A web buffer device and a laser web opening apparatus

Abstract

The application provides a wafer caching device and a laser film opening device. The wafer caching device comprises a conveying line and a wafer caching assembly. The conveying line is used for conveying silicon wafers. A lifting seat is connected to a first support seat in a lifting manner. A storage support is connected to the lifting seat and is lifted along the up-down direction with the lifting seat. A plurality of support portions are arranged on the storage support. Each support portion is used for supporting a silicon wafer. The storage support makes the plurality of support portions pass through the conveying line in sequence through lifting movement. The support portion can support the silicon waer on the conveying line when passing through the conveying line upward, so as to transfer the silicon wafer on the conveying line to the support portion. The support portion can also make the silicon wafer on the support portion fall onto the conveying line when passing through the conveying line downward. The wafer caching assembly caches the silicon wafers on the conveying line, avoids the silicon wafers on the conveying line in a conveying state all the time, guarantees the caching effect of the wafer caching device, and realizes the midway stay and collection of the silicon wafers by the wafer caching device.

Description

Technical Field

[0001] This utility model relates to the technical field of laser film-opening equipment, and in particular to a sheet buffer device and a laser film-opening equipment. Background Technology

[0002] With the development of technology, laser wafer cutting equipment has become an industrial tool that uses lasers to process silicon wafers, gradually vaporizing certain areas of the wafer under laser treatment. Current laser wafer cutting equipment includes a conveyor line for transporting the silicon wafers; however, the conveyor line is constantly transporting the wafers, making it impossible for existing laser wafer cutting equipment to stop midway. Utility Model Content

[0003] The purpose of this invention is to provide a wafer buffering device and a laser film-opening device. A conveyor line is used to transport silicon wafers. The wafer buffering assembly includes a first support base, a lifting base, and a storage bracket. The first support base is located on one side of the conveyor line. The lifting base is vertically connected to the first support base and moves up and down in the vertical direction. The storage bracket is connected to the lifting base and moves up and down with the lifting base in the vertical direction. The storage bracket has multiple support parts, which are spaced apart in the vertical direction. Each support part is used to support the silicon wafers. The storage bracket moves up and down, causing the multiple support parts to pass sequentially through the conveyor line. When passing upwards through the conveyor line, the support parts can support the silicon wafers on the conveyor line, transferring them to the support parts. Alternatively, when passing downwards through the conveyor line, the silicon wafers on the support parts can fall onto the conveyor line. By buffering the silicon wafers on the conveyor line through the wafer buffering assembly, the conveyor line is prevented from continuously transporting the silicon wafers, ensuring the buffering effect of the wafer buffering device and enabling the wafer buffering device to stop and collect the silicon wafers midway.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a material buffer device, comprising:

[0005] Conveyor lines are used to transport silicon wafers;

[0006] A wafer buffer assembly includes a first support base, a lifting base, and a storage bracket. The first support base is disposed on one side of the conveyor line. The lifting base is vertically connected to the first support base and moves up and down in the vertical direction. The storage bracket is connected to the lifting base and moves up and down with the lifting base in the vertical direction. The storage bracket is provided with multiple support parts, which are spaced apart in the vertical direction. Each support part can be used to support silicon wafers. The storage bracket moves up and down to allow the multiple support parts to pass through the conveyor line in sequence. When passing upward through the conveyor line, the support parts can support the silicon wafers on the conveyor line to transfer the silicon wafers on the conveyor line to the support parts, or when passing downward through the conveyor line, the silicon wafers on the support parts can fall onto the conveyor line.

[0007] Optionally, the storage rack is provided with a clearance channel, the conveyor line passes through the storage rack along the clearance channel, the clearance channel extends in the vertical direction to avoid the conveyor line during the lifting and lowering of the storage rack, and the support part is located on the side of the clearance channel.

[0008] Optionally, the support includes a first arm and a second arm, which are located on opposite sides of the clearance passage.

[0009] Optionally, the storage rack may further include a first rack body and a second rack body;

[0010] The first support body includes two first longitudinal beams spaced apart and at least one first crossbeam connected between the two first longitudinal beams. Each first longitudinal beam is provided with a plurality of first support arms spaced apart in the vertical direction, and the first support arms on the two first longitudinal beams are provided in a one-to-one correspondence.

[0011] The second support body includes two second longitudinal beams spaced apart and at least one second crossbeam connected between the two second longitudinal beams. Each second longitudinal beam is provided with a plurality of second arms spaced apart in the vertical direction, and the second arms on the two second longitudinal beams are arranged one-to-one.

[0012] Optionally, both the first arm and the second arm are cylindrical components, which are arranged horizontally, and the peripheral surface of the cylindrical component is used to support the silicon wafer.

[0013] Optionally, the material buffer device further includes a linear motion module, which is arranged in the vertical direction, with its fixed end connected to the first support base and its movable end connected to the lifting base.

[0014] Optionally, the wafer buffer device further includes a camera assembly located on one side of the conveyor line and in front of the wafer buffer assembly; the camera assembly is used to photograph the silicon wafers conveyed by the conveyor line.

[0015] Optionally, the conveyor line includes a first sub-conveyor line and a second sub-conveyor line, the first sub-conveyor line and the second sub-conveyor line being arranged sequentially along the conveying direction of the conveyor line;

[0016] The first sub-conveyor line is arranged relative to the sheet buffer assembly;

[0017] The second sub-conveyor line is arranged relative to the camera assembly;

[0018] The second sub-conveyor line receives the silicon wafers transported via the first sub-conveyor line;

[0019] The conveying cycle of the first sub-conveyor line is 0-2 seconds per cycle; the conveying cycle of the second sub-conveyor line is 0-2 seconds per cycle.

[0020] Optionally, the camera assembly includes a second support and a camera, the camera being mounted on the second support and positioned above the second sub-conveyor line;

[0021] The material buffer device further includes a waste storage frame, which is disposed on one side of the second sub-conveyor line. The waste storage frame and the second support base are respectively arranged on both sides of the second sub-conveyor line.

[0022] The waste storage frame is used to store defective silicon wafers.

[0023] Optionally, the wafer buffer device further includes a transfer assembly, which has a transfer section that passes through the second sub-conveyor line and transfers defective silicon wafers on the second sub-conveyor line to the waste storage frame; the waste storage frame is arranged at an angle.

[0024] To achieve the above objectives, this utility model provides the following technical solution: a laser film-opening device, including the aforementioned sheet buffer device.

[0025] Compared with the prior art, the beneficial effects of this utility model are:

[0026] This utility model provides a wafer buffering device and a laser film-opening device. The conveyor line is used to transport silicon wafers. The wafer buffering assembly includes a first support base, a lifting base, and a storage bracket. The first support base is disposed on one side of the conveyor line. The lifting base is movably connected to the first support base and moves up and down in the vertical direction. The storage bracket is connected to the lifting base and moves up and down with the lifting base in the vertical direction. The storage bracket is provided with multiple support parts, which are arranged at intervals in the vertical direction. Each support part is used to support the silicon wafers. The storage bracket moves up and down, causing the multiple support parts to pass through the conveyor line in sequence. When passing upward through the conveyor line, the support parts can support the silicon wafers on the conveyor line to transfer the silicon wafers on the conveyor line to the support parts, or when passing downward through the conveyor line, the silicon wafers on the support parts can fall onto the conveyor line. By buffering the silicon wafers on the conveyor line through the wafer buffering assembly, the conveyor line is prevented from constantly transporting the silicon wafers, ensuring the buffering effect of the wafer buffering device, and realizing the intermediate stop and collection of silicon wafers by the wafer buffering device. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings. In the following description, the same reference numerals denote the same parts.

[0029] Figure 1 A schematic diagram of a chip buffer device according to an embodiment of this application is shown.

[0030] Figure 2 A schematic diagram of the conveyor line and the sheet buffer assembly of a sheet buffer device according to an embodiment of this application is shown.

[0031] Figure 3 A schematic diagram of a chip buffer component of a chip buffer apparatus according to an embodiment of this application is shown.

[0032] Figure 4 A schematic diagram of a second sub-conveyor line, a waste storage box, and a transfer assembly of a sheet buffer device according to an embodiment of this application is shown.

[0033] Figure 5 A schematic diagram of a transfer component of a sheet buffer device according to an embodiment of this application is shown.

[0034] Figure label:

[0035] 100. Piece buffer device;

[0036] 10. Conveyor line; 11. First sub-conveyor line; 12. Second sub-conveyor line;

[0037] 20. Sheet buffer assembly; 21. First support base; 22. Lifting base; 23. Storage bracket; 23a. Clearance passage; 231. Support part; 2311. First support arm; 2312. Second support arm; 2313. First bracket body; 23131. First longitudinal beam; 23132. First crossbeam; 2314. Second bracket body; 23141. Second longitudinal beam; 23142. Second crossbeam;

[0038] 30. Linear movement module;

[0039] 40. Camera assembly; 41. Second support base; 42. Camera;

[0040] 50. Waste storage box;

[0041] 60. Transfer assembly; 61. Transfer section; 62. Motor; 63. Transmission module; 64. Lifting cylinder. Detailed Implementation

[0042] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0043] Please refer to the attached document. Figures 1-5 This application provides a wafer buffer device 100, which is applied to a laser film-opening equipment and is used to buffer silicon wafers on a conveyor line 10.

[0044] Please refer to the attached document. Figures 1-5In this embodiment, the wafer buffer device 100 includes a conveyor line 10 and a wafer buffer assembly 20. The conveyor line 10 is used to convey silicon wafers. The wafer buffer assembly 20 includes a first support base 21, a lifting base 22, and a storage bracket 23. The first support base 21 is disposed on one side of the conveyor line 10. The lifting base 22 is vertically connected to the first support base 21 and moves up and down in the vertical direction. The storage bracket 23 is connected to the lifting base 22 and moves up and down with the lifting base 22 in the vertical direction. The storage bracket 23 is provided with a plurality of support portions 231, which are spaced apart in the vertical direction. Each support portion 231 is used to support silicon wafers. In the wafer storage device 100, the storage rack 23 moves up and down to allow multiple support parts 231 to pass sequentially through the conveyor line 10. The support parts 231 can support the silicon wafers on the conveyor line 10 when passing upwards to transfer the silicon wafers on the conveyor line 10 to the support parts 231, or allow the silicon wafers on the support parts 231 to fall onto the conveyor line 10 when passing downwards. The wafer buffer assembly 20 buffers the silicon wafers on the conveyor line 10, avoiding the conveyor line 10 from constantly conveying the silicon wafers, thus ensuring the buffering effect of the wafer buffer device 100 and enabling the wafer buffer device 100 to stop and collect the silicon wafers midway.

[0045] Please refer to the attached document. Figures 1-5 In this embodiment of the application, the conveyor line 10 is used to convey silicon wafers so as to facilitate the transfer of each silicon wafer.

[0046] The wafer buffer assembly 20 includes a first support base 21, a lifting base 22, and a storage bracket 23. The first support base 21 is located outside the conveyor line 10. The lifting base 22 is vertically connected to the first support base 21 and moves up and down in the vertical direction to adjust its height. The storage bracket 23 is connected to the lifting base 22 and moves up and down with it to adjust its height. The storage bracket 23 has multiple support portions 231, which are spaced apart in the vertical direction. Each support portion 231 supports the silicon wafer. The bracket 23 moves up and down to allow multiple support parts 231 to pass through the conveyor line 10 in sequence. The support parts 231 can support the silicon wafers on the conveyor line 10 when passing upward to transfer the silicon wafers on the conveyor line 10 to the support parts 231, or allow the silicon wafers on the support parts 231 to fall onto the conveyor line 10 when passing downward. The wafer buffer assembly 20 buffers the silicon wafers on the conveyor line 10, avoiding the conveyor line 10 from being in a continuous conveying state, thus ensuring the buffering effect of the wafer buffer device 100 and realizing the intermediate stop and collection of silicon wafers by the wafer buffer device 100.

[0047] Please refer to the attached document. Figures 1-3In this embodiment, the storage bracket 23 is provided with a clearance channel 23a, which serves as the internal space of the storage bracket 23. The conveyor line 10 passes through the storage bracket 23 along the clearance channel 23a. The clearance channel 23a extends in the vertical direction to avoid the conveyor line 10 during the lifting and lowering of the storage bracket 23. The support part 231 is located on the side of the clearance channel 23a. At this time, the length of the clearance channel 23a is greater than the width of the conveyor line 10 to prevent the outer surface of the support part 231 from contacting the outer surface of the conveyor line 10. The space of the clearance channel 23a ensures the smooth lifting and lowering of the support part 231. Meanwhile, the length of the clearance channel 23a is less than the length of the silicon wafer, so that the support part 231 can carry away the silicon wafer on the conveyor line 10 during the rising process, or the support part 231 can drop the silicon wafer onto the conveyor line 10 during the falling process, so as to achieve the buffering effect of the silicon wafer and avoid the conveyor line 10 from being in the conveying state of the silicon wafer continuously, thus ensuring the buffering effect of the wafer buffering device 100. The length of the clearance channel 23a is a, and the width of the conveyor line 10 is b.

[0048] Please refer to the attached document. Figures 1-3 In this embodiment, the support portion 231 includes a first arm 2311 and a second arm 2312. The first arm 2311 and the second arm 2312 are arranged on opposite sides of the clearance channel 23a. The distance between the first arm 2311 and the second arm 2312 is equivalent to the length of the clearance channel 23a, so that the support portion 231 can support both sides of the silicon wafer through the first arm 2311 and the second arm 2312 respectively, thus ensuring the stability of the support portion 231 in supporting the silicon wafer.

[0049] Please refer to the attached document. Figures 1-3 In this embodiment of the application, the storage bracket 23 further includes a first bracket body 2313 and a second bracket body 2314; the first bracket body 2313 includes two first longitudinal beams 23131 spaced apart and at least one first crossbeam 23132 connected between the two first longitudinal beams 23131, so that the first crossbeam 23132 strengthens the connection strength between the two first longitudinal beams 23131 and avoids the two first longitudinal beams 23131 from moving slowly. Each first longitudinal beam 23131 is provided with a plurality of first arms 2311 spaced apart in the vertical direction. The first arms 2311 on the two first longitudinal beams 23131 are arranged one-to-one, so that the two first longitudinal beams 23131 support two rows of first arms 2311 respectively, thereby facilitating the two first arms 2311 at the same level to support the two ends of the same side of the silicon wafer respectively.

[0050] The second support body 2314 includes two spaced-apart second longitudinal beams 23141 and at least one second crossbeam 23142 connecting the two second longitudinal beams 23141. The crossbeam 23142 strengthens the connection between the two second longitudinal beams 23141, preventing swaying. Each second longitudinal beam 23141 has multiple second arms 2312 spaced apart in the vertical direction. The second arms 2312 on the two second longitudinal beams 23141 are arranged one-to-one, allowing each of the two second longitudinal beams 23141 to support two rows of second arms 2312. This facilitates two second arms 2312 at the same horizontal level supporting the two ends of the same side of the silicon wafer, and further facilitates two first arms 2311 and two second arms 2312 at the same horizontal level supporting the four corners of the silicon wafer, ensuring its stability. Multiple silicon wafers are buffered by arranging multiple first arms 2311 and multiple second arms 2312.

[0051] Please refer to the attached document. Figures 1-3 In this embodiment, the first arm 2311 and the second arm 2312 are both cylindrical components. The cylindrical components are arranged horizontally, and the peripheral surface of the cylindrical components is used to support the silicon wafer, which reduces the contact area between the silicon wafer and the cylindrical components and avoids the accumulation of debris in the first arm 2311 and the second arm 2312 that scratches the silicon wafer.

[0052] Please refer to the attached document. Figures 1-3 In this embodiment, the material buffer device 100 further includes a linear motion module 30, which is arranged vertically. The fixed end of the linear motion module 30 is connected to the first support base 21, and the movable end of the linear motion module 30 is connected to the lifting base 22, so that the lifting base 22 can automatically lift and lower relative to the first support base 21 through the linear motion module 30, thus ensuring the lifting effect of the storage bracket 23. Optionally, the linear motion module 30 is a linear motor module or a ball screw linear module.

[0053] Please refer to the attached document. Figure 1 In this embodiment of the application, the wafer buffer device 100 further includes a camera assembly 40, which is located on one side of the conveyor line 10 and in front of the wafer buffer assembly 20. The camera assembly 40 is used to photograph the silicon wafers conveyed by the conveyor line 10 to facilitate the uploading of the silicon wafers and thus facilitate the selection of good and bad silicon wafers.

[0054] Please refer to the attached document. Figure 1 and 4In this embodiment, the conveyor line 10 includes a first sub-conveyor line 11 and a second sub-conveyor line 12, which are arranged sequentially along the conveying direction of the conveyor line 10. The first sub-conveyor line 11 is arranged relative to the wafer buffer assembly 20 so that the wafer buffer assembly 20 can buffer the silicon wafers on the first sub-conveyor line 11, avoiding the first sub-conveyor line 11 from being in a continuous conveying state. The second sub-conveyor line 12 is arranged relative to the camera assembly 40 so that the camera assembly 40 can detect the silicon wafers on the second sub-conveyor line 12, thereby facilitating the detection of good and defective silicon wafers on the second sub-conveyor line 12. The second sub-conveyor line 12 receives the silicon wafers conveyed by the first sub-conveyor line 11, so that the silicon wafers conveyed by the first sub-conveyor line 11 can be conveyed to the second sub-conveyor line 12, thereby facilitating the transfer of the silicon wafers conveyed by the first sub-conveyor line 11 to the second sub-conveyor line 12; the conveying cycle of the first sub-conveyor line 11 is 0-2 seconds / cycle; the conveying cycle of the second sub-conveyor line 12 is 0-2 seconds / cycle.

[0055] Please refer to the attached document. Figure 1 and 4 ~5. In this embodiment, the camera assembly 40 includes a second support 41 and a camera 42. The camera 42 is mounted on the second support 41 and positioned above the second sub-conveyor line 12, so that the camera 42 is supported above the second sub-conveyor line 12 by the second support 41, ensuring that the camera 42 can capture images of the silicon wafers on the second sub-conveyor line 12. The wafer buffer device 100 also includes a waste storage frame 50, which is disposed on one side of the second sub-conveyor line 12. The waste storage frame 50 and the second support 41 are respectively located on both sides of the second sub-conveyor line 12. The waste storage frame 50 is used to store defective silicon wafers, so that the waste storage frame 50 can store defective silicon wafers and avoids the defective silicon wafers being thrown around.

[0056] Please refer to the attached document. Figure 1 and 5 In this embodiment, the wafer buffer device 100 further includes a transfer component 60. The transfer component 60 is provided with a transfer section 61, which passes through the second sub-conveyor line 12 to avoid the second sub-conveyor line 12. The transfer section 61 transfers the defective silicon wafers on the second sub-conveyor line 12 to the waste storage frame 50, so that the defective silicon wafers can be transferred from the second sub-conveyor line 12 to the waste storage frame 50 through the transfer section 61, thus ensuring the transfer effect of the defective silicon wafers. The waste storage frame 50 is arranged at an angle so that the defective silicon wafers can enter the waste storage frame 50 under automatic gravity.

[0057] The transfer assembly 60 includes a motor 62, a transmission module 63, and a lifting cylinder 64. The output end of the motor 62 is connected to the transmission module 63, and the transfer part 61 is connected to the transmission module 63. The lifting cylinder 64 is connected to the motor 62 and drives the motor 62, transmission module 63, and transfer part 61 to move up and down, so that the transfer part 61 can lift the defective silicon wafers on the second sub-conveyor line 12. This facilitates the transfer part 61, through the cooperation of the motor 62 and the transmission module 63, to transfer the defective silicon wafers on the second sub-conveyor line 12 to the waste storage frame 50. The transfer direction of the transfer part 61 is at 90° to the conveying direction of the second sub-conveyor line 12. Optionally, the transmission module 63 is a synchronous pulley transmission module.

[0058] Workflow: Silicon wafers on the first sub-conveyor line 11 pass through the wafer buffer assembly 20. The first arm 2311 and the second arm 2312 rise under the drive of the linear motion module 30, carrying the silicon wafers on the first sub-conveyor line 11 away, thus buffering the silicon wafers on the first sub-conveyor line 11. When the first arm 2311 and the second arm 2312 descend under the drive of the linear motion module 30, the silicon wafers supported by the first arm 2311 and the second arm 2312 descend to the first sub-conveyor line 11, so that the first sub-conveyor line 11 can transport the silicon wafers towards the second sub-conveyor line 12. When the silicon wafers on the second sub-conveyor line 12 pass through the camera 42, the camera 42 takes pictures of the silicon wafers on the second sub-conveyor line 12. When the camera 42 detects that the silicon wafers on the second sub-conveyor line 12 are defective, the lifting cylinder 64 drives the motor 62, the transmission module 63 and the transfer unit 61 to rise, so that the transfer unit 61 can lift the defective silicon wafers on the second sub-conveyor line 12. The transfer unit 61 transfers the defective silicon wafers on the second sub-conveyor line 12 to the waste storage box 50. When the camera 42 detects that the silicon wafers on the second sub-conveyor line 12 are good, the second sub-conveyor line 12 conveys the good silicon wafers downward.

[0059] In a second application embodiment, a laser wafer-opening device includes a wafer buffer device 100, which is part of the laser wafer-opening device. The laser wafer-opening device uses a laser to process the silicon wafer.

[0060] The laser wafer opening equipment also includes a laser module, which is located on one side of the second sub-conveyor line 12 of the wafer buffer device 100. The laser module is used to perform laser wafer opening on the silicon wafers output from the second sub-conveyor line 12.

[0061] Compared with the prior art, the beneficial effects of this utility model are:

[0062] This utility model provides a wafer buffer device 100 and a laser film-forming device. A conveyor line 10 is used to transport silicon wafers. The wafer buffer assembly 20 includes a first support base 21, a lifting base 22, and a storage bracket 23. The first support base 21 is disposed on one side of the conveyor line 10. The lifting base 22 is vertically connected to the first support base 21 and moves up and down in the vertical direction. The storage bracket 23 is connected to the lifting base 22 and moves up and down with the lifting base 22 in the vertical direction. The storage bracket 23 is provided with multiple support parts 231, which are spaced apart in the vertical direction. Each support part 231 is used to support the silicon wafer. The storage rack 23 moves up and down to allow multiple support parts 231 to pass sequentially through the conveyor line 10. The support parts 231 can support the silicon wafers on the conveyor line 10 when passing upwards to transfer the silicon wafers on the conveyor line 10 to the support parts 231, or allow the silicon wafers on the support parts 231 to fall onto the conveyor line 10 when passing downwards. The wafer buffer assembly 20 buffers the silicon wafers on the conveyor line 10, avoiding the conveyor line 10 from being in a continuous conveying state for the silicon wafers, thus ensuring the buffering effect of the wafer buffer device 100 and realizing the intermediate stop and collection of silicon wafers by the wafer buffer device 100.

[0063] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture. If the specific posture changes, the directional indicator will also change accordingly.

[0064] It should also be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or may be connected to an intermediary component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or indirectly connected to the other component through an intermediary component.

[0065] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0066] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A material buffer device, characterized in that, include: Conveyor lines are used to transport silicon wafers; A wafer buffer assembly includes a first support base, a lifting base, and a storage bracket. The first support base is disposed on one side of the conveyor line. The lifting base is vertically connected to the first support base and moves up and down in the vertical direction. The storage bracket is connected to the lifting base and moves up and down with the lifting base in the vertical direction. The storage bracket is provided with multiple support parts, which are spaced apart in the vertical direction. Each support part can be used to support silicon wafers. The storage bracket moves up and down to allow the multiple support parts to pass through the conveyor line in sequence. When passing upward through the conveyor line, the support parts can support the silicon wafers on the conveyor line to transfer the silicon wafers on the conveyor line to the support parts, or when passing downward through the conveyor line, the silicon wafers on the support parts can fall onto the conveyor line.

2. The material buffer device according to claim 1, characterized in that, The storage rack is provided with a clearance channel, and the conveyor line passes through the storage rack along the clearance channel. The clearance channel extends vertically to avoid the conveyor line during the lifting and lowering of the storage rack. The support part is located on the side of the clearance channel.

3. The material buffer device according to claim 2, characterized in that, The support includes a first arm and a second arm, which are located on opposite sides of the clearance passage.

4. The material buffer device according to claim 3, characterized in that, The storage rack also includes a first rack body and a second rack body; The first support body includes two first longitudinal beams spaced apart and at least one first crossbeam connected between the two first longitudinal beams. Each first longitudinal beam is provided with a plurality of first support arms spaced apart in the vertical direction, and the first support arms on the two first longitudinal beams are provided in a one-to-one correspondence. The second support body includes two second longitudinal beams spaced apart and at least one second crossbeam connected between the two second longitudinal beams. Each second longitudinal beam is provided with a plurality of second arms spaced apart in the vertical direction, and the second arms on the two second longitudinal beams are arranged one-to-one.

5. The material buffer device according to claim 3, characterized in that, Both the first arm and the second arm are cylindrical components, which are arranged horizontally, and the peripheral surface of the cylindrical components is used to support the silicon wafer.

6. The material buffer device according to claim 1, characterized in that, The material buffer device further includes a linear motion module, which is arranged in the vertical direction. The fixed end of the linear motion module is connected to the first support base, and the movable end of the linear motion module is connected to the lifting base.

7. The material buffer device according to claim 1, characterized in that, The wafer buffer device further includes a camera assembly located on one side of the conveyor line and in front of the wafer buffer assembly; the camera assembly is used to photograph the silicon wafers conveyed by the conveyor line.

8. The material buffer device according to claim 7, characterized in that, The conveyor line includes a first sub-conveyor line and a second sub-conveyor line, which are arranged sequentially along the conveying direction of the conveyor line; The first sub-conveyor line is arranged relative to the sheet buffer assembly; The second sub-conveyor line is arranged relative to the camera assembly; The second sub-conveyor line receives the silicon wafers transported via the first sub-conveyor line; The conveying cycle of the first sub-conveyor line is 0-2 seconds per cycle; the conveying cycle of the second sub-conveyor line is 0-2 seconds per cycle.

9. The material buffer device according to claim 8, characterized in that, The camera assembly includes a second support and a camera, the camera being mounted on the second support and positioned above the second sub-conveyor line; The material buffer device further includes a waste storage frame, which is disposed on one side of the second sub-conveyor line. The waste storage frame and the second support base are respectively arranged on both sides of the second sub-conveyor line. The waste storage frame is used to store defective silicon wafers.

10. The material buffer device according to claim 9, characterized in that, The wafer buffer device further includes a transfer component, which has a transfer section that passes through the second sub-conveyor line and transfers defective silicon wafers on the second sub-conveyor line to the waste storage frame; the waste storage frame is arranged at an angle.

11. A laser film-opening device, characterized in that, Includes the sheet buffer device as described in any one of claims 1 to 10.

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