Semiconductor boiler production airtight leak detection device

Abstract

The utility model relates to airtight leak detection equipment technical field provides a kind of semiconductor boiler production airtight leak detection device, including rack and semiconductor boiler;The inside of the rack is equipped with partition, helium detector and vacuum pump are installed in the partition;The outside of the semiconductor boiler is equipped with the leak detection ring frame of axial to-and-fro movement, the inside of the leak detection ring frame is equipped with two two groups of sealing pad, the inside surface of the sealing pad is formed sealing against semiconductor boiler, cavity is formed between adjacent sealing pad;Annular detection strip is equipped in the cavity, detection probe is fixed in the outside of the detection strip. Through leak detection ring frame to-and-fro movement in the outside of semiconductor boiler, using the annular structure of leak detection ring frame forms the coating of semiconductor boiler, through detection strip and detection probe real-time leak detection to semiconductor boiler, realize the effect that wide coverage, fast positioning gas leak position, leak detection time is short, help to improve work efficiency to meet the continuous leak detection needs of batch production.

Description

Technical Field

[0001] This utility model relates to the field of airtightness and leak detection equipment, and more specifically, to an airtightness and leak detection device for semiconductor boiler production. Background Technology

[0002] Semiconductor boilers, also known as PTC semiconductor heating boilers or ceramic electric boilers, are electric heating devices that use semiconductor positive temperature coefficient (PTC) thermistor ceramic materials as heating elements. They are mainly used for heating and domestic hot water in homes and commercial places. In order to ensure the normal operation of the boiler, airtightness testing is often performed on it during production.

[0003] Currently, helium mass spectrometry leak detectors are mostly used for airtight leak detection of semiconductor boilers. After the semiconductor boiler is evacuated and sealed, helium gas is sprayed at all possible leak points on the outside of the boiler (such as welds, flange connections, windows, electrode inlets, etc.) with a spray gun, or the entire boiler is covered with a plastic cover and filled with a certain concentration of helium gas. A suction gun is then used to scan all connections on the outside of the boiler.

[0004] However, among the above-mentioned leak detection methods, external helium blowing is a point-to-point leak detection method, which is inefficient and has a limited coverage area, while internal helium filling is a large-scale leak detection method, which cannot locate the leak location in a timely manner. Both commonly used methods are inconvenient to use and cannot meet the needs of batch continuous leak detection in production operations.

[0005] To address the aforementioned issues, this application proposes a leak detection device for semiconductor boiler production. Utility Model Content

[0006] The purpose of this invention is to provide a leak detection device for semiconductor boiler production, which solves the problem of low efficiency in the existing semiconductor boiler leak detection technology.

[0007] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0008] A leak detection device for semiconductor boiler production includes a frame and a semiconductor boiler;

[0009] The frame has an internal partition, and a helium detector and a vacuum pump are installed inside the partition;

[0010] The outer side of the semiconductor boiler is fitted with a leak detection ring frame that moves axially back and forth. The inner side of the leak detection ring frame is provided with a pair of sealing gaskets. The inner side of the sealing gaskets abuts against the semiconductor boiler to form a seal, and a cavity is formed between adjacent sealing gaskets.

[0011] The cavity is provided with an annular detection strip, and a detection probe is fixed on the outer side of the detection strip. The detection probe is evenly distributed circumferentially.

[0012] Preferably, the leak detection ring has side plates extending inward from both sides, and electric telescopic devices are fixed on the inner side of the side plates, with the electric telescopic devices being evenly distributed circumferentially.

[0013] Preferably, the movable end of the electric telescopic device is fixedly equipped with an annular pressure ring, one side of which abuts against the outer side of the sealing gasket.

[0014] Preferably, the inner ring of the sealing gasket is fixed with a folded gasket, which is normally an axial sleeve structure, with the inner side attached to the semiconductor boiler.

[0015] Preferably, a sliding bearing seat is fixed on the top of the frame, symmetrically distributed on the left and right, one of the sliding bearing seats is connected to the vacuum pump, and the semiconductor boiler is installed between adjacent sliding bearing seats.

[0016] Preferably, a movable support frame is fixedly installed on one side of the leak detection ring frame, a positioning frame is fixedly installed on the outer side of the movable support frame, and the lower end of the movable support frame is provided with upper and lower layered screw holes and guide holes.

[0017] Preferably, a transmission rod that is rotatably connected to the swivel hole is mounted on the top of the frame, and a guide rod that is slidably connected to the guide hole is provided on the top of the frame.

[0018] The beneficial effects of this utility model are:

[0019] 1. Through the ring-shaped covering structure of the leak detection ring frame, the semiconductor boiler is covered by the lateral movement of the leak detection ring frame to form a comprehensive leak detection operation, which is simple, convenient and has a wide coverage, meeting the needs of rapid leak detection.

[0020] 2. Through the ring-shaped covering structure of the leak detection ring frame, and with the built-in detection strip and detection probe, the leak location of the semiconductor boiler can be detected in a timely manner, achieving the effect of quickly locating the leak location;

[0021] In summary, this application achieves comprehensive leak detection by performing continuous leak detection through the lateral movement of the leak detection ring frame. Furthermore, the built-in qualified detection probe with folded pads can promptly locate the leak, which not only shortens the overall time but also facilitates the location of the leak. Moreover, the leak detection range is wider, meeting the rapid leak detection needs in mass production. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a three-dimensional structural diagram of the overall appearance of this utility model;

[0024] Figure 2 This is a schematic diagram of the overall planar structure of the present invention;

[0025] Figure 3 This is a schematic diagram of the combined structure of the leak detection ring frame and the movable support frame of this utility model;

[0026] Figure 4 This is a schematic diagram of the internal three-dimensional structure of the leak detection ring frame of this utility model;

[0027] Figure 5 This is a schematic diagram of the internal planar structure of the leak detection ring frame of this utility model;

[0028] The attached diagram lists the components represented by each number as follows:

[0029] In the diagram: 1. Frame; 2. Helium detector; 3. Vacuum pump; 4. Sliding shaft seat; 5. Semiconductor boiler; 6. Leak detection ring frame; 61. Side plate; 62. Sealing gasket; 621. Folding gasket; 631. Detection strip; 632. Detection probe; 64. Pressure ring; 65. Electric telescopic device; 7. Moving support frame; 711. Rotary joint hole; 712. Guide hole; 72. Positioning frame; 81. Transmission rod; 82. Guide rod. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] In the description of this utility model, it should be understood that the terms "opening", "top and bottom", "thickness", "top", "middle", "length", "inner" and "around" indicate the orientation or positional relationship only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0032] A leak detection device for semiconductor boiler production is designed to improve leak detection efficiency, coverage, and positioning speed. A movable support frame 7 drags a leak detection ring frame 6 in a lateral reciprocating motion outside the semiconductor boiler 5. The ring structure of the leak detection ring frame 6 encloses the semiconductor boiler 5, and then the detection strip 631 and detection probe 632 perform real-time leak detection on the semiconductor boiler 5. This device achieves wide coverage, rapid leak location, and short leak detection time, thus improving work efficiency and meeting the continuous leak detection requirements of mass production.

[0033] In some embodiments, the specific structure of the leak detection device for semiconductor boiler production is as follows: Figure 1-5 As shown, it includes a frame 1 and a semiconductor boiler 5;

[0034] The frame 1 is a double-layer plate structure with a partition between the two plates for installing the helium detector 2 and vacuum pump 3 required for leak detection.

[0035] Furthermore, two sliding bearings 4 are slidably installed on the upper left and right sides of the frame 1. One of the sliding bearings 4 is connected to the vacuum pump 3, and the semiconductor boiler 5 is installed between the adjacent sliding bearings 4 for support and vacuuming. The other sliding bearing 4 is connected to the helium filling device for filling the interior of the semiconductor boiler with helium.

[0036] Furthermore, a leak detection ring 6 that can move back and forth in the left and right directions is fitted on the outside of the semiconductor boiler 5, and one side of the leak detection ring 6 is connected to the helium detector 2, which is a leak detection working component.

[0037] Among them, the inner side of the leak detection ring 6 is provided with two sets of sealing gaskets 62, and the inner side of the sealing gaskets 62 abuts against the semiconductor boiler 5 to form a seal.

[0038] In addition, a cavity is formed between adjacent sealing gaskets 62, and a detection strip 631 is fixedly installed in the cavity. Multiple detection probes 632 are fixed on the outside of the detection strip 631 and are evenly distributed in the circumference to cover the semiconductor boiler 5 for leak detection.

[0039] It should be noted that the detection strip 631 is a ring-shaped sampling tube, one side of which is connected to the flexible conduit installed behind the helium detector 2, and is used to detect the helium gas injected from the leaking part of the semiconductor boiler 5.

[0040] Understandably, the leak detection ring 6 covers the semiconductor boiler 5 and moves laterally. It uses the detection strip 631 and the detection probe 632 to perform multi-point leak detection in real time. The leak detection is completed when the leak detection ring 6 moves from one end of the semiconductor boiler 5 to the other end. At the same time, it achieves the effects of short time consumption, wide coverage and fast positioning.

[0041] like Figure 1-3As shown, a transmission rod 81, which is a ball screw, is rotatably mounted on the top of the frame 1 via a bracket and is driven by a rotary motor on the outside of the bracket.

[0042] Among them, a movable support frame 7 is fixedly installed on one side of the leak detection ring frame 6. The lower end of the movable support frame 7 is located between adjacent supports, and a screw hole 711 is opened inside the movable support frame 7 near the lower end, which is connected to the transmission rod 81 for transmission.

[0043] Furthermore, a guide hole 712 is provided at the lower end of the screw hole 711, which is slidably connected to the guide rod 82 installed inside the adjacent bracket, in order to keep the sliding movement of the movable support frame 7 stable.

[0044] like Figure 3-5 As shown, side plates 61 extend from both sides of the leak detection ring frame 6 toward the axis.

[0045] Among them, the sealing gasket 62 is a conical ring structure with a sloping cross section, and it fits one side of the semiconductor boiler 5 close to the side plate 61, while the other side fixedly connected to the leak detection ring frame 6 is away from the side plate 61.

[0046] In addition, there is an integral folded gasket 621 on the inner side of the sealing gasket 62. Normally, the folded gasket 621 is a tube sleeve structure, and the inner side is attached to the outer surface of the semiconductor boiler 5. When replacing the semiconductor boiler 5 with a smaller size, the folded gasket 621 is used to extend the body of the sealing gasket 62 and compensate for the distance between the inner side of the sealing gasket 62 and the semiconductor boiler 5.

[0047] Furthermore, an electric telescopic device 65 is fixedly installed on the inner side of the side plate 61, and a pressure ring 64 is fixedly installed on the movable end of the electric telescopic device 65.

[0048] It should be noted that one side of the curved surface of the pressure ring 64 abuts against the outer side of the sealing gasket 62;

[0049] Understandably, the extension movement of the electric telescopic device 65 can push the pressure ring 64 toward the sealing gasket 62, thereby causing the inner side of the sealing gasket 62 to move closer to the left and right center positions, thereby reducing the inner ring diameter and thus adapting to the sealing of semiconductor boilers 5 of different sizes.

[0050] like Figure 3 As shown, a positioning frame 72 is fixedly installed on the outside of the movable support frame 7 to fix the soft tube of the helium detector 2 through it, so as to prevent it from swaying and affecting the stability of the connection.

[0051] The specific usage methods of the airtight leak detection device in semiconductor boiler production, as disclosed in some publications, are as follows:

[0052] S1. The semiconductor boiler 5 is inserted into the leak detection ring 6, and then both ends of the semiconductor boiler 5 are inserted into the shaft frame on one side of the sliding shaft seat 4 for sealing. Then, the vacuum pump 3 is used to evacuate the semiconductor boiler 5. Then, helium is filled into the semiconductor boiler 5 through the helium filling device connected to the outside of the sliding shaft seat 4.

[0053] S2. Through the rotational movement of the transmission rod 81, the transmission connection with the screw hole 711 drives the movable support frame 7 to move laterally, thereby driving the leak detection ring frame 6 to move laterally.

[0054] S3. After the leak detection ring 6 is fitted on the outside of the semiconductor boiler 5, the extension of the electric telescopic device 65 drives the pressure ring 64 to push the sealing gasket 62, causing the inner side of the sealing gasket 62 to contract inward, thereby abutting against the semiconductor boiler 5 to form a seal.

[0055] S4. When the leak detection ring 6 moves laterally, the detection strip 631 connected to the soft conduit of the helium detector 2 and the detection probe 632 on its outer side are used to perform real-time airtight leak detection on the outside of the semiconductor boiler 5.

[0056] S5. After the airtightness leak detection operation, the leak detection ring 6 moves to the outside of the shaft bracket on the side of the sliding shaft seat 4, detaches from the semiconductor boiler 5, and then the semiconductor boiler 5 can be removed.

[0057] In the description of this specification, references to terms such as "an embodiment," "example," and "specific example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0058] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A leak detection device for semiconductor boiler production, characterized in that: Includes a frame (1) and a semiconductor boiler (5); The frame (1) has an internal partition, in which a helium detector (2) and a vacuum pump (3) are installed. The outer side of the semiconductor boiler (5) is fitted with a leak detection ring frame (6) that moves axially back and forth. The inner side of the leak detection ring frame (6) is provided with a pair of sealing gaskets (62). The inner side of the sealing gaskets (62) abuts against the semiconductor boiler (5) to form a seal, and a cavity is formed between adjacent sealing gaskets (62). The cavity is provided with an annular detection strip (631), and a detection probe (632) is fixed on the outside of the detection strip (631). The detection probe (632) is evenly distributed circumferentially.

2. The semiconductor boiler production airtightness leak detection device according to claim 1, characterized in that: The leak detection ring (6) has side plates (61) extending inward from both sides. Electric expansion joints (65) are fixed on the inner side of the side plates (61) and are evenly distributed around the circumference.

3. The semiconductor boiler production airtightness leak detection device according to claim 2, characterized in that: The movable end of the electric telescopic device (65) is fixedly equipped with an annular pressure ring (64), and one side of the pressure ring (64) abuts against the outer side of the sealing gasket (62).

4. The semiconductor boiler production airtightness leak detection device according to claim 1, characterized in that: The inner ring of the sealing gasket (62) is fixed with a folded gasket (621), which is normally an axial sleeve structure, and the inner side is attached to the semiconductor boiler (5).

5. The semiconductor boiler production airtightness leak detection device according to claim 1, characterized in that: A sliding bearing seat (4) is fixed on the top of the frame (1), and is symmetrically distributed on the left and right. One of the sliding bearing seats (4) is connected to the vacuum pump (3), and the semiconductor boiler (5) is installed between adjacent sliding bearing seats (4).

6. The semiconductor boiler production airtightness leak detection device according to claim 1, characterized in that: A movable support frame (7) is fixedly installed on one side of the leak detection ring frame (6), and a positioning frame (72) is fixedly installed on the outside of the movable support frame (7). The lower end of the movable support frame (7) is provided with a rotating hole (711) and a guide hole (712) with upper and lower layers.

7. The semiconductor boiler production airtightness leak detection device according to claim 6, characterized in that: A transmission rod (81) that is rotatably connected to the swivel hole (711) is mounted on the top of the frame (1), and a guide rod (82) that is slidably connected to the guide hole (712) is provided on the top of the frame (1).

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