Insulation testing system and test handler

Abstract

The utility model provides a kind of insulation test system, for the insulation test of several chips, each chip includes package and pin;Insulation test system includes carousel assembly, several test components and chip suction assembly, carousel assembly is equipped with carousel and support frame, carousel is equipped with several positioning components, carousel can rotate relative to support frame, to drive several positioning components sequentially pass loading and unloading position;Each test component can be moved to corresponding positioning component or away from corresponding positioning component along the direction perpendicular to the rotation of carousel;Chip suction assembly is set corresponding to loading and unloading position and located outside carousel, and chip suction assembly includes suction arm for placing chip to positioning component or taking out from positioning component at loading and unloading position;When any test component moves to positioning component, carousel stops rotating, so that corresponding test component is respectively connected with the package and pin of corresponding chip.In addition, the utility model also provides a kind of test sorting machine.

Description

Technical Field

[0001] This utility model relates to the field of sorting machine technology, and in particular to an insulation testing system and a testing and sorting machine. Background Technology

[0002] After packaging, chips require insulation testing to ensure their quality and reliability. Insulation testing includes, but is not limited to, insulation tests between chip leads, between chip leads and single-sided packages, and between chip leads and multi-sided packages. Currently, chip insulation testing is typically performed on a turntable within a test sorting machine. However, because other components, such as chip pick-up assemblies, are also fixed within the test sorting machine, occupying space, the rotation space of the turntable is limited, making insulation testing between chip leads and single-sided or multi-sided packages difficult. Utility Model Content

[0003] In view of this, it is necessary to propose an insulation testing system and a test sorting machine that can perform insulation testing between chip pins and the package.

[0004] In a first aspect, this utility model provides an insulation testing system for performing insulation tests on a plurality of chips. Each chip includes a package and pins, the pins extending from the package. The insulation testing system includes a turntable assembly, a plurality of testing components, and a chip pick-up component. The turntable assembly has a turntable and a support frame. The turntable has a plurality of positioning components for positioning the chips. The turntable can rotate relative to the support frame to drive the plurality of positioning components to sequentially pass through loading and unloading positions. Each testing component can move to or away from the corresponding positioning component along a direction perpendicular to the rotation of the turntable. The chip pick-up component is located outside the turntable corresponding to the loading and unloading positions. The chip pick-up component includes a pick-up arm for placing the chip to or removing it from the positioning component at the loading and unloading position. When any testing component moves to the positioning component, the turntable stops rotating, so that the corresponding testing component is connected to the package and pins of the corresponding chip to perform insulation testing.

[0005] Furthermore, the suction arm picks up and places the chip from the outside of the turntable.

[0006] Furthermore, the chip suction assembly also includes a fixing rod, one end of which is fixed to the support frame, and the other end extends upward from the support frame and is hinged to the suction arm.

[0007] Furthermore, when the suction arm places the chip onto the positioning component, the pins are positioned facing the suction arm.

[0008] Furthermore, the plurality of test components are spaced apart on the support frame along the direction of rotation of the turntable.

[0009] Furthermore, the plurality of positioning components are arranged at intervals around the turntable on the side of the turntable away from the support frame, and each positioning component is for placing one chip.

[0010] Furthermore, each positioning component is provided with a positioning structure and a conductor. The positioning structure includes a support portion and a limiting portion. The support portion is made of a conductive material and is in contact with the conductor. The limiting portion is located on the side of the support portion away from the turntable and is used to position the chip on the support portion.

[0011] Furthermore, each test component is provided with a tester, and a positive and a negative terminal electrically connected to the tester; when any test component moves to the positioning component, the positive and negative terminals are respectively connected to the pin and the package.

[0012] Furthermore, there are multiple negative electrodes, and the package includes multiple packaging surfaces, with the multiple negative electrodes respectively connected to the multiple packaging surfaces.

[0013] Furthermore, the plurality of encapsulation surfaces include a first encapsulation surface and a plurality of second encapsulation surfaces; the first encapsulation surface contacts the support portion and is connected to one of the negative electrodes through the conductor; the plurality of second encapsulation surfaces are electrically connected to the remaining negative electrodes.

[0014] Furthermore, the plurality of second packaging surfaces include a top surface disposed opposite to the first packaging surface and a side surface connected between the top surface and the first packaging surface. The limiting portion includes a plurality of limiting members, which are spaced apart from each other on the support portion. When the chip is placed on the positioning component, the plurality of limiting members abut against the side surface from different directions to position the chip on the support portion.

[0015] Furthermore, each test component is also provided with a driving device, which includes a servo motor and a first slider and a second slider connected to each other. One end of the first slider is connected to the tester, and one end of the second slider is connected to the servo motor. The servo motor drives the first slider and the second slider to slide relative to each other or backward to move the test component to or away from the corresponding positioning component.

[0016] Secondly, this utility model embodiment provides a test sorting machine, which includes a sorting machine body and the aforementioned insulation test system disposed on the sorting machine body.

[0017] The aforementioned insulation testing system and test sorting machine effectively solve the problem of not being able to perform comprehensive insulation testing on chip pins and multi-faceted packages due to the chip picking component occupying space outside the rotation path of the turntable, and allow the test component to move in a direction perpendicular to the rotation of the turntable. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 A structural block diagram of a test sorting machine provided for an embodiment of the utility model.

[0020] Figure 2 A perspective view of an insulation testing system provided for an embodiment of the utility model.

[0021] Figure 3 A perspective view of the positioning component provided in an embodiment of the utility model.

[0022] Figure 4 A cross-sectional view of the positioning component provided in an embodiment of the utility model.

[0023] Figure 5 A perspective view of the test component provided in an embodiment of the utility model.

[0024] Figure 6 A structural block diagram of an insulation testing system provided for an embodiment of the utility model.

[0025] Figure 7 A structural block diagram of an insulation testing system provided in another embodiment of the utility model.

[0026] Component designations

[0027]

[0028]

[0029] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0030] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] To provide a clearer and more accurate understanding of the present invention, a detailed description will now be provided in conjunction with the accompanying drawings. The accompanying drawings illustrate examples of embodiments of the present invention, wherein the same reference numerals denote the same elements. It is to be understood that the scale shown in the accompanying drawings is not the actual scale of the present invention, and is for illustrative purposes only, and is not a drawing based on the original dimensions.

[0034] Please refer to Figure 1 This is a structural block diagram of a test sorting machine provided in an embodiment of the utility model. This application provides a test sorting machine 1000. The test sorting machine 1000 includes a sorting machine body 200 and an insulation testing system 100. The insulation testing system 100 is disposed in the sorting machine body 200 and is used to perform insulation testing on a chip 10. In this application, the chip 10 can be a packaged chip. The insulation testing of the chip 10 includes, but is not limited to, insulation testing at locations such as between chip pins, between chip pins and single-sided packages, and between chip pins and multi-sided packages.

[0035] Please refer to Figure 2This application provides an insulation testing system 100 for performing insulation tests on a plurality of chips 10. Each chip 10 includes a package 101 and pins 102 extending from the package 101. The package 101 includes multiple package surfaces. Specifically, the multiple package surfaces include a first package surface 1011 and multiple second package surfaces 1012. The multiple second package surfaces 1012 include a top surface 10121 and a side surface 10122. The top surface 10121 is disposed opposite to the first package surface 1011. The side surface 10122 is connected between the top surface 10121 and the first package surface 1011. In this application, the top surface 10121 can be a single surface or multiple surfaces connected in sequence. Correspondingly, the side surface 10122 can be a single surface or multiple surfaces connected in sequence. The insulation testing system 100 includes a turntable assembly 1, a plurality of testing components 2, and a chip pick-up assembly 3.

[0036] The turntable assembly 1 includes a turntable 11 and a support frame 12. The turntable 11 is mounted on the support frame 12 and houses several chips 10. Specifically, the turntable assembly 1 includes several positioning components 13. These positioning components 13 are spaced apart around the turntable 11 on the side of the turntable 11 opposite to the support frame 12, and are used to position the chips 10. Each positioning component 13 houses one chip 10. The turntable 11 can rotate relative to the support frame 12, causing the positioning components 13 to sequentially pass through loading and unloading positions. In this application, the turntable 11 is located above the support frame 12. The turntable assembly 1 also includes a drive motor (not shown). The turntable 11 can be controlled to rotate or stop rotating on the support frame 12 by the drive motor. The rotation of the turntable 11 can be around its center position. The loading and unloading positions are areas of the turntable assembly 1 where no positioning components 13 are located, to avoid the positioning components 13 obstructing the rotation of the turntable 11.

[0037] like Figure 3 and Figure 4 As shown, the positioning assembly 13 includes a positioning structure 131, a conductor 132, and a base 133. The base 133 is disposed on the turntable 11. The positioning structure 131 and the conductor 132 are both located on the same side of the base 133 and away from the turntable 11. The positioning structure 131 is used to place the chip 10, ensuring that the chip 10 remains stably positioned when the turntable 11 rotates. Specifically, the positioning structure 131 is made of insulating material and includes a support portion 1311 and a limiting portion 1312. The support portion 1311 contacts the conductor 132. The limiting portion 1312 is located on the side of the support portion 1311 away from the turntable 11 and is used to position the chip 10 on the support portion 1311, ensuring that the chip 10 remains stably positioned when rotated by the turntable 11. In this application, the insulating material can be ceramic. The fixing method between the conductor 132 and the base 133 can be a screw engagement, a snap-fit, etc.

[0038] In this embodiment, the first packaging surface 1011 contacts the support portion 1311. The limiting portion 1312 includes a plurality of limiting members 13120. The plurality of limiting members 13120 are spaced apart on the support portion 1311. When the chip 10 is placed on the positioning component 13, the plurality of limiting members 13120 abut against the side surface 10122 from different directions to position the chip 10 on the support portion 1311, ensuring that the chip 10 remains stably placed when rotated by the turntable 11.

[0039] Please refer to Figure 5 This is a perspective view of the test assembly provided in an embodiment of the utility model. A plurality of test assemblies 2 are spaced apart on the support frame 12 along the rotation direction of the turntable 11. Each test assembly 2 can move to or away from a corresponding positioning assembly 13 along a direction perpendicular to the rotation direction of the turntable 11. Specifically, each test assembly 2 is provided with a tester 21 and a driving device 22. The driving device 22 is used to drive the tester 21 to move to or away from the corresponding positioning assembly 13. More specifically, when any test assembly 2 moves to the positioning assembly 13, the turntable 11 stops rotating, aligning the corresponding test assembly 2 with the chip 10 within any positioning structure 131, and respectively connecting with the package 101 and pins 102 of the corresponding chip 10 for insulation testing. When any test component 2 moves away from the corresponding positioning component 13, the turntable 11 resumes rotation, so that the corresponding test component 2 is not connected to the package 101 and pin 102 of any chip 10, thereby allowing the chip 10 to be placed in or removed from the positioning component 13 from the loading / unloading position.

[0040] Each test component 2 is provided with a positive terminal 211 and a negative terminal 212 electrically connected to the tester 21. When any test component 2 moves to the positioning component 13, the positive terminal 211 and the negative terminal 212 are respectively connected to the pin 102 and the package 101. In this application, when any test component 2 moves to the positioning component 13, the positive terminal 211 is connected to the pin 102, and the negative terminal 212 is also connected to the package 101. That is to say, in this application, the positive terminal 211 and the negative terminal 212 are simultaneously connected at different positions of the chip 10.

[0041] Furthermore, there are multiple negative electrodes 212 electrically connected to the tester 21. Each of the multiple negative electrodes 212 is electrically connected to a multiple package surface. Specifically, the first package surface 1011 is electrically connected to one of the negative electrodes 212 via a conductor 132. Multiple second package surfaces 1012 are electrically connected to the remaining negative electrodes 212 in a one-to-one correspondence, i.e., the top surface 10121 and the side surface 10122 are electrically connected to the remaining negative electrodes 212 in a one-to-one correspondence. In this application, the support portion 1311 has a slot 13110 so that when the chip 10 is placed on the positioning assembly 13, the first package surface 1011 faces the slot 13110. A portion of the conductor 132 is exposed outside the positioning assembly 13, and another portion is located between the support portion 1311 and the base 133 to support the support portion 1311 and allow the conductor 132 to directly contact the first package surface 1011 in the slot 13110.

[0042] Furthermore, the tester 21 detects the insulation performance between the pin 102 and one or more package surfaces of the package body 101 by checking whether the positive terminal 211 and / or the two negative terminals 212 are conductive. Specifically, when the test assembly 2 moves to the positioning assembly 13, the positive terminal 211 is conductive to the pin 102. The first package surface 1011 is conductive to one of the negative terminals 212 through the conductor 132. Multiple second package surfaces 1012 are electrically conductive to the remaining negative terminals 212 in a one-to-one correspondence, so as to simultaneously perform insulation testing between the pin 102 and multiple package surfaces. When the tester 21 activates the positive terminal 211 and some of the negative terminals 212, the positive terminal 211 is conductive to the pin 102. The negative terminals 212 activated by the tester 21 are conductive to the corresponding first package surface 1011 or second package surface 1012, thereby realizing simultaneous insulation testing between the pin 102 and one or more package surfaces.

[0043] In some feasible embodiments, there can be multiple pins 102. There can also be multiple positive electrodes 211. The tester 21 controls the activation of the positive electrodes 211 corresponding one-to-one with the pins 102, so that when the test component 2 moves to the positioning component 13, each positive electrode 211 is connected to one pin 102, thereby completing the insulation test between the pins 102.

[0044] The driving device 22 includes a servo motor 223 and a first slider 221 and a second slider 222 connected to each other. One end of the first slider 221 is the tester 21. The other end of the second slider 222 is the servo motor 223. The servo motor 223 drives the first slider 221 and the second slider 222 to slide relative to or away from each other, thereby moving the test component 2 to or away from the corresponding positioning component 13.

[0045] The number of positioning components 13 and test components 2 can be customized according to the number of chips 10 participating in the insulation test, and insulation testing of one or more chips 10 can be achieved through the cooperation of rotating components 1 and test components 2. For example, when it is necessary to perform insulation testing on a large number of chips 10 on a large scale, this embodiment can be configured to have multiple positioning components 13 and multiple test components 2. When the turntable 11 rotates until multiple test components 2 are aligned with multiple corresponding positioning components 13, the turntable 11 can be stopped by driving the drive motor, so that the positive terminal 211 and several negative terminals 212 of each test component 2 are respectively connected to the package body 101 and pin 102 of the chip 10 in the corresponding positioning component 13, so that the tester 21 can perform insulation testing on multiple chips 10, which greatly improves the testing efficiency and reliability.

[0046] like Figure 7 As shown, in other embodiments, when performing insulation tests on a small number of chips 10, the test component 2 can be configured as a single unit. When the turntable 11 rotates until the test component 2 aligns with any one of the positioning components 13, the turntable 11 can be stopped by a drive motor, so that the positive electrode 211 and several negative electrodes 212 of the test component 2 are respectively connected to the package body 101 and pins 102 of the chip 10 within the corresponding positioning component 13. The tester 21 controls the corresponding electrodes to conduct, thereby completing the insulation test of one chip 10. That is to say, the number of positioning components 13 and test components 2 in the above example is only an example of the number of positioning components 13 and test components 2 in this application, and is not a limitation on the number of positioning components 13 and test components 2.

[0047] In this embodiment, the chip pick-up assembly 3 is positioned corresponding to the loading / unloading position and located outside the turntable 11. The chip pick-up assembly 3 includes a pick-up arm 31 and a fixing rod 32. The pick-up arm 31 is used to place the chip 10 onto or remove it from the positioning assembly 13 at the loading / unloading position. One end of the fixing rod 32 is fixed to the support frame 12, and the other end extends upward from the support frame 12 and is hinged to the pick-up arm 31. In this application, the pick-up arm 31 extends from the other end of the fixing rod 32 to the outside of the turntable 11, so that the pick-up arm 31 picks up and places the chip 10 from the outside of the turntable 11, avoiding obstruction of the turntable assembly 1 and / or the test assembly 2 and thus affecting the insulation test of the chip 10. When the pick-up arm 31 places the chip 10 onto the positioning assembly 13, the pins 102 face the pick-up arm 31. The operation flow of the insulation test system 100 to complete the insulation test will be described below.

[0048] First, the operator uses the chip pick-and-place device 3 to pick up each chip 10 and place it onto the positioning structure 131 of each positioning component 13 at the loading / unloading position. Then, the operator controls the drive motor to drive the turntable 11 to start rotating. When the turntable 11 drives the positioning component 13 to align with the test component 2, the operator controls the turntable 11 to stop rotating and drives the corresponding test component 2 to move to the corresponding positioning component 13 via the drive device 22, so that the positive electrode 211 and several negative electrodes 212 are respectively connected to the pins 102, the first package surface 1011 and the second package surface 1012 of the corresponding chip 10. Next, the operator uses the corresponding tester 21 to control whether to activate each electrode to determine whether an insulation test needs to be performed between the pins 102 and one or more package surfaces of the corresponding chip 10. After the insulation test is completed, the operator controls the turntable 11 to resume rotation, and then the chip 10 that has completed the insulation test can be removed from the positioning component 13 at the loading / unloading position, and the insulation test can continue to be performed on the chips 10 on the remaining positioning components 13.

[0049] In the above embodiments, by placing the chip pick-up component outside the rotation path of the turntable and allowing the test component to move in a direction perpendicular to the rotation of the turntable, the problem of not being able to perform comprehensive insulation testing on the chip pins and multi-faceted package due to the chip pick-up component occupying space is effectively solved.

[0050] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from the spirit and scope of this application. Therefore, if these modifications and variations of this utility model fall within the scope of the claims of this utility model and their equivalents, this utility model is also intended to include these modifications and variations.

[0051] The above-listed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall still fall within the scope of the present utility model.

Claims

1. An insulation testing system for performing insulation tests on a plurality of chips, characterized in that, Each chip includes a package and pins extending from the package; the insulation test system includes: A turntable assembly includes a turntable and a support frame. The turntable is equipped with several positioning components for positioning chips. The turntable can rotate relative to the support frame to drive the several positioning components to pass through the loading and unloading positions in sequence. Several test components, each of which can move to or away from a corresponding positioning component along a direction perpendicular to the rotation of the turntable; A chip picking assembly is provided corresponding to the loading and unloading position and located outside the turntable. The chip picking assembly includes a picking arm for placing the chip into or removing it from the positioning assembly at the loading and unloading position. When any test component moves to the positioning component, the turntable stops rotating, so that the corresponding test component is connected to the package and pins of the corresponding chip to perform insulation testing.

2. The insulation testing system as described in claim 1, characterized in that, The suction arm picks up and places the chip from the outside of the turntable.

3. The insulation testing system as described in claim 1, characterized in that, The chip suction assembly also includes a fixing rod, one end of which is fixed to the support frame, and the other end extends upward from the support frame and is hinged to the suction arm.

4. The insulation testing system as described in claim 1, characterized in that, When the suction arm places the chip onto the positioning component, the pins are positioned toward the suction arm.

5. The insulation testing system as described in claim 1, characterized in that, The test components are spaced apart on the support frame along the direction of rotation of the turntable.

6. The insulation testing system as described in claim 1, characterized in that, The plurality of positioning components are arranged at intervals around the turntable on the side of the turntable away from the support frame, and each positioning component is for placing one chip.

7. The insulation testing system as described in claim 6, characterized in that, Each positioning component is provided with a positioning structure and a conductor. The positioning structure includes a support portion and a limiting portion. The support portion is made of a conductive material and is in contact with the conductor. The limiting portion is located on the side of the support portion away from the turntable and is used to position the chip on the support portion.

8. The insulation testing system as described in claim 7, characterized in that, Each test component is equipped with a tester, and positive and negative terminals electrically connected to the tester; when any test component moves to the positioning component, the positive and negative terminals are respectively connected to the pin and the package.

9. The insulation testing system as described in claim 8, characterized in that, The negative electrode is multiple, and the package includes multiple packaging surfaces, with the multiple negative electrodes respectively connected to the multiple packaging surfaces.

10. The insulation testing system as described in claim 9, characterized in that, The plurality of encapsulation surfaces include a first encapsulation surface and a plurality of second encapsulation surfaces; the first encapsulation surface contacts the support portion and is connected to one of the negative electrodes through the conductor; the plurality of second encapsulation surfaces are electrically connected to the remaining negative electrodes.

11. The insulation testing system as described in claim 10, characterized in that, The plurality of second packaging surfaces include a top surface disposed opposite to the first packaging surface and a side surface connected between the top surface and the first packaging surface. The limiting portion includes a plurality of limiting members, which are spaced apart from each other on the support portion. When the chip is placed on the positioning component, the plurality of limiting members abut against the side surface from different directions to position the chip on the support portion.

12. The insulation testing system as described in claim 8, characterized in that, Each test component is further provided with a driving device, which includes a servo motor and a first slider and a second slider connected to each other. One end of the first slider is connected to the tester, and one end of the second slider is connected to the servo motor. The servo motor drives the first slider and the second slider to slide relative to each other or backward to move the test component to or away from the corresponding positioning component.

13. A testing and sorting machine, characterized in that, The test sorting machine includes: The main body of the sorting machine; and The insulation testing system as described in any one of claims 1-12 is disposed on the main body of the sorting machine.

Images