Semiconductor corrosion-proof sealing ring

Abstract

The utility model relates to the technical field of semiconductor processing, especially to a semiconductor anticorrosion sealing ring. Including the sealing ring of inlaying in the connecting cylinder inner wall department, the connecting cylinder outer wall department is fixed with the connecting ring, the connecting ring top is fixed with a pair of upward extending support plate, the connecting ring both sides are opened with the assembly hole, the connecting ring is fastened and is inserted with the assembly top plate through the assembly hole, and the assembly top plate inner wall is opened with the assembly screw thread, the connecting cylinder inner wall department is fixed with a plurality of abutting blocks, the abutting block evenly distributes along the connecting cylinder axle core interval, the abutting block top is clamped and is provided with the sealing ring, and the sealing ring bottom inner wall is opened with the annular groove body that inlays with the abutting block top. The utility model solves the technical problem that: the sealing part is easy to react with the electroplating solution and influence the plating layer quality, causes the back surface or frame of base plate corrosion.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a semiconductor anti-corrosion sealing ring. Background Technology

[0002] Semiconductor devices, as the core foundation of modern information technology and the microelectronics industry, require multiple processes in their manufacturing, including wafer fabrication, photolithography, etching, doping, electroplating, and packaging. In the electroplating stage, one side of the wafer substrate is typically immersed in an electroplating solution, allowing metal ions to deposit on its surface to form a high-purity metal film (such as copper, nickel, or gold), thereby constructing a conductive interconnect layer or protective layer. To avoid non-target electroplating or corrosion in the border area and on the other side, the process must effectively seal the top of the substrate with the APC chuck assembly.

[0003] Existing sealing structures mostly use conventional metals or polymers. These materials are prone to expansion, dissolution, or structural fatigue in highly acidic or corrosive electroplating environments, leading to decreased sealing performance and the risk of electroplating solution leakage or even corrosion of non-target areas of the wafer. Furthermore, after prolonged use, the seals and APC chuck assemblies wear down, allowing electroplating solution to seep into the back of the wafer or the edge, causing localized corrosion and process contamination. This unstable sealing method not only increases the probability of wafer damage but also introduces uncontrollable quality risks to subsequent processes. Utility Model Content

[0004] The technical problem to be solved by this utility model is that the sealing component is prone to react with the electroplating solution, which affects the plating quality and causes corrosion on the back of the substrate or the frame.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: a semiconductor anti-corrosion sealing ring, including a sealing ring fitted into the inner wall of a connecting cylinder, a connecting ring fixedly provided on the outer wall of the connecting cylinder, a pair of upwardly extending support plates fixedly provided at the top of the connecting ring, assembly holes opened on both sides of the connecting ring, an assembly top plate fastened to the connecting ring through the assembly holes, and an assembly thread opened on the inner wall of the assembly top plate, a plurality of abutment blocks fixedly provided on the inner wall of the connecting cylinder, the abutment blocks being evenly distributed along the axis of the connecting cylinder, a sealing ring being snapped onto the top of the abutment block, and an annular groove being opened on the bottom inner wall of the sealing ring to fit into the top of the abutment block.

[0006] As a further improvement of this utility model, the two support plates are symmetrically arranged on both sides of the connecting cylinder, and the support plates are configured as inverted L-shaped plate structures, with mounting bolts passing through the top.

[0007] As a further improvement of this utility model, the bottom sides of the assembly top plate are fixedly provided with plug-in posts that match the assembly holes.

[0008] As a further improvement of this utility model, the outer side of the top of the plug is provided with anti-slip grooves.

[0009] As a further improvement of this utility model, the mounting top plate is configured as an annular sleeve structure, and the mounting thread is located on the inner wall of the top side.

[0010] As a further improvement of this utility model, the top of the abutting block is fixedly provided with a snap-fitting tooth that engages with the annular groove.

[0011] The beneficial effects of this invention are as follows: By evenly distributing abutment blocks on the inner wall of the connecting cylinder and fitting them with a sealing ring with an annular groove, this invention achieves a structured sealing and fixing method, avoiding the loosening problem caused by material aging or deformation of traditional seals. The sealing ring forms a stable annular seal below the wafer bezel, effectively preventing electroplating solution from seeping into the back of the wafer or the bezel area, avoiding corrosion and pollution risks caused by electroplating solution leakage. Simultaneously, the combination structure of the mounting top plate and the insertion post makes wafer assembly and disassembly more convenient, ensuring that the sealing component maintains a stable assembly effect even after long-term use, thereby extending the service life of the overall structure. Based on this structure, this device can maintain excellent sealing performance in strongly acidic or highly corrosive electroplating environments, avoiding the impact of sealing failure on plating quality, significantly reducing the risk of wafer damage, and improving the reliability and consistency of the electroplating process. Attached Figure Description

[0012] Figure 1 This is an overall schematic diagram of a semiconductor anti-corrosion sealing ring according to this utility model;

[0013] Figure 2 This is a disassembly diagram of a semiconductor anti-corrosion sealing ring according to this utility model;

[0014] Figure 3 This is a cross-sectional view of a semiconductor anti-corrosion sealing ring according to this utility model;

[0015] Figure 4 This is a partial view of a semiconductor anti-corrosion sealing ring according to this utility model.

[0016] As shown in the figure: 1. Connecting cylinder; 2. Sealing ring; 3. Connecting ring; 4. Support plate; 5. Assembly hole; 6. Assembly top plate; 7. Abutment block; 8. Insertion post; 9. Annular groove. Detailed Implementation

[0017] The directional terms such as up, down, left, right, front, back, front, back, top, and bottom mentioned or possibly mentioned in this specification are defined relative to their structure and are relative concepts. Therefore, they may vary depending on their location and usage; thus, these or other directional terms should not be interpreted as restrictive terms.

[0018] The singular forms “a,” “the,” and “the” used in this specification are intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes one or more of the associated listed items, any or all possible combinations thereof.

[0019] To make the technical problems to be solved, the technical solutions, and the beneficial effects of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0020] This utility model provides a semiconductor anti-corrosion sealing ring, including a sealing ring 2 that is fitted into the inner wall of the connecting cylinder 1;

[0021] As attached Figure 1 As shown, a connecting ring 3 is fixedly installed on the outer wall of the connecting cylinder 1. A pair of upwardly extending support plates 4 are fixedly installed at the top of the connecting ring 3. The two support plates 4 are symmetrically arranged on both sides of the connecting cylinder 1, and the support plates 4 are set as inverted L-shaped plate structures, with mounting bolts passing through the top. The device can be fastened to the pushing device through the support plates 4 and the mounting bolts, so that the output end of the pushing device can move downward and move the device to the electroplating liquid surface.

[0022] Meanwhile, as attached Figure 1 , 2 As shown in Figures 3 and 4, the connecting ring 3 has assembly holes 5 on both sides. The connecting ring 3 is fastened to the assembly top plate 6 through the assembly holes 5, and the inner wall of the assembly top plate 6 has assembly threads. Multiple abutment blocks 7 are fixedly installed on the inner wall of the connecting cylinder 1. The abutment blocks 7 are evenly distributed along the axis of the connecting cylinder 1. A sealing ring 2 is snapped onto the top of the abutment block 7, and the inner wall of the bottom of the sealing ring 2 has an annular groove 9 that fits into the top of the abutment block 7. The top of the abutment block 7 is fixedly provided with a snap-fit ​​tooth that fits into the annular groove 9 to strengthen the reliable connection between the abutment block 7 and the sealing ring 2.

[0023] In addition, as attached Figure 2 , 3As shown in Figure 4, the mounting top plate 6 is configured as an annular sleeve structure, with the mounting thread located on the inner wall of the top side. It is securely mounted to the wafer with threads on its side via the mounting thread, and the bottom of the wafer abuts against the sealing ring 2. Insertion posts 8, matching the mounting holes 5, are fixedly installed on both sides of the bottom end of the mounting top plate 6, providing a reliable insertion effect. Anti-slip grooves are provided on the outer top of the insertion posts 8, making it easy for the user to push the insertion posts 8 upwards and remove them from the mounting top plate 6.

[0024] Working Principle: In practical application, the sealing ring 2 is first placed into the inner wall of the connecting cylinder 1, so that the annular groove 9 at the bottom of the sealing ring 2 engages with the snap-fit ​​teeth at the top of the abutment block 7. Then, the wafer is securely connected to the inner wall of the mounting top plate 6 via threads at the edge, ensuring the wafer is stably mounted below the mounting top plate 6. Next, the operator inserts the mounting top plate 6 along the insertion post 8 into the mounting hole 5 of the connecting ring 3, forming a stable fastening relationship through the insertion fit, and reliably connecting the bottom end of the mounting top plate 6 to the connecting cylinder 1. At this point, the lower end of the wafer is tightly abutted against the sealing ring 2, forming an annular seal against the wafer edge and back surface, effectively preventing the penetration of the electroplating solution. Driven by the pushing device and secured by the support plate 4 and mounting bolts, the entire structure can move downwards to the electroplating solution surface. During the downward movement, the electroplating solution surface is prevented from submerging the joint between the assembly top plate 6 and the connecting ring 3, thus enabling the electroplating operation of the wafer. At the same time, a stable seal is maintained to prevent the electroplating solution from entering non-target areas of the wafer.

[0025] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A corrosion-proof sealing ring for a semiconductor, comprising a sealing ring (2) fitted in the inner wall of a connecting cylinder (1), characterized in that: A connecting ring (3) is fixedly installed on the outer wall of the connecting cylinder (1). A pair of upwardly extending support plates (4) are fixedly installed on the top of the connecting ring (3). Assembly holes (5) are opened on both sides of the connecting ring (3). An assembly top plate (6) is fastened to the connecting ring (3) through the assembly holes (5). An assembly thread is opened on the inner wall of the assembly top plate (6). A plurality of abutment blocks (7) are fixedly installed on the inner wall of the connecting cylinder (1). The abutment blocks (7) are evenly distributed along the axis of the connecting cylinder (1). A sealing ring (2) is snapped on the top of the abutment block (7). An annular groove (9) that fits into the top of the abutment block (7) is opened on the bottom inner wall of the sealing ring (2).

2. The semiconductor anti-corrosion sealing ring according to claim 1, characterized in that: The two support plates (4) are symmetrically arranged on both sides of the connecting cylinder (1), and the support plates (4) are configured as inverted L-shaped plate structures, with mounting bolts passing through the top.

3. The semiconductor anti-corrosion sealing ring according to claim 1, characterized in that: The bottom of the top plate (6) is fixedly provided with plug-in posts (8) that match the assembly holes (5).

4. The semiconductor anti-corrosion sealing ring according to claim 3, characterized in that: The top outer side of the plug post (8) is provided with anti-slip grooves.

5. A semiconductor anti-corrosion sealing ring according to claim 1, characterized in that: The assembly top plate (6) is configured as an annular sleeve structure, and the assembly thread is located on the inner wall of the top side.

6. The semiconductor anti-corrosion sealing ring according to claim 1, characterized in that: The top of the abutting block (7) is fixedly provided with a snap-fitting tooth that fits into the annular groove (9).

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