A test device and test system

Abstract

The application provides a test device and a test system, and relates to the technical field of testing. The test device comprises a first component, a cooling component arranged on the first component, a second component, and a placement area arranged on the surface of the second component and used for placing a target component. The second component is internally provided with an airflow channel. The first end of the airflow channel is connected to the cooling component, and the second end of the airflow channel is connected to the placement area, so that the airflow of the cooling component can pass through the airflow channel to dissipate heat of the target component located on the placement area.

Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to a testing device and testing system. Background Technology

[0002] When testing the motherboard of electronic devices, a testing device is needed to cool the entire motherboard. However, cooling the entire motherboard will result in some areas of the motherboard that do not need cooling being ineffectively cooled, while the core areas that generate more heat will not be adequately cooled. Utility Model Content

[0003] The embodiments of this application provide the following technical solutions:

[0004] The first aspect of this application provides a testing apparatus, comprising: a first component, the first component being provided with a cooling component; and a second component, the surface of the second component being provided with a placement area for placing a target component; wherein the second component is provided with an airflow channel, a first end of the airflow channel being connectable to the cooling component, and a second end of the airflow channel being connected to the placement area, so that the airflow of the cooling component can dissipate heat from the target component located in the placement area through the airflow channel.

[0005] In some embodiments of this application, the cooling assembly includes a vortex tube capable of separating the airflow into a hot airflow and a cold airflow; the vortex tube includes an air inlet, a cold air outlet, and a hot air outlet, the air inlet being connected to an air source device, the cold air outlet being connected to a first end of the airflow channel, the cold airflow being able to enter the airflow channel from the first end, and the hot airflow being able to exit from the hot air outlet.

[0006] In some embodiments of this application, the cooling assembly further includes a nozzle, which is fixedly disposed on the first assembly along a first direction. One end of the nozzle is connected to the cold air outlet, and the other end of the nozzle can dock with the first end. The first assembly is provided with a testing assembly, and the second assembly can reciprocate relative to the first assembly along the first direction so that the testing assembly can test the target assembly. The first direction is a direction perpendicular to the surface of the second assembly.

[0007] In some embodiments of this application, the nozzle is provided with a nozzle, and when the nozzle is abutting the first end, the nozzle can be sealed to the periphery of the first end.

[0008] In some embodiments of this application, the second component is provided with a plurality of air outlets at the placement area; the airflow channel includes a buffer cavity and a channel structure, the buffer cavity and the channel structure are connected, the buffer cavity is disposed below the placement area, and the buffer cavity is connected to the plurality of air outlets and the second end respectively.

[0009] In some embodiments of this application, the testing device further includes a sealing element, which is detachably connected to the second component and is capable of blocking at least a portion of the air outlet.

[0010] In some embodiments of this application, the cross-sectional area of ​​the air outlet gradually decreases along the direction from the second component toward the first component.

[0011] In some embodiments of this application, the testing apparatus further includes: a first control valve connected to the cooling component; a data acquisition device for acquiring temperature data of the target component; the first control valve being communicatively connected to the data acquisition device, and the first control valve controlling the cooling component to supply the airflow to the first end based on the temperature data.

[0012] In some embodiments of this application, the testing device further includes: a second control valve connected to the hot gas outlet; the second control valve being communicatively connected to the data acquisition device, and the second control valve controlling the flow rate of the hot gas stream discharged from the hot gas outlet according to the temperature data.

[0013] A second aspect of this application provides a testing system, comprising: an air source device; a testing device, the testing device comprising: a first component and a second component, the first component being provided with a cooling component connected to the air source device; the surface of the second component being provided with a placement area for placing a target component; wherein the second component is provided with an airflow channel inside, a first end of the airflow channel being connectable to the cooling component, and a second end of the airflow channel being connected to the placement area, so that the airflow of the cooling component can dissipate heat from the target component located in the placement area through the airflow channel; and a control device, the control device being connected to both the air source device and the testing device, the control device being used to control the on / off connection between the air source device and the testing device. Attached Figure Description

[0014] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0015] Figure 1 The schematic diagram illustrates the structure of the first component and the second component in the test apparatus of an embodiment of this application;

[0016] Figure 2 A schematic diagram of the structure of the test device according to an embodiment of this application is shown.

[0017] Figure 3 A schematic cross-sectional view of the test apparatus according to an embodiment of this application is shown.

[0018] Figure 4 A schematic cross-sectional structural diagram of another state of the test apparatus according to an embodiment of this application is shown;

[0019] Figure 5 A schematic diagram of the structure of the vortex tube in the test device of the embodiment of this application is shown.

[0020] Figure 6 A schematic diagram illustrating the principle of the vortex tube in the testing device of this application embodiment is shown.

[0021] Figure 7 A schematic diagram of the structure of the test system according to an embodiment of this application is shown.

[0022] Explanation of icon numbers:

[0023] 1. First component; 101. Test component; 2. Second component; 201. Placement area; 202. Airflow channel; 2021. Channel structure; 2022. Buffer chamber; 203. Air outlet; 3. Cooling component; 301. Vortex tube; 3011. Air inlet; 3012. Cold air outlet; 3013. Hot air outlet; 302. Nozzle; 4. First control valve; 5. Second control valve;

[0024] 10. Testing device; 20. Gas source device; 30. Control device. Detailed Implementation

[0025] The embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application. This application can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0026] These embodiments are provided to make the application thorough and complete, and to fully express the scope of the application to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​illustrated in these embodiments should be interpreted as merely exemplary and not as limiting.

[0027] It should be noted that, in the description of this application, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0028] Furthermore, the terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well.

[0029] In related technologies, the testing device includes a shielded enclosure, an upper module assembly, and a lower module assembly. The upper and lower module assemblies are located inside the shielded enclosure to test the motherboard. The upper module assembly is used to test the motherboard, and the lower module assembly is used to place the motherboard. The lower module assembly can move vertically to approach the upper module assembly so that the upper module assembly can test the motherboard. The lower module assembly can also move horizontally and be pulled out of the shielded enclosure to place the motherboard. Because a large amount of heat is easily generated during testing, potentially damaging the motherboard, existing cooling solutions use fans to dissipate heat during testing. However, this solution results in ineffective cooling of some areas of the motherboard that do not require heat dissipation, while the core areas with high heat generation lack sufficient cooling capacity, ultimately leading to motherboard damage.

[0030] The testing device provided in this application embodiment can concentrate all or most of the cooling airflow to the motherboard, avoiding the ineffective blowing of air onto areas that do not require heat dissipation in traditional overall heat dissipation, thereby improving heat dissipation efficiency.

[0031] Example 1

[0032] This application provides a testing device, such as... Figures 1 to 4 As shown, it includes: a first component 1, which is provided with a cooling component 3; a second component 2, which has a placement area 201 on its surface for placing a target component; wherein, the second component 2 has an airflow channel 202 inside, the first end of the airflow channel 202 can be connected to the cooling component 3, and the second end of the airflow channel 202 is connected to the placement area 201, so that the airflow of the cooling component 3 can dissipate heat to the target component located in the placement area 201 through the airflow channel 202.

[0033] The first component 1 includes a cooling component 3, which provides cooling airflow to the testing device. The cooling component 3 can be a cooling fan that actively generates airflow, forming cooling airflow through its own operation; or it can be an interface or connector for connecting to an external air source to transmit external cooling airflow into the airflow channel 202.

[0034] The second component 2 has a placement area 201 on its surface, which is used to fix and position the target component (such as a motherboard carrying circuitry, a power module, a memory card, etc.). To ensure the stability of the target component during testing, the placement area 201 can be configured with corresponding positioning structures according to the target component, such as grooves matching the shape of the target component, positioning pins for positioning, or clamps that can fix the target component, thereby ensuring that the target component will not shift during testing. The second component 2 has an internal airflow channel 202, which has a first end and a second end. The first end is used to connect to the cooling component 3 of the first component 1, and the second end extends from the inside of the second component 2 to the placement area 201.

[0035] When testing a target component is required, the target component can be placed in the placement area 201 of the second component 2, ensuring that the core heat-generating component of the target component is aligned with the second end. At this time, the cold airflow generated by the cooling component 3 can enter the airflow channel 202 inside the second component 2 through the first end, and then be precisely blown towards the core heat-generating component of the target component from the second end.

[0036] The testing device provided in this application embodiment, through the directional guidance of the airflow channel 202, can confine the cooling airflow within a preset path, concentrating all or most of the cooling airflow towards the target component, directly acting on the core heat-generating parts of the target component. This avoids the ineffective blowing on areas that do not require heat dissipation in traditional overall heat dissipation, thereby significantly improving heat dissipation efficiency, saving cooling energy, and ensuring the accuracy of test data.

[0037] In some embodiments, such as Figures 3 to 5 As shown, the cooling assembly 3 includes a vortex tube 301, which can separate the airflow into hot airflow and cold airflow. The vortex tube 301 includes an air inlet 3011, a cold air outlet 3012, and a hot air outlet 3013. The air inlet 3011 is used to connect to the air source device, and the cold air outlet 3012 is used to connect to the first end of the airflow channel 202. The cold airflow can enter the airflow channel 202 from the first end, and the hot airflow can be discharged from the hot air outlet 3013.

[0038] like Figure 6As shown, the working principle of the vortex tube 301 is to form a vortex by rotating compressed air at high speed inside the tube, and to achieve cooling of the airflow in the central region and heating of the airflow in the outer region by using the momentum exchange of gas molecules, thereby separating the cold and hot airflows.

[0039] A mounting base can be fixedly installed on the first component 1, and the mounting base is placed on the mounting base. The air inlet 3011 of the vortex tube 301 can be connected to an external air source device, such as a factory air source or an independent air compressor, through which high-pressure compressed air enters the vortex tube 301. The cold air outlet 3012 is the output end of the vortex tube 301, which can be directly or through a short pipe or connector connected to the first end of the airflow channel 202 inside the second component 2. The hot air outlet 3013 is located at the other end of the vortex tube 301. The hot air outlet 3013 can be connected to an exhaust pipe to directly guide the separated hot airflow to the outside of the test device or a designated heat dissipation area, avoiding the accumulation of hot airflow near the device and affecting the heat dissipation effect.

[0040] By setting the vortex tube 301 in the cooling component 3, the high-pressure airflow can be directly separated into cold and hot airflows. No additional cooling equipment is needed. Compressed air can be used to generate cold airflows below the ambient temperature, which can achieve rapid cooling and improve testing efficiency.

[0041] In some embodiments, such as Figure 2 As shown, the cooling assembly 3 also includes a nozzle 302, which is fixedly mounted on the first assembly 1 along a first direction. One end of the nozzle 302 is connected to the cold air outlet 3012; the other end of the nozzle 302 can dock with the first end; the first assembly 1 is provided with a test assembly 101, and the second assembly 2 can reciprocate relative to the first assembly 1 along the first direction so that the test assembly 101 can test the target assembly. The first direction is perpendicular to the surface of the second assembly 2.

[0042] like Figure 2 As shown, the first component 1 is positioned above the second component 2 along a first direction. The second component 2 can precisely reciprocate relative to the first component 1 along the first direction via a guide rail, lead screw, or cylinder, moving closer to or away from the first component 1. A test component 101 is provided on the side of the first component 1 facing the second component 2, which may include probes, connectors, sensors, etc., required for electrical testing of the target component. A mounting hole may be provided through the main body of the first component 1 along the first direction, and a nozzle 302 passes through the mounting hole along the first direction and is fixed to the first component 1. One end of the nozzle 302 is positioned away from the second component 2 and can be tightly connected to the cold air outlet 3012 of the vortex tube 301 via a quick-connect coupling, sealing ring, or flange. The end of the nozzle 302 facing the second component 2 is an open port for docking.

[0043] In the initial state, the second component 2 is in a lowered position, with the nozzle 302 port separated from the first end of the airflow channel 202, and the probe of the test component 101 not in contact with the motherboard test point. When testing is required, the moving mechanism drives the second component 2 to move upward along the first direction, gradually approaching the first component 1. During this process, the port of the nozzle 302 aligns with and connects to the first end of the airflow channel 202 of the second component 2, forming a sealed connection; simultaneously, the probe module of the test component 101 also synchronously contacts the predetermined test point on the target component, establishing a stable electrical connection.

[0044] After the test officially starts, the target component is powered on and the test program is loaded, while the air source device starts simultaneously, and compressed air enters the vortex tube 301. The vortex tube 301 separates the airflow into a cold airflow and a hot airflow. The cold airflow flows into the airflow channel 202 of the second component 2 through the nozzle 302, and after being guided by the airflow channel 202, it is precisely blown towards the key heat-generating components of the target component to achieve efficient heat dissipation; the hot airflow is discharged outside the device through the hot air outlet 3013 of the vortex tube 301. After the test is completed, the moving mechanism drives the second component 2 to move downward in the first direction, the nozzle 302 separates from the airflow channel 202, and the probe detaches from the target component, making it convenient for the operator to pick up and put down the target component.

[0045] By fixing the test probe module and nozzle 302 together on the first component 1, the cooling operation can be initiated only when testing is required. When the second component 2 moves to the test position, and the probe module contacts the target component and begins testing, the nozzle 302 can connect with the airflow channel 202 and provide cooling airflow, achieving precise synchronization of testing and cooling. This eliminates the need to operate the heat dissipation and testing mechanisms separately, greatly simplifying the testing process and improving the automation and efficiency of testing.

[0046] Furthermore, in related technologies, the second component 2 may move back and forth relative to the first component 1 along a second direction, which is perpendicular to the first direction. For example, the first direction is a vertical direction perpendicular to the ground, and the second direction is a horizontal direction parallel to the ground. The second component 2 can move back and forth in the horizontal direction, for example, forming a pull-out shape, which facilitates the operator to pick up and put down the target component. Fixed to the first component 1 by the nozzle 302, the nozzle 302 and the vortex tube 301 can remain stationary regardless of whether the second component 2 moves vertically or horizontally. This avoids problems such as bending and blockage of the air pipe, difficulty in sealing, and easy displacement of the position caused by using long-distance flexible air pipes for the nozzle 302 and the vortex tube 301.

[0047] In some embodiments, the nozzle 302 is provided with a nozzle, which can be sealed to the periphery of the first end when the nozzle is abutting the first end.

[0048] The nozzle is provided at one end of the nozzle 302 facing the second component 2. The nozzle can be made of flexible silicone material and can be funnel-shaped. The large end of the nozzle is an adsorption sealing surface with rounded edges, while the small end is connected to the air outlet 203 of the nozzle 302. The connection can be sealed with sealant to ensure that the cold airflow does not leak here.

[0049] As the second component 2 moves upward along the first direction, the nozzle contacts the peripheral mating surface of the first end of the airflow channel 202. As the second component 2 continues to move upward, the flexible nozzle undergoes slight deformation under pressure, squeezing out air from the contact surface between the nozzle and the second component 2. This allows the nozzle to fit tightly against the mating surface, achieving a tight seal between the nozzle and the peripheral surface of the first end. At the end of the test, this seal between the nozzle and the peripheral surface of the first end prevents leakage of cold air at the mating point, reducing waste of cold airflow.

[0050] In some embodiments, such as Figure 2 As shown, the second component 2 is provided with multiple air outlets 203 located in the placement area 201; the airflow channel 202 includes a buffer cavity 2022 and a channel structure 2021, the buffer cavity 2022 and the channel structure 2021 are connected, the buffer cavity 2022 is located below the placement area 201, and the buffer cavity 2022 is connected to the multiple air outlets 203 and the second end respectively.

[0051] Multiple air outlets 203 are provided on the placement area 201 of the second component 2. These outlets 203 can be circular, rectangular, or other shapes, extending from the surface of the second component 2 along a first direction (perpendicular to the placement area 201) into the interior of the second component 2 and communicating with the buffer cavity 2022. The buffer cavity 2022 is located directly below the placement area 201 and can be a rectangular cavity. The airflow channel 202 includes a channel structure 2021 with a first end and a second end, wherein the second end communicates with the buffer cavity 2022, enabling the channel structure 2021 to deliver cold airflow to the buffer cavity 2022.

[0052] When the cooling component 3 generates a cold airflow, the cold airflow enters the channel structure 2021 through the nozzle 302, and is then transported to the buffer chamber 2022 by the channel structure 2021. The cold airflow will stay briefly in the buffer chamber 2022 to form a stable air pressure environment, and then be distributed to each air outlet 203, and finally blown from the air outlet 203 to the target component.

[0053] By thoroughly mixing the cold airflow within the buffer chamber 2022 and then evenly distributing it to each air outlet 203, each core heat-generating component on the target assembly receives an equal amount of cold airflow. This solves the problem of insufficient airflow in some areas when using a traditional single-channel direct air supply, significantly improving the uniformity of heat dissipation. Simultaneously, the buffer chamber 2022, in conjunction with multiple air outlets 203, can simultaneously meet the heat dissipation needs of multiple heat-generating points on the target assembly, eliminating the need for a separate channel structure 2021 for each heat-generating point. This simplifies the internal structure of the second assembly 2 and reduces manufacturing costs.

[0054] In some embodiments, the testing apparatus further includes a plug (not shown in the figures), the plug being detachably connected to the second component 2, and the plug being capable of blocking at least a portion of the air outlet 203.

[0055] The sealing component can be multiple individual columnar plugging structures, the diameter of which can be slightly larger than the diameter of the air outlet 203, and the air outlet 203 can be sealed by interference fit. Alternatively, it can be a plate-shaped structure made of silicone material, the shape of which is adapted to the edge contour of the second component 2 placement area 201, and multiple protruding plugs are provided at the position of the air outlet 203 corresponding to the placement area 201. The diameter of the protruding plugs is also slightly larger than the diameter of the air outlet 203, and the sealing is completed by interference fit.

[0056] When testing different target components, the number and location of core heat-generating parts vary. If some target components have fewer core heat-generating parts, or if the location of certain air vents 203 does not correspond to the heat-generating area of ​​the target component, appropriate sealing components can be selected according to actual needs. Simply insert the cylindrical plug or protruding plug of the sealing component into the corresponding air vent 203, ensuring that only the air vent 203 corresponding to the heat-generating part remains unobstructed. When testing another target component that requires more air vents 203 for heat dissipation, the current sealing component can be removed.

[0057] By incorporating removable sealing components, the device can flexibly adapt to the heat dissipation requirements of different motherboard models, enhancing its versatility. Furthermore, by blocking unnecessary air outlets 203, the cool airflow can be concentrated and ejected from the unobstructed outlets 203, increasing the airflow pressure and flow rate at the corresponding locations of core heat-generating components. This avoids insufficient heat dissipation caused by dispersed cool airflow, further improving heat dissipation efficiency.

[0058] In some embodiments, the cross-sectional area of ​​the air outlet 203 gradually decreases along the direction from the second component 2 toward the first component 1.

[0059] The cross-sectional area of ​​the air outlet 203 gradually decreases along the direction from the second component 2 toward the first component 1, thus forming a cone-shaped contraction structure in the form of a frustum. This gradually contracting cross-section significantly increases the speed of the cooling airflow. When the high-speed cooling airflow is ejected from the end of the air outlet 203, it precisely aligns with the high-heat points of the motherboard, forming a concentrated airflow column that directly and accurately impacts the core heat-generating components. This concentrates the airflow on the high-heat points of the target component, effectively improving heat exchange efficiency.

[0060] In some embodiments, the testing apparatus further includes: a first control valve 4 connected to the cooling component 3; a data acquisition device for acquiring temperature data of the target component; the first control valve 4 being communicatively connected to the data acquisition device, and the first control valve 4 controlling the cooling component 3 to supply airflow to the first end according to the temperature data.

[0061] The first control valve 4 is an intelligent flow regulation component, which can be a solenoid valve. It is connected to the cooling component 3 (such as the cold air outlet 3012 of the vortex tube 301) and the air source device respectively. It can control the opening, closing and opening degree of the valve through electromagnetic signals, thereby regulating the flow rate of the cold air into the airflow channel 202.

[0062] The data acquisition device (not shown in the attached diagram) may include a GPIO interface module, a Bluetooth module, a Wi-Fi module, etc., for real-time monitoring of the temperature of the target component. Since motherboard-type target components typically integrate multiple temperature sensors, these sensors can monitor the temperature of core components such as the CPU and GPU in real time and actively output temperature data through their own communication interfaces or wireless connections. After receiving the temperature data actively sent by the motherboard, the data acquisition device converts it into an electrical signal and transmits it to the first control valve 4. The first control valve 4 dynamically adjusts the supply of cooling air based on the received temperature data.

[0063] By monitoring and adjusting in real time, it can be ensured that the target component is always within a suitable temperature range during the test. This not only avoids the energy waste caused by continuous heat dissipation, but also prevents the temperature from becoming too high due to insufficient heat dissipation. It achieves heat dissipation on demand, making the test data more stable and reliable.

[0064] In some embodiments, the testing apparatus further includes: a second control valve 5, which is connected to the hot gas outlet 3013; the second control valve 5 is communicatively connected to the data acquisition device, and the second control valve 5 controls the flow rate of the hot gas discharged from the hot gas outlet 3013 according to the temperature data.

[0065] The second control valve 5 can be an automatic valve, such as an electric proportional valve, which is connected to the hot gas outlet 3013 of the vortex tube 301. The electric proportional valve establishes a communication connection with the data acquisition device via a wire. When the data acquisition device obtains the temperature data of the core components of the motherboard, it transmits the data to the electric proportional valve. For example, when the motherboard temperature is low, the data acquisition device sends a signal to reduce the opening of the electric proportional valve. At this time, the flow rate of hot gas discharged from the hot gas outlet 3013 decreases, and the proportion of cold air inside the vortex tube 301 decreases, thereby reducing the output of cold air. When the motherboard temperature rises, the electric proportional valve increases its opening under the control of the data acquisition device, the flow rate of hot gas increases, the proportion of cold air inside the vortex tube 301 increases, and the cooling effect is enhanced.

[0066] Alternatively, the second control valve 5 can be a manual valve with an adjusting screw. The adjusting screw is connected to the hot gas outlet 3013 of the vortex tube 301, and the operator can manually adjust the screw according to the temperature data displayed by the acquisition device. If the main board temperature is too high, the adjusting screw can be turned to reduce the valve core opening, thereby reducing the hot gas flow rate and increasing the proportion of cold gas flow. If the main board temperature is too low, the adjusting screw can be turned to increase the valve core opening, thereby increasing the hot gas flow rate and decreasing the proportion of cold gas flow, thus manually controlling the hot gas flow rate.

[0067] By dynamically controlling the hot airflow through the second control valve 5, it is possible to effectively avoid excessive cooling causing cold shock to the target component, or insufficient cooling leading to inadequate heat dissipation. This reduces test data deviations caused by drastic temperature fluctuations and significantly improves the reliability of test results.

[0068] Example 2

[0069] This application provides a testing system, such as... Figure 7 As shown, it includes: an air source device 20; a testing device 10, the testing device 10 including: a first component 1 and a second component 2, the first component 1 being provided with a cooling component 3, the cooling component 3 being connected to the air source device 20; the surface of the second component 2 being provided with a placement area 201 for placing a target component; wherein, the second component 2 is provided with an airflow channel 202 inside, the first end of the airflow channel 202 being able to connect to the cooling component 3, and the second end of the airflow channel 202 being connected to the placement area 201, so that the airflow of the cooling component 3 can dissipate heat to the target component located in the placement area 201 through the airflow channel 202; and a control device 30, the control device 30 being connected to the air source device 20 and the testing device 10 respectively, the control device 30 being used to control the on / off connection between the air source device 20 and the testing device 10.

[0070] The air source device 20 can be an air compressor, whose outlet 203 is connected to the air inlet 3011 of the cooling component 3 of the first component 1 of the testing device 10 via an air pipe, providing a stable airflow to the system. The second component 2 of the testing device 10 has a placement area 201 for placing the target component. The first end of the airflow channel 202 inside the second component 2 can be precisely connected to the cooling component 3, and the second end is directly connected to the placement area 201, forming a directional airflow transmission path. The control device 30 can be a PLC controller, which is connected to the solenoid valve of the air source device 20 and the temperature control module of the cooling component 3, respectively. The operator can flexibly set various parameters through the touch screen, and the PLC controller will automatically control the on / off of the air source device 20 and the testing device 10 according to the settings, realizing the automated control of the entire testing process.

[0071] By cooperating with the cooling component 3 and the airflow channel 202, the target component in the placement area 201 can be directly and directionally cooled. This avoids the ineffective blowing of air onto areas that do not require cooling, as is common in traditional overall cooling systems. This allows the cooling energy to be concentrated on the target component, significantly improving cooling efficiency and saving cooling energy. Furthermore, the control device 30 enables coordinated control between the air source and the testing device 10, reducing errors that may arise from manual operation and providing timely responses to various operating conditions, ensuring the safety and stability of the testing process.

[0072] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0073] It should also be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application depending on the specific circumstances. When a specific device is described as being located between a first device and a second device, an intermediary device may or may not be present between the specific device and the first or second device.

[0074] All terms used in this application have the same meaning as understood by one of ordinary skill in the art to which this application pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0075] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

Claims

1. A test device, characterized by include: The first component is provided with a cooling component; The second component has a placement area on its surface for placing the target component; The second component has an internal airflow channel. The first end of the airflow channel can be connected to the cooling component, and the second end of the airflow channel is connected to the placement area, so that the airflow of the cooling component can dissipate heat to the target component located in the placement area through the airflow channel.

2. The testing apparatus according to claim 1, characterized in that, The cooling assembly includes a vortex tube that can separate the airflow into hot airflow and cold airflow; The vortex tube includes an air inlet, a cold air outlet, and a hot air outlet. The air inlet is used to connect to an air source device, and the cold air outlet is used to connect to the first end of the airflow channel. The cold airflow can enter the airflow channel from the first end, and the hot airflow can be discharged from the hot air outlet.

3. The testing apparatus according to claim 2, characterized in that, The cooling assembly further includes a nozzle, which is fixedly disposed on the first assembly along a first direction. One end of the nozzle is connected to the cold air outlet, and the other end of the nozzle can be connected to the first end. The first component is provided with a test component, and the second component is capable of reciprocating relative to the first component along the first direction, so that the test component can test the target component, wherein the first direction is a direction perpendicular to the surface of the second component.

4. The testing apparatus according to claim 3, characterized in that, The nozzle is provided with a nozzle, and when the nozzle is aligned with the first end, the nozzle can be sealed to the periphery of the first end.

5. The testing apparatus according to claim 1, characterized in that, The second component has multiple air outlets located in the placement area; The airflow channel includes a buffer chamber and a channel structure, the buffer chamber and the channel structure are connected, the buffer chamber is disposed below the placement area, and the buffer chamber is connected to a plurality of air outlets and the second end respectively.

6. The test device of claim 5, wherein, Also includes: A sealing element, which is detachably connected to the second component, is capable of blocking at least a portion of the air outlet.

7. The testing apparatus according to claim 5, characterized in that, The cross-sectional area of ​​the air outlet gradually decreases along the direction from the second component toward the first component.

8. The test device of claim 2, wherein, Also includes: A first control valve is connected to the cooling assembly; Acquisition device, the acquisition device being used to acquire temperature data of the target component; The first control valve is communicatively connected to the acquisition device, and the first control valve controls the cooling component to supply the airflow to the first end according to the temperature data.

9. The test device of claim 8, wherein, Also includes: A second control valve is connected to the hot gas outlet; The second control valve is communicatively connected to the acquisition device, and the second control valve controls the flow rate of the hot gas discharged from the hot gas outlet according to the temperature data.

10. A test system, characterized by include: Gas source device; The testing device comprises a first component and a second component, the first component is provided with a cooling component connected with the air source device; the second component is provided with a placing area for placing a target component; the second component is internally provided with an air flow channel, the first end of the air flow channel is connectable with the cooling component, and the second end of the air flow channel is connected with the placing area, so that the air flow of the cooling component can pass through the air flow channel to dissipate heat of the target component located on the placing area; The control device is connected with the air source device and the testing device respectively, and is used for controlling on-off between the air source device and the testing device.

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