A cryogenic temperature sensor

CN224650749UActive Publication Date: 2026-08-18BEIJING HEGUANG WEIYE SENSING TECH CO LTD
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Patent Information

Application Number
CN202522822541.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-30
Publication Date
2026-08-18
Estimated Expiration
2035-12-30

AI Technical Summary

Technical Problem

采用这种方式时存在一些问题:一方面,在面对低温测量时,螺纹连接和密封圈通常不能满足低温密封要求,密封效果不好;另一方面,温度测量时,过低的温度对测量电路也产生了极高的要求,由于大部分电子元器件不能在低温-50℃以下使用,过低的温度导致电子元器件失灵而无法工作

Benefits of technology

[0020]1.本申请设有散热基座,散热基座上部开设有多个散热槽,与现有技术相比,可以将散热基座内部的低温温度逐步抬高,使得电子仓内部的温度升高,从而使电子仓外壳内部的电子元器件能在有效的工作温度范围内工作,从而实现产品低温温度的测量,解决了低温产品大多数电子元器件无法使用的问题;

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a kind of low temperature temperature sensor, including measuring rod, heat dissipation pedestal, electronic warehouse component.Heat dissipation pedestal is installed on mounting pedestal, measuring rod is installed in the lower part inside heat dissipation pedestal, the lower end of measuring rod is inserted into the tank to be measured, for measuring the temperature in the tank to be measured.The upper portion of heat dissipation pedestal is evenly provided with multiple heat dissipation grooves, for gradually raising low temperature temperature.Installation hole, which is communicated with the inside of the tank to be measured, is provided on mounting pedestal, the upper portion of installation hole is a threaded surface, the lower portion is a conical surface, the lower portion of heat dissipation pedestal is also provided with the threaded surface matched with the threaded surface on installation hole, and inverted conical surface matched with the conical surface on installation hole is also provided, heat dissipation pedestal and mounting pedestal are fastened by threaded surface, and are pressed tightly by conical surface downward and sealed.The application adopts the form of conical surface and thread sealing, and the sealing effect is good;And by setting heat dissipation pedestal, electronic components can be in effective working temperature range, realize the temperature measurement of product.
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Description

Technical Field

[0001] This utility model relates to the field of temperature sensor technology, and in particular to a low-temperature temperature sensor for use in low-temperature environments. Background Technology

[0002] Temperature measurement is a crucial method in physical quantity measurement. In industry, temperature measurement generally employs the following two methods:

[0003] 1. Contact temperature measurement:

[0004] Contact temperature measurement typically involves directly contacting a temperature-sensing element with the object being measured, achieving measurement through heat exchange. Common temperature-sensing elements include platinum resistance thermometers and thermocouples. Its advantage is high-precision temperature measurement, but its disadvantage is the need for a certain stabilization time, resulting in a long measurement period.

[0005] 2. Non-contact temperature measurement:

[0006] Non-contact temperature measurement generally calculates temperature by detecting the thermal radiation intensity of an object using infrared radiation. It has the advantage of fast response speed (millisecond level) and is suitable for temperature measurement of moving objects, high-risk environments (such as high-temperature furnaces) or corrosive media. Its disadvantage is that the measurement accuracy is affected by the emissivity of the object surface, ambient humidity and distance, with an error of about 1℃.

[0007] In some applications, such as cryogenic liquid nitrogen temperature measurement, it needs to be performed in a confined space, making non-contact measurement difficult. Contact measurement is a more feasible method. When using contact temperature measurement, the commonly used platinum resistance thermometer PT100 can achieve temperature measurement in the range of -200 to 850℃, which is perfectly capable of measuring the temperature of liquid nitrogen.

[0008] In cryogenic applications, such as liquid nitrogen temperature measurement, conventional temperature sensors are threaded onto the object being measured and sealed with a sealing ring. This approach presents several problems: firstly, threaded connections and sealing rings often fail to meet the sealing requirements at low temperatures, resulting in poor sealing performance; secondly, extremely low temperatures place extremely high demands on the measurement circuitry, as most electronic components cannot operate below -50°C, and such low temperatures can cause them to malfunction.

[0009] Therefore, there is a need for a low-temperature temperature sensor that provides better low-temperature sealing and does not affect the effective operation of electronic components to meet market demand. Utility Model Content

[0010] To address the aforementioned problems in the prior art, this utility model provides a low-temperature temperature sensor that employs a conical surface and threaded seal for excellent sealing performance. Furthermore, by providing a heat dissipation base, the electronic components can achieve temperature measurement within the effective operating temperature range.

[0011] To achieve the above objectives, this utility model provides the following technical solution: This application provides a low-temperature temperature sensor, which is disposed on a tank to be tested; the tank to be tested has a raised mounting base, and the low-temperature temperature sensor is mounted on the mounting base; the low-temperature temperature sensor includes a heat dissipation base, a measuring rod, and an electronic compartment assembly; the heat dissipation base is mounted on the mounting base, and the interior of the heat dissipation base is a hollow through hole; the measuring rod is installed in the lower part of the interior of the heat dissipation base, and the lower end of the measuring rod extends into the tank to be tested for measuring the temperature inside the tank; the upper part of the heat dissipation base is evenly provided with multiple heat dissipation grooves for gradually raising the low-temperature temperature; the electronic compartment assembly is mounted on the upper part of the heat dissipation base. The heat dissipation base is used to gradually raise the internal low-temperature temperature, so that the temperature of the electronic compartment assembly does not become too low and affect the effective operation of the electronic components.

[0012] In a preferred embodiment, the mounting base has a mounting hole communicating with the interior of the tank to be tested. The upper part of the mounting hole is a threaded surface, and the lower part is a conical surface. The lower part of the heat dissipation base also has a threaded surface that mates with the upper threaded surface of the mounting hole. The lower end of the threaded surface of the heat dissipation base also has an inverted conical surface that mates with the lower conical surface of the mounting hole. The heat dissipation base and the mounting base are fastened together by their threaded surfaces and sealed by the downward pressure of their conical surfaces. Compared with traditional threaded connections, this threaded connection and conical sealing provides a better sealing effect.

[0013] In a further preferred embodiment, the inside of the measuring rod is a hollow blind cavity, and a platinum resistance thermometer for temperature measurement is installed inside the cavity.

[0014] A further preferred technical solution is that the platinum resistance is a PT100 platinum resistance thermometer. When used for low-temperature measurements, the PT100 platinum resistance thermometer has strong anti-interference capabilities and millisecond-level response speed, making it suitable for real-time monitoring with high accuracy and good measurement stability.

[0015] In a further preferred embodiment, the upper end of the measuring rod is fixed to the lower part of the heat dissipation base by welding.

[0016] In a further preferred embodiment, the electronic compartment assembly includes an electronic compartment shell and a PCBA assembly installed inside the electronic compartment shell.

[0017] In a further preferred embodiment, the platinum resistance thermometer and the PCBA assembly are connected by a low-temperature connecting wire.

[0018] In a further preferred embodiment, the upper end of the electronic compartment shell is provided with a connector, which is connected to the PCBA assembly via a low-temperature connecting wire for data transmission of the measured low-temperature temperature.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] 1. This application is provided with a heat dissipation base, and multiple heat dissipation grooves are opened on the upper part of the heat dissipation base. Compared with the prior art, the low temperature inside the heat dissipation base can be gradually raised, so that the temperature inside the electronic compartment can be increased, thereby enabling the electronic components inside the electronic compartment shell to work within the effective operating temperature range, thereby realizing the measurement of the product's low temperature and solving the problem that most electronic components of low-temperature products cannot be used.

[0021] 2. In this application, the heat dissipation base and the mounting base are fastened and sealed together by a threaded surface, and then further sealed by downward pressing with a conical surface. Compared with traditional threaded connection seals, the sealing effect is better through the combination of threaded connection and conical surface seal. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of a low-temperature temperature sensor according to this application;

[0023] Figure 2 This is a three-dimensional structural diagram of a low-temperature temperature sensor according to this application;

[0024] Figure 3 This is a schematic diagram of the mounting base for a low-temperature temperature sensor according to this application;

[0025] Figure 4 This is a schematic diagram of the heat dissipation base of a low-temperature temperature sensor according to this application;

[0026] The diagram is marked as follows:

[0027] 1-Test tank; 2-Mounting base; 4-Test rod; 5-Heat dissipation base; 6-Electronic chamber assembly; 61-Electronic chamber shell; 62-PCBA assembly; 7-Threaded surface; 8-Conical surface; 9-Platinum resistance; 10-Connector. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Reference Figures 1 to 4 The following is a further description of an embodiment of a low-temperature temperature sensor according to the present invention.

[0030] The low-temperature sensor described in this application is disposed on the tank 1 to be tested; the tank 1 to be tested is provided with a raised mounting base 2, and the low-temperature sensor is mounted on the mounting base 2.

[0031] The low-temperature sensor includes a probe 4, a heat dissipation base 5, and an electronic compartment assembly 6.

[0032] The heat dissipation base 5 is mounted on the mounting base 2. The heat dissipation base 5 has a hollow through hole inside. The measuring rod 4 is installed in the lower part of the heat dissipation base 5, and the lower end of the measuring rod 5 extends into the tank 1 to measure the temperature inside the tank 1. The upper part of the heat dissipation base 5 has multiple heat dissipation grooves evenly distributed to gradually raise the low temperature.

[0033] The mounting base 2 has a mounting hole communicating with the interior of the tank 1 to be tested. The upper part of the mounting hole is a threaded surface 7, and the lower part is a conical surface 8. The lower part of the heat dissipation base 5 also has a threaded surface 7 that mates with the upper threaded surface 7 of the mounting hole. The lower end of the threaded surface 7 of the heat dissipation base 5 also has an inverted conical surface that mates with the lower conical surface 8 of the mounting hole. The heat dissipation base 5 and the mounting base 2 are fastened together by the threaded surface 7 between them and sealed by the downward pressing of the conical surface 8 between them. Compared with the traditional threaded connection seal, the sealing effect is better through the threaded connection and conical surface seal.

[0034] The upper end of the measuring rod 4 is fixed to the lower part of the heat dissipation base 5 by welding. The upper part of the measuring rod 4 is open, and its interior is a hollow blind cavity. A platinum resistance thermometer 9 for temperature measurement is installed inside the cavity of the measuring rod 4. The platinum resistance thermometer 9 is a platinum resistance thermometer PT100. When used for low-temperature measurement, the platinum resistance thermometer PT100 has strong anti-interference ability and millisecond-level response speed, and can be used for real-time monitoring with high accuracy and good measurement stability.

[0035] The electronic compartment assembly 6 is mounted on the upper part of the heat dissipation base. The electronic compartment assembly 6 includes an electronic compartment shell 61 and a PCBA assembly 62 installed inside the electronic compartment shell 61. The platinum resistance thermometer 9 and the PCBA assembly 62 are connected by a low-temperature connecting wire. A connector 10 is provided at the upper end of the electronic compartment shell 6. The connector 10 is also connected to the PCBA assembly 62 by a low-temperature connecting wire for transmitting the measured low-temperature temperature data.

[0036] This application, by setting a heat dissipation base and creating multiple heat dissipation grooves on the base, gradually raises the low-temperature temperature, thereby increasing the internal temperature of the electronic compartment. This allows the electronic components of the PCBA assembly inside the electronic compartment to operate within an effective operating temperature range, enabling the measurement of the product's low-temperature temperature and solving the problem that most electronic components cannot be used in low-temperature products. Furthermore, the lower part of the heat dissipation base and the mounting base are tightly sealed together via a threaded surface, and then further sealed by downward pressure with a conical surface. Compared to traditional threaded connections, this combination of threaded connection and conical seal provides a better low-temperature sealing effect.

[0037] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. It should be noted that any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A low-temperature temperature sensor, wherein the low-temperature temperature sensor is disposed on the tank to be measured; characterized in that: The test tank has a raised mounting base, and the low-temperature sensor is mounted on the mounting base. The low-temperature sensor includes a heat dissipation base, a probe, and an electronic chamber assembly. The heat dissipation base is mounted on the test tank and has a hollow through hole inside. The probe is installed in the lower part of the heat dissipation base, and its lower end extends into the test tank to measure the temperature inside the test tank. The upper part of the heat dissipation base has multiple heat dissipation grooves evenly distributed to gradually raise the low-temperature temperature. The electronic chamber assembly is mounted on the upper part of the heat dissipation base.

2. A low-temperature temperature sensor according to claim 1, characterized in that: The mounting base has a mounting hole that communicates with the inside of the tank to be tested. The upper part of the mounting hole is a threaded surface, and the lower part of the mounting hole is a conical surface. The lower part of the heat dissipation base also has a threaded surface that mates with the upper threaded surface of the mounting hole. The lower end of the threaded surface of the heat dissipation base also has an inverted conical surface that mates with the lower conical surface of the mounting hole. The heat dissipation base and the mounting base are fastened together by the threaded surfaces between them and sealed by pressing down with the conical surfaces between them.

3. A low-temperature temperature sensor according to claim 1, characterized in that: The inside of the measuring rod is a hollow blind cavity, and a platinum resistance thermometer is installed inside the cavity for temperature measurement.

4. A low-temperature temperature sensor according to claim 3, characterized in that: The platinum resistance is a PT100 platinum resistance.

5. A low-temperature temperature sensor according to claim 1, characterized in that: The upper end of the measuring rod is fixed to the lower part of the heat dissipation base by welding.

6. A low-temperature temperature sensor according to claim 4, characterized in that: The electronic compartment assembly includes an electronic compartment shell and a PCBA assembly installed inside the electronic compartment shell.

7. A low-temperature temperature sensor according to claim 6, characterized in that: The platinum resistance thermometer and the PCBA assembly are connected by low-temperature connecting wires.

8. A low-temperature temperature sensor according to claim 7, characterized in that: The upper part of the electronic compartment shell is equipped with a connector, which is connected to the PCBA assembly via a low-temperature connecting wire.