A single-head cutting machine sample and head-tail material automatic collecting device

Abstract

The utility model relates to the technical field of cutting-off machine, concretely relates to a single cutter head cutting-off machine sample and head tail material automatic collection device, including cutting-off machine main part, inhale piece mechanism, two feeding mechanisms and collection mechanism, inhale piece mechanism is used for inhaling and conveying the crystal bar sample that cutting-off machine main part cut, two feeding mechanisms are all used for conveying the crystal bar head tail material that cutting-off machine main part cut, and collection mechanism is used for collecting the crystal bar sample and crystal bar head tail material of conveying, and every feeding mechanism includes the bearing plate, and the bearing plate is opened with the slope, and the bearing plate is relative to cutting-off machine main part and can move horizontally. This single cutter head cutting-off machine sample and head tail material automatic collection device, through setting inhale piece mechanism, feeding mechanism and collection mechanism, can to the sample and head tail material of crystal bar intercept, realize stable automatic conveying and collection effect, alleviateed the labor of staff, improved the working efficiency of cutting-off machine.

Description

Technical Field

[0001] This utility model relates to the field of cutting machine technology, specifically to a single-blade cutting machine sample sheet and an automatic head and tail material collection device. Background Technology

[0002] A single-blade cutting machine is a device used to cut materials into specific lengths. Single-blade cutting machines are generally divided into two types of cutting methods: diamond wire cutting and blade shearing. Diamond wire cutting uses a ring of diamond wire wrapped around a cutting wheel to reciprocate at high speed, in conjunction with the material feeding motion. It utilizes the high hardness and wear resistance of diamond wire to cut hard and brittle materials such as silicon rods, achieving tasks such as cutting, removing ends, and taking samples. Blade shearing, on the other hand, is used in some metal processing or cutting scenarios such as ropes and pipes. In these scenarios, the single-blade cutting machine uses the shearing action of blades to cut materials.

[0003] In the semiconductor and photovoltaic industries, single-blade cutting machines mostly use diamond wire cutting. The process involves first fixing the crystal rod in place, setting the cutting parameters, and then starting the equipment. The cutting component starts running at high speed under power drive, while the feeding system moves the crystal rod towards the cutting component, so that the cutting component contacts the crystal rod and produces a cutting action. During the cutting process, the cooling system cools the crystal rod simultaneously until the crystal rod is sliced ​​and cut according to the preset requirements.

[0004] However, considering that existing single-blade cutting machines typically require manual collection and disposal of the cut-off head and tail material and sample pieces when cutting crystal rods, this increases the labor force and poses certain safety risks, while also reducing the automation level and work efficiency of the cutting machine. Utility Model Content

[0005] The purpose of this utility model is to provide an automatic collection device for sample pieces and head and tail materials of a single-blade cutting machine.

[0006] To achieve this objective, the present invention adopts the following technical solution: An automatic collection device for sample wafers and head and tail materials of a single-blade cutting machine is provided, including a cutting machine body, a wafer suction mechanism, two feeding mechanisms and a collection mechanism. The wafer suction mechanism is used to suction and convey the crystal rod sample wafers cut by the cutting machine body. Both feeding mechanisms are used to convey the head and tail materials of the crystal rods cut by the cutting machine body. The collection mechanism is used to collect the conveyed crystal rod sample wafers and head and tail materials. Each feeding mechanism includes a support plate with a ramp. The support plate is horizontally movable relative to the main body of the cutting machine, and the ramp is used to clamp the head and tail of the crystal ingot. Through the set suction mechanism and feeding mechanism, the crystal ingot sample and the head and tail can be automatically transported to the collection mechanism for collection. The two support plates in the feeding mechanism can stably clamp the head and tail of the crystal ingot, thereby improving the stability of the head and tail of the crystal ingot during automatic transportation.

[0007] Furthermore, each feeding mechanism also includes an electric guide rail and an electric slide. The electric guide rail is fixedly installed on the main body of the cutting machine, and the electric slide is slidably installed on the electric guide rail, and the electric slide is slidably connected to the bearing plate.

[0008] Furthermore, the wafer suction mechanism includes an electric slide rail one, an electric slide rail two, and a support arm. The electric slide rail one is fixedly installed on the main body of the cutting machine, the electric slide rail two is slidably installed on the electric slide rail one via a sliding seat, and the support arm is slidably installed on the electric slide rail two via a mounting bracket. The movement of the support arm drives the suction cup to move, thereby enabling the suction and transport of the crystal rod sample.

[0009] Furthermore, the suction mechanism also includes a suction cup, which is fixedly mounted on the support arm and is used to pick up crystal rod samples.

[0010] Furthermore, the collection mechanism includes a collection box and a buffer mechanism. The collection box is fixedly installed on the main body of the cutting machine and is located between two electric guide rails. The collection box has a collection slot, and the buffer mechanism is used to buffer and protect the collection box. By opening a collection slot on the collection box, the head and tail of the crystal rod and the sample can be collected inside the collection box and the collection slot, respectively.

[0011] Furthermore, the buffer mechanism includes a buffer plate and a connecting plate. A groove is provided on the collection box, and the buffer plate is slidably mounted in the groove via a guide block. The connecting plate is hinged to the buffer plate via a hinge rod, and is slidably mounted inside the collection box via a cylindrical rod. The connecting plate and the collection box are connected by a spring. Through the elastic force of the spring, when the head and tail of the crystal rod fall onto the buffer plate inside the collection box, it provides a buffering effect.

[0012] Furthermore, the buffer mechanism also includes a rubber pad and a damper. The rubber pad is fixedly installed on the buffer plate, and the damper is fixedly installed inside the collection box, with the top of the damper fixedly connected to the bottom of the buffer plate. By setting the damper, the movement speed of the buffer plate when it is impacted is reduced, further improving the buffering effect of the buffer plate.

[0013] Furthermore, the buffer mechanism also includes a circular pad, which is fixedly installed on the top of the connecting plate.

[0014] The beneficial effects of this utility model are as follows: This automatic collection device for sample wafers and head and tail materials of a single-blade cutting machine, through the set suction mechanism, feeding mechanism and collection mechanism, can achieve stable automatic conveying and collection of sample wafers and head and tail materials cut from crystal rods, reducing the labor of workers and improving the working efficiency of the cutting machine. In addition, the buffer mechanism in the collection mechanism can play a good buffering role when the head and tail materials of crystal rods fall into the collection box, avoiding excessive impact force of the head and tail materials of crystal rods and causing damage to the collection box. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the embodiments of this utility model will be briefly introduced below.

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the main structure of the support plate of this utility model; Figure 3 This is a schematic diagram of the main structure of the suction mechanism of this utility model; Figure 4 For the present utility model Figure 3 Enlarged structural diagram of section A; Figure 5 This is a schematic diagram of the main structure of the collection mechanism of this utility model; Figure 6 This is a schematic diagram of the main structure of the buffer mechanism of this utility model; Figure 7 This is a cross-sectional view of the collection box of this utility model; Figure 8 This is a schematic diagram of the main structure of the connecting plate of this utility model.

[0017] In the diagram: 1. Main body of the cutting machine; 2. Suction mechanism; 21. Electric slide rail one; 22. Sliding seat; 23. Electric slide rail two; 24. Mounting frame; 25. Support arm; 26. Suction cup; 3. Feeding mechanism; 31. Electric guide rail; 32. Electric slide seat; 33. Bearing plate; 34. Inclined ramp; 4. Collection mechanism; 41. Collection box; 42. Slip collection groove; 43. Buffer mechanism; 431. Buffer plate; 432. Rubber pad; 433. Hinge rod; 434. Connecting plate; 435. Spring; 436. Cylindrical rod; 437. Circular pad; 438. Damper; 439. Slide groove; 4310. Guide block. Detailed Implementation

[0018] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0019] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this patent. To better illustrate the embodiments of this utility model, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0020] Reference Figure 1 The device shown is an automatic collection device for crystal rod samples and head / tail materials from a single-blade cutting machine. It includes a cutting machine body 1, a suction mechanism 2, two feeding mechanisms 3, and a collection mechanism 4. The suction mechanism 2 is used to pick up and transport the crystal rod samples cut by the cutting machine body 1. The suction mechanism 2 automatically picks up the crystal rod samples and transports them to the collection mechanism 4 for collection. The two feeding mechanisms 3 are used to transport the head and tail materials of the crystal rods cut by the cutting machine body 1. The two feeding mechanisms 3 automatically clamp and transport the head and tail materials of the crystal rods and transport them to the collection mechanism 4 for collection, thereby achieving automatic collection of crystal rod samples and head / tail materials. The collection mechanism 4 is used to collect the transported crystal rod samples and head / tail materials, thus reducing the need for manual intervention and improving the working efficiency of the cutting machine.

[0021] Reference Figure 1 and Figure 2 Each feeding mechanism 3 includes a bearing plate 33, on which a ramp 34 is provided. The bearing plate 33 can move horizontally relative to the main body 1 of the cutting machine. Through the movement of the two bearing plates 33, the head and tail of the crystal rod can be clamped and conveyed. The ramp 34 is used to clamp the head and tail of the crystal rod. By setting the ramp 34, the clamping effect of the head and tail of the crystal rod can be improved, and the shaking and deviation of the head and tail of the crystal rod during the conveying process can be avoided. Each feeding mechanism 3 also includes an electric guide rail 31 and an electric slide 32. The electric guide rail 31 is fixedly installed on the main body 1 of the cutting machine. The electric guide rail 31 is existing technology. By activating the electric guide rail 31, the electric slide 32 can be moved along the electric guide rail 31, thereby moving the bearing plate 33 along the electric guide rail 31, thus enabling automatic conveying of the crystal rod head and tail materials. The electric slide 32 is slidably installed on the electric guide rail 31, and the electric slide 32 is slidably connected to the bearing plate 33. The electric slide 32 is existing technology. By activating the electric slide 32, the bearing plate 33 can be moved along both sides of the main body 1 of the cutting machine, thereby enabling clamping or releasing the crystal rod head and tail materials.

[0022] Reference Figure 3 and Figure 4The suction mechanism 2 includes an electric slide rail 1 21, an electric slide rail 23, and a support arm 25. The electric slide rail 1 21 is fixedly installed on the main body 1 of the cutting machine. By activating the electric slide rail 1 21, the sliding seat 22 can be moved along the direction of the electric slide rail 1 21. The electric slide rail 23 is slidably installed on the electric slide rail 1 21 through the sliding seat 22. By the movement of the sliding seat 22, the electric slide rail 23 can be moved along the direction of the electric slide rail 1 21. The support arm 25 is slidably installed on the electric slide rail 23 through the mounting bracket 24. By activating the electric slide rail 23, the mounting bracket 24 can be moved along the direction of the electric slide rail 23, which in turn can move the support arm 25 along the direction of the electric slide rail 23. The suction mechanism 2 also includes a suction cup 26, which is fixedly installed on the support arm 25. The suction cup 26 is used to pick up the crystal rod sample. There are four suction cups 26 arranged in an array on the support arm 25. Through the movement of the support arm 25, the suction cup 26 can be driven to contact the crystal rod sample, thereby picking up and transporting the crystal rod sample.

[0023] Reference Figure 1 and Figure 5 The collection mechanism 4 includes a collection box 41 and a buffer mechanism 43. The collection box 41 is fixedly installed on the main body 1 of the cutting machine and is located between two electric guide rails 31. When the bearing plate 33 moves the crystal rod head and tail material to above the collection box 41, it releases the clamping effect on the crystal rod head and tail material, allowing the crystal rod head and tail material to fall into the collection box 41 for collection. The collection box 41 is provided with a collection slot 42. When the support arm 25 moves the crystal rod sample into the collection slot 42, it releases the adsorption effect of the suction cup 26 on the crystal rod sample, allowing the crystal rod sample to fall into the collection slot 42 for collection. The buffer mechanism 43 is used to buffer and protect the collection box 41, reducing the impact force of the crystal rod head and tail material on the collection box 41.

[0024] Reference Figures 5 to 7The buffer mechanism 43 includes a buffer plate 431 and a connecting plate 434. A groove 439 is provided on the collection box 41, which guides the buffer plate 431 and improves its stability during movement. The buffer plate 431 is slidably mounted on the groove 439 via a guide block 4310. When the buffer plate 431 is impacted, it moves along the groove 439. The connecting plate 434 is hinged to the buffer plate 431 via a hinge rod 433, and is slidably mounted inside the collection box 41 via a cylindrical rod 436. The movement effect disperses and transmits the impact force to the hinge rod 433, causing the hinge rod 433 to move. The hinge rod 433 then disperses and transmits the impact force to the connecting plate 434, causing the connecting plate 434 to move along the cylindrical rod 436. The connecting plate 434 and the collection box 41 are connected by a spring 435. The connecting plate 434 transmits the impact force to the spring 435. The elastic force of the spring 435 exerts a reaction force on the connecting plate 434, thereby reducing the impact force and thus buffering the buffer plate 431 and the collection box 41.

[0025] Reference Figure 6 and Figure 8 The buffer mechanism 43 also includes a rubber pad 432 and a damper 438. The rubber pad 432 is fixedly installed on the buffer plate 431. When the crystal rod head and tail material fall into the collection box 41, they will impact the rubber pad 432 and the buffer plate 431. The rubber pad 432 reduces part of the impact force on the buffer plate 431. The damper 438 is fixedly installed inside the collection box 41, and the top of the damper 438 is fixedly connected to the bottom of the buffer plate 431. The damper 438 is existing technology. The damper 438 reduces the moving speed of the buffer plate 431 when it is impacted, thereby further reducing the impact force on the buffer plate 431. The buffer mechanism 43 also includes a circular pad 437. The circular pad 437 is fixedly installed on the top of the connecting plate 434. The circular pad 437 protects the connecting plate 434 and the buffer plate 431, preventing direct impact contact between the buffer plate 431 and the connecting plate 434.

[0026] Reference Figures 1 to 8 This automatic collection device for sample wafers and head / tail materials from a single-blade cutting machine, through its suction mechanism, feeding mechanism, and collection mechanism, can achieve stable automatic conveying and collection of sample wafers and head / tail materials cut from crystal rods. This reduces the labor burden on workers and improves the working efficiency of the cutting machine. In addition, the buffer mechanism within the collection mechanism provides good cushioning when the head / tail materials of the crystal rods fall into the collection box, preventing excessive impact force and damage to the collection box.

[0027] It should be stated that the above-described specific embodiments are merely preferred embodiments of this utility model and the technical principles employed. Those skilled in the art should understand that various modifications, equivalent substitutions, and variations can be made to this utility model. However, such variations, as long as they do not depart from the spirit of this utility model, should be within the protection scope of this utility model. Furthermore, some terminology used in this application specification and claims is not limiting, but merely for ease of description.

Claims

1. A single-head slitting machine sample and head-tail material automatic collecting device, characterized in that, The device includes a cutting machine body (1), a wafer suction mechanism (2), two feeding mechanisms (3) and a collection mechanism (4). The wafer suction mechanism (2) is used to suction and transport the crystal rod sample cut by the cutting machine body (1). The two feeding mechanisms (3) are used to transport the crystal rod head and tail material cut by the cutting machine body (1). The collection mechanism (4) is used to collect the transported crystal rod sample and crystal rod head and tail material. Each of the feeding mechanisms (3) includes a support plate (33), on which a ramp (34) is provided, and the support plate (33) can move horizontally relative to the main body (1) of the cutting machine. The ramp (34) is used to clamp the head and tail of the crystal rod.

2. The apparatus according to claim 1, wherein Each of the feeding mechanisms (3) further includes an electric guide rail (31) and an electric slide (32). The electric guide rail (31) is fixedly installed on the main body (1) of the cutting machine, and the electric slide (32) is slidably installed on the electric guide rail (31). The electric slide (32) is slidably connected to the bearing plate (33).

3. The apparatus according to claim 1, wherein the apparatus is characterized by: The suction mechanism (2) includes an electric slide rail one (21), an electric slide rail two (23) and a support arm (25). The electric slide rail one (21) is fixedly installed on the main body (1) of the cutting machine. The electric slide rail two (23) is slidably installed on the electric slide rail one (21) through a sliding seat (22). The support arm (25) is slidably installed on the electric slide rail two (23) through a mounting bracket (24).

4. The automatic collection device for sample pieces and head / tail materials of a single-blade cutting machine according to claim 3, characterized in that, The suction mechanism (2) also includes a suction cup (26), which is fixedly installed on the support arm (25) and is used to pick up crystal rod samples.

5. The apparatus according to claim 2, wherein The collection mechanism (4) includes a collection box (41) and a buffer mechanism (43). The collection box (41) is fixedly installed on the main body (1) of the cutting machine and is located between two electric guide rails (31). The collection box (41) has a collection slot (42) and the buffer mechanism (43) is used to buffer and protect the collection box (41).

6. The automatic collection device for sample pieces and head / tail materials of a single-blade cutting machine according to claim 5, characterized in that, The buffer mechanism (43) includes a buffer plate (431) and a connecting plate (434). The collection box (41) is provided with a groove (439). The buffer plate (431) is slidably installed in the groove (439) through a guide block (4310). The connecting plate (434) is hinged to the buffer plate (431) through a hinge rod (433). The connecting plate (434) is slidably installed in the collection box (41) through a cylindrical rod (436). The connecting plate (434) and the collection box (41) are connected by a spring (435).

7. The apparatus according to claim 6, wherein the apparatus is characterized by: The buffer mechanism (43) further includes a rubber pad (432) and a damper (438). The rubber pad (432) is fixedly installed on the buffer plate (431), and the damper (438) is fixedly installed inside the collection box (41). The top of the damper (438) is fixedly connected to the bottom of the buffer plate (431).

8. The apparatus according to claim 6, wherein, The buffer mechanism (43) also includes a circular pad (437), which is fixedly installed on the top of the connecting plate (434).

Images