Notch polishing apparatus

Abstract

The utility model discloses a kind of notched polishing device, applied to silicon wafer notch, carry out polishing to notch, the notched polishing device includes mounting plate, swing plate, swing plate is used to carry silicon wafer, and its edge side part is equipped with the positioning groove of positioning silicon wafer notch, support seat, set in mounting plate, swing plate is rotatably connected with support seat by first driving element, so that swing plate can swing around a preset axis, polishing wheel component, including polishing wheel and the second driving element of driving its rotation, slide rail component, set in mounting plate, polishing wheel component is slidably arranged in slide rail component, slide rail component is used to guide polishing wheel component to slide along swing plate direction, to adjust the distance between polishing wheel and silicon wafer, for the radial polishing silicon wafer notch of polishing wheel, the above design utilizes the rotation of swing plate around preset axis, can dynamically adjust silicon wafer notch inclination, make polishing wheel working surface always adapt silicon wafer notch curved surface, guarantee normal polishing force uniform distribution.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer polishing technology, and in particular to a notch polishing device. Background Technology

[0002] The V-notch polishing process of semiconductor silicon wafers directly affects the integrity of the wafer structure and the reliability of packaging. The current mainstream technology uses a fixed-angle fixture to support the silicon wafer and a unidirectional feed polishing wheel for processing. However, there are process tolerances in the geometric angle of the silicon wafer notch. Rigid positioning causes the polishing wheel and the notch surface to not always maintain ideal contact, which in turn leads to local over-polishing or under-polishing defects and reduces product yield.

[0003] To improve adaptability, some equipment incorporates multi-axis linkage mechanisms to dynamically adjust the silicon wafer's orientation. While this approach can theoretically accommodate different notch angles, the complex motion control system significantly increases manufacturing costs and maintenance complexity, and the cumulative errors in the mechanical transmission chain weaken positioning accuracy. For mass production scenarios, balancing efficiency and cost becomes a key constraint.

[0004] Therefore, there is an urgent need for an integrated device that can simultaneously adjust the tilt angle of the silicon wafer and the radial displacement of the polishing wheel, so as to achieve dynamic matching polishing while simplifying the structure. Utility Model Content

[0005] The main purpose of this invention is to provide a notch polishing device to solve the problem of uneven notch polishing of silicon wafers, which can easily lead to microscopic edge chipping or excessive surface roughness.

[0006] To achieve the above objectives, this utility model proposes a notch polishing device, applied to the notch of a silicon wafer, for polishing the notch. The notch polishing device comprises: Mounting plate; A swing plate, which is used to support a silicon wafer, has a positioning groove on its edge side for positioning the notch of the silicon wafer; A support base is provided on the mounting plate, and the swing plate is rotatably connected to the support base through a first driving element, so that the swing plate can swing around a preset axis. A polishing wheel assembly, including a polishing wheel and a second drive element for driving its rotation; A slide rail assembly is disposed on the mounting plate, and a polishing wheel assembly is slidably disposed on the slide rail assembly. The slide rail assembly is used to guide the polishing wheel assembly to slide along the direction of the swing plate to adjust the distance between the polishing wheel and the silicon wafer, for the polishing wheel to radially polish the notch of the silicon wafer.

[0007] Preferably, the swing plate is provided with a vacuum adsorption element inside, and the side of the swing plate that supports the silicon wafer has a plurality of adsorption holes evenly distributed thereon. The vacuum adsorption element adsorbs the silicon wafer and fixes it to the swing plate through the plurality of adsorption holes.

[0008] Preferably, the first driving element includes a first motor, a driving wheel, a driven wheel, a timing belt, and a rotating shaft. The first motor is disposed at the bottom of the mounting plate. The driving wheel is connected to the driving end of the first motor. The driven wheel is mounted on the support base and is connected to the rotating shaft. The rotating shaft is connected to the swing plate. The driving wheel and the driven wheel are linked by the timing belt. The first motor drives the driving wheel to rotate, which in turn drives the driven wheel to rotate the rotating shaft, causing the swing plate to swing up and down.

[0009] Preferably, the slide rail assembly includes a third motor, a slide rail, and a lead screw. The output shaft of the third motor is coaxially connected to the lead screw. The polishing wheel assembly is threadedly fitted onto the lead screw. The third motor drives the lead screw to rotate, allowing the polishing wheel assembly to slide on the slide rail.

[0010] Preferably, the notch polishing device further includes a displacement sensor, which is disposed on the sliding path of the polishing wheel assembly.

[0011] Preferably, the polishing wheel assembly further includes a polishing cover, the polishing cover having the polishing wheel friction surface, wherein the polishing wheel friction surface located on the side of the swing plate is not covered by the polishing cover.

[0012] Preferably, the positioning groove has the same shape as the notch in the silicon wafer.

[0013] Preferably, the mounting plate is provided with a waterproof cover, which surrounds the swing plate and the polishing wheel.

[0014] The beneficial effects of this utility model are as follows: By utilizing the rotation of the swing plate around a preset axis, the tilt angle of the silicon wafer notch can be dynamically adjusted, ensuring that the working surface of the polishing wheel always adapts to the curved surface of the silicon wafer notch, guaranteeing a uniform distribution of normal polishing force, and completely eliminating defects such as local over-polishing or under-polishing of the silicon wafer notch. At the same time, with the cooperation of the slide rail assembly, the polishing wheel in the polishing wheel assembly adapts to contact with the silicon wafer notch without excessively squeezing the silicon wafer notch and causing damage to the silicon wafer notch, thus enhancing the uniform polishing of the silicon wafer notch by the polishing wheel. Secondly, the positioning groove design integrated into the mounting plate further enhances the positioning accuracy and response efficiency of the polishing wheel assembly for polishing the silicon wafer notch. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0015] Figure 1 This is a three-dimensional structural diagram of the notch polishing device in this utility model; Figure 2 This is a schematic diagram of the notch polishing device in this utility model; Figure 3 This is a schematic diagram of the notch polishing device of this utility model.

[0016] Label Explanation: 1. Mounting plate; 2. Swing plate; 21. Adsorption hole; 22. Positioning groove; 3. Support base; 4. First driving element; 41. First motor; 42. Driving pulley; 43. Driven pulley; 44. Synchronous belt; 45. Rotating shaft; 5. Polishing wheel assembly; 51. Second drive element; 511. Second motor; 52. Polishing wheel; 53. Polishing cover; 6. Slide rail assembly; 61. Third motor; 62. Slide rail; 7. Displacement sensor; 8. Waterproof cover.

[0017] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0020] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if the word "and / or" appears throughout the text, it means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0021] This invention provides a notch polishing device, applied to the notch area of ​​a silicon wafer, for polishing the notch. Please refer to [reference needed]. Figures 1-3 The notch polishing device includes a mounting plate 1, a swing plate 2, a support base 3, a polishing wheel assembly 5, and a slide rail assembly 6. The swing plate 2 is used to support the silicon wafer, and a positioning groove 22 for positioning the notch of the silicon wafer is provided on the side edge of the swing plate 2. The support base 3 is disposed on the mounting plate 1, and the swing plate 2 is rotatably connected to the support base 3 through a first driving element 4, so that the swing plate 2 can swing around a preset axis. The polishing wheel assembly 5 includes a polishing wheel 52 and a second driving element 51 for driving its rotation. The slide rail assembly 6 is disposed on the mounting plate 1, and the polishing wheel assembly 5 is slidably disposed on the slide rail assembly 6. The slide rail assembly 6 is used to guide the polishing wheel assembly 5 to slide along the direction of the swing plate 2 to adjust the polishing wheel. The distance between the polishing wheel 52 and the silicon wafer is used for the radial polishing of the silicon wafer notch by the polishing wheel 52. The above design utilizes the rotation of the swing plate 2 around a preset axis to dynamically adjust the tilt angle of the silicon wafer notch, so that the working surface of the polishing wheel 52 always adapts to the curved surface of the silicon wafer notch, ensuring a uniform distribution of normal polishing force. At the same time, with the cooperation of the slide rail assembly 6, the polishing wheel 52 in the polishing wheel assembly 5 adapts to contact the silicon wafer notch without excessively squeezing the silicon wafer notch and causing damage to the silicon wafer notch, thus enhancing the uniform polishing of the silicon wafer notch by the polishing wheel 52. Secondly, the positioning groove 22 integrated into the mounting plate 1 further enhances the positioning accuracy and response efficiency of the polishing wheel assembly 5 in polishing the silicon wafer notch.

[0022] It should be noted that in this embodiment, the notch on the silicon wafer is V-shaped. Of course, in other embodiments, the notch on the silicon wafer can also be U-shaped, and uniform polishing can still be achieved by this device. Secondly, the second driving element 51 includes a second motor 511. Furthermore, the preset axis is represented by the arrow X. Please refer to [reference needed]. Figure 1 .

[0023] In this embodiment, please refer to Figure 1The swing plate 2 is equipped with a vacuum adsorption element (not shown). The side of the swing plate 2 that carries the silicon wafer has a plurality of adsorption holes 21 evenly distributed. The vacuum adsorption element adsorbs the silicon wafer and fixes it to the swing plate 2 through the plurality of adsorption holes 21. This design is to prevent the silicon wafer on the swing plate 2 from falling when the swing plate 2 swings. Secondly, it also avoids the silicon wafer notch from being deviated from its predetermined position by force during polishing, thereby affecting the polishing accuracy of the silicon wafer notch. Furthermore, the use of vacuum adsorption will not damage the silicon wafer.

[0024] For further information, please refer to [link / reference]. Figure 1 and Figure 2 The first driving element 4 includes a first motor 41, a driving wheel 42, a driven wheel 43, a synchronous belt 44, and a rotating shaft 45. The first motor 41 is located at the bottom of the mounting plate 1. The driving wheel 42 is connected to the driving end of the first motor 41. The driven wheel 43 is mounted on the support base 3 and is connected to the rotating shaft 45. The rotating shaft 45 is connected to the swing plate 2. The driving wheel 42 and the driven wheel 43 are linked by the synchronous belt 44. The first motor 41 drives the driving wheel 42 to rotate, which in turn drives the rotating shaft 45 to rotate, so that the swing plate 2 swings up and down. This design utilizes the synchronous belt 44 transmission design to precisely control the swing range of the swing plate 2, thereby precisely controlling the angle of the notch and achieving cooperation with the polishing wheel 52.

[0025] In other embodiments, the first driving element 4 can also be a gear transmission mechanism, as long as it can accurately control the swing range of the swing plate 2.

[0026] For further details, please refer to... Figure 1 and Figure 2 The slide rail assembly 6 includes a third motor 61, a slide rail 62, and a lead screw. The output shaft of the third motor 61 is coaxially connected to the lead screw. The polishing wheel assembly 5 is threadedly fitted onto the lead screw. The third motor 61 drives the lead screw to rotate, allowing the polishing wheel assembly 5 to slide on the slide rail 62. This adjusts the distance between the polishing wheel 52 and the silicon wafer notch. To ensure that the distance between the polishing wheel 52 and the silicon wafer notch can be further precisely controlled, in this embodiment, the notch polishing device also includes a displacement sensor 7. The displacement sensor 7 is set on the sliding path of the polishing wheel assembly 5. This sensor uploads the distance data between the polishing wheel 52 and the notch, thereby controlling the output of the third motor 61 and changing the sliding speed and stopping position of the polishing wheel assembly 5 on the slide rail 62. The above settings also improve the polishing accuracy of the silicon wafer notch and prevent the silicon wafer notch from being too close or too far away from the polishing wheel 52, which could cause uneven polishing.

[0027] In fact, the slide rail assembly 6 uses a lead screw drive mechanism. In other embodiments, the slide rail assembly 6 can also use a magnetic attraction movement method to precisely change the distance between the polishing wheel 52 in the polishing wheel assembly 5 and the silicon wafer notch.

[0028] In this embodiment, the polishing wheel assembly 5 also includes a polishing cover 53, which provides a friction surface for the polishing wheel 52. The friction surface of the polishing wheel 52 located on the side of the swing plate 2 is not covered by the polishing cover 53. This design avoids structural interference between the swing plate 2 and the polishing cover 53 when the swing plate 2 adjusts its angle. It also provides the operator with a window to directly observe the polishing contact state, ensuring that the contact state between the polishing wheel and the silicon wafer notch can be monitored in real time to accurately control the polishing quality. At the same time, this open structure allows the polishing liquid to be sprayed directly onto the friction point without obstruction, which can efficiently dissipate heat and reduce contamination on the silicon wafer surface. It balances process visibility and thermal management efficiency while ensuring safety.

[0029] In this embodiment, the positioning groove 22 is consistent with the shape of the silicon wafer notch. When the silicon wafer is placed on the swing plate 2, the silicon wafer notch is located above the positioning groove 22 and the silicon wafer notch is connected to the positioning groove 22. This design serves two purposes: firstly, to position the silicon wafer notch so that it can cooperate with the polishing wheel 52; and secondly, to ensure that the friction surface of the polishing wheel 52 can smoothly enter the silicon wafer notch to polish the inner wall surface of the silicon wafer notch.

[0030] In this embodiment, please refer to Figure 1 The mounting plate 1 is equipped with a waterproof cover 8, which surrounds the swing plate 2 and the polishing wheel 52. Specifically, the waterproof cover 8 forms a sealed barrier around the swing plate 2 and the polishing wheel assembly 5, effectively preventing the polishing liquid and debris splashed during the polishing process from entering the internal moving mechanism of the device, preventing the polishing liquid from seeping in and causing bearing corrosion or short circuit, while inhibiting the centrifugal diffusion of liquid and debris when the swing plate 2 rotates, and maintaining the cleanliness of the cavity.

[0031] Regarding the operation of this notch polishing device, firstly, the silicon wafer is placed on the surface of the swing plate 2 via the transport module and is firmly adsorbed through the vacuum adsorption hole 21. At this time, the silicon wafer notch is located above the positioning groove 22, thus determining the position of the silicon wafer notch. Then, the first drive element 4 is activated, and the swing plate 2 is precisely controlled to rotate around the preset axis by the synchronous belt 44, dynamically adjusting the notch tilt angle to the optimal polishing posture. The third motor 61 pushes the polishing wheel assembly 5 radially forward via the lead screw slide rail assembly 6. During this process, the displacement sensor 7 monitors the distance between the polishing wheel 52 and the notch in real time and feeds it back to the control system, adjusting the sliding speed and stopping position of the polishing wheel assembly 5 on the slide rail 62, so that the friction surface of the polishing wheel 52 presses perpendicularly against the inner wall surface of the silicon wafer notch. Then, the second drive element 51 drives the polishing wheel 52 to rotate for polishing. The operator monitors the contact state between the polishing wheel and the silicon wafer notch through the exposed area of ​​the polishing cover 53. The polishing liquid is directly sprayed to the friction point for heat dissipation and to flush out the powder. After polishing is completed, the slide rail assembly 6 moves back, the vacuum adsorption is released, the silicon wafer is taken out, and the waterproof cover 8 continuously prevents liquid and powder from entering the core mechanism.

[0032] The above description is only an optional embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A notch polishing apparatus, applied to notches on silicon wafers, for polishing the notches, characterized in that, The notch polishing device includes: Mounting plate; A swing plate, which is used to support a silicon wafer, has a positioning groove on its edge side for positioning the notch of the silicon wafer; A support base is provided on the mounting plate, and the swing plate is rotatably connected to the support base through a first driving element, so that the swing plate can swing around a preset axis. A polishing wheel assembly, including a polishing wheel and a second drive element for driving its rotation; A slide rail assembly is disposed on the mounting plate, and a polishing wheel assembly is slidably disposed on the slide rail assembly. The slide rail assembly is used to guide the polishing wheel assembly to slide along the direction of the swing plate to adjust the distance between the polishing wheel and the silicon wafer, for the polishing wheel to radially polish the notch of the silicon wafer.

2. The notch polishing apparatus according to claim 1, characterized in that, The swing plate is equipped with a vacuum adsorption element inside. The side of the swing plate that supports the silicon wafer has a plurality of adsorption holes evenly distributed thereon. The vacuum adsorption element adsorbs the silicon wafer through the plurality of adsorption holes and fixes it to the swing plate.

3. The notch polishing apparatus according to claim 2, characterized in that, The first driving element includes a first motor, a driving wheel, a driven wheel, a timing belt, and a rotating shaft. The first motor is disposed at the bottom of the mounting plate. The driving wheel is connected to the driving end of the first motor. The driven wheel is mounted on the support base and is connected to the rotating shaft. The rotating shaft is connected to the swing plate. The driving wheel and the driven wheel are linked by the timing belt. The first motor drives the driving wheel to rotate, which in turn drives the driven wheel to rotate the rotating shaft, causing the swing plate to swing up and down.

4. The notch polishing apparatus according to claim 1, characterized in that, The slide rail assembly includes a third motor, a slide rail, and a lead screw. The output shaft of the third motor is coaxially connected to the lead screw. The polishing wheel assembly is threadedly fitted onto the lead screw. The third motor drives the lead screw to rotate, allowing the polishing wheel assembly to slide on the slide rail.

5. The notch polishing apparatus according to claim 4, characterized in that, The notch polishing device also includes a displacement sensor, which is disposed on the sliding path of the polishing wheel assembly.

6. The notch polishing apparatus according to claim 1, characterized in that, The polishing wheel assembly further includes a polishing cover, which provides the polishing wheel friction surface, wherein the polishing wheel friction surface located on the side of the swing plate is not covered by the polishing cover.

7. The notch polishing apparatus according to claim 6, characterized in that, The positioning groove is identical in shape to the notch in the silicon wafer.

8. The notch polishing apparatus according to any one of claims 1-7, characterized in that, The mounting plate is provided with a waterproof cover, which surrounds the swing plate and the polishing wheel.

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