Laminated composite high reliability conductive cloth

Abstract

The application discloses laminated composite high-reliability conductive cloth, wherein the laminated composite high-reliability conductive cloth comprises a plated conductive cloth, a metal fiber blended fabric and a bonding layer; the metal fiber blended fabric is formed by blending ordinary insulating fibers and conductive fibers; the bonding layer is arranged between the plated conductive cloth and the metal fiber blended fabric; and the plated conductive cloth is electrically connected with the conductive fibers. The laminated composite high-reliability conductive cloth provided by the application is formed by compounding the plated conductive cloth and the metal fiber blended fabric together, redundant conductive paths are formed by using the metal fiber blended fabric, and a conductive cloth structure with high reliability is formed. When the plated conductive cloth of the surface layer is damaged, the metal fiber blended fabric of the lower layer can provide a standby conductive path, so that the long-term stability of the overall electrical performance is ensured.

Description

Technical Field

[0001] This application relates to the field of electromagnetic shielding materials, specifically to laminated composite high-reliability conductive cloth. Background Technology

[0002] Currently, electroplated conductive cloth (such as copper-nickel plated on polyester cloth) is one of the most widely used electromagnetic shielding materials in the field of electronic equipment electromagnetic shielding. It has excellent conductivity (low surface resistance) and good flexibility. However, its core drawback is that its conductivity depends entirely on the metal plating on the fiber surface. After repeated physical stress such as friction, bending, or scratching, the metal plating is prone to micro-cracks and peeling, resulting in interruption of the conductive path, causing a sharp increase in material resistivity, a significant decrease in shielding performance, poor reliability, and limited service life.

[0003] To address this issue, the industry is exploring different technological approaches. However, how to fundamentally improve the reliability of conductive fabrics in harsh environments while maintaining excellent conductivity and flexibility, in a low-cost and easily industrializable manner, remains a significant technological challenge in this field. Utility Model Content

[0004] This application provides a laminated composite high-reliability conductive cloth.

[0005] This application provides a laminated composite high-reliability conductive cloth comprising: an electroplated conductive cloth; a metal fiber blended fabric, wherein the metal fiber blended fabric is composed of ordinary insulating fibers and conductive fibers; and an adhesive layer disposed between the electroplated conductive cloth and the metal fiber blended fabric; wherein the electroplated conductive cloth is electrically connected to the conductive fibers.

[0006] In some alternative embodiments, the adhesive layer between the conductive fibers and the electroplated conductive cloth is pushed apart, and the electroplated conductive cloth comes into direct contact with the conductive fibers.

[0007] In some alternative embodiments, the adhesive layer is a conductive adhesive layer, and the electroplated conductive cloth is electrically connected to the conductive fibers through the conductive adhesive layer.

[0008] In some alternative embodiments, the conductive adhesive layer comprises a polymeric adhesive and conductive fillers dispersed therein.

[0009] In some alternative embodiments, the conductive filler is metal particles, including at least one of silver particles, nickel particles, copper particles, and silver-plated particles.

[0010] In some alternative embodiments, the conductive fiber is stainless steel fiber.

[0011] In some alternative embodiments, the conductive fiber is formed by twisting stainless steel filaments with insulating filaments.

[0012] In some alternative embodiments, the electroplated conductive cloth includes a non-conductive substrate and a metal plating layer formed on the non-conductive substrate.

[0013] In some alternative embodiments, the metal plating is copper or nickel.

[0014] In some alternative embodiments, the metal plating includes a first portion and a second portion formed on two opposing surfaces of the non-conductive substrate, and a third portion extending into a gap in the non-conductive substrate, wherein the first portion and the second portion are electrically connected through the third portion.

[0015] To address the shortcomings of existing electroplated conductive fabrics, this application proposes a laminated composite high-reliability conductive fabric. This application combines an electroplated conductive fabric with a metal fiber blended fabric, utilizing the metal fiber blended fabric to form redundant conductive paths, thus creating a highly reliable conductive fabric structure. When the surface electroplated conductive fabric is damaged, the underlying metal fiber blended fabric provides a backup conductive path, thereby ensuring the long-term stability of the overall electrical performance.

[0016] The technical effects achieved by this application include, but are not limited to:

[0017] (1) Extremely high reliability and damage tolerance: Through an innovative three-layer structure, using metal fiber blended fabric, redundant backup of the conductive path is achieved. Even if the surface layer is severely worn, the conductive network composed of wire fibers in the lower metal fiber blended fabric can still ensure the continuity of conductivity, and the reliability far exceeds that of any single-structure conductive cloth.

[0018] (2) High production flexibility and easy industrialization: The preparation method of this application is lamination composite, rather than complex wet chemical treatment. Electroplated conductive cloth and metal fiber blended fabric can both be produced and purchased independently as standard materials. The manufacturing of the final product only requires mature coating and lamination processes. The production process is decoupled, the supply chain is flexible, and it is easy to control costs and achieve large-scale production.

[0019] (3) High performance designability: Product performance can be flexibly customized by adjusting the materials at different levels. For example, electroplated conductive cloth with different shielding efficiencies can be selected, combined with metal fiber blended fabrics with different stainless steel contents, and adhesives with different conductivity can be used as bonding layers to meet the needs of different application scenarios from consumer electronics to military aerospace.

[0020] (4) Maintaining excellent surface properties: Since the outermost layer of the product is a standard electroplated conductive cloth, its smooth surface and extremely low contact resistance are preserved, ensuring that it can establish excellent electrical connections when in contact with other components. Attached Figure Description

[0021] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0022] Figure 1 This is a schematic diagram of the longitudinal cross-sectional structure of a laminated composite high-reliability conductive cloth according to an embodiment of this application;

[0023] Figure 2 This is a schematic diagram of the longitudinal cross-sectional structure of a laminated composite high-reliability conductive cloth according to another embodiment of this application;

[0024] Figure 3 This is a top view structural diagram of a metal fiber blended fabric according to an embodiment of this application;

[0025] Figure 4 This is a top view of a metal fiber blended fabric according to another embodiment of this application.

[0026] Figure 5 This is a flowchart of a method for preparing a laminated composite high-reliability conductive cloth according to an embodiment of this application.

[0027] Explanation of reference numerals / symbols in the attached diagram:

[0028] 100: First conductive layer; 200: Second conductive layer; 201: Ordinary insulating fiber; 202: Conductive fiber; 300: Adhesive layer. Detailed Implementation

[0029] The specific embodiments of this application will be described below with reference to the accompanying drawings and examples. Those skilled in the art can easily understand the technical problems solved by this application and the resulting technical effects through the content described herein. It is understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not intended to limit the invention. Furthermore, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0030] It should be readily understood that the meanings of “on,” “above,” and “on top of” in this application should be interpreted in the broadest sense, such that “on” means not only “directly on something,” but also “on something” including intermediate components or layers existing between the two.

[0031] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship of one element or component to another element or component shown in the accompanying drawings. In addition to the orientations described in the figures, spatial relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90° or otherwise), and the spatial relative descriptive terms used herein may be interpreted accordingly.

[0032] As used herein, the term "layer" refers to a portion of material comprising a region of a certain thickness. A layer may extend over the entirety of an underlying or upper layer structure, or may have a extent smaller than that of the underlying or upper layer structure. Furthermore, a layer may be a region of a homogeneous or heterogeneous continuous structure, with a thickness less than that of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure, or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically, and / or along a tapered surface. A substrate may be a single layer, which may include one or more layers, and / or may have one or more layers on, above, and / or below it. A single layer may include multiple layers. For example, a semiconductor layer may include one or more doped or undoped semiconductor layers, and may have the same or different materials.

[0033] It should be noted that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and to facilitate understanding and reading of the contents described in the specification. They are not intended to limit the scope of this application and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives of this application, should still fall within the scope of the technical content disclosed in this application. Furthermore, terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0034] It should also be noted that the longitudinal section corresponding to the embodiment of this application can be the section corresponding to the front view direction, the transverse section can be the section corresponding to the right view direction, and the horizontal section can be the section corresponding to the top view direction.

[0035] Furthermore, where there is no conflict, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0036] refer to Figures 1 to 4One embodiment of this application provides a laminated composite high-reliability conductive cloth. The laminated composite high-reliability conductive cloth of this application includes:

[0037] The first conductive layer 100 is an electroplated conductive cloth;

[0038] The second conductive layer 200 is a metal fiber blended fabric, which is made of ordinary insulating fiber 201 and conductive fiber 202 blended together.

[0039] Intermediate layer 300: This is an adhesive layer disposed between the electroplated conductive cloth and the metal fiber blended fabric.

[0040] Among them, the electroplated conductive cloth is electrically connected to the conductive fiber 202.

[0041] Here, the electroplated conductive cloth comprises a non-conductive substrate and a metallic coating formed on the non-conductive substrate. The non-conductive substrate can be a fabric made of materials such as polyester, nylon, or aramid. The metallic coating can be formed using wet processes such as electroless plating and electroplating. The materials of the metallic coating include, but are not limited to, copper and / or nickel. This electroplated conductive cloth, located on the surface of the entire product, serves to provide the product with a primary, low-resistance conductive surface and electromagnetic shielding function.

[0042] Here, the metal fiber blended fabric can be made by blending ordinary insulating fiber 201 and conductive fiber 202 through weaving or knitting processes, and it itself constitutes a stable, wear-resistant, and tensile-resistant conductive network.

[0043] Here, an adhesive layer is applied between the electroplated conductive fabric and the metal fiber blended fabric to bond them together. This layer serves as a physical bond between the two layers.

[0044] In some alternative implementations, such as Figure 1 As shown, the adhesive layer can be a conductive adhesive layer, such as conductive glue or self-adhesive conductive adhesive, thus possessing good conductivity in the vertical direction (Z-axis direction), enabling electrical signal communication between the first conductive layer 100 and the second conductive layer 200. Through the "Z-axis bridging" effect provided by the conductive adhesive layer, the conductive fibers 202 in the electroplated conductive fabric and the metal fiber blended fabric can be electrically connected via the conductive adhesive layer. Here, the conductive adhesive layer can, for example, be a mixture of a polymer adhesive (such as acrylic or silicone) and a conductive filler (such as metal particles), and the metal particles can include at least one of silver particles, nickel particles, copper particles, and silver-plated particles.

[0045] In some alternative implementations, such as Figure 2As shown, the adhesive layer can also be a non-conductive adhesive layer, such as ordinary non-conductive glue. During the lamination process of product preparation, the non-conductive adhesive layer between the conductive fiber 202 and the electroplated conductive cloth can be squeezed apart, allowing the electroplated conductive cloth and the conductive fiber 202 to come into direct contact, thereby achieving direct electrical connection.

[0046] In some alternative embodiments, when the adhesive layer is a conductive adhesive layer, the adhesive layer between the conductive fiber and the electroplated conductive cloth can be squeezed apart through a lamination process, thereby allowing the electroplated conductive cloth and the conductive fiber to come into direct contact. At the same time, the electroplated conductive cloth and the conductive fiber also come into indirect contact through metal particles in the conductive adhesive layer. Thus, they are electrically connected through two paths simultaneously, resulting in better conductivity.

[0047] In some alternative embodiments, in the metal fiber blended fabric, the common insulating fiber 201 may be one or more of polyester, nylon or aramid fibers, which serve as the main skeleton of the fabric, providing basic mechanical strength and flexibility.

[0048] In some alternative embodiments, in the metal fiber blended fabric, the conductive fiber 202 comprises stainless steel fiber. Here, the conductive fiber 202 can be made of pure stainless steel fiber. Alternatively, the conductive fiber 202 can be formed by twisting stainless steel fiber filaments with insulating fiber filaments. The insulating fiber filaments can be one or more combinations of polyester, nylon, or aramid fibers. The material of the stainless steel fiber filaments includes, but is not limited to, 316L stainless steel.

[0049] In some alternative embodiments, in the metal fiber blended fabric, conductive fibers 202 can be used as warp and / or weft yarns, interwoven with ordinary insulating fibers 201 at a predetermined spacing to form a blended structure. (Reference) Figure 3 Conductive fiber 202 can be used as a weft yarn (horizontal direction), evenly distributed throughout the metal fiber blended fabric at certain intervals (e.g., one conductive fiber 202 yarn is woven in every N ordinary insulating fiber 201 yarns). For example, N can be a natural number between 5 and 15. (See reference) Figure 4 Conductive fiber 202 can also be used as both warp and weft yarns, and is distributed in a uniform mesh pattern in metal fiber blended fabrics to form a mesh-like conductive substrate.

[0050] In some alternative embodiments, in the electroplated conductive cloth, the metal plating includes a first portion and a second portion formed on two opposing surfaces of a non-conductive substrate, and a third portion extending into a gap in the non-conductive substrate, the first portion and the second portion being electrically connected through the third portion.

[0051] The above provides a brief overview of the structure of the laminated composite high-reliability conductive cloth of this application. The core working principle of this application lies in:

[0052] Normal state: Current is mainly transmitted on the low-resistance metal plating layer on the surface (first conductive layer 100).

[0053] Surface Damage Condition: When the surface metal plating develops a break (e.g., a microscopic crack) due to scratches or wear, current cannot pass through that break. In this case, the current utilizes the Z-axis conductivity of the adhesive layer or the direct contact between the first conductive layer 100 and the second conductive layer 200 to flow "downward" from one side of the break into the lower second conductive layer 200 (metal fiber blended fabric). Through the conductive network formed by the metal fiber blended fabric, the current "bypasses" the break area of ​​the surface layer and then returns "upward" to the surface layer from the other side of the break, thus forming a complete "bypass" conductive loop. This structure ensures that even with localized damage, the overall conductive path remains unobstructed.

[0054] refer to Figure 5 An embodiment of this application also provides a method for preparing the laminated composite high-reliability conductive cloth as described above, the method comprising the following steps:

[0055] Step 510: Prepare materials: Provide electroplated conductive cloth as the first conductive layer, provide metal fiber composite fabric as the second conductive layer, and provide an adhesive layer.

[0056] Here, the metal fiber blended fabric is made by blending ordinary insulating fibers with conductive fibers.

[0057] In some alternative embodiments, the adhesive layer may be a conductive adhesive layer, such as a conductive glue. For example, the conductive glue may be a mixture of a polymeric adhesive (such as acrylic or silicone) and a conductive filler (such as metal particles). The metal particles may include at least one of silver particles, nickel particles, copper particles, and silver-plated particles, and the metal particles are uniformly dispersed in the polymeric adhesive.

[0058] In some alternative implementations, the adhesive layer may also be a non-conductive adhesive layer, such as ordinary non-conductive glue.

[0059] Step 520: Set an adhesive layer: Set an adhesive layer on the surface of the electroplated conductive cloth and / or metal fiber composite fabric.

[0060] In this step, the adhesive layer, such as the prepared conductive adhesive, can be evenly applied to the back surface of the electroplated conductive cloth and / or the upper surface of the metal fiber composite fabric by means of scraping or roller coating.

[0061] Step 530, Lamination and Composite: The two fabrics, electroplated conductive cloth and metal fiber composite fabric, are laminated and cured through an adhesive layer, so that the electroplated conductive cloth and conductive fiber are electrically connected.

[0062] In this step, the electroplated conductive cloth and the metal fiber composite fabric are first aligned and fed into a hot roller laminator.

[0063] Then, lamination is performed. In some optional embodiments, lamination can be performed by hot pressing under certain temperature (e.g., 80°C to 120°C) and pressure conditions to cure the adhesive layer (e.g., conductive adhesive) and firmly bond the two fabric layers together. In other optional embodiments, the adhesive layer can be a self-adhesive conductive adhesive, in which case lamination can be achieved by room temperature bonding.

[0064] Here, the adhesive layer can be a conductive adhesive layer with conductive fillers (such as metal particles) dispersed inside. When the adhesive layer is a conductive adhesive layer, the electroplated conductive fabric can contact and electrically connect with the conductive fibers in the metal fiber blended fabric through the conductive fillers in the conductive adhesive layer, and the conductive fillers form an effective electrical contact between the upper and lower layers.

[0065] Here, the adhesive layer can also be a non-conductive adhesive layer, such as ordinary conductive glue. When the adhesive layer is non-conductive, a lamination process can be used to ensure that the adhesive layer between the conductive fibers and the electroplated conductive cloth is squeezed apart, allowing the electroplated conductive cloth and the conductive fibers to come into direct contact, thereby achieving electrical connection.

[0066] Here, when the adhesive layer is a conductive adhesive layer, the adhesive layer between the conductive fiber and the electroplated conductive cloth can be squeezed apart through the lamination process, so that the electroplated conductive cloth and the conductive fiber can be in direct contact. At the same time, the electroplated conductive cloth and the conductive fiber can also be indirectly contacted through the metal particles in the conductive adhesive layer. Thus, they are electrically connected through two paths at the same time, and the conductivity is better.

[0067] Finally, the composite conductive cloth is cured, inspected, and cut to obtain the final product.

[0068] Although this application has been described and illustrated with reference to specific embodiments thereof, such description and illustration are not limiting of this application. It will be readily understood by those skilled in the art that various changes can be made and equivalent elements can be substituted within embodiments without departing from the true spirit and scope of this application as defined by the appended claims. Illustrations may not be drawn to scale. Differences may exist between the technical representation in this application and actual implementation due to variables in the manufacturing process, etc. Other embodiments of this application may exist that are not specifically described. The description and illustrations should be considered illustrative rather than restrictive. Modifications can be made to adapt particular circumstances, materials, composition, methods, or processes to the objectives, spirit, and scope of this application. All such modifications fall within the scope of the appended claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations can be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this application. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit this application.

Claims

1. A laminated composite high-reliability conductive cloth, characterized in that, include: Electroplated conductive cloth; Metal fiber blended fabric, wherein the metal fiber blended fabric is made of a blend of ordinary insulating fibers and conductive fibers; An adhesive layer is disposed between the electroplated conductive fabric and the metal fiber blended fabric; The electroplated conductive cloth is electrically connected to the conductive fiber.

2. The laminated composite high-reliability conductive cloth according to claim 1, characterized in that, The adhesive layer between the conductive fiber and the electroplated conductive cloth is squeezed apart, and the electroplated conductive cloth comes into direct contact with the conductive fiber.

3. The laminated composite high-reliability conductive cloth according to claim 1, characterized in that, The adhesive layer is a conductive adhesive layer, and the electroplated conductive cloth is electrically connected to the conductive fibers through the conductive adhesive layer.

4. The laminated composite high-reliability conductive cloth according to claim 3, characterized in that, The conductive adhesive layer comprises a polymeric adhesive and conductive fillers dispersed therein.

5. The laminated composite high-reliability conductive cloth according to claim 4, characterized in that, The conductive filler is metal particles, which include at least one of silver particles, nickel particles, copper particles, and silver-plated particles.

6. The laminated composite high-reliability conductive cloth according to claim 1, characterized in that, The conductive fiber is stainless steel fiber.

7. The laminated composite high-reliability conductive cloth according to claim 1, characterized in that, The conductive fiber is formed by twisting stainless steel filaments and insulating filaments together.

8. The laminated composite high-reliability conductive cloth according to claim 1, characterized in that, The electroplated conductive cloth includes a non-conductive substrate and a metal plating layer formed on the non-conductive substrate.

9. The laminated composite high-reliability conductive cloth according to claim 8, characterized in that, The metal plating is made of copper or nickel.

10. The laminated composite high-reliability conductive cloth according to claim 8, characterized in that, The metal plating includes a first portion and a second portion formed on two opposing surfaces of the non-conductive substrate, and a third portion extending into a gap in the non-conductive substrate, wherein the first portion and the second portion are electrically connected through the third portion.

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