Highly shielded composite conductive tape

Abstract

The utility model discloses a high shielding composite conductive adhesive tape, including conductive cloth double -faced pressure sensitive adhesive layer, conductive cloth double -faced pressure sensitive adhesive layer one side is provided with the anti -static foam layer, the anti -static foam layer is away from conductive cloth double -faced pressure sensitive adhesive layer and is provided with the conductive adhesive layer, the conductive adhesive layer is away from anti -static foam layer one side and is provided with the first release film layer, conductive cloth double -faced pressure sensitive adhesive layer is away from anti -static foam layer one side and is provided with the conductive polyethylene film layer, the conductive polyethylene film layer is away from conductive cloth double -faced pressure sensitive adhesive layer one side and is provided with the second release film layer, the six layer structure of the application will conductive bonding, electromagnetic shielding, buffer shock absorption and surface protection four big functions perfect integration, realized single material solution.

Description

Technical Field

[0001] This utility model relates to the field of electromagnetic shielding and electronic packaging technology, and in particular to a high-shielding composite conductive tape. Background Technology

[0002] In fields such as 5G communications, aerospace, high-end automotive electronics, and military equipment, the electromagnetic compatibility (EMC) requirements for electronic components are extremely stringent. These requirements not only necessitate very high electromagnetic shielding effectiveness (SE) but also address issues related to vibration and shock, installation and fixation, and surface protection. Existing technologies typically employ a step-by-step solution: first, conductive adhesive is used for bonding and fixing; then, conductive foam is attached to provide shielding and cushioning; and finally, a protective film is added. This approach has significant drawbacks:

[0003] High interface impedance: The stacking of multiple layers of materials introduces too many contact interfaces, resulting in an increase in overall grounding impedance and a decrease in shielding effectiveness.

[0004] Complex process: multiple mounting operations are cumbersome, alignment accuracy is difficult to guarantee, production efficiency is low and cost is high.

[0005] Insufficient reliability: Differences in the thermal expansion coefficients of different materials and interfacial compatibility issues can easily lead to delamination and cracking under thermal shock and mechanical vibration, resulting in shielding failure.

[0006] Large size: The multi-layered structure results in an excessively thick overall thickness, making it difficult to meet the design requirements of miniaturization and thinning of the equipment.

[0007] Therefore, there is an urgent need to develop an integrated, low-impedance, and highly reliable ultrathin composite shielding material. Utility Model Content

[0008] The technical problem solved by this utility model is to provide an integrated, low-impedance, high-reliability, highly shielded composite conductive tape.

[0009] The technical solution adopted by this utility model to solve its technical problem is: a high-shield composite conductive tape, comprising a conductive cloth double-sided pressure-sensitive adhesive layer, an antistatic foam layer disposed on one side of the conductive cloth double-sided pressure-sensitive adhesive layer, a conductive adhesive layer disposed on the antistatic foam layer away from the conductive cloth double-sided pressure-sensitive adhesive layer, a first release film layer disposed on the side of the conductive adhesive layer away from the antistatic foam layer, a conductive polyethylene film layer disposed on the side of the conductive cloth double-sided pressure-sensitive adhesive layer away from the antistatic foam layer, and a second release film layer disposed on the side of the conductive polyethylene film layer away from the conductive cloth double-sided pressure-sensitive adhesive layer.

[0010] Furthermore, the conductive cloth double-sided pressure-sensitive adhesive layer includes a conductive fiber cloth substrate, and acrylic conductive pressure-sensitive adhesive layers are provided on both sides of the conductive fiber cloth substrate. The thickness of the conductive cloth double-sided pressure-sensitive adhesive layer is 0.08-0.25mm.

[0011] Furthermore, the conductive fiber cloth substrate is one of silver-plated nylon cloth, nickel-plated polyester cloth, or carbon fiber woven cloth.

[0012] Furthermore, the conductive adhesive layer is a thermosetting epoxy resin conductive adhesive or a UV-curable acrylate conductive adhesive, and the thickness of the conductive adhesive layer is 20-70 μm.

[0013] Furthermore, the antistatic foam layer is cross-linked polyethylene foam or polyurethane foam, and the thickness of the antistatic foam layer is 0.3-2.0 mm.

[0014] Furthermore, the first release film layer is a high-density polyethylene release film, and the second release film layer is a polyester release film.

[0015] Furthermore, the thickness of the conductive polyethylene film layer is 25-80 μm.

[0016] The beneficial effects of this utility model are:

[0017] 1. The six-layer structure of this application perfectly integrates four major functions: conductive bonding, electromagnetic shielding, shock absorption and surface protection, realizing a single material solution.

[0018] 2. The double-sided pressure-sensitive adhesive layer of the conductive cloth in this structure serves as the core conductive bridge, greatly reducing the interlayer contact resistance and forming a highly efficient three-dimensional conductive network, providing stable and reliable high shielding performance.

[0019] 3. The conductive cloth substrate in this structure provides good dimensional stability and tear resistance, giving the entire tape higher mechanical strength and reliability.

[0020] 4. The double release film design in this structure facilitates automated application, greatly improving production efficiency and reducing labor costs.

[0021] 5. This application optimizes the layered structure design, effectively controlling the overall thickness while ensuring multifunctionality, thus meeting the demand for thinner and lighter modern electronic devices. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the high-shield composite conductive tape according to an embodiment of this application.

[0023] Figure 2 This is a schematic diagram of the structure of the conductive cloth double-sided pressure-sensitive adhesive layer of the high-shield composite conductive tape according to an embodiment of this application.

[0024] The following are labeled in the diagram: 1. Second release film layer; 2. Conductive polyethylene film layer; 3. Conductive cloth double-sided pressure-sensitive adhesive layer; 31. Conductive fiber cloth substrate; 32. Acrylic conductive pressure-sensitive adhesive layer; 4. Antistatic foam layer; 5. Conductive adhesive layer; 6. First release film layer. Detailed Implementation

[0025] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0026] like Figure 1 As shown in the figure, an embodiment of this application discloses a high-shield composite conductive tape, including a conductive cloth double-sided pressure-sensitive adhesive layer 3, an antistatic foam layer 4 disposed on one side of the conductive cloth double-sided pressure-sensitive adhesive layer 3, a conductive adhesive layer 5 disposed on the antistatic foam layer 4 away from the conductive cloth double-sided pressure-sensitive adhesive layer 3, a first release film layer 6 disposed on the side of the conductive adhesive layer 5 away from the antistatic foam layer 4, a conductive polyethylene film layer 2 disposed on the side of the conductive cloth double-sided pressure-sensitive adhesive layer 3 away from the antistatic foam layer 4, and a second release film layer 1 disposed on the side of the conductive polyethylene film layer 2 away from the conductive cloth double-sided pressure-sensitive adhesive layer 3.

[0027] Specifically, in this structure, the conductive adhesive layer 5 is placed on the first release film to provide a high-strength, low-impedance permanent conductive connection to the equipment housing or grounding point during final use. The antistatic foam layer 4 is composited with the first release film through the conductive adhesive layer 5, providing excellent cushioning and shock absorption performance and auxiliary electromagnetic shielding function. The conductive polyethylene film layer 2 is composited with the antistatic foam layer 4 through the conductive cloth double-sided pressure-sensitive adhesive layer 3. The conductive cloth double-sided pressure-sensitive adhesive layer 3 can simultaneously play a triple role of structural reinforcement, electromagnetic shielding and conductive bonding. Finally, the conductive polyethylene film layer 2, as the outermost layer, provides surface protection and antistatic function.

[0028] In summary, the six-layer structure of this application perfectly integrates four major functions: conductive bonding, electromagnetic shielding, shock absorption, and surface protection, achieving a single-material solution.

[0029] In this embodiment, as Figure 2 As shown, the conductive cloth double-sided pressure-sensitive adhesive layer 3 includes a conductive fiber cloth substrate 31, and acrylic conductive pressure-sensitive adhesive layers 32 are provided on both sides of the conductive fiber cloth substrate 31. The thickness of the conductive cloth double-sided pressure-sensitive adhesive layer 3 is 0.08-0.25mm.

[0030] Specifically, the conductive fiber cloth substrate 31 in this structure provides excellent mechanical strength and in-plane conductivity; its double-sided acrylic voltage-sensitive adhesive layer 32 can ensure that it forms a low-impedance ohmic contact with the upper and lower layers, establishing a reliable vertical conductive path.

[0031] Specifically, the thickness of the double-sided pressure-sensitive adhesive layer 3 of the conductive cloth can be 0.08mm, 0.15mm, 0.25mm, etc. Meanwhile, depending on different requirements, the conductive fiber cloth substrate 31 can be one of silver-plated nylon cloth, nickel-plated polyester cloth, or carbon fiber woven cloth. The selection of these materials not only ensures the tape has excellent conductivity but also provides good corrosion resistance and mechanical strength. Furthermore, the weaving method of the conductive fiber cloth substrate 31 can be flexibly adjusted to adapt to different application scenarios and shielding requirements, ensuring that the tape maintains stable shielding effectiveness in various complex environments. Experimental results show that its shielding effectiveness can reach 60-75dB in an environment of 1MHz-3GHz.

[0032] It should be explained that in this industry, a shielding effectiveness greater than 60dB is considered a high shielding material.

[0033] In this embodiment, the conductive adhesive layer 5 is a thermosetting epoxy resin conductive adhesive or a UV-curable acrylate conductive adhesive. The thickness of the conductive adhesive layer 5 is 20-70 μm, and its volume resistivity is less than 5.0 × 10⁻⁶ μm, as demonstrated in experiments. -4 Ω·cm.

[0034] The thickness of the conductive adhesive layer 5 can be 20μm, 50μm, 70μm, etc.

[0035] Specifically, the thermosetting epoxy conductive adhesive or the UV-curing acrylate conductive adhesive has good conductivity and bonding strength, and can form a stable and reliable conductive connection after curing. At the same time, the thickness range is designed to ensure conductivity while avoiding an increase in overall thickness due to excessive thickness.

[0036] In this embodiment, the antistatic foam layer 4 is cross-linked polyethylene foam or polyurethane foam, and the thickness of the antistatic foam layer 4 is 0.3-2.0 mm. Experiments show that its surface resistivity is 10⁻⁶. 3 ~10 5 Ω.

[0037] The thickness of the antistatic foam layer 4 can be 0.3mm, 1.0mm, 2.0mm, etc. The selection and design of this layer material provides excellent cushioning and shock absorption performance. At the same time, its antistatic function can effectively prevent the accumulation and discharge of static electricity from damaging electronic equipment.

[0038] In this embodiment, the first release film layer 6 is a high-density polyethylene release film, and the second release film layer 1 is a polyester release film.

[0039] Specifically, the first release film layer 6 serves as a protective layer for the conductive adhesive layer 5, preventing contamination or damage to the conductive adhesive layer 5 during storage and transportation; the second release film layer 1 serves as a protective layer for the conductive polyethylene film layer 2, also providing protection. The selection of high-density polyethylene release film and polyester release film ensures both effective protection and ease of peeling during application, without damaging other layers of the tape.

[0040] In this embodiment, the thickness of the conductive polyethylene film layer 2 is 25-80 μm, and its surface resistivity is experimentally determined to be 10. 6 ~10 10 Ω.

[0041] The thickness of the conductive polyethylene film layer 2 can be 25μm, 50μm, 80μm, etc. This thickness design ensures sufficient mechanical strength and surface protection while also guaranteeing good conductivity and antistatic effects. As the outermost layer of the tape, the conductive polyethylene film layer 2 is in direct contact with the external environment. Its excellent abrasion resistance and weather resistance extend the service life of the tape. Simultaneously, its antistatic function effectively prevents damage to electronic equipment caused by static electricity accumulation and discharge, improving the overall electromagnetic shielding effectiveness.

[0042] The production steps for this composite conductive tape are as follows:

[0043] Step 1: Conductive adhesive coating and pre-curing:

[0044] Coating: Use a comma-shaped scraper to evenly coat the conductive adhesive onto the corona-treated surface of the first release film, and after drying, a dry adhesive thickness of 50 μm is obtained.

[0045] Drying / Pre-curing: Place the coated conductive adhesive layer 5 into a drying oven.

[0046] Step 2: Lamination with antistatic foam:

[0047] Align the substrate surface of the antistatic foam with the first release film layer 6 coated with semi-cured conductive adhesive, and then laminate them using a set of cold press rollers to initially bond the antistatic foam and the conductive adhesive layer 5, thus preventing damage to the adhesive layer.

[0048] Step 3: Preparation of the double-sided pressure-sensitive adhesive layer of the conductive cloth 3:

[0049] The conductive filler is mixed with the acrylic pressure-sensitive adhesive resin in a certain proportion and dispersed at high speed until it is uniform and free of agglomeration. The above-mentioned conductive pressure-sensitive adhesive is evenly coated on both sides of the conductive cloth through a micro-gravure coating head, with a single-sided dry adhesive thickness of 20-25um, and then dried.

[0050] Process 4: Main Composite Process

[0051] The semi-finished product with antistatic foam, the double-sided pressure-sensitive adhesive layer 3 of conductive cloth, the composite of conductive polyethylene film and the second release film are simultaneously fed into a high-temperature hot press laminating machine.

[0052] Step 5: Maturation

[0053] After the conductive adhesive layer 5 is fully cured to achieve the final mechanical and electrical properties, the composite complete roll of material is placed into the curing chamber.

[0054] Step Six: Cutting and Packaging

[0055] The cured large rolls are cut into widths required by the customer using a precision slitting machine. The finished products are vacuum-packed in anti-static bags and placed in anti-static turnover boxes.

[0056] It should be explained that the above-mentioned process steps are all currently mature process steps, and this application has not made any improvements to the process.

[0057] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above descriptions are merely specific embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A highly shielded composite conductive tape, characterized by: The device includes a conductive fabric double-sided pressure-sensitive adhesive layer (3), an antistatic foam layer (4) is provided on one side of the conductive fabric double-sided pressure-sensitive adhesive layer (3), a conductive adhesive layer (5) is provided on the side of the antistatic foam layer (4) away from the conductive fabric double-sided pressure-sensitive adhesive layer (3), a first release film layer (6) is provided on the side of the conductive adhesive layer (5) away from the antistatic foam layer (4), a conductive polyethylene film layer (2) is provided on the side of the conductive fabric double-sided pressure-sensitive adhesive layer (3) away from the antistatic foam layer (4), and a second release film layer (1) is provided on the side of the conductive polyethylene film layer (2) away from the conductive fabric double-sided pressure-sensitive adhesive layer (3).

2. The highly shielded composite conductive tape of claim 1, wherein: The conductive cloth double-sided pressure-sensitive adhesive layer (3) includes a conductive fiber cloth substrate (31), and an acrylic conductive pressure-sensitive adhesive layer (32) is provided on both sides of the conductive fiber cloth substrate (31). The thickness of the conductive cloth double-sided pressure-sensitive adhesive layer (3) is 0.08-0.25mm.

3. The highly shielded composite conductive tape of claim 2, wherein: The conductive fiber cloth substrate (31) is one of silver-plated nylon cloth, nickel-plated polyester cloth, or carbon fiber woven cloth.

4. The highly shielded composite conductive tape of claim 1, wherein: The conductive adhesive layer (5) is a thermosetting epoxy resin conductive adhesive or an ultraviolet-curing acrylate conductive adhesive, and the thickness of the conductive adhesive layer (5) is 20-70 μm.

5. The highly shielded composite conductive tape of claim 1, wherein: The antistatic foam layer (4) is cross-linked polyethylene foam or polyurethane foam, and the thickness of the antistatic foam layer (4) is 0.3-2.0 mm.

6. The highly shielded composite conductive tape of claim 1, wherein: The first release film layer (6) is a high-density polyethylene release film, and the second release film layer (1) is a polyester release film.

7. The highly shielded composite conductive tape of claim 1, wherein: The thickness of the conductive polyethylene film layer (2) is 25-80 μm.

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