Under-screen heat dissipation buffer conductive heat insulation tape

Abstract

The utility model discloses a kind of under-screen heat dissipation buffering conductive heat insulation adhesive tape, including heat dissipation layer, the conductive layer being arranged at the back of heat dissipation layer, the buffer layer being arranged at the back of conductive layer, the heat insulation layer being arranged at the back of buffer layer, the protective film being arranged at the back of heat insulation layer and the release film being arranged at the front of heat dissipation layer. Advantage: heat of module can be dissipated in time using heat dissipation layer and buffer layer, and at the same time, energy can be effectively absorbed when the device is impacted or extruded using buffer layer, the screen and internal components are protected, the risk of damage is reduced, and the heat insulation layer can also be used to isolate external heat from being transmitted to the adhesive tape, providing excellent heat preservation and insulation efficiency for the thermosensitive element.

Description

Technical Field

[0001] This utility model relates to the field of adhesive tapes, specifically a heat dissipation, buffering, conductive, and heat-insulating adhesive tape for under-screen applications. Background Technology

[0002] With the continuous development of electronic devices, the requirements for heat dissipation and conductivity inside the devices are becoming increasingly stringent, especially for components under the screen, which require a type of tape that can effectively dissipate heat, conduct electricity, and also act as a buffer.

[0003] Existing under-display adhesive tapes have several problems. For example, some tapes have poor heat dissipation performance, failing to quickly transfer the heat generated by the screen, leading to excessively high screen temperatures after prolonged use, affecting display quality and lifespan. Other tapes have unstable conductivity, unable to reliably establish electrical connections in complex circuit environments, affecting the normal operation of electronic devices. Still others have inadequate cushioning, failing to effectively protect the screen and internal components when subjected to minor impacts or pressure, easily causing screen damage or loosening of internal wiring. While conventional heat-dissipating and conductive heat-dissipating tapes on the market achieve certain functions to some extent, they still fall short in terms of overall performance in heat dissipation, conductivity, and cushioning. In terms of heat dissipation, the thermal conductivity of their materials is low, failing to meet the heat dissipation requirements of the large amounts of heat generated by the high-power operation of modern electronic devices. Regarding conductivity, the uneven distribution of the conductive medium results in poor consistency in conductivity performance. In terms of cushioning, the design of the cushioning structure is not reasonable enough, significantly reducing its cushioning effect under large external impacts.

[0004] Therefore, it is necessary to provide an under-screen heat dissipation buffer conductive thermal insulation tape. Utility Model Content

[0005] This utility model provides an under-screen heat dissipation, buffering, conductive, and heat-insulating tape, which effectively solves the problem of poor compatibility of existing tapes in terms of heat dissipation, buffering, conductivity, and heat insulation functions.

[0006] The technical solution adopted in this utility model is: A heat dissipation, buffer, conductive, and heat-insulating tape for under-display applications includes a heat dissipation layer, a conductive layer disposed on the back of the heat dissipation layer, a buffer layer disposed on the back of the conductive layer, a heat insulation layer disposed on the back of the buffer layer, a protective film disposed on the back of the heat insulation layer, and a release film disposed on the front of the heat dissipation layer.

[0007] Furthermore, the heat dissipation layer is a graphite layer.

[0008] Furthermore, the thickness of the graphite layer is 0.05mm to 0.3mm.

[0009] Furthermore, the buffer layer is either conductive silicone foam or conductive polyurethane foam.

[0010] Furthermore, the thickness of the buffer layer is 0.1mm to 0.5mm.

[0011] Furthermore, the heat insulation layer is an aerogel layer or a liquid crystal polymer.

[0012] Furthermore, the thickness of the insulation layer ranges from 0.01mm to 0.2mm.

[0013] Furthermore, the thickness of the insulation layer ranges from 0.01mm to 0.2mm.

[0014] The beneficial effects of the utility model are: it can dissipate the heat of the module in a timely manner by using the heat dissipation layer and the buffer layer, and at the same time, it can effectively absorb energy when the device is impacted or squeezed, protect the screen and internal components, reduce the risk of damage, and can also use the heat insulation layer to isolate the external heat from the tape, providing excellent heat preservation and insulation performance for the thermal element. Attached Figure Description

[0015] Figure 1 This is an overall schematic diagram of the under-screen heat dissipation buffer conductive thermal insulation tape provided in an embodiment of this application.

[0016] Figure 2 The images show thermal images of the under-screen heat dissipation buffer conductive heat insulation tape provided in the embodiments of this application and the control group after 15 minutes of frontal heating.

[0017] Figure 3 Thermal images of the back of the under-screen heat dissipation buffer conductive heat insulation tape provided in the embodiments of this application and the control group after heating for 15 minutes.

[0018] Figure 4 The images show thermal images of the under-screen heat dissipation buffer conductive heat insulation tape provided in the embodiments of this application and the control group after 30 minutes of frontal heating.

[0019] Figure 5 This is a schematic diagram showing the back of the under-screen heat dissipation buffer conductive heat insulation tape provided in the embodiments of this application and the control group being heated for 30 minutes.

[0020] The following are labeled in the diagram: 1. Release film; 2. Heat dissipation layer; 3. Conductive layer; 4. Buffer layer; 5. Heat insulation layer; 6. Protective film. Detailed Implementation

[0021] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0022] like Figure 1As shown, the first embodiment provided in this application is an under-screen heat dissipation buffer conductive heat insulation tape, including a heat dissipation layer 2, a conductive layer 3 disposed on the back of the heat dissipation layer 2, a buffer layer 4 disposed on the back of the conductive layer 3, a heat insulation layer 5 disposed on the back of the buffer layer 4, a protective film 6 disposed on the back of the heat insulation layer 5, and a release film 1 disposed on the front of the heat dissipation layer 2. The conductive layer 3 can be a conductive adhesive uniformly mixed with silver powder or copper powder, or it can be a composite layer formed by uniformly distributing conductive fibers in an acrylate-based conductive adhesive with added silver powder or copper powder.

[0023] In actual use, peel off the release film 1, then attach the heat dissipation layer 2 to the module directly below the screen, and then peel off the protective film 6. During module operation, heat is transferred from the screen surface to the heat dissipation layer 2. Some of the heat is then dissipated through the sides of the heat dissipation layer 2, while the remaining heat is transferred to the conductive layer 3 and then dissipated through the buffer layer 4. The conductive layer 3 ensures conductivity between all layers. The heat insulation layer 5 prevents external heat from being transferred to the adhesive tape.

[0024] In the actual test, the tape of this application was used as the test group, that is... Figures 2 to 5 In case a, a traditional adhesive tape (acrylate-based conductive adhesive + silicone foam + liquid crystal polymer) was used as a control group, that is... Figures 2 to 5 b. Testing instruments used: FLUKE TI200 thermal imager, DC regulated power supply, and matching fixture; Test environment: room temperature 22~23℃, relative humidity 48%RH, measuring distance 40mm; Test time 15min, 30min; Test method: The front sides of the test group and control group were attached to the fixture, and the fixture was heated with the same power for 15min and 30min, respectively. The thermal images of the test group and control group were observed using the thermal imager. The back sides of the test group and control group were attached to the fixture, and the fixture was heated with the same power for 15min and 30min, respectively. The thermoforming of the test group and control group was observed using the thermal imager. Figure 2 and Figure 4 It can be seen that, under test times of 15 min and 30 min, Figure 2 and Figure 4 In the image, the shadow area and red shadow depth of image a are less than those of image b, indicating that the surface temperature of the test group is lower than that of the control group. This means that more heat is dissipated from the tape after the heat is transferred from the fixture to the tape. Figure 3 and Figure 5 It can be seen that, Figure 3 and Figure 5 The image shadow area and red shadow depth of group a are less than those of group b, which means that the heat transferred from group a fixture to the tape is less than that transferred from group b fixture to the tape. In group a, the heat insulation layer 5 blocks the heat transfer.

[0025] In the above design, the heat dissipation layer 2 and the buffer layer 4 can dissipate the heat of the module in a timely manner. At the same time, the buffer layer 4 can effectively absorb energy when the device is impacted or squeezed, protecting the screen and internal components and reducing the risk of damage. The heat insulation layer 5 can also be used to isolate external heat from being transferred to the tape, providing excellent heat preservation and insulation performance for the thermal element.

[0026] Specifically: The heat dissipation layer 2 is a graphite layer.

[0027] The graphite layer has excellent anisotropic thermal conductivity. Through its high thermal conductivity in the planar direction, the graphite layer diffuses heat laterally and then dissipates it along the sides.

[0028] In the above design, the graphite layer has good planar heat dissipation performance, which can absorb most of the heat generated by the module and dissipate it along the side.

[0029] Specifically, the thickness of the graphite layer is 0.05mm to 0.3mm.

[0030] In the above design, the thickness of the graphite layer is 0.05mm to 0.3mm, which can ensure good heat dissipation performance without adding too much thickness and weight.

[0031] Specifically, the buffer layer 4 is either conductive silicone foam or conductive polyurethane foam.

[0032] In the above design, conductive silicone foam and conductive polyurethane foam have good elasticity and cushioning properties, and can effectively absorb energy when subjected to external impact, protecting the screen and other components.

[0033] Specifically, the thickness of the buffer layer 4 is 0.1mm to 0.5mm.

[0034] In the above design, the thickness of the buffer layer 4 is 0.1mm~0.5mm, which can ensure the requirement of thinness of the product and has good buffering performance.

[0035] Specifically, the heat insulation layer 5 is a conductive aerogel layer or a liquid crystal polymer. The conductive aerogel can be a carbon-based aerogel, and the conductive liquid crystal polymer can be a liquid crystal polymer filled with conductive metal powder.

[0036] In the above design, the heat insulation layer 5 is a conductive aerogel layer or liquid crystal polymer with good weather resistance and chemical stability, which can maintain stable performance in harsh environments for a long time and extend service life.

[0037] Specifically, the thickness of the heat insulation layer 5 ranges from 0.01mm to 0.2mm.

[0038] In the above design, the thickness of the insulation layer 5 ranges from 0.01mm to 0.2mm, which can not only effectively isolate heat transfer and reduce energy loss, but also achieve lightweight design while ensuring structural strength, so as to adapt to more diverse application scenarios.

[0039] Specifically: the protective film 6 is a PET protective film 6.

[0040] Before the tape is applied to the bottom of the screen, the PEI protective film 6 protects the heat insulation layer 5 from external factors. After the tape is applied to the module under the screen, the PET protective film 6 is removed.

[0041] In the above design, the structural design and specific implementation of the protective film 6 can achieve the protection of the heat insulation layer 5.

[0042] The second embodiment of this application provides an under-screen heat dissipation, buffer, conductive, and heat-insulating tape, comprising a heat dissipation layer 2, a conductive layer 3 disposed on the back of the heat dissipation layer 2, a buffer layer 4 disposed on the back of the conductive layer 3, a heat insulation layer 5 disposed on the back of the buffer layer 4, a protective film 6 disposed on the back of the heat insulation layer 5, and a release film 1 disposed on the front of the heat dissipation layer 2. The heat dissipation layer 2 is a graphite layer. The thickness of the graphite layer is 0.05mm to 0.3mm. The buffer layer 4 is either conductive silicone foam or conductive polyurethane foam. The thickness of the buffer layer 4 is 0.1mm to 0.5mm. The heat insulation layer 5 is a conductive aerogel layer or a liquid crystal polymer. The thickness of the heat insulation layer 5 ranges from 0.01mm to 0.2mm. The tape dimensions are L150mm * W40mm.

[0043] In actual use, first peel off the release film 1, attach the heat dissipation layer 2 to the module under the screen, and then peel off the protective film 6. The heat generated by the module is transferred to the graphite layer. Utilizing the planar heat dissipation properties of the graphite layer, most of the heat is dissipated along its sides, while the remaining heat transferred to the conductive layer 3 is dissipated after passing through the conductive silicone foam. The conductive layer 3 is formed by combining conductive adhesive and conductive fibers. Its thickness is 0.03 ~ 0.2 mm, ensuring stable conductivity and good compatibility with other layers. The buffer layer 4 has a thickness of 0.1 ~ 0.5 mm, effectively absorbing energy and protecting the screen and other components from external impacts. The silicone foam has excellent weather resistance and chemical stability, while the polyurethane foam has high strength and good resilience, and can be selected according to actual needs. The heat insulation layer 5 possesses good weather resistance and chemical stability, maintaining stable performance in harsh environments for extended periods and extending its service life. Release film 1 facilitates the storage and transportation of the tape when not in use, and prevents the surface of the heat dissipation layer 2 from being contaminated and damaged; a protective film 6 is provided on the back of the heat insulation layer 5 to protect the heat insulation layer 5 from external factors before the tape is pasted under the screen, ensuring the stability of its connection.

[0044] In the above design, the entire tape achieves efficient heat dissipation, quickly conducting away the heat generated by the module, effectively reducing screen temperature, improving display quality, and extending screen lifespan. The foam material in buffer layer 4 possesses excellent elasticity and cushioning properties, effectively absorbing energy when the device is impacted or compressed, protecting the screen and internal components, and reducing the risk of damage. The heat insulation layer 5 effectively enhances heat insulation performance, significantly reducing heat transfer and providing superior thermal insulation for the thermally sensitive components.

[0045] In further detail, it should be understood that the above description is only a specific embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat-dissipating, buffering, conductive, and heat-insulating tape for under-screen applications, characterized in that: It includes a heat dissipation layer (2), a conductive layer (3) disposed on the back of the heat dissipation layer (2), a buffer layer (4) disposed on the back of the conductive layer (3), a heat insulation layer (5) disposed on the back of the buffer layer (4), a protective film (6) disposed on the back of the heat insulation layer (5), and a release film (1) disposed on the front of the heat dissipation layer (2).

2. The under-screen heat dissipation buffer conductive thermal insulation tape according to claim 1, characterized in that: The heat dissipation layer (2) is a graphite layer.

3. The under-screen heat dissipation buffer conductive thermal insulation tape according to claim 2, characterized in that: The thickness of the graphite layer is 0.05mm to 0.3mm.

4. The under-screen heat dissipation buffer conductive thermal insulation tape according to claim 1, characterized in that: The buffer layer (4) is either conductive silicone foam or conductive polyurethane foam.

5. The under-screen heat dissipation buffer conductive thermal insulation tape according to claim 4, characterized in that: The thickness of the buffer layer (4) is 0.1mm~0.5mm.

6. The under-screen heat dissipation buffer conductive thermal insulation tape according to claim 1, characterized in that: The heat insulation layer (5) is a conductive aerogel layer or a liquid crystal polymer.

7. The under-screen heat dissipation buffer conductive insulation tape according to claim 6, characterized in that: The thickness of the insulation layer (5) ranges from 0.01 mm to 0.2 mm.

8. The under-screen heat dissipation buffer conductive thermal insulation tape according to claim 1, characterized in that: The thickness of the insulation layer (5) ranges from 0.01 mm to 0.2 mm.

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