A semiconductor chip testing apparatus

Abstract

The utility model discloses a semiconductor chip testing arrangement, include: test board, the test board top has the accommodating groove, the accommodating groove inner chamber is equipped with chip placing seat, installation slot, fixed component, push out subassembly, moving component, the test board top four corners are fixedly connected with vertical board, moving component setting is between two vertical boards, and the fixed connection of two moving components has top plate, mounting bracket, mounting plate, limiting component, detection probe. The utility model discloses a semiconductor chip testing arrangement, through fixed component fixed can place the chip placing seat of a plurality of to be tested chip, and can be aimed at different chip, replace different detection probe, and through moving component drive detection probe to move, and can carry out the continuous detection to the chip on placing seat, after detection, pull apart fixed component, through push out subassembly and push out the chip placing seat accommodating groove, replace the chip placing seat, and the practicality is strong.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip technology, specifically to a semiconductor chip testing device. Background Technology

[0002] In electronics, semiconductor chips are a way to miniaturize circuits (mainly including semiconductor devices, but also passive components, etc.) and are usually manufactured on the surface of semiconductor wafers. Chip testing is generally divided into CP testing and FT testing. CP testing is a test for chips during the design phase and is a test for chip semi-finished products. FT testing is a test that needs to be performed on the packaged chip after the integrated circuit chip is packaged from the wafer into a finished product to ensure the performance and quality of the finished product.

[0003] However, existing semiconductor chip testing equipment can only test one semiconductor chip at a time. After testing, the semiconductor chip needs to be removed and replaced with a new one before testing can begin again. This prevents continuous testing, reduces testing speed, and lowers work efficiency. Furthermore, removing the semiconductor chip requires reaching into the slot, which is inconvenient. Additionally, the probes are fixed and cannot be replaced for different semiconductor chips, resulting in poor practicality. Therefore, we propose a new semiconductor chip testing device. Utility Model Content

[0004] The main purpose of this invention is to provide a semiconductor chip testing device that can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a semiconductor chip testing device, comprising: a testing platform, wherein a non-through receiving groove is formed on the top of the testing platform, a chip placement seat is provided in the inner cavity of the receiving groove, and mounting grooves are symmetrically formed on both side walls of the receiving groove; a moving component, wherein upright plates are fixedly connected to the four corners of the top of the testing platform, the moving component is disposed between two upright plates, a top plate is fixedly connected between the two moving components, and a mounting frame and a mounting plate are provided at the bottom of the top plate; a limiting component, wherein the limiting component fixes the mounting plate to the inner cavity of the mounting frame, and a plurality of detection probes are fixedly connected to the bottom of the mounting plate; a fixing component, wherein the fixing component is fixedly connected to the mounting groove, and two fixing components respectively abut against the chip placement seat; and an ejection component, wherein the ejection component is disposed at the bottom of the inner cavity of the receiving groove.

[0006] As a further description of the above technical solution, the moving component includes a motor, a threaded rod, and a moving block. The threaded rod is rotatably connected to one side of two vertical plates located on the long side of the test platform. A motor is fixedly connected to one side of the vertical plate, and the output end of the motor passes through the vertical plate and is fixedly connected to the threaded rod. A moving block is threadedly engaged with the threaded rod, and one side of the moving block is fixedly connected to one side of the top plate.

[0007] As a further description of the above technical solution, a cylinder is fixedly connected to the top of the top plate, and the output end of the cylinder extends through to the lower part of the top plate and is fixedly connected to a mounting bracket. Telescopic rods are symmetrically fixedly connected between the bottom of the top plate and the top of the mounting bracket. Through slots extending into the inner cavity are symmetrically opened on both sides of the mounting bracket. A limiting slot is opened in the inner cavity of the side wall of the mounting bracket, and the limiting slot is fitted in the middle of the through slot. Non-through slots are symmetrically opened on both sides of the mounting plate, and the slots and the through slots are on the same horizontal line.

[0008] As a further description of the above technical solution, the limiting component includes a locking rod, a limiting plate, a spring, and a handle. The locking rod is slidably connected to the through groove and the inner cavity of the locking groove. The limiting plate is slidably connected to the inner cavity of the limiting groove and is fixedly sleeved on the locking rod. A spring is fixedly connected to one side of the limiting plate and is slidably sleeved on the locking rod. A handle is fixedly connected to one side of the locking rod.

[0009] As a further description of the above technical solution, the fixing component includes a limiting spring, a moving plate, a connecting block, a fixing plate, a pull handle, and a limiting ring. A plurality of the limiting springs are fixedly connected to the side wall of the inner cavity of the mounting groove. A moving plate is fixedly connected to one side of the limiting spring, a connecting block is fixedly connected to one side of the moving plate, and a fixing plate is fixedly connected to one side of the connecting block. One side of the fixing plate abuts against the side wall of the chip placement seat. A pull handle is fixedly connected to the top of the fixing plate. The limiting ring is fixedly connected to the opening of the mounting groove, and the limiting ring is slidably sleeved on the connecting block.

[0010] As a further description of the above technical solution, the ejection assembly includes an electric telescopic rod, a push plate, and a guide rod. The electric telescopic rod is fixedly connected to the bottom of the test platform. The output end of the electric telescopic rod extends through the inner cavity of the receiving groove and is fixedly connected to the push plate. The top of the push plate abuts against the bottom of the chip placement seat. Guide rods are fixedly connected to both sides of the bottom of the push plate. The guide rods slide through the bottom of the inner cavity of the receiving groove to the outside.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] In this invention, a chip holder for placing several chips to be tested is fixed by a fixing component. Different detection probes can be replaced for chips of different specifications on different chip holders. The detection probes can be moved by a moving component to continuously test the chips on the holder. After the test is completed, the fixing component is pulled open and the chip holder is pushed out of the receiving slot by the pushing component, which is convenient for replacing the chip holder and has strong practicality. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of a semiconductor chip testing device proposed in this utility model;

[0014] Figure 2 This is an exploded structural diagram of a semiconductor chip testing device proposed in this utility model;

[0015] Figure 3 This is an exploded view of the semiconductor chip testing device proposed in this utility model.

[0016] Figure 4 This utility model proposes a semiconductor chip testing device. Figure 3 A magnified structural diagram at point A.

[0017] In the diagram: 1. Test stand; 2. Vertical plate; 3. Moving component; 4. Top plate; 5. Cylinder; 6. Mounting bracket; 7. Mounting plate; 8. Limiting component; 9. Detection probe; 10. Telescopic rod; 11. Through slot; 12. Limiting slot; 13. Slot; 14. Receiving slot; 15. Mounting slot; 16. Fixing component; 17. Chip placement seat; 18. Push-out component; 3.1. Motor; 3.2. Threaded rod; 3.3. Moving block; 8.1. Locking rod; 8.2. Limiting plate; 8.3. Spring; 8.4. Handle; 16.1. Limiting spring; 16.2. Moving plate; 16.3. Connecting block; 16.4. Fixing plate; 16.5. Pull handle; 16.6. Limiting ring; 18.1. Electric telescopic rod; 18.2. Push plate; 18.3. Guide rod. Detailed Implementation

[0018] To make the technical means, creative features, and objectives of this utility model easier to understand, the following describes this utility model in conjunction with specific embodiments.

[0019] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] Please see Figure 1-4 This utility model provides a technical solution: a semiconductor chip testing device, comprising: a test platform 1, the top of the test platform 1 having a non-through receiving groove 14, the inner cavity of the receiving groove 14 having a chip placement seat 17, the top of the chip placement seat 17 having a plurality of placement slots for placing the chip to be tested, and mounting slots 15 symmetrically formed on both side walls of the receiving groove 14; and a moving component 3, the four corners of the top of the test platform 1 being fixedly connected to upright plates 2, the moving component 3 being disposed between two upright plates 2, and a top plate 4 being fixedly connected between two moving components 3, the bottom of the top plate... The device includes a mounting bracket 6, a mounting plate 7, a limiting component 8 that fixes the mounting plate 7 to the inner cavity of the mounting bracket 6, and a number of detection probes 9 that are fixedly connected to the bottom of the mounting plate 7. When different chips need to be tested, the mounting plate 7 can be removed through the limiting component 8 and replaced with a mounting plate 7 equipped with different detection probes 9. A fixing component 16 is fixedly connected to the mounting groove 15, and two fixing components 16 respectively abut against the chip placement seat 17. An ejection component 18 is disposed at the bottom of the inner cavity of the receiving groove 14.

[0022] Specifically, such as Figure 2As shown, the moving component 3 includes a motor 3.1, a threaded rod 3.2, and a moving block 3.3. The threaded rod 3.2 is rotatably connected to one side of the two upright plates 2 located on the long side of the test bench 1 via bearings. The motor 3.1 is fixedly connected to one side of the upright plate 2, and the output end of the motor 3.1 passes through the upright plate 2 and is fixedly connected to the threaded rod 3.2. The moving block 3.3 is threadedly engaged with the threaded rod 3.2, and one side of the moving block 3.3 is fixedly connected to one side of the top plate 4. When the chip testing begins, the motor 3.1 is started, and the threaded rod 3.2 rotates, thereby driving the moving block 3.3 to move along the direction of the threaded rod 3.2. This drives the top plate 4 and its mounting plate 7 and detection probe 9 to move. When it moves to the top of the corresponding chip, the motor 3.1 is stopped, and the cylinder 5 is started to push the mounting bracket 6, mounting plate 7, and detection probe 9 downwards, so that the row of chips on the chip placement seat 17 can be tested.

[0023] Specifically, such as Figure 1 , Figure 3 , Figure 4 As shown, a cylinder 5 is fixedly connected to the top of the top plate 4. The output end of the cylinder 5 extends through to the lower part of the top plate 4 and is fixedly connected to a mounting bracket 6. Telescopic rods 10 are symmetrically fixedly connected between the bottom of the top plate 4 and the top of the mounting bracket 6. The two telescopic rods 10 are located on both sides of the cylinder 5, which play a good limiting and guiding role in the lifting and lowering of the mounting bracket 6. The mounting bracket 6 has through slots 11 symmetrically opened on both sides, which extend into the inner cavity. A limiting slot 12 is opened in the inner cavity of the side wall of the mounting bracket 6, and the limiting slot 12 is fitted in the middle of the through slot 11. The diameter of the limiting slot 12 is larger than the diameter of the limiting slot 12. The mounting plate 7 has non-through slots 13 symmetrically opened on both sides. The slots 13 and the through slots 11 are on the same horizontal line.

[0024] Specifically, such as Figure 4As shown, the limiting assembly 8 includes a locking rod 8.1, a limiting plate 8.2, a spring 8.3, and a handle 8.4. The locking rod 8.1 is slidably connected to the inner cavity of the through groove 11 and the locking slot 13. The limiting plate 8.2 is slidably connected to the inner cavity of the limiting groove 12, and the diameter of the limiting plate 8.2 is adapted to the inner cavity of the limiting groove 12, so that the limiting plate 8.2 can only move within the inner cavity of the limiting groove 12, which facilitates the limiting of the spring 8.3. The limiting plate 8.2 is fixedly sleeved on the locking rod 8.1. The spring 8.3 is fixedly connected to one side of the limiting plate 8.2, and the spring 8.3 is slidably sleeved on the locking rod 8.1. The handle 8.4 is fixedly connected to one side of the locking rod 8.1. Before starting the test, replace the corresponding detection probe 9 according to the size of the chip to be tested. First, pull the handle 8.4 to compress the spring 8.3 through the limiting plate 8.2, and pull the lever 8.1 out of the inner cavity of the slot 13. Then, the mounting plate 7 can be taken out from the inner cavity of the mounting bracket 6. After selecting the required model of mounting plate 7 and detection probe 9, insert the top of the mounting plate 7 into the inner cavity of the mounting bracket 6. Release the handle 8.4. At this time, the spring 8.3 will rebound, pushing the limiting plate 8.2 and the lever 8.1 to move, so that the lever 8.1 enters the inner cavity of the slot 13. Then, the mounting plate 7 and detection probe 9 can be fixed on the mounting bracket 6. The installation is quick and convenient.

[0025] Specifically, such as Figure 2 As shown, the fixing assembly 16 includes a limiting spring 16.1, a movable plate 16.2, a connecting block 16.3, a fixing plate 16.4, a handle 16.5, and a limiting ring 16.6. Several limiting springs 16.1 are fixedly connected to the inner wall of the mounting groove 15. A movable plate 16.2 is fixedly connected to one side of each limiting spring 16.1. The movable plate 16.2 is slidably connected to the inner cavity of the mounting groove 15. A connecting block 16.3 is fixedly connected to one side of the movable plate 16.2, and a fixing plate 16.4 is fixedly connected to one side of the connecting block 16.3. The bottom and sidewall of plate 16.4 are slidably connected to the bottom and sidewall of the inner cavity of the receiving groove 14, respectively. One side of the fixed plate 16.4 abuts against the sidewall of the chip placement seat 17. A pull handle 16.5 is fixedly connected to the top of the fixed plate 16.4. A limiting ring 16.6 is fixedly connected to the opening of the mounting groove 15 and is slidably sleeved on the connecting block 16.3. The inner cavity size of the limiting ring 16.6 is smaller than the size of the moving plate 16.2, which can limit and guide the moving plate 16.2 to prevent the moving plate 16.2 from falling out of the inner cavity of the mounting groove 15. When the chip placement seat 17 is fixed into the inner cavity of the receiving groove 14, first pull the two handles 16.5 to both sides to place the chip placement seat 17 into the inner cavity of the receiving groove 14. Then release the handles 16.5, the limit spring 16.1 returns, and pushes the moving plate 16.2, the connecting block 16.3, and the fixing plate 16.4 into the inner cavity of the receiving groove 14, thereby fixing the chip placement seat 17 from both sides.

[0026] Specifically, such as Figure 3As shown, the ejection assembly 18 includes an electric telescopic rod 18.1, a push plate 18.2, and a guide rod 18.3. The electric telescopic rod 18.1 is fixedly connected to the bottom of the test bench 1. The output end of the electric telescopic rod 18.1 passes through the inner cavity of the receiving groove 14 and is fixedly connected to the push plate 18.2. The top of the push plate 18.2 abuts against the bottom of the chip placement seat 17. The guide rods 18.3 are fixedly connected to both sides of the bottom of the push plate 18.2. The guide rods 18.3 slide through the bottom of the inner cavity of the receiving groove 14 to the outside. When the push plate 18.2 moves upward, the guide rods 18.3 play a good guiding role for the push plate 18.2, ensuring that the push plate 18.2 moves smoothly. When the chip test is complete and a new chip needs to be replaced, pull the two handles 16.5 to the sides to activate the electric telescopic rod 18.1, which pushes the push plate 18.2 upward, thereby pushing the chip placement seat 17 upward. After the chip placement seat 17 moves out of the inner cavity of the receiving slot 14, stop the electric telescopic rod 18.1, and you can easily replace the new chip and the chip placement seat 17.

[0027] It should be noted that this utility model is a semiconductor chip testing device. Before starting the test, the corresponding detection probe 9 is replaced according to the size of the chip to be tested. First, pull the handle 8.4 to compress the spring 8.3 through the limiting plate 8.2, and pull the lever 8.1 out of the inner cavity of the slot 13. Then the mounting plate 7 can be taken out from the inner cavity of the mounting frame 6. After selecting the required model of mounting plate 7 and detection probe 9, the top of the mounting plate 7 is inserted into the inner cavity of the mounting frame 6. Release the handle 8.4. At this time, the spring 8.3 rebounds and pushes the limiting plate 8.2 and the lever 8.1 to move, so that the lever 8.1 enters the inner cavity of the slot 13. Then the mounting plate 7 and detection probe 9 can be fixed on the mounting frame 6. The installation is quick and convenient. Next, fix the chip placement seat 17 into the inner cavity of the receiving groove 14. First, pull the two handles 16.5 to both sides to place the chip placement seat 17 into the inner cavity of the receiving groove 14. Then, release the handles 16.5. The limit spring 16.1 will rebound and push the moving plate 16.2, connecting block 16.3, and fixing plate 16.4 into the inner cavity of the receiving groove 14, thereby fixing the chip placement seat 17 from both sides.

[0028] When chip testing begins, motor 3.1 is started, and the threaded rod 3.2 rotates, causing the moving block 3.3 to move along the direction of the threaded rod 3.2. This moves the top plate 4, its mounting plate 7, and the detection probe 9. When it reaches the top of the corresponding chip, motor 3.1 is stopped, and cylinder 5 is started to push the mounting bracket 6, mounting plate 7, and detection probe 9 downwards, allowing testing of the row of chips on the chip holder 17. After testing this row, cylinder 5 is started to raise the detection probe 9, and the above steps are repeated to test all the chips on the chip holder 17, effectively improving chip testing efficiency.

[0029] When the chip test is complete and a new chip needs to be replaced, pull the two handles 16.5 to the sides to activate the electric telescopic rod 18.1, which pushes the push plate 18.2 upward, thereby pushing the chip placement seat 17 upward. After the chip placement seat 17 moves out of the inner cavity of the receiving slot 14, stop the electric telescopic rod 18.1, and you can easily replace the new chip and the chip placement seat 17.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip testing device, characterized in that, include: Test bench (1), the top of the test bench (1) has a non-through receiving groove (14), the inner cavity of the receiving groove (14) is provided with a chip placement seat (17), and the two side walls of the receiving groove (14) have symmetrical installation grooves (15). The moving component (3) is fixedly connected to the four corners of the top of the test platform (1) with a vertical plate (2). The moving component (3) is set between two vertical plates (2). A top plate (4) is fixedly connected between the two moving components (3). A mounting bracket (6) and a mounting plate (7) are provided at the bottom of the top plate. Limiting component (8), the limiting component (8) fixes the mounting plate (7) to the inner cavity of the mounting frame (6), and a number of detection probes (9) are fixedly connected to the bottom of the mounting plate (7). Fixing component (16), the fixing component (16) is fixedly connected to the mounting slot (15), and the two fixing components (16) respectively abut against the chip placement seat (17); The ejection component (18) is disposed at the bottom of the cavity of the receiving groove (14).

2. The semiconductor chip testing apparatus according to claim 1, characterized in that, The moving component (3) includes a motor (3.1), a threaded rod (3.2), and a moving block (3.3). The threaded rod (3.2) is rotatably connected to one side of two upright plates (2) located on the long side of the test platform (1). The motor (3.1) is fixedly connected to one side of the upright plate (2), and the output end of the motor (3.1) passes through the upright plate (2) and is fixedly connected to the threaded rod (3.2). The moving block (3.3) is threadedly engaged on the threaded rod (3.2), and one side of the moving block (3.3) is fixedly connected to one side of the top plate (4).

3. The semiconductor chip testing apparatus according to claim 1, characterized in that, A cylinder (5) is fixedly connected to the top of the top plate (4). The output end of the cylinder (5) extends through to the lower part of the top plate (4) and is fixedly connected to a mounting bracket (6). A telescopic rod (10) is symmetrically fixedly connected between the bottom of the top plate (4) and the top of the mounting bracket (6). A through groove (11) extending into the inner cavity is symmetrically opened on both sides of the mounting bracket (6). A limiting groove (12) is opened in the inner cavity of the side wall of the mounting bracket (6), and the limiting groove (12) is fitted in the middle of the through groove (11). A non-through slot (13) is symmetrically opened on both sides of the mounting plate (7). The slot (13) and the through groove (11) are on the same horizontal line.

4. The semiconductor chip testing apparatus according to claim 3, characterized in that, The limiting component (8) includes a locking rod (8.1), a limiting plate (8.2), a spring (8.3), and a handle (8.4). The locking rod (8.1) is slidably connected to the inner cavity of the through groove (11) and the locking groove (13). The limiting plate (8.2) is slidably connected to the inner cavity of the limiting groove (12), and the limiting plate (8.2) is fixedly sleeved on the locking rod (8.1). A spring (8.3) is fixedly connected to one side of the limiting plate (8.2), and the spring (8.3) is slidably sleeved on the locking rod (8.1). A handle (8.4) is fixedly connected to one side of the locking rod (8.1).

5. A semiconductor chip testing apparatus according to claim 1, characterized in that, The fixing component (16) includes a limiting spring (16.1), a moving plate (16.2), a connecting block (16.3), a fixing plate (16.4), a handle (16.5), and a limiting ring (16.6). Several limiting springs (16.1) are fixedly connected to the inner wall of the mounting groove (15). A moving plate (16.2) is fixedly connected to one side of the limiting spring (16.1). A connecting block (16.3) is fixedly connected to one side of the moving plate (16.2). A fixing plate (16.4) is fixedly connected to one side of the connecting block (16.3). One side of the fixing plate (16.4) abuts against the side wall of the chip placement seat (17). A handle (16.5) is fixedly connected to the top of the fixing plate (16.4). The limiting ring (16.6) is fixedly connected to the opening of the mounting groove (15) and is slidably sleeved on the connecting block (16.3).

6. The semiconductor chip testing apparatus according to claim 1, characterized in that, The ejection assembly (18) includes an electric telescopic rod (18.1), a push plate (18.2), and a guide rod (18.3). The electric telescopic rod (18.1) is fixedly connected to the bottom of the test bench (1). The output end of the electric telescopic rod (18.1) extends through the inner cavity of the receiving groove (14) and is fixedly connected to the push plate (18.2). The top of the push plate (18.2) abuts against the bottom of the chip placement seat (17). Guide rods (18.3) are fixedly connected to both sides of the bottom of the push plate (18.2). The guide rods (18.3) slide through the bottom of the inner cavity of the receiving groove (14) to the outside.

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