Heat dissipation substrate polishing device with transmission direction changing function
Patent Information
- Application Number
- CN202522026009.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-22
- Publication Date
- 2026-08-18
- Estimated Expiration
- 2035-09-22
AI Technical Summary
然而,此类常规打磨装置普遍缺少传输校正功能,在实际应用中存在着一些问题:传输过程中易出现基板偏移,由于输送辊组的平行度误差、基板自身微小形变或传输速度波动,基板在传输至打磨区域时,易发生横向偏移、纵向倾斜或角度偏转,导致基板与打磨轮的相对位置偏离预设加工基准,传输偏差会使打磨轮的特殊纹理与基板的相对运动轨迹错位,使得基板表面最终形成的纹理呈现“断节”“歪斜”“交叉错乱”等缺陷,部分区域甚至出现纹理重叠或空缺
1、本实用新型中,将散热基板放在输送带上传输时,引导板之间形成的引导腔,对刚进入输送带的散热基板形成两侧初步限位,即便基板初始放置存在偏差、或受输送带启动惯性影响产生位置偏移,引导腔的斜面也能对基板边缘形成柔性导向力,快速将基板规整至大致传输轨迹,有效避免基板进入传输阶段时出现大幅横向偏移或角度偏转,为后续精准校正奠定稳定基础,减少后续校正环节的调整压力。随着基板继续传输至转动轴所在区域,第一引导轮与基板侧面接触时形成滚动摩擦,大幅降低了对基板表面的摩擦损伤,并在第一引导轮的引导下逐渐与安装框平行,使其回正,基板进入安装框之后,可根据加工角度需求,通过第一电机使得安装框旋转一定角度,从而调整基板进入打磨轮的角度。当基板传输至打磨轮区域时,驱动机构带动打磨轮稳定转动,对基板表面进行打磨加工。通过对基板进入打磨轮时角度的调整,从而得到打磨合格且纹理角度符合需求的基板,满足多种加工需求。
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Figure CN224643185U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a polishing device, specifically a heat dissipation substrate polishing device with transmission direction changing function, belonging to the field of substrate processing technology. Background Technology
[0002] In high heat flux density electronic devices such as 5G base stations, new energy vehicle electronic control systems, and artificial intelligence servers, the heat dissipation substrate serves as a core thermal management component, and its surface quality directly affects thermal conductivity and assembly reliability. To improve heat dissipation performance, some heat dissipation substrates require grinding to create specific textures on their surface. These special textures can increase the heat dissipation surface area, optimize airflow guidance, and improve the substrate's thermal conductivity. Therefore, the regularity and continuity of the texture after grinding are required to be extremely high. Currently, conventional grinding equipment used for heat dissipation substrates in the industry mainly consists of a conveyor roller group, a grinding mechanism, and a frame. Its working process is as follows: the conveyor roller group transports the substrate to be ground to the grinding area, and the grinding wheel rotates under the drive component to grind the substrate surface. However, conventional grinding devices generally lack transmission correction functions, leading to several problems in practical applications: substrate misalignment is prone to occur during transmission. Due to parallelism errors in the conveyor rollers, minor deformations of the substrate itself, or fluctuations in transmission speed, the substrate is susceptible to lateral shift, longitudinal tilt, or angular deflection when transported to the grinding area. This causes the relative position of the substrate and the grinding wheel to deviate from the preset processing reference. Transmission deviations cause misalignment between the special texture of the grinding wheel and the relative movement trajectory of the substrate, resulting in defects such as "discontinuous," "skewed," and "intersecting" textures on the substrate surface. In some areas, texture overlap or gaps may even occur. This texture misalignment not only damages the surface regularity of the heat dissipation substrate but also affects its heat dissipation performance. Furthermore, due to differences in heat dissipation requirements and assembly space for various electronic devices, some heat dissipation substrates need to be adjusted to a specific angle for grinding to ensure that the processed texture matches the internal heat dissipation path and assembly layout of the equipment. Therefore, designing a grinding device with transmission correction functions to solve these problems has become a research focus in the industry. Utility Model Content
[0003] The purpose of this invention is to provide a heat dissipation substrate polishing device with a transmission direction changing function. This invention can adjust the transmission angle of the heat dissipation substrate, thereby adjusting the angle of the polishing texture to meet different heat dissipation requirements.
[0004] The technical solution of this utility model is as follows: a heat dissipation substrate polishing device with transmission direction changing function, including a frame, on which multiple polishing wheels are rotatably connected; a drive mechanism is provided on the frame, and the drive mechanism is connected to the rotating shaft of the polishing wheels; a conveyor belt is provided on the frame; multiple guide plates are provided on the frame, and the guide plates are located above the input end of the conveyor belt; gaps exist between the guide plates to form guide cavities; multiple rotating shafts located in the output direction of the guide plates are rotatably connected on the frame, and a horizontal plate is connected below the rotating shafts. Mounting frames are provided at both ends of the horizontal plate, and multiple first guide wheels are rotatably connected within the mounting frames. An adjustment cavity is formed between the first guide wheels on both sides, and the adjustment cavity is connected to the guide cavity; multiple first motors are provided on the frame, and the output ends of the first motors are fixedly connected to the rotating shafts.
[0005] The aforementioned heat dissipation substrate polishing device with transmission reversal function includes a drive mechanism comprising a first synchronous wheel mounted on the polishing wheel shaft and multiple second motors mounted on the frame. The output end of each second motor is provided with a second synchronous wheel, which is connected to the first synchronous wheel via a synchronous belt.
[0006] The aforementioned heat dissipation substrate polishing device with transmission reversal function has multiple dust collection hoppers on the frame, with the dust collection hoppers located in front of the polishing wheel and the suction inlet facing the polishing wheel; a connection port is provided above the dust collection hoppers.
[0007] The aforementioned heat dissipation substrate polishing device with transmission reversal function has a plurality of flat rollers located on the front and rear sides of the polishing wheel on the frame.
[0008] The aforementioned heat dissipation substrate polishing device with transmission reversal function has a brush located above the output end of the conveyor belt on the frame.
[0009] In the aforementioned heat dissipation substrate polishing device with transmission reversal function, the width of the guide cavity is greater than the width of the adjustment cavity.
[0010] In the aforementioned heat dissipation substrate polishing device with transmission reversal function, the mounting frame is rotatably connected to a rotating frame at the end facing the guide plate, and a second guide wheel is rotatably connected inside the rotating frame; a torsion spring is provided between the rotating shaft of the rotating frame and the mounting frame.
[0011] The aforementioned heat dissipation substrate polishing device with transmission direction changing function has a limiting plate at the upper end of the mounting frame, which extends to the top of the rotating frame; an abutment block is provided above the rotating frame, and the abutment block abuts against the limiting plate when the rotating frame is parallel to the mounting frame.
[0012] Compared with the prior art, the present invention has the following beneficial effects: 1. In this utility model, when the heat dissipation substrate is placed on the conveyor belt for transmission, the guide cavity formed between the guide plates provides initial lateral positioning for the heat dissipation substrate as it enters the conveyor belt. Even if there is an initial placement deviation of the substrate or a positional shift due to the inertia of the conveyor belt, the inclined surface of the guide cavity can still provide a flexible guiding force to the edge of the substrate, quickly aligning the substrate to the approximate transmission trajectory. This effectively avoids significant lateral shifts or angular deflections when the substrate enters the transmission stage, laying a stable foundation for subsequent precise correction and reducing the adjustment pressure in subsequent correction stages. As the substrate continues to be transmitted to the area of the rotating shaft, rolling friction is formed when the first guide wheel contacts the side of the substrate, significantly reducing frictional damage to the substrate surface. Under the guidance of the first guide wheel, the substrate gradually becomes parallel to the mounting frame, returning it to its correct position. After the substrate enters the mounting frame, the mounting frame can be rotated by the first motor at a certain angle according to the processing angle requirements, thereby adjusting the angle at which the substrate enters the grinding wheel. When the substrate is transmitted to the grinding wheel area, the drive mechanism drives the grinding wheel to rotate stably, performing grinding processing on the substrate surface. By adjusting the angle of the substrate as it enters the grinding wheel, a substrate that has been properly ground and has the required texture angle can be obtained, thus satisfying various processing needs.
[0013] 2. In this utility model, the substrate continues to be transported into the rotating frame area at the end of the mounting frame. The second guide wheel inside the rotating frame first contacts the side of the substrate. If the substrate still has a slight tilt, it will generate a lateral thrust on one side of the second guide wheel, causing the rotating frame to tilt adaptively around its axis of rotation with the mounting frame. At this time, the torsion spring between the rotating frame axis and the mounting frame is further compressed or stretched to store elastic potential energy. When the substrate gradually enters the adjustment cavity through the first guide wheel, the thrust of the substrate on the second guide wheel gradually weakens. The second guide wheel has a slow corrective thrust on the tail of the substrate through the torsion spring, gradually correcting the position of the substrate until the substrate completely enters the adjustment cavity from the rotating frame. The lateral thrust on the rotating frame disappears, the torsion spring releases elastic potential energy, and drives the rotating frame to rotate in the opposite direction to return to the center. When the rotating frame returns to its original position and is parallel to the mounting frame, the abutment block on the rotating frame comes into close contact with the limiting plate of the mounting frame, restricting the rotating frame from continuing to retract inward and ensuring that the rotating frame is stably maintained in the preset guide position, preparing for the guidance of the next substrate. At the same time, the rolling friction of the second guide wheel also greatly reduces the scratch damage to the edge of the substrate. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a structural diagram of the drive mechanism; Figure 3 This is a structural diagram of the guide plate and the rotating shaft; Figure 4 This is a structural diagram of the rotating shaft; Figure 5This is a structural diagram of a torsion spring.
[0015] The labels in the attached diagram are as follows: 1-frame, 2-guide plate, 3-guide cavity, 4-rotating shaft, 5-horizontal plate, 6-mounting frame, 7-first guide wheel, 8-adjustment cavity, 9-first motor, 10-rotating frame, 11-second guide wheel, 12-limiting plate, 13-grinding wheel, 14-drive mechanism, 15-dust suction hopper, 16-connection port, 17-flattening roller, 18-brush, 19-conveyor belt, 20-first synchronous pulley, 21-second motor, 22-second synchronous pulley, 23-contact block, 24-torsion spring. Detailed Implementation
[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments, but this should not be construed as limiting the present invention.
[0017] Example: A heat dissipation substrate polishing device with transmission reversal function, configured as follows Figure 1-5 As shown, the device includes a frame 1, which is welded from Q235 steel plate. The surface is treated with shot blasting and electrostatic spraying, providing high strength and corrosion resistance, and offering a stable support foundation for the entire device. A conveyor belt 19 is mounted on the frame 1. The conveyor belt 19 is made of polyurethane with an anti-slip textured surface and is driven by a servo motor. Through roller transmission, it achieves continuous and stable transport of the substrate, preventing substrate displacement due to slippage during transport. Its function is to transport the heat dissipation substrate from the input end to the grinding area, and then transport the ground substrate to the output end. Figure 3As shown, the frame 1 is equipped with multiple guide plates 2. The guide plates 2 are made of 6061 aluminum alloy and have anodized surfaces, which combine lightweight and wear resistance, and avoid scratching the edges of the substrate. The guide plates 2 are located above the input end of the conveyor belt 19 and are fixed to the frame 1 by welding. The spacing between adjacent guide plates 2 is consistent, and there is a gap between the bottom of the guide plate 2 and the conveyor belt 19. The guide plates 2 on both sides are inclined plates that slope inward, while the remaining guide plates 2 are V-shaped. The gaps between the guide plates 2 form guide cavities 3. The width of the guide cavity 3 is greater than the width of the subsequent adjustment cavity 8. This provides initial guidance for the heat dissipation substrate that has just entered the conveyor belt 19. Even if the substrate is initially misplaced or deviates from its trajectory due to the inertia of the conveyor belt 19, the inclined structure of the guide plate 2 can still form a flexible guiding force on the edge of the substrate, quickly straightening the substrate to the approximate transmission path, reducing the offset of the substrate before entering the correction stage, and reducing the difficulty of adjustment for subsequent precise correction. Multiple rotating shafts 4, located in the output direction of the guide plate 2, are rotatably connected to the frame 1. The rotating shafts 4 are made of 45# steel and heat-treated. They are connected to the frame 1 via deep groove ball bearings to ensure smooth rotation without jamming. A horizontal plate 5, made of Q235 steel, is welded and fixedly connected below the rotating shafts 4. Its function is to connect the rotating shafts 4 to the mounting frame 6 and transmit the force during the calibration process. Mounting frames 6, made of 6061 aluminum alloy, are welded and fixed to both ends of the horizontal plate 5, providing lightweight yet sufficient rigidity. Multiple first guide wheels 7, made of polyurethane with a smooth surface, are rotatably connected to the mounting frames 6 via rolling bearings. Their function is to generate rolling friction when in contact with the side of the substrate, preventing scratches on the substrate surface. An adjustment cavity 8 is formed between the two mounting frames 6, connecting to the guide cavity 3. The width of the adjustment cavity 8 is adapted to the width of a conventional heat dissipation substrate. Multiple first motors 9 are provided on the frame 1. The output ends of the first motors 9 are fixedly connected to the rotating shafts 4. The operation of the first motors 9 causes the mounting frames 6 to rotate, thereby adjusting the angle of the substrate output. Multiple grinding wheels 13 located in front of the rotating shaft 4 are rotatably connected to the frame 1 via rolling bearings. The abrasive layer surface of the grinding wheels 13 can be pressed with special textures such as spiral patterns and grid patterns according to processing requirements. The function of the grinding wheels 13 is to grind the surface of the substrate, forming regular textures or removing burrs. Driven by the drive mechanism 14, they rotate at high speed, and the abrasive layer contacts the substrate surface to generate a cutting action, achieving surface treatment. The frame 1 is equipped with the drive mechanism 14, which is connected to the rotating shaft of the grinding wheels 13, providing stable rotational power for the grinding wheels 13. Figure 2As shown, the drive mechanism 14 includes a first synchronous pulley 20 mounted on the shaft of the grinding wheel 13 and multiple second motors 21 mounted on the frame 1. The second motors 21 are servo motors to ensure stable rotational speed. Both the first synchronous pulley 20 and the second synchronous pulleys 22 are made of 45# steel and have undergone quenching treatment, with the groove surfaces finely ground to prevent slippage of the synchronous belt. The output end of the second motor 21 is connected to the second synchronous pulley 22 via a key, and the second synchronous pulley 22 is connected to the first synchronous pulley 20 via a synchronous belt. The function of the drive mechanism 14 is to drive the grinding wheel 13 to rotate at a uniform speed. The second motors 21 drive the second synchronous pulleys 22 to rotate, and the synchronous belt drives the first synchronous pulley 20 and the shaft of the grinding wheel 13 to rotate synchronously. Figure 1 and Figure 2 As shown, the frame 1 is equipped with multiple dust collection hoppers 15. Each dust collection hopper 15 is welded from Q235 steel plate, and its inner wall is polished to reduce dust adhesion. The dust collection hopper 15 is located in front of the grinding wheel 13, with its suction inlet facing the grinding wheel 13. The distance between the suction inlet and the grinding wheel 13 is 5-8mm, ensuring that dust generated can be captured promptly. A connection port 16 is located above the dust collection hopper 15, which can be connected to a vacuum pump via a flexible hose. The function of the dust collection hopper 15 is to collect the metal dust generated during the grinding process. The vacuum pump creates negative pressure inside the dust collection hopper 15 through the connection port 16. The dust generated during grinding is sucked into the dust collection hopper 15 by the airflow and then discharged through a pipe. This avoids dust adhering to the substrate surface and affecting the grinding quality, and also prevents dust from spreading and polluting the working environment. Figure 1 and Figure 2 As shown, the frame 1 is equipped with multiple pressing rollers 17 located on the front and rear sides of the grinding wheel 13; the axis of the pressing rollers 17 is parallel to the surface of the conveyor belt 19; the function of the pressing rollers 17 is to flatten the substrate that may warp during the grinding process. When the substrate moves with the conveyor belt 19, the pressing rollers 17 apply uniform pressure to the surface of the substrate, making the substrate flat and in close contact with the surface of the conveyor belt 19, avoiding uneven contact between the grinding wheel 13 and the substrate due to substrate warping, resulting in local over-grinding or under-grinding. Figure 2 As shown, the frame 1 is equipped with a brush 18 located above the output end of the conveyor belt 19. The bristles of the brush 18 are made of nylon and are densely arranged. It is fixed to the frame 1 by a bracket. The contact pressure between the lower end of the brush bristles and the substrate surface is 5-10N. When the substrate moves to the output end with the conveyor belt 19, the brush bristles gently contact the substrate surface. The elastic deformation of the bristles sweeps away the dust adhering to the substrate surface, ensuring the cleanliness of the output heat dissipation substrate surface without the need for additional manual cleaning. Figure 3 and Figure 4As shown, the mounting frame 6 has a rotating frame 10 rotatably connected to its end facing the guide plate 2. The rotating frame 10 is made of 6061 aluminum alloy profile with an anodized surface, combining lightweight and structural rigidity to avoid deformation under stress affecting guidance accuracy. Its function is to connect the guide cavity 3 and the adjustment cavity 8, providing a transition channel for the substrate from initial guidance to precise adjustment, ensuring smooth and uninterrupted substrate transmission. Multiple second guide wheels 11 are rotatably connected inside the rotating frame 10 via rolling bearings. The second guide wheels 11 are made of polyurethane with a finely ground surface. Their function is to generate rolling friction when in contact with the side of the substrate, significantly reducing scratch damage to the substrate edges. Simultaneously, the rolling contact adapts the substrate position in real time, assisting the substrate to smoothly enter the adjustment cavity 8. Figure 5 As shown, a torsion spring 24 is provided between the rotating shaft of the rotating frame 10 and the mounting frame 6 to provide the resetting power for the rotating frame 10. The elastic potential energy of the torsion spring 24 can automatically drive the rotating frame 10 back to its original position after it is deflected by force, without the need for additional driving components, simplifying the structure while ensuring timely resetting. A limiting plate 12 is fixed inward at the upper end of the mounting frame 6 by bolts, and the limiting plate 12 is integrally connected to the mounting frame 6. An abutment block 23 is welded and fixed on the upper part of the rotating frame 10; when the rotating frame 10 returns to its original position parallel to the mounting frame 6 under the action of the torsion spring 24, the abutment block 23 and the limiting plate 12 are in close contact, ensuring that the angle of the rotating frame 10 is consistent after each return to its original position, providing a stable reference for subsequent substrate guidance. After the substrate, roughly calibrated by the guide cavity 3, enters the area of the rotating frame 10 under the drive of the conveyor belt 19, the second guide wheel 11 first contacts the side of the substrate. If the substrate is still slightly tilted, it will generate a lateral thrust on one side of the second guide wheel 11, causing the rotating frame 10 to tilt adaptively around its axis of rotation with the mounting frame 6. At this time, the torsion spring 24 on the corresponding side is further compressed or stretched, storing elastic potential energy. After the substrate has completely passed through the rotating frame 10 and entered the adjustment cavity 8, the lateral thrust on the rotating frame 10 disappears, the torsion spring 24 releases its elastic potential energy, and causes the rotating frame 10 to rotate in the opposite direction to return to the center. When the rotating frame 10 returns to the center and is parallel to the mounting frame 6, the abutment block 23 on the rotating frame 10 abuts against the limiting plate 12 of the mounting frame 6, restricting the rotating frame 10 from continuing to retract inward, ensuring that the rotating frame 10 is stably maintained in the preset guide position, and preparing for the guidance of the next substrate.
[0018] Working principle: The heat dissipation substrate to be polished is placed on the conveyor belt 19. After the conveyor belt 19 starts, it carries the substrate to the polishing area. First, the substrate enters the guide cavity 3 formed between the guide plates 2. The guide cavity 3 forms an initial limit on both sides of the substrate as it enters the conveyor belt 19 through the V-shaped inclined structure. Even if there is a positional deviation in the initial placement of the substrate, or if it is offset due to the inertia of the conveyor belt 19, the inclined surface of the guide cavity 3 can apply a flexible guiding force to the edge of the substrate, quickly straightening the substrate to the approximate transport trajectory. As the substrate continues to be transported, it enters the rotating frame 10 area at the end of the mounting frame 6. The second guide wheel 11 inside the rotating frame 10 first contacts the side of the substrate. If the substrate still has a slight tilt, it will generate a lateral thrust on one side of the second guide wheel 11, causing the rotating frame 10 to tilt adaptively around its axis of rotation with the mounting frame 6. At this time, the torsion spring between the rotating frame 10 axis and the mounting frame 6 is further compressed or stretched to store elastic potential energy. When the substrate gradually passes through the rotating frame 10 and enters the adjustment cavity 8, the thrust of the substrate on the second guide wheel 11 gradually weakens. The second guide wheel 11 has a slow corrective thrust on the tail of the substrate through the torsion spring 24, gradually correcting the position of the substrate until the substrate completely enters the adjustment cavity from the rotating frame 10. The lateral thrust on the rotating frame 10 disappears, the torsion spring releases elastic potential energy, and causes the rotating frame 10 to rotate in the opposite direction to return to the center. When the rotating frame 10 returns to its original position and is parallel to the mounting frame 6, the abutment block 23 on the rotating frame 10 comes into close contact with the limiting plate 12 of the mounting frame 6, restricting the rotating frame 10 from continuing to retract inward, ensuring that the rotating frame 10 is stably maintained in the preset guide position, and preparing for the guidance of the next substrate. At the same time, the rolling friction of the second guide wheel 11 also greatly reduces the scratch damage to the edge of the substrate.
[0019] After the substrate enters the adjustment cavity 8 formed by the mounting frames 6 on both sides, the first guide wheel 7 inside the mounting frame 6 contacts the side of the substrate and rotates synchronously with the substrate during transmission, making the substrate parallel to the mounting frame 6. At this time, according to the texture angle requirements of the heat dissipation substrate, the first motor 9 can be started. The first motor 9 drives the rotating shaft 4 to rotate around the frame 1. The rotating shaft 4 drives the mounting frames 6 on both sides to rotate to the set angle through the horizontal plate 5, thereby adjusting the substrate to the processing angle that matches the grinding wheel 13, meeting the diverse requirements of different equipment for the substrate texture angle. After the angle is adjusted, the substrate continues to be transmitted to the area of the grinding wheel 13. Before reaching the grinding wheel 13, the flat roller 17 first contacts the surface of the substrate. The flat roller 17 applies uniform pressure to the substrate, which may be slightly warped during transmission, flattening it and making it tightly adhere to the surface of the conveyor belt 19, avoiding uneven contact between the grinding wheel 13 and the substrate due to substrate warping. Simultaneously, the drive mechanism 14 starts: the second motor 21 drives the second synchronous wheel 22 at the output end to rotate, which in turn drives the first synchronous wheel 20 on the shaft of the grinding wheel 13 to rotate via a synchronous belt, thereby driving the grinding wheel 13 to rotate stably. During the grinding process, the dust collection hopper 15 in front of the grinding wheel 13 is connected to an external vacuum pump through the upper connection port 16, forming a negative pressure inside the dust collection hopper 15 to promptly suck in the metal dust generated during grinding and discharge it through the pipe, preventing dust from adhering to the substrate surface and affecting the grinding quality or spreading and polluting the working environment. After grinding, the substrate is transported to the output end by the conveyor belt 19. The brush 18 above the conveyor belt 19 gently contacts the substrate surface, and the elastic deformation of the brush bristles sweeps away the fine dust remaining on the substrate surface, ultimately ensuring that the cleaned and ground substrate with the required texture angle is output smoothly.
Claims
1. A heat dissipation substrate polishing device with transmission reversal function, comprising a frame (1), wherein a plurality of polishing wheels (13) are rotatably connected on the frame (1); a drive mechanism (14) is provided on the frame (1), and the drive mechanism (14) is connected to the rotating shaft of the polishing wheels (13); characterized in that: The frame (1) is provided with a conveyor belt (19); the frame (1) is provided with multiple guide plates (2), which are located above the input end of the conveyor belt (19); there are gaps between the guide plates (2) to form a guide cavity (3); multiple rotating shafts (4) located in the output direction of the guide plates (2) are rotatably connected to the frame (1), and a horizontal plate (5) is connected below the rotating shaft (4). The two ends of the horizontal plate (5) are respectively provided with mounting frames (6), and multiple first guide wheels (7) are rotatably connected inside the mounting frames (6). An adjustment cavity (8) is formed between the first guide wheels (7) on both sides, and the adjustment cavity (8) is connected to the guide cavity (3); multiple first motors (9) are provided on the frame (1), and the output end of the first motor (9) is fixedly connected to the rotating shaft (4).
2. The heat dissipation substrate polishing device with transmission reversal function according to claim 1, characterized in that: The drive mechanism (14) includes a first synchronous wheel (20) mounted on the shaft of the grinding wheel (13) and a plurality of second motors (21) mounted on the frame (1). The output end of the second motor (21) is provided with a second synchronous wheel (22), which is connected to the first synchronous wheel (20) via a synchronous belt.
3. The heat dissipation substrate polishing device with transmission reversal function according to claim 1, characterized in that: The frame (1) is provided with multiple dust collection buckets (15), which are located in front of the grinding wheel (13) and have their suction inlets facing the grinding wheel (13); a connection port (16) is provided above the dust collection bucket (15).
4. The heat dissipation substrate polishing device with transmission reversal function according to claim 1, characterized in that: The frame (1) is provided with multiple pressing rollers (17) located on the front and rear sides of the grinding wheel (13).
5. The heat dissipation substrate polishing device with transmission reversal function according to claim 1, characterized in that: The frame (1) is provided with a brush (18) located above the output end of the conveyor belt (19).
6. The heat dissipation substrate polishing device with transmission reversal function according to claim 1, characterized in that: The width of the guide cavity (3) is greater than the width of the adjustment cavity (8).
7. The heat dissipation substrate polishing device with transmission reversal function according to claim 1, characterized in that: The mounting frame (6) is rotatably connected to a rotating frame (10) at the end facing the guide plate (2), and a second guide wheel (11) is rotatably connected inside the rotating frame (10); a torsion spring (24) is provided between the rotating shaft of the rotating frame (10) and the mounting frame (6).
8. The heat dissipation substrate polishing device with transmission reversal function according to claim 7, characterized in that: The mounting frame (6) is provided with a limiting plate (12) facing inward at the upper end, and the limiting plate (12) extends above the rotating frame (10); the rotating frame (10) is provided with an abutting block (23) above it, and when the rotating frame (10) is parallel to the mounting frame (6), the abutting block (23) abuts against the limiting plate (12).