Isolation layer processing device based on ring cutting and wire harness automatic assembly line

Abstract

The utility model discloses a kind of isolation layer processing device and pencil automatic assembly line based on annular cutting, laser cutting device includes clamping unit, for fixing the section of pencil to be handled, the processing position of section to be handled is provided with processing path;Laser output unit, including laser light source, laser light source is used to output processing beam to processing position, processing beam is used to eliminate the isolation layer of processing position, processing beam is perpendicular with the axis of processing position;Rotary unit, with anyone of clamping unit, laser output unit is connected, rotary unit can drive clamping unit or laser output unit rotation, to make processing beam can eliminate the isolation layer of processing position along processing path. Pencil automatic assembly line has applied above-mentioned laser cutting device.

Description

Technical Field

[0001] This utility model relates to the field of wire harness production technology, and in particular to an isolation layer processing device based on ring cutting and an automatic wire harness assembly line. Background Technology

[0002] In the wire harness production process, before crimping terminals onto the wire cores, specific areas of the wire harness require separation of the wire cores and shielding layer. This process necessitates the precise removal of the outer insulating layer from these areas. Traditional insulating layer stripping processes rely on two main methods: one is entirely manual, where workers use hand tools to peel off the outer sheath layer by layer. This method is not only inefficient but also lacks precision. The other is handheld mechanical cutting, where the operator holds the wire harness in place and uses a hand-held cutter to circumferentially cut the insulating layer. This method suffers from difficulties in controlling the cutting depth and uneven cuts. Both traditional methods have significant technical drawbacks: manual operation can easily lead to residual insulating layer or damage to the internal wire cores, while mechanical cutting may produce burrs or tilted cuts due to uneven force. More seriously, traditional processes struggle to ensure consistency across different parts of the wire harness during mass production, directly impacting the quality stability of subsequent shielding layer processing and terminal crimping. Furthermore, manual operation is labor-intensive and poses numerous safety hazards, failing to meet the dual demands of efficiency and precision in modern wire harness production. Utility Model Content

[0003] This utility model aims to solve at least one of the technical problems existing in the prior art. To this end, this utility model proposes an isolation layer processing device based on ring cutting and an automatic wire harness assembly line. The automatic wire harness assembly line uses the laser cutting device provided in this application, which has the advantages of improving cutting accuracy, avoiding damage to the wire core, and improving processing efficiency.

[0004] In a first aspect, the isolation layer processing apparatus based on ring cutting according to an embodiment of the present invention includes:

[0005] The clamping unit is used to fix the section of the wire harness to be processed, and the processing position of the section to be processed is set with a processing path;

[0006] The laser output unit includes a laser source, which outputs a processing beam to the processing position. The processing beam is used to eliminate the isolation layer at the processing position, and the processing beam is perpendicular to the axis of the processing position.

[0007] The rotating unit is connected to either the clamping unit or the laser output unit. The rotating unit can drive the clamping unit or the laser output unit to rotate so that the processing beam can eliminate the isolation layer at the processing position along the processing path.

[0008] The isolation layer processing device based on ring cutting according to the embodiments of this utility model has at least the following beneficial effects: This application uses a clamping unit to rigidly fix the wire harness segment to be processed, avoiding displacement deviations caused by manual handling. Simultaneously, the preset processing path provides a precise trajectory reference for laser cutting. The laser output unit uses a processing beam perpendicular to the wire harness axis, concentrating laser energy onto the surface of the isolation layer and avoiding damage to the internal wire core. The rotating unit drives the clamping unit or laser output unit to rotate, causing the processing beam to move along the preset ring processing path, achieving continuous circumferential cutting of the isolation layer. The connection method between the rotating unit and the clamping unit or laser output unit is selective; either the cutting path can be covered by rotating the wire harness, or the cutting trajectory can be completed by rotating the laser head. Both modes overcome the limitations of traditional manual ring cutting operations, achieving automated precision processing.

[0009] The isolation layer processing device based on ring cutting according to the present utility model embodiment further includes an installation mechanism. The installation mechanism includes a fixed base, a clamping unit fixedly connected to the fixed base, a rotating unit mounted on the fixed base, and a laser output unit connected to the rotating unit. The rotating unit can drive the laser output unit to rotate around the processing position so that the processing beam can eliminate the isolation layer at the processing position along the processing path.

[0010] or,

[0011] It also includes an installation mechanism, which includes a fixed base, a laser output unit fixedly connected to the fixed base, a rotating unit mounted on the fixed base, and rotating units connected to each other. The rotating units can drive the clamping unit to rotate so that the processing beam can eliminate the isolation layer at the processing position along the processing path.

[0012] According to the embodiment of the present invention, the isolation layer processing device based on ring cutting includes a rotating unit comprising a rotating drive and a rotating connecting seat. The rotating connecting seat is rotatably connected to a fixed seat. The output end of the rotating drive is connected to the rotating connecting seat in a transmission manner. The laser output unit is fixedly connected to the rotating connecting seat.

[0013] According to the embodiment of the present invention, the isolation layer processing device based on ring cutting has a clamping unit coaxially arranged with a rotating connecting seat, and a laser output unit located away from the center of the rotating connecting seat.

[0014] According to the embodiment of the present invention, the isolation layer processing device based on ring cutting has the output end of the laser light source and the rotating connecting seat on the same side. A first optical path and a second optical path are provided along the output path of the processing beam. The first optical path is parallel to the axis of the segment to be processed, and the second optical path is perpendicular to the axis of the segment to be processed.

[0015] or,

[0016] The output end of the laser source is located on one side of the section to be processed, and a first optical path is set along the output path of the processing beam. The first optical path is perpendicular to the axis of the section to be processed.

[0017] According to the embodiment of the present invention, an isolation layer processing device based on ring cutting is provided between the first optical path and the second optical path. The processing beam can enter the second optical path from the first optical path through the optical path switching unit so as to focus on the processing position of the segment to be processed.

[0018] According to the embodiment of the present invention, the isolation layer processing device based on ring cutting has a retractable first bracket on the rotating connecting seat, and the refractive element is installed on the first bracket. The first bracket can drive the optical path switching unit away from or near the laser source.

[0019] The isolation layer processing device based on ring cutting according to the present utility model embodiment further includes a translation mechanism. The translation mechanism includes a translation drive, a slide rail and a slide base. The slide rail and the slide base are slidably connected. The mounting mechanism is connected to the slide base. The output end of the translation drive is connected to the slide base. The translation drive can drive the clamping unit away from or close to the section of the wire harness to be processed.

[0020] The isolation layer processing device based on ring cutting according to an embodiment of the present invention further includes a waste recycling mechanism, which includes a collection hopper disposed below the clamping unit and a collection box connected to the collection hopper.

[0021] Secondly, the automatic wire harness assembly line according to the embodiments of the present invention utilizes the aforementioned isolation layer processing device based on ring cutting.

[0022] The automatic wire harness assembly line according to the embodiments of this utility model has at least the following beneficial effects: This application uses a clamping unit to rigidly fix the wire harness section to be processed, avoiding displacement deviations caused by manual handling. Simultaneously, the preset processing path provides a precise trajectory reference for laser cutting. The laser output unit uses a processing beam perpendicular to the wire harness axis, concentrating laser energy onto the surface of the insulating layer and preventing damage to the internal wire core. The rotating unit drives the clamping unit or laser output unit to rotate, causing the processing beam to move along a preset annular processing path, achieving continuous circumferential cutting of the insulating layer. The connection method between the rotating unit and the clamping unit or laser output unit is selective; either the cutting path can be covered by rotating the wire harness, or the cutting trajectory can be completed by rotating the laser head. Both modes overcome the limitations of traditional manual circumferential cutting, achieving automated precision processing.

[0023] Furthermore, the automatic wire harness assembly line provided in this application is equipped with two laser cutting devices arranged side by side.

[0024] When the rotating unit in the laser cutting device is connected to the laser output unit and drives the laser output unit to rotate to achieve continuous circumferential cutting of the isolation layer, this connection method can achieve simultaneous processing of two wire bundles, or simultaneous processing of both ends of the same wire bundle.

[0025] When the rotating unit in the laser cutting device is connected to the clamping unit and drives the clamping unit to rotate to achieve continuous circumferential cutting of the isolation layer, this connection method can simultaneously process the segments to be processed of two wire bundles.

[0026] According to the automatic wire harness assembly line of this utility model embodiment, two laser cutting devices are arranged side by side.

[0027] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0028] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0029] Figure 1 This is a structural diagram of the laser cutting device according to an embodiment of the present invention from a first-view perspective;

[0030] Figure 2 This is a structural diagram of the laser cutting device according to an embodiment of the present invention from a second perspective.

[0031] Figure 3 This is a partial structural diagram of the laser cutting device according to an embodiment of the present invention;

[0032] Figure 4 This is a schematic diagram of the structure of the second embodiment of the laser cutting device of this utility model.

[0033] Explanation of reference numerals in the attached figures:

[0034] Section 1 to be processed;

[0035] Clamping unit 100;

[0036] Laser source 200;

[0037] Rotating unit 300; Rotating drive component 310; Rotating connecting seat 320;

[0038] Mounting base 400;

[0039] Optical path switching unit 500;

[0040] First support 600;

[0041] Translation mechanism 700;

[0042] Waste recycling mechanism 800; collection hopper 810; collection box 820. Detailed Implementation

[0043] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0044] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0045] In the description of a utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If the terms "first" and "second" are used, they are merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly specifying the number of indicated technical features or the order of the indicated technical features.

[0046] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0047] Reference Figures 1 to 3 This utility model provides an isolation layer processing device based on ring cutting. Specifically, the laser cutting device includes a clamping unit 100, a laser output unit, and a rotating unit 300.

[0048] The clamping unit 100 is used to fix the section 1 of the wire harness to be processed, and the processing position of the section 1 to be processed is provided with a processing path; the laser output unit includes a laser source 200, which is used to output a processing beam to the processing position, the processing beam is used to eliminate the isolation layer at the processing position, and the processing beam is perpendicular to the axis of the processing position; the rotating unit 300 is connected to either the clamping unit 100 or the laser output unit, and the rotating unit 300 can drive the clamping unit 100 or the laser output unit to rotate so that the processing beam can eliminate the isolation layer at the processing position along the processing path.

[0049] Understandably, after the wire harness is fixed by the clamping unit 100, the processing position of its segment 1 to be processed is determined by a preset path to determine the cutting trajectory. The processing beam emitted by the laser source 200 is incident in a direction perpendicular to the wire harness axis and focused on the surface of the isolation layer. The processing beam forms a continuous annular cutting trajectory on the surface of the isolation layer. Since the laser energy is concentrated on the surface of the isolation layer, the cutting depth can be precisely controlled by adjusting the laser power and the spot diameter to avoid damaging other parts inside the wire harness.

[0050] In this application, the processing path is the processing path parameter preset by the control unit.

[0051] In some embodiments of this application, the rotating unit 300 is connected to the clamping unit 100, and the rotating unit 300 can drive the clamping unit 100 to rotate, so that the wire bundle rotates while the laser output unit remains stationary. It is understood that, referring to the reference figures, when the rotating unit 300 drives the clamping unit 100 to rotate the wire bundle, the processing beam forms a continuous annular cutting trajectory on the surface of the isolation layer to complete the circumferential cutting of the wire bundle isolation layer.

[0052] In other embodiments of this application, such as Figure 1 As shown, the rotating unit 300 is connected to the laser output unit, and the rotating unit 300 can drive the laser output unit to rotate so that the processing beam rotates around the section 1 to be processed of the wire bundle. That is, it can be understood that when the rotating unit 300 drives the laser output unit to rotate, the laser output unit makes a circular motion with the axis of the section 1 to be processed of the wire bundle as the center, so as to realize the circumferential cutting of the isolation layer of the wire bundle.

[0053] This solution eliminates human error through rigid clamping, and laser cutting enables non-contact processing. The rotating mechanism ensures the closure and consistency of the cutting path, achieving automated cutting of the wire harness isolation layer and solving the problems of low efficiency and unstable cutting quality in manual operation. It is important to note that the laser beam focused on the wire harness surface is perpendicular to the axis of the segment 1 to be processed, ensuring cutting efficiency while avoiding damage to the wire conductor and guaranteeing a smooth cut.

[0054] Furthermore, in practical applications of this application, the laser cutting apparatus of this application also includes a mounting mechanism, specifically, such as... Figure 1 As shown, the mounting mechanism includes a fixed base 400, a clamping unit 100 fixedly connected to the fixed base 400, a laser output unit connected to a rotating unit 300, and the rotating unit 300 can drive the laser output unit to rotate around the processing position of the wire bundle segment 1 to be processed, so that the processing beam can follow the processing path to complete the cutting of the isolation layer at the processing position.

[0055] Furthermore, such as Figure 1and Figure 2 As shown, the rotating unit 300 includes a rotating drive component 310 and a rotating connecting seat 320. The rotating connecting seat 320 is rotatably connected to the fixed seat 400. The output end of the rotating drive component 310 is drively connected to the rotating connecting seat 320, and the laser output unit is fixedly connected to the rotating connecting seat 320. It should be noted that when the clamping unit 100 is fixedly connected to the fixed seat 400, and the rotating unit 300 drives the laser output unit to rotate around the wire bundle, the clamping unit 100 and the rotating connecting seat 320 are coaxial, while the laser output unit is positioned close to the edge of the rotating connecting seat 320. It can be understood that the clamping unit 100 is fixedly connected to the axial end face of the rotating connecting seat 320 via a flange, and the axial error between the two is controlled within a set tolerance range. The laser output unit is mounted on the outer peripheral edge of the rotating connecting seat 320 via a cantilever bracket, and its light output direction is always perpendicular to the wire bundle axis. When the rotating connector 320 drives the clamping unit 100 and the wire bundle to rotate around the axis, the laser beam forms a circular cutting trajectory on the surface of the section to be processed 1. Since the coaxiality of the clamping unit 100 and the rotation axis is guaranteed, the wire bundle will not have radial displacement during rotation. At the same time, the external layout of the laser output unit avoids the risk of collision between the optical components and the wire bundle during rotation, effectively eliminating the cutting position offset caused by assembly deviation during rotation processing, and ensuring that the laser beam accurately removes the isolation layer along the preset path. The eccentric layout of the laser output unit expands the beam's effective range, which can adapt to the processing requirements of wire bundles of different specifications, while avoiding spatial interference problems between the rotating mechanism and the optical system.

[0056] The output shaft of the rotary drive 310 is rigidly connected to the drive shaft of the rotary connector 320 via a spline. The rotary connector 320 is mounted in the mounting hole of the fixed base 400 via a deep groove ball bearing. The laser output unit is fixed to the outer end face of the rotary connector 320 by bolts. When the rotary drive 310 is powered on, its output torque is transmitted to the rotary connector 320 via the spline, driving the laser output unit to move in a circular motion around the axis of the fixed base 400. At this time, the laser beam is always perpendicular to the beam axis and performs circumferential cutting along the processing path. This application eliminates elastic deformation in the transmission chain by cooperating with the rotary connector 320 supported by a precision bearing through a rigid transmission connection, enabling the laser output unit to obtain stable angular velocity control capability.

[0057] In some other embodiments of this application, the rotating unit 300 includes a rotating drive 310. The output shaft of the rotating drive 310 passes through the middle of the fixed base 400 and is connected to the clamping unit 100. The rotating unit 300 drives the clamping unit 100 to rotate, while the laser output unit is connected to the fixed base 400. The clamping unit 100 is coaxial with the middle of the fixed base 400, and the laser output unit is disposed near the edge of the fixed base 400.

[0058] According to some embodiments of this application, in order to improve the compactness of the device and reduce the overall space occupied by the equipment, the output end of the laser light source 200 is arranged on the same side as the rotary connector 320. For example... Figure 1 and Figure 2 As shown, a first optical path F1 and a second optical path F2 are provided along the output path of the processing beam. The first optical path F1 is parallel to the axis of the segment to be processed 1, and the second optical path F2 is perpendicular to the axis of the segment to be processed 1.

[0059] Or, such as Figure 3 As shown, the output end of the laser source 200 is located on one side of the section to be processed 1, and a first optical path F1 is provided along the output path of the processing beam. The first optical path F1 is perpendicular to the axis of the section to be processed 1.

[0060] It is understandable that in the first implementation, such as Figure 1 and Figure 2 As shown, the laser source 200 is mounted on the side of the rotating connector 320. The laser beam is first transmitted along a first optical path parallel to the wire bundle axis, and then redirected by the optical path switching unit 500 to a second optical path perpendicular to the axis, focusing on the processing position. When the rotating connector 320 rotates, the laser source 200 rotates accordingly, while the clamping unit 100 remains stationary. The second optical path F2 always remains perpendicular to the wire bundle surface, realizing continuous processing of the annular cutting path.

[0061] In the second implementation, such as Figure 4 As shown, the laser source 200 is fixed to the side of the wire bundle. When the rotating connecting seat 320 rotates, the laser source 200 rotates accordingly, while the clamping unit 100 remains stationary. The laser beam directly enters along the first optical path perpendicular to the wire bundle axis, eliminating the need for an optical path steering structure. Straight cutting can be completed by adjusting the distance between the light source and the wire bundle through the translation mechanism 700. The above two implementation methods, through the different designs of dual-optical-path dynamic steering and single-optical-path static direct illumination, respectively, adapt to the needs of circular or straight-line processing.

[0062] This application employs two switchable optical path configurations, supporting both the circular path of rotary cutting and the simplified structure of linear cutting while maintaining the perpendicularity of the beam to the processing surface. This avoids the problem of reduced processing efficiency caused by inflexible optical path adjustment in traditional equipment, and solves the problem of insufficient flexibility in laser cutting path adjustment. It can automatically maintain the perpendicular relationship between the beam and the wire beam surface in different processing scenarios, ensuring uniform cutting depth. At the same time, through optional single-optical-path or dual-optical-path structures, a balance is achieved between complex processing requirements and equipment simplification, reducing the complexity of the optical path system and improving maintenance convenience.

[0063] Optionally, the optical path switching unit 500 can be implemented using a prism or a mirror, and the beam can be switched from the first optical path to the second optical path by adjusting the refraction angle.

[0064] According to some embodiments of this application, as a further improvement to the solution, a retractable first bracket 600 is provided on the rotating connecting seat 320, and the optical path switching unit 500 is mounted on the first bracket 600. The first bracket 600 can drive the optical path switching unit 500 away from or closer to the laser source 200.

[0065] Understandably, when the focusing position of the laser beam needs to be adjusted, the first support 600 moves axially along the rotating connecting seat 320, causing a change in the distance between the optical path switching unit 500 and the laser source 200. The optical path switching unit 500 maintains a fixed installation angle during movement, and the optical path length formed after the beam passes through the optical path switching unit 500 changes accordingly, thereby adjusting the axial position of the focusing point at the wire harness processing location. Since the rotating connecting seat 320 synchronously drives the first support 600 and the optical path switching unit 500 during rotation, the focusing point position of the beam on the processing path can be compensated in real time through the extension and retraction of the first support 600, thereby eliminating focus offset caused by differences in wire harness diameter or assembly errors. This application, through the combined design of the extendable support and the optical path switching unit 500, achieves dynamic compensation of the optical path length, enabling the laser beam's focusing point to accurately match the wire harness processing position, ensuring cutting quality without relying on high-precision assembly.

[0066] Alternatively, the retractable first support 600 can be implemented using an electric actuator or a pneumatic telescopic rod.

[0067] As a further improvement to the plan, such as Figure 1 As shown, the laser cutting device provided in this application is also provided with a translation mechanism 700. Specifically, the translation mechanism 700 includes a translation drive, a slide rail and a slide base. The slide rail and the slide base are slidably connected. The mounting mechanism is connected to the slide base. The output end of the translation drive is connected to the slide base. The translation drive can drive the clamping unit 100 away from or near the section 1 to be processed of the wire harness.

[0068] Understandably, when the drive unit is activated, the slide moves linearly along the extension direction of the slide rail. Since the mounting mechanism is fixedly connected to the slide, the clamping unit 100 moves synchronously with the slide, thereby changing the relative distance between the clamping unit 100 and the wire harness segment 1 to be processed. This application, by employing a translation mechanism 700 combining a slide rail and a slide, achieves precise control of the displacement by constraining the movement path through a mechanical structure, avoiding deviations caused by human factors, and realizing automated adjustment of the distance between the clamping unit 100 and the wire harness segment 1 to be processed, solving the problem of difficulty in accurately controlling the processing distance through manual operation. The rigid guidance of the slide rail and the slide ensures the stability of the clamping unit 100's movement process, avoiding positioning offset caused by mechanical vibration.

[0069] According to some embodiments of this application, the laser cutting apparatus provided in this application is further provided with a waste recycling mechanism 800. Specifically, as... Figure 1 As shown, the waste recycling mechanism 800 includes a collection hopper 810 disposed below the clamping unit 100 and a collection box 820 connected to the collection hopper 810. It is understood that when the isolation layer debris generated by laser cutting detaches from the wire harness surface, it falls vertically into the opening area of ​​the collection hopper 810 under gravity. The inclined inner wall of the collection hopper 810 guides the debris towards the bottom outlet, where it is temporarily stored inside the collection box 820 via a connecting pipe. Waste generated during the cutting process is continuously collected, preventing debris from spreading in the working area. The enclosed structure of the collection box 820 prevents secondary scattering of waste, while the detachable connection allows for centralized waste processing without interrupting equipment operation.

[0070] This application also provides an automated wire harness assembly line that utilizes the aforementioned laser cutting device, wherein, for example... Figure 1 and Figure 2 As shown, two laser cutting devices are spaced apart in the horizontal direction.

[0071] Specifically, when the rotating unit 300 in the laser cutting device is connected to the laser output unit and drives the laser output unit to rotate to achieve continuous circumferential cutting of the isolation layer, this connection method can achieve simultaneous processing of two wire bundles, or simultaneous processing of both ends of the same wire bundle.

[0072] Alternatively, when the rotating unit 300 in the laser cutting device is connected to the clamping unit 100 and drives the clamping unit 100 to rotate to achieve continuous circumferential cutting of the isolation layer, this connection method can simultaneously process the segments 1 to be processed of the two wire bundles.

[0073] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0074] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A device for processing an isolation layer based on ring cutting, characterized in that, include: A clamping unit is used to fix the section of the wire harness to be processed, wherein the processing position of the section to be processed is provided with a processing path; A laser output unit includes a laser source, which outputs a processing beam to the processing position. The processing beam is used to eliminate the isolation layer at the processing position, and the processing beam is perpendicular to the axis of the processing position. A rotating unit is connected to either the clamping unit or the laser output unit. The rotating unit can drive the clamping unit or the laser output unit to rotate so that the processing beam can eliminate the isolation layer at the processing position along the processing path.

2. The isolation layer processing device based on ring cutting according to claim 1, characterized in that, It also includes an installation mechanism, which includes a fixed base, a clamping unit fixedly connected to the fixed base, a rotating unit mounted on the fixed base, and a laser output unit connected to the rotating unit. The rotating unit can drive the laser output unit to rotate around the processing position so that the processing beam can eliminate the isolation layer at the processing position along the processing path. or, It also includes an installation mechanism, which includes a fixed base. The laser output unit is fixedly connected to the fixed base, and the rotating unit is mounted on the fixed base. The rotating unit is connected to the rotating unit and can drive the clamping unit to rotate so that the processing beam can eliminate the isolation layer at the processing position along the processing path.

3. The isolation layer processing device based on ring cutting according to claim 2, characterized in that, The rotating unit includes a rotating drive and a rotating connecting seat. The rotating connecting seat is rotatably connected to the fixed seat. The output end of the rotating drive is driven by the rotating connecting seat. The laser output unit is fixedly connected to the rotating connecting seat.

4. The isolation layer processing device based on ring cutting according to claim 3, characterized in that, The clamping unit is coaxially arranged with the rotating connecting seat, and the laser output unit is located away from the center of the rotating connecting seat.

5. The isolation layer processing device based on ring cutting according to claim 3, characterized in that, The output end of the laser source is located on the same side as the rotating connecting seat. A first optical path and a second optical path are provided along the output path of the processing beam. The first optical path is parallel to the axis of the segment to be processed, and the second optical path is perpendicular to the axis of the segment to be processed. or, The output end of the laser source is located on one side of the section to be processed, and a first optical path is provided along the output path of the processing beam. The first optical path is perpendicular to the axis of the section to be processed.

6. The isolation layer processing device based on ring cutting according to claim 5, characterized in that, A light path switching unit is provided between the first light path and the second light path. The processing beam can enter the second light path from the first light path through the light path switching unit to focus on the processing position of the segment to be processed.

7. The isolation layer processing device based on ring cutting according to claim 6, characterized in that, The rotating connecting seat is provided with a retractable first bracket, and the optical path switching unit is mounted on the first bracket. The first bracket can move the optical path switching unit away from or closer to the laser source.

8. The isolation layer processing device based on ring cutting according to claim 2, characterized in that, It also includes a translation mechanism, which includes a translation drive, a slide rail and a slide base. The slide rail is slidably connected to the slide base, the mounting mechanism is connected to the slide base, and the output end of the translation drive is connected to the slide base. The translation drive can drive the clamping unit to move away from or closer to the section of the wire harness to be processed.

9. The isolation layer processing device based on ring cutting according to claim 8, characterized in that, It also includes a waste recycling mechanism, which includes a collection hopper located below the clamping unit and a collection box connected to the collection hopper. The collection box is used to collect the isolation layer stripped from the section to be processed.

10. An automated wire harness assembly line, characterized in that, The isolation layer processing apparatus based on ring cutting as described in any one of claims 1 to 9.

11. The automatic wire harness assembly line according to claim 10, characterized in that, Two laser cutting devices are set up side by side.

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