A driving type top plate for outer circle grinding of a semiconductor crystal bar

Abstract

The utility model discloses a kind of driving type top disc for semiconductor crystal bar external circle grinding, including grinding machine main body and workpiece to be processed, two groups of centre and the top head gear are correspondingly installed on the grinding machine main body, the outer circumferential surface of the centre is fixedly connected with spring, and the other end of spring is fixedly connected with top head gear, make top head gear axial sliding assembly in the outer circumferential surface of its along centre, the clamping end of top head gear towards workpiece to be processed is equipped with top head tooth insert, and the clamping end of top head gear is detachably connected with end tooth top disc, the driving type top disc for semiconductor crystal bar external circle grinding of this is significantly improved centring accuracy, adopt the cooperation structure of "spherical centre+hemispherical centring recess", the cooperation gap of centre and top disc is greatly reduced, in combination with the axial pre-tightening force of spring to top head gear, ensure that end tooth top disc and crystal bar always keep coaxial rotation, crystal bar external circle roundness error is smaller, satisfy high-precision crystal bar processing demand.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor material processing technology, specifically a drive-type top plate for grinding the outer diameter of semiconductor crystal rods. Background Technology

[0002] As semiconductor chips develop towards higher integration and higher precision, the requirements for the outer diameter accuracy, roundness, and surface roughness of semiconductor crystal rods (such as silicon crystal rods and silicon carbide crystal rods), which serve as chip substrates, are becoming increasingly stringent. The outer diameter grinding process has become a core step determining the quality of crystal rod processing. Currently, in semiconductor crystal rod outer diameter grinding equipment, the centering accuracy of traditional top-plate structures is insufficient, resulting in significant transmission torque loss and low workpiece fixation reliability. Utility Model Content

[0003] The technical problem to be solved by this utility model is to overcome the existing defects and provide a drive-type top plate for grinding the outer diameter of semiconductor crystal rods. It has high centering accuracy, stable transmission torque, and reliable workpiece fixation, which can effectively solve the problems in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: A drive-type top plate for grinding the outer diameter of semiconductor crystal rods includes a grinding machine body and a workpiece to be processed. Two sets of centers and a top toothed disc adapted to the centers are correspondingly installed on the grinding machine body. A spring is fixedly connected to the outer peripheral surface of the center, and the other end of the spring is fixedly connected to the top toothed disc, so that the top toothed disc is slidably assembled on the outer peripheral surface of the center along the axial direction of the center. The top toothed disc is provided with a top toothed insert at the clamping end facing the workpiece to be processed, and the clamping end of the top toothed disc is detachably connected to an end toothed disc. The workpiece to be processed is coaxially fixed between the two end toothed discs. The end tooth top plate has a centering groove on the side center facing the top tooth plate to achieve centering with the center tip. The side of the end tooth top plate is provided with a top plate tooth insert that mates with the top tooth insert to transmit the rotational torque required for grinding.

[0005] In a preferred embodiment of this invention, one end of the spring is fixedly connected to the outer peripheral surface of the tip, and the other end of the spring is connected to the toothed disc of the tip.

[0006] As a preferred technical solution of this utility model, the clamping surface of the end tooth top plate facing the workpiece to be processed is provided with an adhesive layer to achieve a stable fixation between the workpiece to be processed and the end tooth top plate.

[0007] As a preferred embodiment of this utility model, the end of the tip facing the centering groove is a spherical structure, and the centering groove is a hemispherical groove adapted to the spherical structure to improve the centering accuracy.

[0008] As a preferred technical solution of this utility model, the top head toothed fitting and the top plate toothed fitting are fitted together to avoid torque loss during transmission.

[0009] As a preferred embodiment of this invention, the outer diameter of the end tooth top plate is smaller than the outer diameter of the workpiece to be processed, so as to avoid interference between the end tooth top plate and the grinding wheel of the grinding machine during the grinding process.

[0010] Compared with the prior art, the beneficial effects of this utility model are: 1. The centering accuracy is significantly improved. The "spherical tip + hemispherical centering groove" matching structure is adopted, which greatly reduces the matching gap between the tip and the top plate. Combined with the axial preload of the spring on the top tooth plate, it ensures that the end tooth plate and the crystal rod always rotate coaxially. The roundness error of the outer circle of the crystal rod is small, which meets the requirements of high-precision crystal rod processing. 2. Smooth and lossless torque transmission: The top gear plate and the end gear plate are connected by meshing. Compared with traditional friction transmission or single key transmission, the torque transmission efficiency is improved, avoiding torque fluctuations caused by slippage or gaps, and eliminating torsional differences when reversing. The occurrence rate of surface ripples on the crystal rod is reduced, and the surface roughness is small. 3. The workpiece is fixed firmly and without damage. The end tooth top plate clamping surface is provided with an adhesive layer to avoid mechanical clamping damage to the crystal rod, ensuring that the crystal rod does not shift during the entire grinding cycle and improving the fixation reliability. 4. Completely avoid component interference. The outer diameter of the end tooth top plate is smaller than that of the workpiece to be processed. During the grinding process, the end tooth top plate is always outside the grinding range of the grinding wheel. The entire length of the crystal rod can be ground without adjusting the grinding path, thus improving processing efficiency. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this utility model.

[0012] Figure 2 This is a partial cross-sectional structural diagram of the present invention.

[0013] Figure 3 This is a magnified structural diagram of section A of the present invention.

[0014] Figure 4 This is a schematic diagram of the end tooth top plate structure of this utility model.

[0015] Figure 5 This is a schematic diagram of the assembly structure of the top gear and the center of this utility model.

[0016] Figure 6 This is a schematic diagram of the spring assembly structure of this utility model.

[0017] In the figure: 1. Grinding machine body, 2. Top tooth plate, 3. Workpiece to be processed, 4. Adhesive layer, 5. Spring, 6. Center, 7. Top tooth insert, 8. Centering groove, 9. Top plate tooth insert. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figure 1-6 This utility model provides a technical solution: A drive-type top plate for grinding the outer diameter of semiconductor crystal rods includes a grinding machine body 1 and a workpiece 4 to be processed. Two sets of tips 7 and a top toothed disk 2 adapted to the tips 7 are installed on the grinding machine body 1. A spring 6 is fixedly connected to the outer peripheral surface of the tip 7, and the other end of the spring 6 is fixedly connected to the top toothed disk 2, so that the top toothed disk 2 is slidably assembled on its outer peripheral surface along the axial direction of the tip 7. The clamping end of the top toothed disc 2 facing the workpiece 4 is provided with a top toothed insert 8, and the clamping end of the top toothed disc 2 is detachably connected to an end toothed disc 3. The workpiece 4 is coaxially fixed between the two end toothed discs 3. The end tooth top plate 3 has a centering groove 9 on the center of its side facing the top tooth plate 2, which cooperates with the top tip 7 to achieve centering. The side of the end tooth top plate 3 is provided with a top plate tooth insert 10 that cooperates with the top tooth insert 8 around the centering groove 9.

[0020] One end of the spring 6 is fixedly connected to the outer circumferential surface of the tip 7, and the other end of the spring 6 is connected to the tip gear 2.

[0021] An adhesive layer 5 is provided on the clamping surface of the end tooth top plate 3 facing the workpiece 4 to be processed.

[0022] The tip 7 has a spherical structure at the end facing the centering groove 9, and the centering groove 9 is a hemispherical groove adapted to the spherical structure.

[0023] The top tooth insert 8 and the top plate tooth insert 10 are fitted together.

[0024] The outer diameter of the end tooth top plate 3 is smaller than the outer diameter of the workpiece 4 to be processed.

[0025] This drive-type top plate achieves high-precision outer cylindrical grinding of semiconductor crystal rods through the coordinated action of various components. The specific working process and principle are as follows: During the pre-assembly stage, firstly, according to the diameter specifications of the workpiece 4 to be processed, select an end tooth top plate 3 with an outer diameter 5-15mm smaller. Apply a 0.1-0.5mm thick high-temperature resistant adhesive layer 5 (such as epoxy resin adhesive layer or metal adhesive film) to the clamping surface of the end tooth top plate 3. Then, attach the two ends of the workpiece 4 to be processed to the adhesive layers 5 of the two end tooth top plates 3 respectively. After the adhesive layers are cured, the crystal rod and the end tooth top plate are coaxially fixed.

[0026] During the top plate assembly and centering stage, the clamping mechanism of the grinding machine body 1 is activated, pushing the two sets of top toothed discs 2 to move towards each other. After the top toothed disc 2's top toothed insert 8 and the top toothed disc 3's top toothed insert 10 are tightly engaged, the spring 6 is compressed during the movement of the top toothed disc 2, generating axial preload until the spherical end of the tip 7 is embedded in the centering groove 9. The spring 6 is used to make the top toothed insert 8 and the top toothed disc 10 tightly engaged. At the same time, the spherical end of the tip 7 is embedded in the centering groove 9, which can ensure that the workpiece 4 to be processed has a high degree of centering when rotating, and also eliminate the torsional difference when reversing, thus completing the final centering and torque transmission structure assembly.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A drive-type top plate for grinding the outer diameter of semiconductor crystal rods, comprising a grinding machine body (1) and a workpiece (4) to be processed, characterized in that: The grinding machine body (1) is equipped with two sets of centers (7) and a top gear plate (2) that is adapted to the centers (7). A spring (6) is fixedly connected to the outer peripheral surface of the center (7), and the other end of the spring (6) is fixedly connected to the top gear plate (2), so that the top gear plate (2) slides along the axial direction of the center (7) and is mounted on its outer peripheral surface. The top toothed disc (2) is provided with a top toothed insert (8) at the clamping end facing the workpiece (4) to be processed, and the clamping end of the top toothed disc (2) is detachably connected to an end toothed disc (3), and the workpiece (4) to be processed is coaxially fixed between the two end toothed discs (3). The end tooth top plate (3) has a centering groove (9) on the side center facing the top tooth plate (2) to cooperate with the top tip (7) to achieve centering. The side of the end tooth top plate (3) is provided with a top plate tooth insert (10) that cooperates with the top tooth insert (8) around the centering groove (9).

2. The drive-type top plate for grinding the outer diameter of semiconductor ingots according to claim 1, characterized in that: One end of the spring (6) is fixedly connected to the outer circumferential surface of the tip (7), and the other end of the spring (6) is connected to the top toothed disc (2).

3. The drive-type top plate for grinding the outer diameter of semiconductor crystal rods according to claim 1, characterized in that: The end tooth top plate (3) has an adhesive layer (5) on the clamping surface facing the workpiece (4).

4. The drive-type top plate for grinding the outer diameter of semiconductor crystal rods according to claim 1, characterized in that: The end of the tip (7) facing the centering groove (9) is a spherical structure, and the centering groove (9) is a hemispherical groove adapted to the spherical structure.

5. The drive-type top plate for grinding the outer diameter of semiconductor ingots according to claim 1, characterized in that: The top tooth insert (8) and the top plate tooth insert (10) are fitted together.

6. The drive-type top plate for grinding the outer diameter of semiconductor ingots according to claim 1, characterized in that: The outer diameter of the end tooth top plate (3) is smaller than the outer diameter of the workpiece (4) to be processed.

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