A device for grinding and polishing the surface of a sample for hardness testing

Abstract

The utility model provides a kind of hardness detection sample surface grinding and polishing processing device, the device includes: base;Workbench is set on the base in a manner that position can be adjusted;Sample clamping mechanism is set on the workbench, clamps and makes the surface to be treated of sample to be polished and polished to be arranged upward;Grinding and polishing mechanism is set on the base.The utility model is clamped to the sample to be polished by sample clamping mechanism, and makes the surface to be treated of sample to be polished and polished to be arranged upward;By workbench drives sample clamping mechanism to carry out position adjustment, can drive sample to be polished with the workbench to carry out lateral position adjustment, and grinding and polishing are carried out in different lateral positions by grinding and polishing mechanism, grinding and polishing process do not need manual cooperation, greatly reduce the workload of manual grinding and polishing while improving the time utilization efficiency and utilization value of manual, solve the problem that metal material hardness is detected before using manual operation to grind and polish sample.

Description

Technical Field

[0001] This utility model relates to the field of grinding and polishing technology, and more specifically, to a grinding and polishing device for the surface of a hardness testing sample. Background Technology

[0002] Hardness testing of metallic materials requires specific surface conditions, especially for Brinell and Vickers hardness tests. To ensure accurate indentation measurements and obtain reliable hardness values, the sample surface must meet stringent requirements. The required hardness sample surface should be flat, smooth, clean, and undamaged during preparation. This ensures a regular indentation shape, accurate diagonal measurements, and a truly reliable hardness value. Typically, Vickers hardness testing samples are quite thin, making them inconvenient to handle. Manual polishing is time-consuming, laborious, and extremely dangerous, and can easily cause injury. Summary of the Invention

[0003] In view of this, the present invention proposes a surface polishing device for hardness testing samples, which aims to solve the problem of time-consuming and labor-intensive manual polishing of samples before hardness testing of metallic materials.

[0004] This utility model proposes a surface polishing device for hardness testing samples. The device includes: a base; a worktable, which is positioned on the base in an adjustable manner; a sample clamping mechanism, which is disposed on the worktable and is used to clamp the sample to be polished so that the surface to be polished is facing upwards, and to drive the sample to be polished to be adjusted laterally with the worktable to perform polishing at different lateral positions; and a polishing mechanism, which is disposed on the base and is used to polish the surface to be polished of the sample.

[0005] Furthermore, in the aforementioned hardness testing sample surface polishing device, the sample clamping mechanism includes: a sample fixing stage, which is positioned above the worktable in a height-adjustable manner to support and secure the sample to be polished; and two grippers, which are positioned opposite each other on both sides of the sample fixing stage and are also positioned on the worktable in a width-adjustable manner. The two grippers are used to limit the top of the two sides of the sample to be polished, so that the sample is positioned at a preset height during polishing.

[0006] Furthermore, in the above-mentioned hardness testing sample surface polishing device, the sample fixing stage is connected to a lifting drive component, which is used to drive the sample fixing stage to adjust its height position.

[0007] Furthermore, in the above-mentioned hardness testing sample surface polishing device, both of the grippers are connected to longitudinal driving components, which are used to drive the two grippers to move towards each other or away from each other along the width direction of the sample fixing stage.

[0008] Furthermore, the above-mentioned surface polishing device for hardness testing samples includes a polishing mechanism comprising: a support frame; a polishing wheel, mounted on the support frame, for polishing the surface of the sample to be polished by rotating it; and a vacuum cleaner, mounted outside the polishing wheel, for collecting debris and dust generated during the polishing process of the sample to be polished.

[0009] Furthermore, in the above-mentioned hardness test sample surface polishing device, the support frame is equipped with a force controller, the power control end of which is equipped with a polishing frame, and the polishing wheel is rotatably mounted on the polishing frame for adjusting its height position according to the power control end of the force controller, so as to adjust the polishing force between the polishing wheel and the sample to be polished to a preset force value.

[0010] Furthermore, in the above-mentioned hardness test sample surface polishing device, the power control end of the force value controller is connected to the polishing frame via a connecting rod, and the connecting rod is fitted with a dustproof rubber sleeve.

[0011] Furthermore, in the above-mentioned hardness test sample surface polishing device, the polishing wheel is connected to a polishing drive component, which drives the polishing wheel to rotate to achieve polishing treatment.

[0012] Furthermore, in the aforementioned hardness testing sample surface polishing device, the base is provided with a transverse support rail, and the worktable is slidably mounted on the transverse support rail along its length.

[0013] Furthermore, in the aforementioned hardness testing sample surface polishing device, the worktable is connected to a transverse drive mechanism for driving the worktable to adjust its position on the base.

[0014] The hardness testing sample surface polishing device provided by this utility model clamps the sample to be polished using a sample clamping mechanism, ensuring that the surface to be polished faces upwards. The worktable drives the sample clamping mechanism to adjust its position, allowing the sample to be polished to move laterally with the worktable. The polishing mechanism then performs polishing at different lateral positions. The polishing process requires no manual intervention, significantly reducing the workload of manual polishing while improving the efficiency and value of manual labor. This solves the problem of time-consuming and labor-intensive manual polishing of samples before hardness testing of metallic materials. Attached Figure Description

[0015] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 A schematic diagram of the surface polishing device for hardness testing samples provided in this embodiment of the present invention; Figure 2 This is a schematic diagram of the sample clamping mechanism and worktable provided in an embodiment of the present utility model; Figure 3 A cross-sectional view of the sample clamping mechanism and worktable provided in an embodiment of this utility model; Figure 4 This is a schematic diagram of the sample fixing stage provided in an embodiment of the present invention. Detailed Implementation

[0016] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specified, embodiments and features of the present invention can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0017] See Figure 1 This is a schematic diagram of the hardness testing sample surface polishing device provided in this embodiment of the invention. As shown in the figure, the device includes: a base 1, a worktable 2, a sample clamping mechanism 3, a polishing mechanism 4, and a transverse drive mechanism 5.

[0018] The worktable 2 is mounted on the base 1 in a position-adjustable manner.

[0019] Specifically, base 1 serves as the equipment base plate, and worktable 2 extends along the length of base 1 (e.g., ...). Figure 1 The sample (in the direction of AA shown) is slidably mounted on the base 1. It can move to the right to the polishing area directly below the polishing mechanism 4, and can also move to the left to the sample placement position on the left side of the polishing area, so as to install and remove the sample to be polished. It can also move left and right in the polishing area, thereby moving the sample to be polished, so as to polish it in different lateral positions through the polishing mechanism on the upper side.

[0020] In this embodiment, a transverse support rail 11 is provided on the base 1, and the worktable 2 is slidably disposed on the transverse support rail 11 along its length direction. The transverse support rail 11 is slidably disposed on the transverse support rail 11 along its length direction (e.g., along the base 1). Figure 1 The worktable 2 (as shown in the direction of AA) is arranged above the base 1, and there can be two or more transverse support rails 11 to provide multiple sliding supports for the worktable 2. The bottom of the worktable 2 can be provided with several sets of guide grooves 21 that correspond one-to-one with the transverse support rails 11 to guide the transverse movement. In this embodiment, the worktable 2 can be connected to a transverse drive mechanism 5, which is used to drive the worktable 2 to adjust its position on the base 1. In particular, it can drive the worktable 2 to slide along the length direction of the transverse support rails 11 to achieve position adjustment. This not only enables the switching of sample placement and polishing areas, but also drives the worktable 2 to move in the polishing area to achieve polishing at different transverse positions.

[0021] The sample clamping mechanism 3 is set on the worktable 2 to clamp the sample 6 to be polished and arrange the surface to be processed of the sample 6 to be polished facing upwards, and drive the sample 6 to be polished to be adjusted laterally with the worktable 2 to perform polishing at different lateral positions.

[0022] Specifically, the sample clamping mechanism 3 is mounted on the worktable 2, such as... Figure 2 As shown, the sample clamping mechanism 3 can clamp the sample 6 to be polished and can move the clamped sample 6 to be polished and polished.

[0023] The polishing mechanism 4 is mounted on the base 1 and is used to polish the surface of the sample 6 to be polished.

[0024] Specifically, the polishing mechanism 4 is set on the base 1, and the actuating end of the polishing mechanism 4 can be set on the upper side of the sample clamping mechanism 3 so as to polish the sample 6 to be polished on the sample clamping mechanism 3 by rotating it, thereby realizing the polishing treatment of the surface to be processed of the sample 6 to be polished.

[0025] See also Figure 2 and Figure 3 The sample clamping mechanism 3 may include: a sample fixing stage 31, two grippers 32, a lifting drive 33, and a longitudinal drive 34.

[0026] The sample fixing stage 31 is positioned above the worktable 2 in a height-adjustable manner to support and secure the sample 6 to be polished.

[0027] Specifically, the workbench 2 serves as the support frame for the sample clamping mechanism 3. Of course, a separate support frame may also be provided; this embodiment does not impose any limitations on it. Figure 4 As shown, the sample fixing stage 31 can be a rectangular structure, with a sample clamping groove 311 at its center that matches the cross-section of the sample to be polished, for clamping the sample 6 to be polished, achieving horizontal limitation, and providing bottom support through the sample clamping mechanism 3. The sample fixing stage 31 has polishing sides (such as...) on both sides of the sample clamping groove 311. Figure 4 The front and rear sides (as shown) are provided with polishing clearance grooves 312 to allow the polishing mechanism 4 to make way for it, avoiding interference with the polishing operation of the polishing mechanism 4. Polishing can be performed on different lateral positions of the sample 6 to be polished. The sample fixing stage 31 has clamping grooves 311 on both sides (as shown) on the sample fixing grooves 311. Figure 4 The left and right sides (as shown) are provided with clamping relief grooves 313 to clamp and allow the grippers 32 to press against the top wall of the sample 6 to be polished. In this embodiment, the sample fixing stage is connected to a lifting drive 33 for driving the sample fixing stage 31 to adjust its height. In particular, the lifting drive 33 can be set between the sample fixing stage 31 and the worktable 2, with the fixed end fixedly installed on the worktable 2 and the power output end connected to the bottom wall of the sample fixing stage 31 to drive the sample fixing stage 31 to adjust its height.

[0028] Two grippers 32 are positioned opposite each other on both sides of the sample fixing stage 31 (e.g., Figure 2 (as shown on the left and right sides), and the two grippers 32 are along the width direction of the sample fixing stage 31 (e.g., ...). Figure 2 The direction of BB shown is arranged on the worktable 2 in a position-adjustable manner, and the two grippers 32 are used to respectively handle the two sides of the sample 6 to be ground and polished (e.g., the direction of BB shown). Figure 2 The top of the sample 6 to be polished is limited by the left and right sides shown, so that the sample 6 to be polished is at a preset height position during polishing.

[0029] Specifically, the two grippers 32 are arranged opposite each other to clamp the sample 6 to be polished, which is supported on the sample fixing stage 31 in the middle, at both ends. In this embodiment, both grippers 32 are movable grippers that can move towards or away from each other to allow the top of the sample 6 to be polished to be moved aside, so that the sample 6 can be installed into or removed from the sample fixing slot 311. Alternatively, they can move towards each other so that the clamping limiting part 321 of the grippers 32 can move to directly above the sample 6, thereby driving the sample 6 to move upward through the sample fixing stage 31 until it is as shown in the image. Figure 3The top wall of the sample 6 to be polished is pressed against the bottom wall of the clamping and limiting part 321, thus clamping the sample 6. In this embodiment, the grippers 32 may be connected to a longitudinal drive member 34, which drives the two grippers 32 to move towards or away from each other along the width direction of the sample fixing stage 31, so as to achieve the clearance and clamping of the sample 6 to be polished. The longitudinal drive member 34 may be a cylinder structure; of course, in other embodiments, it may also be a linear module, and this embodiment does not impose any limitation on it. In this embodiment, the longitudinal drive member 34 may be positioned between the two grippers 32, with its bottom wall fixedly installed on the top wall of the worktable 2. The bottom ends of the two grippers 32 may also be slidably installed on the top wall of the worktable 2. Of course, the two grippers 32 may also be suspended in the air, and this embodiment does not impose any limitation on it.

[0030] See also Figure 3 The lifting drive component 33 can be set directly above the longitudinal drive component 34, and its bottom can be supported by several fixed support rods 331 to support it to a certain height above the longitudinal drive component 34. The lifting drive component 33 can be a lifting hydraulic cylinder to lift the sample fixing platform 31.

[0031] See also Figure 1 The polishing mechanism 4 may include: a support frame 41, a polishing wheel 42, and a vacuum cleaner 43; wherein, the polishing wheel 42 is mounted on the support frame 41 and is used to polish the surface of the sample 6 to be polished by rotating it; the vacuum cleaner 43 is mounted outside the polishing wheel 42 and is used to collect the debris and dust generated during the polishing process of the sample 6 to be polished.

[0032] Specifically, the support frame 41 may include two parallel support rods for support and fixation. In this embodiment, to ensure that the polishing force between the polishing wheel 42 and the sample 6 to be polished is maintained at a preset pressure, preferably, the top of the support frame 41 may be provided with a force controller 45, whose power control terminal (such as...) Figure 1A polishing frame 46 is provided at the bottom (shown), and the polishing wheel 42 is rotatably mounted on the polishing frame 46. Its height is adjusted according to the power control end of the force controller 45 to adjust the polishing force between the polishing wheel 42 and the sample 6 to a preset force value. The preset force value can be determined based on actual conditions, and is not limited in this embodiment. The polishing frame 46 and the force controller 45 can be connected via a connecting rod (not shown in the figure), and the connecting rod is fitted with a dustproof rubber sleeve 47 to prevent external dust from interfering with the connecting rod. The polishing wheel 42 can be connected to a polishing drive component 44, which can be a motor, to drive the polishing wheel 42 to rotate and achieve the polishing process. The axes of the polishing drive component 44 and the polishing wheel 42 can be arranged horizontally, especially perpendicular to the movement direction of the worktable 2. In this embodiment, the fixed end of the polishing drive component 44 can be fixedly mounted on the polishing frame 46, and the power output shaft rotatably passes through the vertical plate of the polishing frame 46 and is connected to the polishing wheel 42, thereby driving the rotation of the polishing wheel 42. A vacuum cleaner 43 is disposed outside the polishing wheel 42 to collect debris and dust generated during the polishing process of the sample 6 to be polished, preventing debris and dust from splashing during the process.

[0033] See also Figure 1 The vacuum cleaner 43 may include a dust cover 431 and a dust suction pipe 432; wherein, the dust cover 431 covers the top and outer periphery of the polishing wheel 42, the dust cover 431 is connected to the dust suction pipe 432, and the dust suction pipe 432 is used to connect to a negative pressure dust collection device, such as a negative pressure fan, to collect dust and prevent splashing.

[0034] In summary, the surface polishing device for hardness testing samples provided in this embodiment clamps the sample to be polished using a sample clamping mechanism, ensuring that the surface to be treated faces upwards. The worktable drives the sample clamping mechanism to adjust its position, allowing the sample to be polished to move laterally with the worktable. The polishing mechanism then performs polishing at different lateral positions. The polishing process requires no manual intervention, significantly reducing the workload of manual polishing while improving the efficiency and value of manual labor. This solves the problem of time-consuming and labor-intensive manual polishing of samples before hardness testing of metallic materials.

[0035] It should be noted that in the description of this utility model, the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the direction or positional relationship are based on the direction or positional relationship shown in the drawings. This is only for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this utility model.

[0036] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A device for detecting the surface grinding and polishing treatment of a sample of hardness, characterized by, include: Base; The worktable is mounted on the base in a position-adjustable manner; A sample clamping mechanism is set on the worktable to clamp the sample to be polished and arrange the sample to be polished with the surface to be treated facing upwards, and to drive the sample to be polished to adjust its lateral position with the worktable so as to perform polishing at different lateral positions. The polishing mechanism, mounted on the base, is used to polish the surface of the sample to be polished.

2. The hardness-detecting sample surface polishing device according to claim 1, wherein The sample clamping mechanism includes: A sample fixing stage is positioned above the worktable in a height-adjustable manner to support and secure the sample to be polished. Two grippers are disposed opposite each other on both sides of the sample fixing stage. The two grippers are disposed on the worktable in a position-adjustable manner along the width direction of the sample fixing stage. The two grippers are used to limit the top of the two sides of the sample to be polished, so that the sample to be polished is at a preset height position during polishing.

3. The surface polishing device for hardness testing samples according to claim 2, characterized in that, The sample fixing stage is connected to a lifting drive component, which is used to drive the sample fixing stage to adjust its height.

4. The hardness testing sample surface polishing device according to claim 2, characterized in that, Both grippers are connected to a longitudinal drive unit, which drives the two grippers to move towards each other or away from each other along the width direction of the sample fixing stage.

5. The hardness-detecting sample surface polishing device according to any one of claims 1 to 4, wherein The polishing mechanism includes: Support frame; A polishing wheel, mounted on the support frame, is used to polish the surface of the sample to be polished by rotating it. A vacuum cleaner, located outside the polishing wheel, is used to collect debris and dust generated during the polishing process of the sample to be polished.

6. The hardness testing sample surface polishing device according to claim 5, characterized in that, The support frame is equipped with a force controller, and its power control end is equipped with a polishing frame. The polishing wheel is rotatably mounted on the polishing frame and is used to adjust its height position according to the power control end of the force controller, so as to adjust the polishing force between the polishing wheel and the sample to be polished to a preset force value.

7. The hardness testing sample surface polishing device according to claim 6, characterized in that, The power control terminal of the force controller is connected to the grinding and polishing frame via a connecting rod, and the connecting rod is fitted with a dustproof rubber sleeve.

8. The hardness testing sample surface polishing device according to claim 5, characterized in that, The polishing wheel is connected to a polishing drive component, which drives the polishing wheel to rotate and achieve polishing treatment.

9. The hardness testing sample surface polishing device according to any one of claims 1 to 4, characterized in that, The base is provided with a transverse support rail, and the worktable is slidably mounted on the transverse support rail along its length.

10. The hardness testing sample surface polishing apparatus according to any one of claims 1 to 4, characterized in that, The worktable is connected to a transverse drive mechanism for adjusting the position of the worktable on the base.

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