An epoxy resin housing forming mold for a controller

Abstract

The utility model relates to controller technical field, specifically disclose a kind of epoxy resin shell forming die of controller, including upper die and lower die, upper die is detachably connected with lower die by clamping member, several controller's die cavity is set up in upper die, the die cavity is blind hole, die cavity is coated with non-adhesion coating, the position corresponding with die cavity is equipped with the mounting groove fixed with controller on lower die. The scheme is by installing the circuit board and cable of controller in mould, and using fast clamp die closing, forms cavity for pouring epoxy resin, epoxy resin is integrated after solidification with circuit board, after taking out, no additional metal or plastic shell is needed. The utility model need not specially customize shell for product, simplifies the installation step of product, by curing circuit board and epoxy resin together in mould, so that epoxy resin is wrapped around circuit board and forms specific shape, reaches the same or more optimal three-proofing effect with product with shell.

Description

Technical Field

[0001] This utility model relates to the field of controller technology, and in particular to an epoxy resin shell molding mold for a controller. Background Technology

[0002] In traditional solutions, the controller circuit board is fixed to a metal or plastic housing with screws. To achieve a waterproof effect, sealing rings or sealant are installed at the joints of various parts of the housing, or epoxy adhesive is injected inside the housing. This traditional manufacturing method adds a housing component and requires matching with the housing, making the overall assembly process more complex and the product manufacturing cost higher. Utility Model Content

[0003] The purpose of this invention is to provide an epoxy resin shell molding die for a controller. By setting a main air nozzle and a secondary air nozzle, the main air nozzle meets the drying requirements during normal coating, and the secondary air nozzle automatically emits air when it senses that it is very close to the electrode to supplement the air volume of the main air nozzle. This effectively protects the electrode from being scratched by the air nozzle, maintains drying efficiency, improves electrode quality and production efficiency, and solves the problems encountered in the above-mentioned background technology.

[0004] To achieve the above objectives, the technical solution of this utility model is as follows:

[0005] An epoxy resin shell molding die for a controller includes an upper mold and a lower mold. The upper mold is detachably connected to the lower mold via a clamping member. The upper mold has several mold cavities for placing the controller. The mold cavities are blind holes and coated with a non-adhesive coating. The lower mold has mounting grooves for fixing the controller at positions corresponding to the mold cavities.

[0006] In the above scheme, after the upper mold and lower mold are assembled and the controller is fixed in the mold cavity, epoxy resin is poured into the mold cavity. As a preferred embodiment, the mold cavity is a trapezoidal cavity, and a marking area is provided on one side of the mold cavity.

[0007] In the above solution, a reference groove is provided on the outer periphery of the lower mold, and a sealing strip is installed in the reference groove. As a preferred solution, a threaded hole is provided in the mounting groove, and the lower mold is fixedly connected to the circuit board of the controller by screws passing through the threaded hole.

[0008] In the above solution, the top of the upper mold is provided with a mounting hole, which is a countersunk screw hole. Positioning grooves are provided on both sides of the upper mold, and the positioning grooves have a stepped structure. Support blocks are provided on both sides of the bottom of the upper mold, and the base of the clamping member is mounted on the support blocks. As a preferred solution, the clamping member is a quick-release clamp. Furthermore, clearance grooves are provided on both sides of the lower mold to avoid obstructing the lower mold.

[0009] Compared with existing technologies, the advantages of this invention are: This solution eliminates the need for a specially prefabricated product shell. Instead, it creates a mold cavity of a specific shape using an upper mold, with the inner side of the cavity coated with Teflon. In use, the controller circuit board is first installed into the mold, and then screwed into the lower mold. Epoxy resin is then injected into the cavity and allowed to stand. After the epoxy resin cures, the product is removed from the cavity. This achieves a three-proof (proof, dustproof, and shockproof) effect without the need for an additional shell. The product is easy to assemble, compact, and aesthetically pleasing. The mold is reusable, and the cost is low. Attached Figure Description

[0010] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts. Wherein:

[0011] Figure 1 This is an exploded structural diagram of the present invention;

[0012] Figure 2 This is a schematic diagram of the upper mold in this utility model;

[0013] Figure 3 This is a schematic diagram of the lower mold in this utility model.

[0014] The numbers in the diagram are: 1-Upper mold; 11-Mold cavity; 12-Mounting hole; 13-Support block; 14-Marking area; 15-Positioning groove; 2-Lower mold; 21-Mounting groove; 22-Allowing groove; 23-Threaded hole; 24-Reference groove; 3-Clamping part; 4-Sealing strip. Detailed Implementation

[0015] To make the technical means, creative features, achieved objectives and effects of this utility model easier to understand, the utility model will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of this utility model, and therefore only show the relevant components of this utility model.

[0016] Based on the technical solution of this utility model, without changing the essential spirit of this utility model, those skilled in the art can propose various interchangeable structural methods and implementation methods. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model, and should not be regarded as the entirety of this utility model or as a limitation or restriction of the technical solution of this utility model.

[0017] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0018] Example 1, as Figures 1 to 3As shown, an epoxy resin shell molding die for a controller includes an upper mold 1 and a lower mold 2. The materials of the upper mold 1 and the lower mold 2 are not limited to metal; plastic or other materials can also achieve the same effect. The upper mold 1 is detachably connected to the lower mold 2 via a clamping member 3, facilitating mold removal and mold closing.

[0019] The upper mold 1 has several cavities 11 for placing the controller. Each cavity 11 is a blind hole and serves both to house the controller's circuit board and cables, and to be filled with epoxy resin as a shell. The cavities 11 are coated with a non-adhesive coating, specifically a Teflon coating. The inner side of the cavity 11 is sprayed with Teflon, making it easy to separate from the cured epoxy resin and preventing adhesion. Teflon is a fluoropolymer coating based on polytetrafluoroethylene (PTFE) resin, widely used in seals, insulation materials, and industrial pipe coatings, possessing moisture resistance, abrasion resistance, and non-adhesive properties.

[0020] The lower mold 2 is provided with a mounting groove 21 for fixing the controller at the position corresponding to the mold cavity 11. The controller circuit board is fixed with the controller through the threaded hole 23, which plays a positioning role and has higher stability. It is also easy to demold after removing the screws.

[0021] This solution eliminates the need for a specially prefabricated product casing. Instead, an upper mold 1 creates a mold cavity 11 with a specific shape, the inside of which is coated with Teflon. In use, the controller circuit board is first installed into the mold, and then screwed into the lower mold 2. Epoxy resin is then injected into the mold cavity 11 and allowed to stand. After the epoxy resin cures, the product is removed from the cavity. This solution achieves a three-proof (dustproof, waterproof, and shockproof) effect without the need for an additional casing. The product is easy to assemble, compact, and aesthetically pleasing. The mold is reusable, and the cost is low.

[0022] During implementation, after assembling the upper mold 1 and the lower mold 2, and fixing the controller in the mold cavity 11, epoxy resin is poured into the mold cavity 11. As a preferred embodiment, the mold cavity 11 is a trapezoidal cavity for easy demolding. A marking area 14 is provided on one side of the mold cavity 11, and the upper mold 1 has customized protruding character patterns for display on the surface of the cured epoxy resin shell, which can be patterns or characters such as model number, trademark, and name.

[0023] Example 2, based on the scheme of Example 1, has a reference groove 24 on the outer periphery of the lower mold 2, and a sealing strip 4 is installed in the reference groove 24. After the upper mold 1 and the lower mold 2 are closed, the connection can be sealed to prevent epoxy resin glue leakage. A threaded hole 23 is opened in the mounting groove 21. The lower mold 2 is fixedly connected to the circuit board of the controller by screws passing through the threaded hole 23, so as to position the controller placed in the mold cavity 11.

[0024] In addition, other additional technical features can be designed, such as mounting holes 12 on the top of the upper mold 1. The mounting holes 12 are countersunk screw holes, which are used to rotate the upper mold 1 90 degrees and mount it on a backing plate, facilitating the injection of epoxy resin adhesive. Positioning grooves 15 are provided on both sides of the upper mold 1. The positioning grooves 15 have a stepped structure and can be positioned on the backing plate of the worktable.

[0025] To facilitate the installation of the clamping component 3, support blocks 13 are provided on both sides of the bottom of the upper mold 1. The support blocks 13 have a boss structure, and the base of the clamping component 3 is installed on the support blocks 13. In implementation, the clamping component 3 is a quick clamp, used to quickly close the upper and lower molds. Furthermore, clearance grooves 22 are provided on both sides of the lower mold 2 to allow space for smooth clamping by the quick clamp.

[0026] Example 3, as Figure 1 As shown, when using it, perform the following steps:

[0027] Step 1: First, install the sealing strip 4 around the lower mold 2 and fix the controller circuit board to the mounting groove 21 of the lower mold with screws. Install the cover plate of the lower mold 2 onto the mold cavity 11 of the upper mold 1, close the quick clamps to clamp it, forming a sealed cavity for glue pouring.

[0028] Step 2: Fill the mold cavity 11 with epoxy resin glue and wait for the epoxy resin glue to cure.

[0029] Step 3: After the epoxy resin adhesive has cured, the mold is removed, the controller is taken out, and the controller with the shell is formed. After the label is attached, it flows into the next process.

[0030] By directly pouring epoxy resin into a mold pre-assembled with the controller circuit board, the product is removed from the mold after the epoxy resin adhesive has cured. The cured epoxy resin can then be used as the casing of the controller.

[0031] This solution involves mounting the controller's circuit board and cables within a mold, then closing the mold with quick-clamping clamps to create a cavity for epoxy resin injection. Once cured, the epoxy resin fuses seamlessly with the circuit board, eliminating the need for an additional metal or plastic casing after removal. It offers excellent dust and shock resistance, a compact structure, and low cost. Furthermore, the inner side of the mold is coated with Teflon, resolving the issue of adhesion between the mold and the potting compound.

[0032] This invention eliminates the need for a custom-made casing for the product, simplifying the installation process. By curing the circuit board and epoxy resin together in a mold, the epoxy resin encapsulates the circuit board and forms a specific shape, achieving the same or better three-proof effect as products with casings.

[0033] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A molding die for an epoxy resin housing of a controller, characterized in that: It includes an upper mold (1) and a lower mold (2). The upper mold (1) is detachably connected to the lower mold (2) through a clamping member (3). The upper mold (1) has several mold cavities (11) for placing controllers. The mold cavities (11) are blind holes and are coated with a non-adhesive coating. The lower mold (2) has mounting grooves (21) for fixing the controllers at positions corresponding to the mold cavities (11).

2. The epoxy resin shell molding die for a controller according to claim 1, characterized in that: After the upper mold (1) and the lower mold (2) are assembled, and after the controller is fixed in the mold cavity (11), epoxy resin is injected into the mold cavity (11).

3. The epoxy resin shell molding die for a controller according to claim 1, characterized in that: The mounting groove (21) has a threaded hole (23), and the lower mold (2) is fixedly connected to the circuit board of the controller by screws passing through the threaded hole (23).

4. The epoxy resin shell molding die for a controller according to claim 1, characterized in that: The top of the upper mold (1) is provided with a mounting hole (12), which is a countersunk screw hole.

5. The epoxy resin shell molding die for a controller according to claim 4, characterized in that: The upper mold (1) has positioning grooves (15) on both sides, and the positioning grooves (15) have a stepped structure.

6. The epoxy resin shell molding die for a controller according to claim 1, characterized in that: The upper mold (1) has support blocks (13) on both sides of its bottom, and the base of the clamping member (3) is mounted on the support blocks (13).

7. The epoxy resin shell molding die for a controller according to claim 6, characterized in that: The clamping component (3) is a quick clamp.

8. The epoxy resin shell molding die for a controller according to claim 6, characterized in that: The lower mold (2) is provided with clearance grooves (22) on both sides to avoid the lower mold (2).

9. The epoxy resin shell molding die for a controller according to claim 1, characterized in that: The mold cavity (11) is a trapezoidal cavity, and a marking area (14) is provided on one side of the mold cavity (11).

10. The epoxy resin shell molding die for a controller according to claim 1, characterized in that: The lower mold (2) has a reference groove (24) on its outer periphery, and a sealing strip (4) is installed in the reference groove (24).

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