Capacitor chip detection machine and precision pick-and-place mechanism

Abstract

The utility model relates to capacitor chip detection technical field especially relates to a kind of capacitor chip detection machine and precision pick-and-place mechanism, including first workstation, second workstation, at least one pickup head mechanism, multi-chip piece table, probe station and vision system;The first workstation and second workstation are respectively used for the feeding and discharging of chip, the pickup head mechanism is used for the pickup and placement of chip, the multi-chip piece table is used for the bearing and station conversion of chip, the probe station is used for the test of chip, the vision system is used for the position and angle identification and compensation of chip.The capacitor chip detection machine and precision pick-and-place mechanism provided by the utility model, through multi-shaft drive and vision system compensation, the precision of taking and placing can reach ±10 μm, angle error is ≤±0.1 °, positioning accuracy is significantly improved;Visual closed-loop positioning is used instead of mechanical push alignment, and chip breakage rate is greatly reduced;Multi-chip piece table realizes three-station synchronous operation, and test efficiency is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of capacitor chip testing technology, specifically to a capacitor chip testing machine and a precise pick-and-place mechanism. Background Technology

[0002] With the rapid growth of downstream demand from 5G communications, new energy vehicles, AI and IoT, the ceramic capacitor chip market is showing a strong growth trend, and the technology continues to evolve towards high performance, miniaturization and high reliability.

[0003] Traditional capacitor testing and sorting equipment has the following drawbacks: the pick-and-place nozzle mechanism is simple, only capable of single picking and placing, and cannot perform position compensation and angle correction, with a pick-and-place accuracy of ≥±50μm and an angle error of ≥±1°; the secondary calibration of the chip stage uses an X and Y axis push rod mechanism to push the chip to the positioning edge, which can easily lead to chip scratches and damage; the chip support stage has a single structure, and there is waiting time in the loading, testing, and unloading processes, resulting in low efficiency and failing to meet market demands. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a capacitor chip testing machine and a precise pick-and-place mechanism to solve the problems of low pick-and-place accuracy, easy chip damage and low testing efficiency.

[0005] This utility model embodiment is implemented as follows: a capacitor chip testing machine and a precise pick-and-place mechanism, comprising: a first worktable, a second worktable, at least one pick-up head mechanism, a multi-chip support platform, a probe station, and a vision system; the first and second worktables are respectively used for chip loading and unloading, the pick-up head mechanism is used for chip picking and placement, the multi-chip support platform is used for chip support and station switching, the probe station is used for chip testing, and the vision system is used for chip position and angle recognition and compensation.

[0006] Preferably, the pickup head mechanism includes an X-axis drive mechanism, a Y-axis drive mechanism, a Z-axis drive mechanism, and a pickup head rotation drive mechanism. The X-axis drive mechanism and the Y-axis drive mechanism are used to drive the pickup head to a preset position. The Z-axis drive mechanism is used to drive the pickup head to move up and down to pick up and release the chip. The pickup head rotation drive mechanism is used to adjust the angle of the chip.

[0007] Preferably, the pickup head mechanism is a dual pickup head mechanism, which can simultaneously complete the chip loading and unloading process steps.

[0008] Preferably, the multi-chip wafer stage includes a torque rotary drive mechanism and at least two chip wafer stage mechanisms, wherein the torque rotary drive mechanism is used to drive the chip wafer stage mechanisms to rotate in order to achieve workstation switching.

[0009] Preferably, the chip mounting stage mechanism consists of four units, enabling simultaneous chip loading, probe testing, and chip unloading at three stations.

[0010] Preferably, the probe on the probe station is a force sensor, which is used to control the force of the probe insertion.

[0011] Preferably, the vision system includes a first vision system, a second vision system, a third vision system, a fourth vision system, and a fifth vision system. The first vision system is used to identify the chip position and angle. The second vision system is used to perform secondary identification of the position and angle of the picked-up chip. The third vision system is used to calibrate the center of the chip placement position. The fourth vision system is used to calibrate the center of the chip pickup position. The fifth vision system is used to calibrate the chip placement position.

[0012] Preferably, the vision system can be manually and mechanically fine-tuned to calibrate the vision center to a preset position center via X / Y axis adjustment, and can be manually zoomed and fine-tuned to adjust focus.

[0013] Preferably, the first worktable includes an X-axis drive mechanism, a Y-axis drive mechanism, a wafer ring rotation drive mechanism, and a wafer ring carrier platform. The wafer ring carrier platform is compatible with at least one wafer. The mother and daughter rings are fixed by the mother and daughter ring wafer ring carrier platform top beads. The wafer ring carrier platform is provided with a cavity to avoid the ejector pin assembly.

[0014] Preferably, it also includes a ejector pin mechanism, wherein the ejector pin center can be adjusted to the preset crystal picking position center of the pickup head by manual mechanical fine adjustment of the X / Y axis, and then lifted by the lifting mechanism so that the ejector pin cap vacuum adsorbs the blue film, and the ejector pin cam controls the lifting height of the ejector pin to realize the chip detaching from the blue film.

[0015] Beneficial effects: The capacitor chip testing machine and precision pick-and-place mechanism provided by this utility model, through multi-axis drive and vision system compensation, achieve a pick-and-place accuracy of ±10μm and an angle error of ≤±0.1°, significantly improving positioning accuracy; the use of visual closed-loop positioning to replace mechanical push-and-alignment greatly reduces chip breakage rate; the multi-chip support stage enables three-station synchronous operation, effectively improving testing efficiency; the dual pick-up head mechanism works in parallel, increasing efficiency to 2.5 times that of traditional equipment; the force-controlled probe stage protects chip testing yield, and the pin-piercing force control accuracy reaches ±5gf. Attached Figure Description

[0016] Fig. 1 This is a schematic diagram of the capacitor chip testing machine and the precision pick-and-place mechanism.

[0017] Fig. 2 This is a schematic diagram of the pickup head mechanism of a capacitor chip testing machine and a precision pick-and-place mechanism.

[0018] In the attached diagram: 1-First worktable, 2-Second worktable, 3-Pick-up head mechanism, 4-Multi-chip wafer stage, 5-Probe stage, 6-X-axis drive mechanism, 7-Y-axis drive mechanism, 8-Wafer ring rotation drive mechanism, 9-Wafer ring carrier stage, 10-Ejector pin assembly, 11-First vision system, 12-Second vision system, 13-Third vision system, 14-Fourth vision system, 15-Fifth vision system, 16-Z-axis drive mechanism, 17-Pick-up head rotation drive mechanism, 18-Torque rotation drive mechanism, 19-Chip wafer stage mechanism. Detailed Implementation

[0019] To make the purpose, technical solution, and effects of this utility model clearer and more explicit, the following description is provided in conjunction with the appendix. Figs. 1-2 The present invention will be further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are only for explaining the present invention and are not intended to limit the present invention.

[0020] like Figs. 1-2 As shown, this utility model discloses a capacitor chip testing machine and a precise pick-and-place mechanism, including a first worktable 1, a second worktable 2, at least one pick-up head mechanism 3, a multi-chip support platform 4, a probe station 5, and a vision system; the first worktable 1 and the second worktable 2 are respectively used for chip loading and unloading, the pick-up head mechanism 3 is used for chip picking and placement, the multi-chip support platform 4 is used for chip support and station switching, the probe station 5 is used for chip testing, and the vision system is used for chip position and angle recognition and compensation.

[0021] The first worktable 1 includes an X-axis drive mechanism 6, a Y-axis drive mechanism 7, a wafer ring rotation drive mechanism 8, and a wafer ring carrier stage 9. The wafer ring carrier stage 9 is compatible with at least one wafer. The mother and daughter rings are fixed by top beads on the wafer ring carrier stage. The wafer ring carrier stage 9 has a cavity to avoid the ejector pin assembly 10. In practical applications, the operator places three 6-inch wafer mother rings loaded with ceramic capacitor chips onto the wafer ring carrier stage 9. The mother and daughter rings are fixed by top beads. The wafer ring rotation drive mechanism 8 drives the wafer ring carrier stage 9 to rotate to switch between different wafers. The X-axis drive mechanism 6 and the Y-axis drive mechanism 7 drive the wafer ring carrier stage 9 to move to achieve chip positioning.

[0022] The vision system includes a first vision system 11, a second vision system 12, a third vision system 13, a fourth vision system 14, and a fifth vision system 15. The first vision system 11 is used to identify the chip's position and angle. The second vision system 12 is used to perform secondary identification of the position and angle of the picked-up chip. The third vision system 13 is used to calibrate the chip placement center. The fourth vision system 14 is used to calibrate the chip pickup center. The fifth vision system 15 is used to calibrate the chip placement position. Each vision system can be manually and mechanically fine-tuned to calibrate the X / Y axis to a preset position center, and can be manually zoomed to fine-tune the focus. The second vision system 12 uses a telecentric lens placed horizontally, and uses a deflection module to achieve optical path deflection, enabling high-precision secondary identification of the picked-up chip.

[0023] The pickup head mechanism 3 includes an X-axis drive mechanism 6, a Y-axis drive mechanism 7, a Z-axis drive mechanism 16, and a pickup head rotation drive mechanism 17. The X-axis drive mechanism 6 and the Y-axis drive mechanism 7 drive the pickup head to a preset position. The Z-axis drive mechanism 16 drives the pickup head to move up and down to pick up and release the chip. The pickup head rotation drive mechanism 17 adjusts the chip angle. In this embodiment, the pickup head mechanism 3 is a dual pickup head mechanism, which can simultaneously complete the chip loading and unloading processes. The first pickup head mechanism is responsible for chip loading, and the second pickup head mechanism is responsible for chip unloading. They work independently, improving work efficiency.

[0024] The multi-chip wafer carrier stage 4 includes a torque rotary drive mechanism 18 and at least two chip wafer carrier mechanisms 19. In this embodiment, there are four chip wafer carrier mechanisms 19. The torque rotary drive mechanism 18 is used to drive the chip wafer carrier mechanisms 19 to rotate to achieve station switching. By driving the four chip wafer carrier mechanisms 19 to rotate through the torque rotary drive mechanism 18, chip loading, probe testing, and chip unloading can be completed simultaneously, reducing waiting time.

[0025] The probes on the probe station 5 are equipped with force sensors, which are used to control the probe piercing force and drive the probe Z-axis to perform piercing tests on the chip on the chip support stage 4 to measure capacitance / loss, insulation value, and withstand voltage value.

[0026] Working Principle: Loading Stage: The operator places and fixes the wafer ring on the wafer ring support platform 9 of the first worktable 1. The first vision system 11, after manually fine-tuning the X / Y axes and zooming, captures images of the wafer surface to identify the position coordinates and angle of the chip to be picked up, and sends a signal to the control system. Chip Pickup: After receiving the signal, the first pickup head mechanism 3 is driven by the X-axis drive mechanism 6 and the Y-axis drive mechanism 7 to move to the preset chip picking position center. The Z-axis drive mechanism 16 drives the nozzle to descend. The ejector pin mechanism 10 lifts the ejector pin cap through the lifting mechanism to vacuum-adsorb the blue film. The ejector pin cam controls the ejector pin lifting height to detach the chip from the blue film. The nozzle opens to vacuum-pick up the chip and rises to a safe position. Position and Angle Compensation: The first pickup head mechanism 3 moves directly above the second vision system 12. The second vision system 12 performs secondary identification on the picked-up chip to obtain position and angle deviations. The control system controls the X-axis drive mechanism 6 and the Y-axis drive mechanism 7 to complete position compensation, and the pickup head rotation drive mechanism 17 to complete angle compensation. Chip Placement: The torque rotation drive mechanism 18 of the multi-chip wafer stage 4 drives the chip wafer stage mechanism 19 to rotate, aligning the idle station with the third vision system 13. After the third vision system 13 calibrates the center of the station, the first pick-up head mechanism 3 moves above the station, releasing the vacuum to precisely place the chip. Probe Testing: The multi-chip wafer stage 4 rotates to align the chip-bearing station with the probe station 5. The Z-axis drive mechanism 16 drives the power sensor probe to descend. When the force sensor detects the preset pin-piercing force, the descent stops, and capacitance / loss, insulation value, and withstand voltage value tests are performed. Chip Unloading: After the tests are completed, the multi-chip wafer stage 4 rotates to align the station with the fourth vision system 14. The second pick-up head mechanism 3 picks up the chip according to the chip position identified by the fourth vision system 14 and moves it to the second worktable 2. After the fifth vision system 15 calibrates the placement position, the chip is precisely placed into the wafer or waffle box.

[0027] This invention achieves a pick-and-place accuracy of ±10μm and an angle error of ≤±0.1° through a five-vision system closed-loop compensation and multi-axis drive, solving the problem of low pick-and-place accuracy in traditional equipment. Visual positioning replaces mechanical pushing for alignment, preventing chip scratches and damage, significantly reducing chip breakage rates. A multi-chip support stage enables synchronous operation at three stations, with dual pick-up head mechanisms working in parallel, effectively improving testing efficiency compared to traditional equipment. The probe station uses a force sensor to control the pin insertion force, protecting chips from damage and significantly improving test yield.

[0028] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural or procedural transformations made based on the content of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are similarly included within the protection scope of the present utility model.

Claims

1. A capacitor chip testing machine and a precise pick-and-place mechanism, characterized in that, The device includes a first worktable, a second worktable, at least one pick-up head mechanism, a multi-chip wafer support platform, a probe station, and a vision system. The first and second worktables are used for loading and unloading chips, respectively. The pick-up head mechanism is used for picking up and placing chips. The multi-chip wafer support platform is used for chip support and station switching. The probe station is used for chip testing. The vision system is used for chip position and angle recognition and compensation.

2. The capacitor chip testing machine and precise pick-and-place mechanism according to claim 1, characterized in that, The pickup head mechanism includes an X-axis drive mechanism, a Y-axis drive mechanism, a Z-axis drive mechanism, and a pickup head rotation drive mechanism. The X-axis drive mechanism and the Y-axis drive mechanism are used to drive the pickup head to a preset position. The Z-axis drive mechanism is used to drive the pickup head to move up and down to pick up and release the chip. The pickup head rotation drive mechanism is used to adjust the angle of the chip.

3. The capacitor chip testing machine and precise pick-and-place mechanism according to claim 2, characterized in that, The pickup head mechanism is a dual pickup head mechanism, which can simultaneously complete the chip loading and unloading process steps.

4. The capacitor chip testing machine and precise pick-and-place mechanism according to claim 1, characterized in that, The multi-chip wafer stage includes a torque rotary drive mechanism and at least two chip wafer stage mechanisms. The torque rotary drive mechanism is used to drive the chip wafer stage mechanisms to rotate in order to achieve workstation switching.

5. The capacitor chip testing machine and precise pick-and-place mechanism according to claim 4, characterized in that, The chip mounting platform consists of four units, enabling simultaneous chip loading, probe testing, and chip unloading at three stations.

6. The capacitor chip testing machine and precise pick-and-place mechanism according to claim 1, characterized in that, The probes on the probe station employ force sensors, which are used to control the force of the probe insertion.

7. The capacitor chip testing machine and precise pick-and-place mechanism according to claim 1, characterized in that, The vision system includes a first vision system, a second vision system, a third vision system, a fourth vision system, and a fifth vision system. The first vision system is used to identify the chip position and angle. The second vision system is used to perform secondary identification of the position and angle of the picked-up chip. The third vision system is used to calibrate the center of the chip placement position. The fourth vision system is used to calibrate the center of the chip pickup position. The fifth vision system is used to calibrate the chip placement position.

8. The capacitor chip testing machine and precise pick-and-place mechanism according to claim 7, characterized in that, The vision system can be manually and mechanically fine-tuned to calibrate the vision center to a preset position center via the X / Y axis, and can be manually adjusted for focus via zoom.

9. The capacitor chip testing machine and precise pick-and-place mechanism according to claim 1, characterized in that, The first worktable includes an X-axis drive mechanism, a Y-axis drive mechanism, a wafer ring rotation drive mechanism, and a wafer ring carrier platform. The wafer ring carrier platform is compatible with at least one wafer. The mother and daughter rings are fixed by the mother and daughter ring wafer ring carrier platform top beads. The wafer ring carrier platform is provided with a cavity to avoid the ejector pin assembly.

10. The capacitor chip testing machine and precise pick-and-place mechanism according to claim 1, characterized in that, It also includes a ejector pin mechanism, which can manually adjust the X / Y axis to the center of the ejector pin to the center of the preset crystal picking position of the pickup head, and then lift it up by the lifting mechanism so that the ejector pin cap can vacuum adsorb the blue film. The ejector pin cam controls the lifting height of the ejector pin to realize the chip detachment from the blue film.

Images