle 432. During the handling process, the suction nozzle 432 can first be driven down a certain height by the second lifting module 420, and then the height of the suction nozzle 432 can be finely adjusted by the third lifting module 431 so that the suction nozzle 432 reaches the position where it can pick up and release the chip. In specific implementations, the third lifting module 431 can be a linear module or other linear movement mechanism, and the control precision of the third lifting module 431 can be higher than that of the second lifting module 420. For example, the second lifting module 420 uses a gear and rack mechanism for transmission, and the third lifting module 431 uses a lead screw and nut mechanism for transmission.

[0061] In some embodiments, the picking mechanism 430 further includes a mounting base 433 and a rotary motor 434. The mounting base 433 is disposed on the third lifting module 431, and the suction nozzle 432 is rotatably disposed on the mounting base 433. The rotary motor 434 is disposed on the mounting base 433 and connected to the suction nozzle 432. The rotary motor 434 is used to drive the suction nozzle 432 to rotate relative to the connecting frame to adjust the chip feeding angle. That is, the suction nozzle 432 is mounted on the third lifting module 431 via the mounting base 433, and the suction nozzle 432 is rotatable. In practical use, by selecting the motor to drive the suction nozzle 432 to rotate, the angle of the picked-up chip can be adjusted to accurately place the chip into the corresponding hole.

[0062] In some embodiments, the number of picking mechanisms 430 is multiple. For example, such as... Figure 2 As shown, there are two picking mechanisms 430, arranged side by side in a horizontal direction. In use, each picking mechanism 430 can pick up two chips. This arrangement improves handling efficiency.

[0063] In some embodiments, the first conveying unit 400 and the second conveying unit 600 share the second linear module 450. For example, as Figure 1 As shown, the second conveying unit 600 eliminates the second linear module, and the first linear module of the second conveying unit 600 is directly mounted on the first linear module 440 of the first conveying unit 400. This arrangement simplifies the equipment structure and saves costs.

[0064] refer to Figure 1In some embodiments, the chip testing equipment further includes a positioning unit 700, which is disposed in the movement trajectory of the first transport unit 400 and is used to position the chip transported by the first transport unit 400 so that the first transport unit 400 adjusts the chip placement position according to the positioning information. For example, during the process of the first transport unit 400 transporting the chip along a direction perpendicular to the transport direction of the first conveyor line 100, the positioning unit 700 can position the chip being transported in the transport direction of the first conveyor line 100. When there is a deviation in the position of the chip in the transport direction of the first conveyor line 100, the second linear module 450 can drive the first linear module 440 to move to adjust the position of the first linear module 440 in the transport direction of the first conveyor line 100, thereby adjusting the position of the chip in the transport direction of the first conveyor line 100, so that when the second lifting module 420 drives the picking mechanism 430 to descend, the chip can be accurately delivered into the corresponding hole.

[0065] refer to Figure 1 In some embodiments, the positioning unit 700 includes a third fixing base 710 and a second camera 720. The third fixing base 710 is disposed below the first transport unit 400 (e.g., on a base plate). The second camera 720 is disposed on the third fixing base 710 and is used to capture images of the chip during the transport process. That is, during the process of the first transport unit 400 transporting the chip in a direction perpendicular to the transport direction of the first transport line 100, the second camera 720 can capture images of the picked-up chip from bottom to top. The processing system can determine the positional deviation of the chip in the transport direction of the first transport line 100 based on the captured images, so that the first transport unit 400 can appropriately adjust the position of the chip, thereby accurately placing the chip into the corresponding hole.

[0066] refer to Figure 1 In some embodiments, the chip inspection equipment further includes a defective product unloading unit 800, which is disposed in a defective product unloading area and is used to collect chips with damaged bump surfaces. For example, Figure 3As shown, the defective product unloading unit 800 includes a waffle box holder 810, a first lifting platform 820, a second lifting platform 830, and a robotic arm 840. The waffle box holder 810 is used to hold empty waffle boxes. The second conveying unit 600 is used to move damaged chips into the waffle box. The first lifting platform 820 is used to stack empty waffle boxes, and the second lifting platform 830 is used to stack waffle boxes filled with damaged chips. The robotic arm 840 is used to move empty waffle boxes from the first lifting platform 820 to the waffle box holder 810 or to move waffle boxes filled with damaged chips to the second lifting platform 830. Both the first lifting platform 820 and the second lifting platform 830 are controlled by pneumatic or electric push rods to accommodate changes in the thickness of the stacked waffle boxes.

[0067] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the scope of protection of this application.

[0068] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chip testing device, characterized in that, include: The first conveyor line is used to convey waffle boxes, which are provided with holes for placing chips. The second conveyor line is used to transport chips; The first detection unit is located above the first conveyor line and is used to detect whether the hole position is missing a chip; A first transport unit is used to transport the chip conveyed by the second transport line to the hole where the chip is missing; The second detection unit is located above the first conveyor line and downstream of the first detection unit, and is used to detect whether the bump surface of the chip in the hole is damaged. The second handling unit is used to remove the chip with the bump surface damaged from the hole and transport it to the defective product unloading area.

2. The chip testing equipment according to claim 1, characterized in that, Both the first detection unit and the second detection unit include a first fixed base, a first lifting module, and a first camera; The first fixing seat is disposed above the first conveyor line; The first lifting module is disposed on the first fixed base, and the first lifting module is used to drive the first camera to move along the height direction; The first camera is mounted on the first lifting module and is used to capture images of the chip in the waffle box.

3. The chip testing equipment according to claim 1, characterized in that, The first detection unit and the second detection unit are respectively disposed in the first transport unit and the second transport unit.

4. The chip testing equipment according to claim 1, characterized in that, Both the first transport unit and the second transport unit include a second fixed base, a second lifting module, a picking mechanism, a first linear module, and a second linear module; The second fixing seat is disposed above the first conveyor line; The second lifting module is disposed on the second fixed base, and the second lifting module is used to drive the picking mechanism to reciprocate along the height direction; The picking mechanism is disposed in the second lifting module, and the picking mechanism is used to pick up and place chips; The first linear module is mounted above the first conveyor line and connected to the second fixed base. The first linear module is used to drive the second fixed base to move in a direction perpendicular to the conveying direction of the first conveyor line. The second linear module is disposed on both sides of the first conveyor line and is respectively connected to the two ends of the first linear module. The second linear module is used to drive the first linear module to move in a direction parallel to the conveying direction of the first conveyor line.

5. The chip testing equipment according to claim 4, characterized in that, The pickup mechanism includes a third lifting module and a suction nozzle; The third lifting module is disposed on the second lifting module, and the third lifting module is used to adjust the height of the suction nozzle; The suction nozzle is disposed on the third lifting module, and the suction nozzle is used to adsorb and release the chip.

6. The chip testing equipment according to claim 5, characterized in that, The pickup mechanism also includes a mounting base and a rotary motor; The mounting base is disposed on the third lifting module, and the suction nozzle is rotatably disposed on the mounting base; The rotary motor is mounted on the mounting base and connected to the suction nozzle. The rotary motor is used to drive the suction nozzle to rotate relative to the connecting frame in order to adjust the chip feeding angle.

7. The chip testing equipment according to claim 5, characterized in that, The number of the picking mechanisms is multiple.

8. The chip testing equipment according to claim 4, characterized in that, The first transport unit and the second transport unit share the second linear module.

9. The chip testing equipment according to claim 1, characterized in that, The chip testing equipment also includes: A positioning unit is disposed in the activity trajectory of the first transport unit and is used to position the chip transported by the first transport unit so that the first transport unit can adjust the chip placement position according to the positioning information.

10. The chip testing equipment according to claim 9, characterized in that, The positioning unit includes a third fixed base and a second camera; The third fixing seat is disposed below the first transport unit; The second camera is mounted on the third mounting base and is used to capture images of the chip during the handling process.

Images