Specialized extraction device for semiconductor equipment heat lamps

CN224643490UActive Publication Date: 2026-08-18SHANDONG JUZHI SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202521075207.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-28
Publication Date
2026-08-18
Estimated Expiration
2035-05-28

AI Technical Summary

Technical Problem

[0002]半导体设备中的加热灯在长期使用后灯管老化或污染会降低加热效率,增加能耗,甚至引发工艺偏差,需及时更换

Benefits of technology

该半导体设备加热灯专用取出装置,将夹持槽对准加热灯,使加热灯一端插入至夹持槽内,旋转推进器,使推进器向夹持块移动,推进器一侧的压环挤压夹持块,使两侧的夹持块向中部移动,由于夹持块的半径沿安装杆向夹持块的方向增加,以对夹持槽内的加热灯进行夹持固定,通过调整推进器的移动距离以调整两侧的夹持块对加热灯的压力,可以对不同尺寸的加热灯进行夹持,夹持后通过手柄取出加热灯。

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Abstract

The utility model relates to the field of taking-out device, concretely to special taking-out device of semiconductor equipment heating lamp, including handle, fixedly installed clamping mechanism on handle and be located on the pusher of clamping mechanism, clamping mechanism includes at least mounting rod, and one side fixed mounting of mounting rod has clamping block fixed base. The special taking-out device of semiconductor equipment heating lamp, the clamping groove is aimed at heating lamp, makes heating lamp one end to insert into the clamping groove, rotates the pusher, makes the pusher to clamping block movement, and the compression ring of pusher one side extrudes clamping block, makes both sides clamping block to the middle part movement, because the radius of clamping block increases along the direction of mounting rod to clamping block, to clamp and fix the heating lamp in the clamping groove, adjust the moving distance of pusher to adjust the pressure of both sides clamping block to heating lamp, can clamp the heating lamp of different size, and the heating lamp is taken out after clamping through handle.
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Description

Technical Field

[0001] This utility model relates to the field of removal devices, and in particular to a removal device specifically for heating lamps in semiconductor equipment. Background Technology

[0002] In semiconductor equipment, heating lamps can experience reduced heating efficiency, increased energy consumption, and even process deviations after prolonged use due to lamp aging or contamination, necessitating timely replacement. The JID82V500W LAMP is a type of heating lamp used in semiconductor equipment, typically installed in high-temperature, high-precision cavities. Handling it manually can lead to burns from the high temperature or damage from improper force, requiring specialized tools for stable clamping and easy removal. Therefore, a dedicated removal device for semiconductor equipment heating lamps is provided. Utility Model Content

[0003] The main purpose of this invention is to provide a dedicated removal device for heating lamps in semiconductor equipment, in order to solve the problems raised in related technologies.

[0004] To achieve the above objectives, according to one aspect of the present invention, a special removal device for heating lamps of semiconductor equipment is provided, including a handle, a clamping mechanism fixedly mounted on the handle, and a pusher mounted on the clamping mechanism. The clamping mechanism includes at least a mounting rod, a clamping block fixing base is fixedly mounted on one side of the mounting rod, and two mutually symmetrical and non-contacting clamping blocks are fixedly mounted at the end of the clamping block fixing base. A clamping groove is provided between the two clamping blocks. The device also includes a pusher, which is sleeved on the clamping block fixing base and clamps the heating lamp by squeezing the clamping blocks with a pressure ring.

[0005] Furthermore, one end of the mounting rod is fixedly installed inside the handle, and an inner toothed sleeve is fixedly installed in the middle of the mounting rod, with threads on the surface of the inner toothed sleeve.

[0006] Furthermore, an external toothed sleeve is fixedly installed inside the thruster.

[0007] Furthermore, the inner surface of the external threaded sleeve is threaded, and the external threaded sleeve and the internal threaded sleeve are threadedly engaged.

[0008] Furthermore, the radius of the clamping block increases along the mounting rod towards the clamping block.

[0009] Compared with the prior art, the present invention has the following beneficial effects: This semiconductor equipment heating lamp removal device aligns the clamping slot with the heating lamp, inserting one end of the heating lamp into the clamping slot. Rotating the pusher moves it towards the clamping blocks. A pressure ring on one side of the pusher squeezes the clamping blocks, causing the clamping blocks on both sides to move towards the center. As the radius of the clamping blocks increases along the mounting rod towards the clamping blocks, the heating lamp in the clamping slot is clamped and fixed. The pressure of the clamping blocks on the heating lamp can be adjusted by changing the movement distance of the pusher. This allows for clamping heating lamps of different sizes. After clamping, the heating lamp is removed using the handle. Attached Figure Description

[0010] Figure 1 This is a cross-sectional view of the extraction device in a preferred embodiment of the present invention; Figure 2 This is a schematic diagram of the overall structure of the extraction device in a preferred embodiment of the present invention; Figure 3 This is a schematic diagram of the clamping mechanism in a preferred embodiment of the present invention.

[0011] Figure label: 1. Handle; 2. Clamping mechanism; 21. Mounting rod; 22. Clamping block fixing base; 23. Internal toothed sleeve; 221. Clamping block; 222. Clamping groove; 3. Propeller; 31. Pressure ring; 32. External gear sleeve. Detailed Implementation

[0012] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0013] Please see Figures 1 to 3 This embodiment provides a dedicated removal device for heating lamps of semiconductor equipment, including a handle 1, a clamping mechanism 2 fixedly mounted on the handle 1, and a pusher 3 mounted on the clamping mechanism 2. The clamping mechanism 2 includes at least a mounting rod 21. A clamping block fixing base 22 is fixedly mounted on one side of the mounting rod 21. Two symmetrical and non-contacting clamping blocks 221 are fixedly mounted at the end of the clamping block fixing base 22. A clamping groove 222 is provided between the two clamping blocks 221. It also includes: a pusher 3, which is sleeved on the mounting rod 21. A pressure ring 31 is fixedly installed on one side of the pusher 3. The pressure ring 31 is sleeved on the clamping block fixing base 22. The heating lamp placed in the clamping groove 222 is clamped by the inner arc wall of the pressure ring 31 pressing the clamping block 221. like Figure 1 , Figure 2As shown, the clamping groove 222 has an arc-shaped structure, and the arc-shaped clamping groove 222 fits the heating lamp better; like Figure 2 As shown, one end of the mounting rod 21 is fixedly installed inside the handle 1, and an inner toothed sleeve 23 is fixedly installed in the middle of the mounting rod 21. The surface of the inner toothed sleeve 23 is provided with threads. like Figure 1 As shown, an external toothed sleeve 32 is fixedly installed inside the pusher 3. The inner surface of the external toothed sleeve 32 is threaded. The external toothed sleeve 32 is threadedly engaged with the internal toothed sleeve 23. When the pusher 3 is rotated, the pusher 3 moves along the internal toothed sleeve 23 through the external toothed sleeve 32. like Figure 3 As shown, the radius of the clamping block 221 increases along the mounting rod 21 toward the clamping block 221. When the pressure ring 31 moves toward the clamping block 221, the pressure of the pressure ring 31 on the clamping block 221 increases, causing the clamping blocks 221 on both sides to move toward the center, so as to clamp and fix the heating lamp in the clamping groove 222. In practical use, the clamping groove 222 is aligned with the heating lamp, and one end of the heating lamp is inserted into the clamping groove 222. The pusher 3 is rotated to move the pusher 3 toward the clamping block 221. Since the radius of the clamping block 221 increases along the mounting rod 21 toward the clamping block 221, the pressure ring 31 on one side of the pusher 3 squeezes the clamping block 221, causing the clamping blocks 221 on both sides to move toward the center, so as to clamp and fix the heating lamp in the clamping groove 222. By adjusting the moving distance of the pusher 3, the pressure of the clamping blocks 221 on both sides on the heating lamp can be adjusted, so that heating lamps of different sizes can be clamped. After clamping, the heating lamp is taken out through the handle 1. After taking it out, the pusher 3 is rotated in the opposite direction to remove the heating lamp.

[0014] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A dedicated removal device for heating lamps in semiconductor equipment, comprising a handle (1), a clamping mechanism (2) fixedly mounted on the handle (1), and a pusher (3) mounted on the clamping mechanism (2), characterized in that, The clamping mechanism (2) includes at least a mounting rod (21), a clamping block fixing base (22) is fixedly mounted on one side of the mounting rod (21), and two symmetrical and non-contacting clamping blocks (221) are fixedly provided at the end of the clamping block fixing base (22). A clamping groove (222) is provided between the two clamping blocks (221), and further includes: The pusher (3) is sleeved on the mounting rod (21). A pressure ring (31) is fixedly installed on one side of the pusher (3). The pressure ring (31) is sleeved on the clamping block fixing base (22). The heating lamp is clamped by the pressure ring (31) squeezing the clamping block (221).

2. The semiconductor device heating lamp removal device according to claim 1, characterized in that, One end of the mounting rod (21) is fixedly installed inside the handle (1), and an inner toothed sleeve (23) is fixedly installed in the middle of the mounting rod (21). The inner toothed sleeve (23) has threads on its surface.

3. The semiconductor device heating lamp removal device according to claim 2, characterized in that, An external toothed sleeve (32) is fixedly installed inside the thruster (3).

4. The semiconductor device heating lamp removal device according to claim 3, characterized in that, The outer toothed sleeve (32) has a thread on its inner surface, and the outer toothed sleeve (32) is threadedly engaged with the inner toothed sleeve (23).

5. The semiconductor device heating lamp removal device according to claim 1, characterized in that, The radius of the clamping block (221) increases along the mounting rod (21) toward the clamping block (221).