A multi-layer thermoelectric separation metal substrate high-efficiency heat dissipation structure

Abstract

The utility model is suitable for metal substrate technical field provides a kind of multilayer thermoelectric separation metal substrate high -efficient heat radiation structure, including thermoelectric separation substrate, LED lamp is installed on the thermoelectric separation substrate, and the LED lamp is electrically connected with thermoelectric separation substrate by conducting connection piece;Further include: heat dissipation module, the heat dissipation module includes heat dissipation pillar and flexible heat conduction block, the heat dissipation pillar is installed in the bottom of LED lamp, and the LED lamp is installed on thermoelectric separation substrate by heat dissipation pillar, the flexible heat conduction block is covered in LED lamp, and the flexible heat conduction block is also connected with thermoelectric separation substrate;Auxiliary heat dissipation piece, the auxiliary heat dissipation piece is set in the bottom of thermoelectric separation substrate, for the heat dissipation of thermoelectric separation substrate.This device is often used flexible silica gel material, can adapt to the shape of LED lamp, the heat of LED lamp everywhere is quickly transferred to metal base layer, realizes quick heat dissipation, and its structure is simple, and work efficiency is high, and use effect is good.

Description

Technical Field

[0001] This utility model belongs to the field of metal substrate technology, and in particular relates to a high-efficiency heat dissipation structure for a multilayer thermoelectric separation metal substrate. Background Technology

[0002] After years of development, LED lighting has become a mature lighting technology. LED devices generate a significant amount of heat during operation, causing their temperature to rise. High temperatures shorten the lifespan of LEDs and reduce their luminous performance. To prevent excessively high LED temperatures, efficient heat dissipation methods must be considered in the packaging structure design. Currently, most LED packaging manufacturers use materials with high thermal conductivity as substrates, such as copper, aluminum, and ceramics, allowing the heat generated by the chip to be conducted to the environment through the substrate.

[0003] However, in actual processing, existing metal thermal conductive materials cannot fully cover the LED light, resulting in poor actual heat conduction. How to quickly and fully transfer the heat of the LED light to the metal substrate for heat dissipation is an urgent problem to be solved. Utility Model Content

[0004] The purpose of this utility model embodiment is to provide a high-efficiency heat dissipation structure for a multilayer thermoelectric separation metal substrate, aiming to solve the problems mentioned in the background art.

[0005] This utility model embodiment is implemented as follows: a multi-layer thermoelectric separation metal substrate high-efficiency heat dissipation structure includes a thermoelectric separation substrate, an LED light mounted on the thermoelectric separation substrate, and the LED light electrically connected to the thermoelectric separation substrate through a conductive connector; it also includes:

[0006] A heat dissipation module includes a heat dissipation support column and a flexible heat-conducting block. The heat dissipation support column is installed at the bottom of the LED lamp, and the LED lamp is installed on the thermoelectric separation substrate through the heat dissipation support column. The flexible heat-conducting block covers the LED lamp and adopts a contour-following design. The flexible heat-conducting block is also connected to the thermoelectric separation substrate.

[0007] An auxiliary heat dissipation component is disposed at the bottom of the thermoelectric separation substrate and is used to dissipate heat from the thermoelectric separation substrate.

[0008] In a further technical solution, the flexible heat-conducting block is made of thermally conductive silicone material.

[0009] In a further technical solution, the thermoelectric separation substrate includes a metal base layer, an insulating layer, and a circuit layer;

[0010] The metal base layer uses copper or high thermal conductivity aluminum alloy as the core heat dissipation medium;

[0011] The insulating layer is disposed between the metal base layer and the circuit layer, and is filled with polymer using high thermal conductivity ceramic to achieve electrical isolation and thermal conduction.

[0012] The circuit layer is covered on an insulating layer and the circuit pattern is formed by etching. The material is electrolytic copper foil.

[0013] In a further technical solution, the thickness of the metal base layer is 0.5~3mm; the thickness of the insulating layer is 50~150μm; and the thickness of the circuit layer is 18~105μm.

[0014] In a further technical solution, the auxiliary heat dissipation component is disposed at the bottom of the metal base layer and consists of several S-shaped fins arranged side by side.

[0015] This utility model provides a high-efficiency heat dissipation structure for a multi-layer thermoelectric separation metal substrate. In use, an LED lamp can be electrically connected to the thermoelectric separation substrate via a conductive connector, thereby supplying power to the LED lamp through the thermoelectric separation substrate. During heat dissipation, the heat dissipation support serves two purposes: firstly, it provides support to ensure the stability of the LED lamp; secondly, it transfers the heat generated by the LED lamp to the thermoelectric separation substrate. Simultaneously, the heat generated by the LED lamp can also be transferred to the thermoelectric separation substrate via a flexible heat-conducting block, allowing heat from all parts of the LED lamp to be transferred to the thermoelectric separation substrate simultaneously, thus achieving rapid heat dissipation. The heat at the thermoelectric separation substrate can be transferred to the external environment through auxiliary heat dissipation components, achieving rapid heat dissipation for the LED lamp. This device often uses flexible silicone material, which can adapt to the shape of the LED lamp, quickly transferring heat from all parts of the LED lamp to the metal base layer for rapid heat dissipation. It has a simple structure, high working efficiency, and good performance. Attached Figure Description

[0016] Figure 1 A schematic diagram of a high-efficiency heat dissipation structure for a multilayer thermoelectric separation metal substrate provided in this embodiment of the present invention;

[0017] Figure 2 for Figure 1 Sectional view at point A in the diagram;

[0018] Figure 3 This is a bottom view of the metal substrate in a high-efficiency heat dissipation structure for a multilayer thermoelectric separation metal substrate provided in an embodiment of the present invention.

[0019] In the attached diagram: 1. Metal base layer; 2. Insulating layer; 3. Circuit layer; 4. LED light; 5. Conductive connector; 6. Heat dissipation support; 7. Flexible heat-conducting block; 8. Auxiliary heat dissipation component; 9. Thermoelectric separation substrate. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0021] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0022] like Figures 1-3 As shown, an embodiment of this utility model provides a high-efficiency heat dissipation structure for a multilayer thermoelectrically separated metal substrate, including a thermoelectrically separated substrate 9, on which an LED lamp 4 is mounted, and the LED lamp 4 is electrically connected to the thermoelectrically separated substrate 9 through a conductive connector 5; it also includes:

[0023] The heat dissipation module includes a heat dissipation support column 6 and a flexible heat-conducting block 7. The heat dissipation support column 6 is installed at the bottom of the LED lamp 4, and the LED lamp 4 is installed on the thermoelectric separation substrate 9 through the heat dissipation support column 6. The flexible heat-conducting block 7 covers the LED lamp 4 and adopts a contour-following design. The flexible heat-conducting block 7 is also connected to the thermoelectric separation substrate 9.

[0024] An auxiliary heat sink 8 is disposed at the bottom of the thermoelectric separation substrate 9 and is used to dissipate heat from the thermoelectric separation substrate 9.

[0025] In this embodiment of the invention, during use, the LED lamp 4 is electrically connected to the thermoelectric separation substrate 9 via the conductive connector 5, thereby supplying power to the LED lamp 4 through the thermoelectric separation substrate 9. During heat dissipation, the heat dissipation support 6 serves two purposes: firstly, it provides support to ensure the stability of the LED lamp 4; secondly, it transfers the heat generated by the LED lamp 4 to the thermoelectric separation substrate 9. Simultaneously, the heat generated by the LED lamp 4 can also be transferred to the thermoelectric separation substrate 9 via the flexible heat-conducting block 7. The flexible heat-conducting block 7 allows heat from all parts of the LED lamp 4 to be transferred to the thermoelectric separation substrate 9 simultaneously, achieving rapid heat dissipation. The heat at the thermoelectric separation substrate 9 can be transferred to the external environment via the auxiliary heat dissipation component 8, achieving rapid heat dissipation for the LED lamp 4.

[0026] In a preferred embodiment of this utility model, the flexible heat-conducting block 7 is made of thermally conductive silicone material. The flexible silicone material can fully cover the LED lamp 4, so that the heat generated by the LED lamp 4 can be quickly transferred to the thermoelectric separation substrate 9, thereby achieving rapid heat dissipation.

[0027] like Figure 1 As shown, in a preferred embodiment of the present invention, the thermoelectric separation substrate 9 includes a metal base layer 1, an insulating layer 2, and a circuit layer 3;

[0028] The metal base layer 1 is made of copper or high thermal conductivity aluminum alloy (thickness 0.5~3mm) as the core heat dissipation medium;

[0029] The insulating layer 2 is disposed between the metal base layer 1 and the circuit layer 3, and is filled with polymer using high thermal conductivity ceramic (thickness 50~150μm) to achieve electrical isolation and thermal conduction.

[0030] The circuit layer 3 covers the insulating layer 2 and is formed by etching to form a circuit pattern. The material is electrolytic copper foil (thickness 18~105μm).

[0031] In this embodiment of the invention, the conductive connector 5 is connected to the circuit layer 3 to provide power to the LED lamp 4.

[0032] like Figure 3 As shown, in a preferred embodiment of the present invention, the auxiliary heat dissipation component 8 is disposed at the bottom of the metal base layer 1 and is composed of several S-shaped fins arranged side by side. The use of S-shaped fins can expand the heat dissipation area, thereby accelerating the transfer of heat.

[0033] Working Principle: During use, the LED lamp 4 is electrically connected to the circuit layer 3 via the conductive connector 5, thereby supplying power to the LED lamp 4. During heat dissipation, the heat dissipation support 6 serves two purposes: firstly, it provides support to ensure the stability of the LED lamp 4; secondly, it transfers the heat generated by the LED lamp 4 to the thermoelectric separation substrate 9. Simultaneously, the heat generated by the LED lamp 4 can also be transferred to the thermoelectric separation substrate 9 via the flexible heat-conducting block 7. The flexible heat-conducting block 7 allows heat from all parts of the LED lamp 4 to be transferred to the thermoelectric separation substrate 9 simultaneously, achieving rapid heat dissipation. The heat at the thermoelectric separation substrate 9 can be transferred to the external environment via the auxiliary heat dissipation component 8, achieving rapid heat dissipation for the LED lamp 4.

[0034] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-efficiency heat dissipation structure for a multilayer thermoelectric separation metal substrate, characterized in that, The system includes a thermoelectric separation substrate, on which an LED light is mounted, the LED light being electrically connected to the thermoelectric separation substrate via a conductive connector; it also includes: A heat dissipation module includes a heat dissipation support column and a flexible heat-conducting block. The heat dissipation support column is installed at the bottom of the LED lamp, and the LED lamp is mounted on the thermoelectric separation substrate through the heat dissipation support column. The flexible heat-conducting block covers the LED lamp and adopts a design that imitates the shape of the LED lamp. The flexible heat-conducting block is also connected to the thermoelectric separation substrate. An auxiliary heat dissipation component is disposed at the bottom of the thermoelectric separation substrate and is used to dissipate heat from the thermoelectric separation substrate.

2. The high-efficiency heat dissipation structure of the multilayer thermoelectric separation metal substrate according to claim 1, characterized in that, The flexible heat-conducting block is made of thermally conductive silicone material.

3. The high-efficiency heat dissipation structure of the multilayer thermoelectric separation metal substrate according to claim 1, characterized in that, The thermoelectric separation substrate includes a metal base layer, an insulating layer, and a circuit layer; The metal base layer uses copper or high thermal conductivity aluminum alloy as the core heat dissipation medium; The insulating layer is disposed between the metal base layer and the circuit layer, and is filled with polymer using high thermal conductivity ceramic to achieve electrical isolation and thermal conduction. The circuit layer is covered on an insulating layer and the circuit pattern is formed by etching. The material is electrolytic copper foil.

4. The high-efficiency heat dissipation structure of the multilayer thermoelectric separation metal substrate according to claim 3, characterized in that, The thickness of the metal base layer is 0.5~3mm; the thickness of the insulating layer is 50~150μm; and the thickness of the circuit layer is 18~105μm.

5. The high-efficiency heat dissipation structure of the multilayer thermoelectric separation metal substrate according to claim 1, characterized in that, The auxiliary heat dissipation component is located at the bottom of the metal base layer and consists of several S-shaped fins arranged side by side.

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