A high-precision solder paste thickness measuring device

Abstract

The utility model relates to a kind of high-precision solder paste thickness measuring device, including workbench and laser measuring device, the top of workbench is provided with wide slot, two rotating shafts are rotatably connected in wide slot, two conveying strips are wound between the two rotating shafts, a number of bearing rods are fixedly connected between the two conveying strips, corresponding inner recesses are set up on the opposite two side walls of wide slot with number of strips, rotating belt is rotatably connected in inner recesses.The utility model relates to the technical field of solder paste thickness measurement.This kind of high-precision solder paste thickness measuring device can automatically position pcb board after placing pcb circuit board on bearing rod and slide bar during use, and can also automatically center pcb board while positioning, and can also automatically release the clamping positioning of pcb board after measurement, thereby greatly improving the efficiency of solder paste thickness detection on pcb board.

Description

Technical Field

[0001] This utility model relates to the technical field of solder paste thickness measurement, and in particular to a high-precision solder paste thickness measurement device. Background Technology

[0002] In the field of electronic manufacturing, surface mount technology (SMT) is widely used for soldering some components on PCBs. Solder paste printing is a very critical part of the entire production process, so the quality inspection of solder paste printing is very important. According to statistics, 70% of the quality defects in SMT processes come from the solder paste printing stage.

[0003] In existing technologies, the soldering of components or the printing of solder paste on PCBs require thickness testing to avoid problems such as cold solder joints and solder bridging. During continuous operation, the PCBs need to be placed and positioned repeatedly, and then disassembled after testing. Generally, spring clamps or screw rotations are used to clamp the PCBs. Therefore, positioning, placement, and disassembly take a long time, which affects the efficiency of solder paste thickness testing. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a high-precision solder paste thickness measuring device in order to solve the technical problems mentioned in the background art.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: A high-precision solder paste thickness measuring device includes a worktable and a laser measuring instrument. The top of the worktable has a wide groove, and two rotating shafts are rotatably connected in the wide groove. Two conveyor strips are wound between the two rotating shafts, and a number of support rods are fixedly connected between the two conveyor strips. On the two opposite side walls of the wide groove, there are inner grooves corresponding to the number of strips. A rotating belt is rotatably connected in the inner groove, and a clamping component is provided in the rotating belt. A drive motor is fixedly connected to the side of the worktable, and the output shaft end of the drive motor is fixedly connected to the corresponding rotating shaft.

[0006] In a preferred embodiment, the present invention can be further configured as follows: the clamping member includes a circular groove, a sliding cylinder is slidably connected in the circular groove, the sliding cylinder passes through the corresponding conveyor bar and is slidably connected to the conveyor bar, a sliding rod is slidably connected between the two sliding cylinders, a clamping rod is fixedly connected to the end of the sliding cylinder, and the clamping rod is also slidably connected to the sliding rod.

[0007] In a preferred embodiment, the present invention can be further configured such that a fixing belt is fixedly connected between the two conveyor bars, and a gap is left between the fixing belt and the outer periphery of the slide.

[0008] In a preferred embodiment, the present invention can be further configured as follows: a small hole is provided on the end side wall of the circular groove, a tension spring is fixedly connected between the end side wall of the circular groove and the slide cylinder, a pneumatic groove communicating with the inner groove is provided on the side of the worktable, an air pump is fixedly connected to the side of the worktable, and the output end of the air pump is connected to the pneumatic groove.

[0009] In a preferred embodiment, the present invention can be further configured such that: a through hole is provided on the outer side wall of the workbench, and the through hole communicates with the inner groove.

[0010] In a preferred embodiment, the present invention can be further configured such that: a support column is fixedly connected to the side of the workbench, and the top and bottom sidewalls of the support column are fixedly connected to the laser measuring device.

[0011] In summary, this utility model has at least one of the following beneficial technical effects: 1. This high-precision solder paste thickness measuring device, when in use, after placing the PCB circuit board on the support rod and slide rod, can automatically position the PCB board, and at the same time, can automatically center the PCB board, and can automatically release the clamping and positioning of the PCB board after measurement, thereby greatly improving the efficiency of solder paste thickness detection on the PCB board. 2. This high-precision solder paste thickness measuring device supports the PCB board by a sliding rod while it is placed on the support rod. Then, the sliding cylinder drives the clamping rod to clamp the PCB board, thus facilitating the clamping operation. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This is a schematic diagram of the laser measuring device structure of this utility model.

[0015] Figure 3 This is a schematic diagram of the structure at the rotating shaft of this utility model.

[0016] Figure 4 This is a schematic diagram of the rotating belt structure of this utility model.

[0017] Figure 5 This is a schematic diagram of the internal structure of the circular groove of this utility model.

[0018] Figure 6 For the present utility model Figure 5 Enlarged structural diagram at point A in the middle.

[0019] In the diagram, 1. Workbench; 2. Laser measuring instrument; 3. Wide groove; 4. Rotating shaft; 5. Conveyor bar; 6. Bearing rod; 7. Inner groove; 8. Rotating belt; 9. Clamping component; 10. Drive motor; 11. Circular groove; 12. Slide cylinder; 13. Slide rod; 14. Clamping rod; 15. Fixing belt; 16. Small hole; 17. Tension spring; 18. Air pressure groove; 19. Air pump; 20. Through hole; 21. Bearing column. Detailed Implementation

[0020] The present invention will be further described in detail below with reference to the accompanying drawings.

[0021] Example: Reference Figure 1 - Figure 6 This utility model discloses a high-precision solder paste thickness measuring device, including a worktable 1 and a laser measuring device 2. The top of the worktable 1 is provided with a wide groove 3, and two rotating shafts 4 are rotatably connected in the wide groove 3. Two conveyor strips 5 are wound between the two rotating shafts 4. A number of bearing rods 6 are fixedly connected between the two conveyor strips 5. The two opposite side walls of the wide groove 3 are provided with inner grooves 7 corresponding to the number of strips. A rotating belt 8 is rotatably connected in the inner groove 7. A clamping member 9 is provided in the rotating belt 8. A drive motor 10 is fixedly connected to the side of the worktable 1. The output shaft end of the drive motor 10 is fixedly connected to the corresponding rotating shaft 4. The workbench 1 is fixedly connected to a support column 21 on its side, and the top and bottom sidewalls of the support column 21 are fixedly connected to the laser measuring device 2.

[0022] In this embodiment, reference Figure 1 - Figure 3 When in use, the PCB board with solder paste is placed on the support rod 6. Then, the drive motor 10 drives the rotating shaft 4 to rotate, which in turn drives the two conveyor bars 5 to rotate. When the conveyor bars 5 rotate, they will drive the support rod 6 to move to the position of the laser measuring device 2 on the support column 21. At the same time, the clamping parts 9 on the rotating belt 8 are used to position and fix the PCB board, achieving the effect of automatic fixing and automatic conveying dynamic detection.

[0023] In a further preferred embodiment of this utility model, such as Figure 4 - Figure 6As shown, the clamping member 9 includes a circular groove 11, a sliding cylinder 12 is slidably connected in the circular groove 11, the sliding cylinder 12 passes through the corresponding conveyor bar 5 and is slidably connected to the conveyor bar 5, a sliding rod 13 is slidably connected between the two sliding cylinders 12, and a clamping rod 14 is fixedly connected to the end of the sliding cylinder 12, and the clamping rod 14 is also slidably connected to the sliding rod 13. A fixing belt 15 is fixedly connected between the two conveyor bars 5, and a gap is left between the fixing belt 15 and the outer periphery of the slide 12.

[0024] In this embodiment, reference Figure 4 - Figure 6 While the PCB board is placed on the support rod 6, it is also supported by the slide rod 13. Then the slide cylinder 12 is slidable, and the slide cylinder 12 drives the clamping rod 14 to clamp the PCB board, so as to facilitate the clamping of the PCB board. The fixing belt 15 is used to stabilize the two conveyor bars 5, so that the fixing bar can be stabilized on the rotating shaft 4. A gap is left between the slide cylinder 12 and the fixing belt 15 to prevent jamming when the clamping rod 14 slides.

[0025] In a further preferred embodiment of this utility model, such as Figure 4 - Figure 6 As shown, a small hole 16 is provided on the end side wall of the circular groove 11, and a tension spring 17 is fixedly connected between the end side wall of the circular groove 11 and the slide cylinder 12. A pneumatic groove 18 communicating with the inner groove 7 is provided on the side of the worktable 1. An air pump 19 is fixedly connected to the side of the worktable 1, and the output end of the air pump 19 is connected to the pneumatic groove 18. A through hole 20 is provided on the side of the outer side wall of the worktable 1, and the through hole 20 is interconnected with the inner groove 7.

[0026] In this embodiment, reference Figure 4 - Figure 6A pressure sensor is fixedly connected to each of the two clamping rods 14 on opposite sides. A controller is fixedly installed on the worktable 1. The controller is connected to the pressure sensors and is also connected to the air pump 19 and the drive motor 10. The drive motor 10 is driven by the controller to rotate the shaft 4 for transporting the PCB board. The controller is located in the middle of the top side of the worktable 1 and contains a sensor to detect the pressure sensors approaching on the clamping rods 14. When the corresponding sensor approaches, the controller starts the air pump 19 to inject air into the air pressure groove 18, which in turn injects air into the corresponding circular groove 11. The movement of the slide cylinder 12 drives the clamping operation of the clamping rod 14. After the clamping rod 14 clamps the PCB board, the pressure transmitted by the pressure sensor reaches a certain threshold. At this time, the controller controls the air pump 19 to stop working. After the next pressure sensor reaches the designated position and the previous pressure sensor leaves the sensing range, the controller controls the air pump 19 to start again. It stops after the pressure received by the pressure sensor reaches a certain threshold. Therefore, the distance between the two corresponding sensors needs to be such that the subsequent pressure sensor enters the sensing range of the sensor after the previous pressure sensor leaves the sensor range, to avoid the phenomenon of the air pump 19 being blocked. After the solder paste thickness on the corresponding PCB board is measured, it will move to the position of the through hole 20. Then the high pressure inside the corresponding circular groove 11 will be released, and the sliding cylinder 12 will be pulled back to its original position by the reaction force of the tension spring 17, thereby releasing the positioning effect on the PCB board and facilitating the disassembly of the PCB board.

[0027] The implementation principle of the above embodiment is as follows: the PCB board processed with solder paste is placed on the support rod 6, and then the drive motor 10 drives the rotating shaft 4 to rotate, which in turn drives the two conveyor bars 5 to rotate. When the conveyor bars 5 rotate, they will drive the support rod 6 to move, so that the support rod 6 moves to the position of the laser measuring device 2 on the support column 21. After the support rod 6 moves to the position of the laser measuring device 2 on the support column 21, the corresponding sensor approaches. At this time, the controller starts the air pump 19 to inject air into the air pressure groove 18, and then into the corresponding circular groove 11, which drives the slide cylinder 12 to move and causes the clamping rod 14 to clamp. After the clamping rod 14 clamps the PCB board, the pressure transmitted by the pressure sensor reaches a certain threshold. At this time, the controller controls the air pump 19 to stop working. After the next pressure sensor reaches the designated position and the previous pressure sensor leaves the sensing range, the controller controls the air pump 19 to start again. It stops after the pressure received by the pressure sensor reaches a certain threshold. Therefore, the distance between the two corresponding sensors needs to be such that the subsequent pressure sensor enters the sensing range of the sensor after the previous pressure sensor leaves the sensor range, to avoid the phenomenon of the air pump 19 being blocked.

[0028] The embodiments described herein are preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape, and principle of this utility model should be included within the scope of protection of this utility model.

Claims

1. A high-precision solder paste thickness measuring device, comprising a worktable (1) and a laser measuring instrument (2), characterized in that, The top of the workbench (1) is provided with a wide groove (3), and two rotating shafts (4) are rotatably connected in the wide groove (3). Two conveyor strips (5) are wound between the two rotating shafts (4). A number of bearing rods (6) are fixedly connected between the two conveyor strips (5). An inner groove (7) corresponding to the number of strips is provided on the two opposite side walls of the wide groove (3). A rotating belt (8) is rotatably connected in the inner groove (7). A clamping piece (9) is provided in the rotating belt (8). A drive motor (10) is fixedly connected to the side of the workbench (1). The end of the output shaft of the drive motor (10) is fixedly connected to the corresponding rotating shaft (4).

2. The high-precision solder paste thickness measuring device according to claim 1, characterized in that, The clamping member (9) includes a circular groove (11), in which a sliding cylinder (12) is slidably connected. The sliding cylinder (12) passes through the corresponding conveyor bar (5) and is slidably connected to the conveyor bar (5). A sliding rod (13) is slidably connected between the two sliding cylinders (12). A clamping rod (14) is fixedly connected to the end of the sliding cylinder (12), and the clamping rod (14) is also slidably connected to the sliding rod (13).

3. The high-precision solder paste thickness measuring device according to claim 2, characterized in that, A fixing belt (15) is fixedly connected between the two conveyor bars (5), and a gap is left between the fixing belt (15) and the outer periphery of the slide (12).

4. The high-precision solder paste thickness measuring device according to claim 3, characterized in that, The end sidewall of the circular groove (11) is provided with a small hole (16), and a tension spring (17) is fixedly connected between the end sidewall of the circular groove (11) and the slide (12). The side of the workbench (1) is provided with a pressure groove (18) that communicates with the inner groove (7). An air pump (19) is fixedly connected to the side of the workbench (1), and the output end of the air pump (19) is connected to the pressure groove (18).

5. The high-precision solder paste thickness measuring device according to claim 4, characterized in that, The workbench (1) has a through hole (20) on its outer side wall, and the through hole (20) is connected to the inner groove (7).

6. The high-precision solder paste thickness measuring device according to claim 5, characterized in that, The workbench (1) is fixedly connected to a support column (21) on its side, and the top and bottom sidewalls of the support column (21) are fixedly connected to the laser measuring device (2).

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