Wafer bump electroforming mold plate

Abstract

The utility model relates to wafer bump packaging technical field, especially wafer bump electroforming template, including electroforming template, a plurality of docking tubes are passed through and set up in the surface of electroforming template, the one end of docking tube is installed with fixed limiting block, the outer surface of docking tube one end is equipped with vacuum suction tube, the one end surface of wafer is seted up with a plurality of docking holes, the other end surface of wafer is inserted with a plurality of fixed limiting cylinders, the utility model discloses docking tube and fixed limiting block with docking hole and fixed limiting cylinder are docked, then through vacuum suction tube to the air of junction is pumped, in the process that electroforming template is connected with wafer, only one insertion one suction can complete the positioning and fixing of electroforming template and wafer, positioning and fixing are carried out simultaneously, do not need to fix through the dowel after positioning, further reduce the time that electroforming template and wafer connection fixed need, further improve wafer electroforming's efficiency.

Description

Technical Field

[0001] This utility model relates to the field of wafer bumping packaging technology, and in particular to a wafer bumping electroforming template. Background Technology

[0002] Wafer bumps are tiny metal protrusions made on the chip pads on the surface of a semiconductor wafer. They serve as a bridge to achieve electrical connection and mechanical fixation between the chip and external circuits, and are one of the core structures in the chip packaging process.

[0003] In the wafer bumping process, the electroforming template is a key component for wafer bumping. During the electroforming of wafer bumps, the electroforming template needs to be precisely aligned with the wafer to ensure that the bump forming holes on the electroforming template correspond to the positions of the wafer during electroforming. Currently, the positioning and fixing method for the electroforming template and the wafer is to first align the electroforming template with the positioning holes and positioning posts on the wafer, and then fix it with the machine and pins. This divides the positioning and fixing of the electroforming template into two parts, which wastes a lot of time when installing the wafer and the electroforming module, further affecting the efficiency of wafer electroforming.

[0004] Therefore, we provide a wafer bump electroforming template. Utility Model Content

[0005] The purpose of this invention is to address the aforementioned technical problems by providing a wafer bump electroforming template, thereby reducing the time required for docking and fixing the wafer with the template and improving the efficiency of wafer bump electroforming.

[0006] In view of this, the present invention provides a wafer bump electroforming template, including an electroforming template, a wafer is disposed on the top of the electroforming template, a plurality of docking cylinders are disposed through the surface of the electroforming template, a fixed limiting block is installed at one end of the docking cylinder, a vacuum suction tube is sleeved on the outer surface of one end of the docking cylinder, a plurality of docking holes are opened on one end surface of the wafer, and a plurality of fixed limiting cylinders are inserted into the other end surface of the wafer.

[0007] Preferably, the electroforming template is tightly fitted to the surfaces of the wafer on both sides, and a plurality of docking cylinders are evenly distributed at the corners of the electroforming template, with the opposite ends of the docking cylinders extending out of the outer surfaces of the opposite sides of the electroforming template.

[0008] Preferably, the docking cylinder and the fixed limiting block are connected through each other, the fixed limiting block is connected to both sides, and the fixed limiting block is hexagonal in shape.

[0009] Preferably, the fixing limiting cylinder and the docking hole are through-connected, the inner end of the fixing limiting cylinder is through-connected, the docking cylinder and the fixing limiting block are respectively inserted into the docking hole and the fixing limiting cylinder, and the outer surfaces of the docking cylinder and the fixing limiting block are respectively tightly fitted to the inner walls of the docking hole and the fixing limiting cylinder.

[0010] Preferably, the outer surface of the end of the docking cylinder away from the wafer is provided with an external thread, and the inner end of the vacuum suction tube is provided with an internal thread. The docking cylinder and the vacuum suction tube are connected by threaded engagement through the external and internal threads, and a vacuum machine is installed at the other end of the vacuum suction tube.

[0011] Preferably, a fixed annular sealing groove is formed on the outer surface of the other end of the docking cylinder, and a sealing ring is engaged inside the fixed annular sealing groove.

[0012] Preferably, the inner wall of the docking hole is provided with a docking sealing annular groove, and during the process of fixing the docking cylinder to the docking hole, the sealing ring is simultaneously engaged inside the docking sealing annular groove.

[0013] Compared with the prior art, the present invention provides a wafer bump electroforming template, which has the following beneficial effects:

[0014] 1. This utility model connects the electroforming template and the wafer by connecting the docking cylinder and the fixing limiting block with the docking hole and the fixing limiting cylinder. Then, the air at the connection point is sucked out by the vacuum suction tube. During the connection process between the electroforming template and the wafer, the positioning and fixing of the electroforming template and the wafer can be completed by simply inserting and sucking. The positioning and fixing are carried out simultaneously, eliminating the need to fix with pins after positioning. This further reduces the time required for the connection and fixing of the electroforming template and the wafer, and further improves the efficiency of wafer electroforming.

[0015] The parts of this device not covered herein are the same as or can be implemented using existing technologies. This utility model has a simple structure and is easy to operate. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of a wafer bump electroforming template proposed in this utility model;

[0017] Figure 2 This is a schematic diagram of the connection structure between the wafer and the electroforming module in a wafer bump electroforming template proposed in this utility model.

[0018] Figure 3 This is a schematic diagram of the connection and fixing operation mode of the wafer and the electroforming module of the wafer bump electroforming template proposed in this utility model;

[0019] Figure 4This is a schematic diagram of the wafer docking hole structure of a wafer bump electroforming template proposed in this utility model;

[0020] Figure 5 This is a schematic diagram of the electroforming template docking cylinder structure of a wafer bump electroforming template proposed in this utility model.

[0021] In the figure: 1. Electroforming template; 2. Wafer; 3. Docking cylinder; 301. Fixed annular sealing groove; 302. Sealing ring; 303. External thread; 4. Fixed limiting block; 5. Docking hole; 501. Docking sealing annular groove; 6. Fixed limiting cylinder; 7. Vacuum suction tube. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] Example: A wafer bump electroforming template, such as Figures 1-5 As shown, it includes an electroforming template 1, a wafer 2 is arranged above the electroforming template 1, a number of docking cylinders 3 are arranged through the surface of the electroforming template 1, a fixed limiting block 4 is installed at one end of the docking cylinder 3, a vacuum suction tube 7 is sleeved on the outer surface of one end of the docking cylinder 3, a number of docking holes 5 are opened on one end of the surface of the wafer 2, and a number of fixed limiting cylinders 6 are inserted into the other end of the surface of the wafer 2.

[0025] The surfaces of the electroforming template 1 and the wafer 2 are tightly fitted together. Several docking cylinders 3 are evenly distributed at the corners of the electroforming template 1, and the two ends of the docking cylinders 3 extend out of the outer surfaces of the electroforming template 1 on opposite sides.

[0026] The connecting cylinder 3 and the fixed limiting block 4 are connected through each other, and the fixed limiting block 4 is connected on both sides. The fixed limiting block 4 is hexagonal in shape.

[0027] The fixed limiting cylinder 6 and the docking hole 5 are through-holes, and the inner end of the fixed limiting cylinder 6 is through-hole. The docking cylinder 3 and the fixed limiting block 4 are respectively inserted into the docking hole 5 and the fixed limiting cylinder 6. The outer surfaces of the docking cylinder 3 and the fixed limiting block 4 are tightly fitted to the inner walls of the docking hole 5 and the fixed limiting cylinder 6, respectively.

[0028] The outer surface of the end of the docking cylinder 3 away from the wafer 2 is fitted with an external thread 303, and the inner end of the vacuum suction tube 7 is fitted with an internal thread. The docking cylinder 3 and the vacuum suction tube 7 are connected by threaded engagement through the external thread 303 and the internal thread. The other end of the vacuum suction tube 7 is fitted with a vacuum machine.

[0029] When electroplating the bumps on wafer 2 using electroforming template 1, to ensure the accuracy and firmness of the connection between electroforming template 1 and wafer 2, the mating hole 5 and the fixing limiting cylinder 6 on wafer 2 are aligned with the mating cylinder 3 and the fixing limiting block 4 on electroforming template 1, respectively, and inserted. To prevent relative displacement between electroforming template 1 and wafer 2 due to gaps after connection, the connection point between electroforming template 1 and wafer 2 is set to a tight fit, ensuring stability after connection. This is important considering the diverse specifications of wafer 2. To avoid having too few connection points between the electroforming template 1 and the wafer 2, such as only one, and to prevent the wafer 2 from rotating around this single connection point, the connection point between the electroforming template 1 and the wafer 2 is configured with a hexagonal fixed limiting cylinder 6 and a fixed limiting block 4. This multi-sided limiting ensures the stability of the connection between the electroforming template 1 and the wafer 2, preventing relative rotation of the wafer 2 during the electroplating process. This further guarantees the stability of the connection between the electroforming template 1 and the wafer 2. During the docking process between the electroforming template 1 and the wafer 2, to ensure the stability of the connection between the electroforming template 1 and the wafer 2... The fixing can be completed simultaneously with the docking. A vacuum suction tube 7 is connected to one end of the docking cylinder 3. The air at the connection between the electroforming template 1 and the wafer 2 is evacuated by a vacuum machine. Since the docking cylinder 3, the fixing limit block 4, the docking hole 5, and the fixing limit cylinder 6 are all hollow, and the connection between the electroforming template 1 and the wafer 2 is designed to fit tightly, the vacuum suction tube 7 can evacuate the air at the connection between the electroforming template 1 and the wafer 2 while they are docking. After the vacuum suction tube 7 has safely evacuated the air at the connection between the electroforming template 1 and the wafer 2, it can continuously evacuate the wafer. 2. It plays an adsorption role, ensuring the firm connection between the electroforming template 1 and the wafer 2. It is connected to the docking cylinder 3 and the fixing limit block 4, docking hole 5 and fixing limit cylinder 6. Then, the air at the connection is sucked out by the vacuum suction tube 7. During the connection process between the electroforming template 1 and the wafer 2, the positioning and fixing of the electroforming template 1 and the wafer 2 can be completed by simply inserting and sucking. The positioning and fixing are carried out at the same time, without the need to fix it with pins after positioning. This further reduces the time required for the connection and fixing of the electroforming template 1 and the wafer 2, and further improves the efficiency of the electroforming of the wafer 2.

[0030] like Figures 1-5 As shown, a fixed annular sealing groove 301 is provided on the outer surface of the other end of the docking cylinder 3, and a sealing ring 302 is snapped into the fixed annular sealing groove 301.

[0031] The inner wall of the docking hole 5 is provided with a docking sealing annular groove 501. During the process of fixing the docking cylinder 3 and the docking hole 5, the sealing ring 302 is simultaneously engaged inside the docking sealing annular groove 501.

[0032] During the connection process between wafer 2 and electroforming template 1, in order to ensure that the vacuum suction tube 7 can firmly hold wafer 2 and avoid gaps between wafer 2 and electroforming template 1, which would lead to an unstable connection between wafer 2 and electroforming template 1, the gap between the docking hole 5 and the docking cylinder 3 is reduced by the sealing ring 302 at the same time as the connection between electroforming template 1 and wafer 2. This prevents the vacuum suction tube 7 from absorbing external air during the suction process, further ensuring the connection strength between electroforming template 1 and wafer 2, ensuring the stability of the operating position of wafer 2, and preventing deviation between the bump forming hole on electroforming template 1 and the electroplating position on electroforming template 1, further ensuring the accuracy of the electroforming position of the bump band on wafer 2.

[0033] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A wafer bump electroforming template, characterized in that, The device includes an electroforming template (1), on which a wafer (2) is placed. Several docking cylinders (3) are provided through the surface of the electroforming template (1). A fixed limiting block (4) is installed at one end of the docking cylinder (3). A vacuum suction tube (7) is sleeved on the outer surface of one end of the docking cylinder (3). Several docking holes (5) are opened on one end of the surface of the wafer (2). Several fixed limiting cylinders (6) are inserted into the other end of the surface of the wafer (2).

2. The wafer bump electroforming template according to claim 1, characterized in that, The surfaces of the electroforming template (1) and the wafer (2) are closely fitted together. Several docking cylinders (3) are evenly distributed at the corners of the electroforming template (1). The two ends of the docking cylinders (3) extend out of the outer surfaces of the electroforming template (1) on opposite sides.

3. The wafer bump electroforming template according to claim 1, characterized in that, The docking cylinder (3) and the fixed limiting block (4) are connected through each other, and the fixed limiting block (4) is connected on both sides. The fixed limiting block (4) is hexagonal in shape.

4. The wafer bump electroforming template according to claim 1, characterized in that, The fixed limiting cylinder (6) and the docking hole (5) are through-holes, and the inner end of the fixed limiting cylinder (6) is through-holes. The docking cylinder (3) and the fixed limiting block (4) are respectively inserted into the docking hole (5) and the fixed limiting cylinder (6). The outer surfaces of the docking cylinder (3) and the fixed limiting block (4) are tightly fitted to the inner walls of the docking hole (5) and the fixed limiting cylinder (6).

5. A wafer bump electroforming template according to claim 1, characterized in that, The outer surface of the end of the docking cylinder (3) away from the wafer (2) is provided with an external thread (303), and the inner end of the vacuum suction tube (7) is provided with an internal thread. The docking cylinder (3) and the vacuum suction tube (7) are connected by threaded engagement through the external thread (303) and the internal thread. The other end of the vacuum suction tube (7) is provided with a vacuum machine.

6. The wafer bump electroforming template according to claim 1, characterized in that, A fixed annular sealing groove (301) is provided on the outer surface of the other end of the docking cylinder (3), and a sealing ring (302) is snapped into the fixed annular sealing groove (301).

7. A wafer bump electroforming template according to claim 6, characterized in that, The inner wall of the docking hole (5) is provided with a docking sealing annular groove (501). During the process of fixing the docking cylinder (3) and the docking hole (5), the sealing ring (302) is simultaneously engaged inside the docking sealing annular groove (501).

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