Chip testing apparatus

Abstract

The application relates to a chip testing device. The chip testing device comprises a feeding module, a taking and placing module, a positioning module, a moving module, a testing module and a discharging module; the feeding module is used for lifting the to-be-tested chip from the mounting film; the taking and placing module is used for picking up the lifted to-be-tested chip and transferring the to-be-tested chip to the positioning module, and the taking and placing module is also used for transferring the tested chip to the discharging module; the positioning module is used for placing the to-be-tested chip on the moving module, and the position of the to-be-tested chip is shot, and the position of the to-be-tested chip is adjusted when the position of the to-be-tested chip does not match the set position; the positioning module is also used for picking up and transferring the tested chip on the moving module; the moving module is used for driving the to-be-tested chip on the moving module to move to the testing module for testing, and driving the tested chip to return after the testing is completed. The chip testing device can improve the taking and placing efficiency, the testing precision and the testing efficiency.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, specifically to a chip testing device. Background Technology

[0002] Testing chips is a critical testing process in the semiconductor industry. It is mainly used to ensure the functionality and reliability of chips before they are integrated into complex systems, and to reduce resource waste caused by poor chip performance.

[0003] In related technologies, chip testing equipment is mainly used to perform performance testing on chips. During the testing process, the chip undergoes a series of steps, including loading, unloading, positioning, transfer, and testing. In traditional chip testing equipment, the chip unloading efficiency is low, and the chips cannot be accurately positioned, which greatly affects the testing accuracy and efficiency. Utility Model Content

[0004] Therefore, it is necessary to provide a chip testing device that can improve the efficiency of picking and placing materials, testing accuracy, and testing efficiency to address the above problems.

[0005] A chip testing device, comprising a loading module, a picking and placing module, a positioning module, a transfer module, a testing module, and a unloading module;

[0006] The loading module is used to expand the mounting film and lift the chip to be tested from the mounting film. The picking and placing module is used to pick up the lifted chip to be tested and transfer it to the positioning module. The picking and placing module is also used to transfer the qualified chip on the positioning module to the unloading module. The positioning module is used to place the chip to be tested on the transfer module and photograph the position of the chip to be tested. If the position of the chip to be tested does not match the set position, the chip to be tested is picked up again and its position is adjusted. The positioning module is also used to pick up and transfer the tested chip on the transfer module. The transfer module is used to move the chip to be tested on it to the testing module for testing, and after the test, it moves the tested chip back.

[0007] In some embodiments, the feeding module includes a film expansion assembly and a ejector assembly. The film expansion assembly has an expansion hole and is used to clamp and expand the mounting film circumferentially, exposing the mounting film to the expansion hole. The ejector assembly is used to lift the chip to be tested from the mounting film through the expansion hole.

[0008] In some embodiments, the chip testing equipment has a placement receiving station and a placement transfer station;

[0009] The positioning module includes a support beam, a shuttle assembly, a pickup assembly, and a vision assembly, all of which are connected to the support beam.

[0010] The shuttle assembly moves relative to the support beam between the placement receiving station and the placement transfer station. The shuttle assembly receives the chip to be tested at the placement receiving station and transfers the chip to be tested to the placement transfer station. The shuttle assembly is also used to transfer the tested chip at the placement transfer station to the placement receiving station.

[0011] The vision component is used to capture the position of the chip under test located at the placement transfer station, and the position of the chip under test on the transfer module.

[0012] The picking component places the chip under test onto the transfer module according to the position of the chip under test at the transfer station in the placement. When the placement position of the chip under test on the transfer module does not match the set position, the picking component picks up the chip under test again and adjusts the position of the chip under test. The picking component is also used to pick up and transfer the tested chip on the transfer module.

[0013] In some embodiments, the extension direction of the support beam is consistent with the line direction connecting the placement receiving station and the placement transfer station, and the placement receiving station is located outside the extension length range of the support beam, while the placement transfer station and the transfer module are located within the extension length range of the support beam.

[0014] In some embodiments, there are two sets of positioning modules and two sets of transfer modules, and the positioning modules and the transfer modules correspond one-to-one. The picking and placing module is used to pick up the chip to be tested that has been lifted up and transfer it to any of the positioning modules. The positioning module is used to receive the chip to be tested transferred by the corresponding positioning module and place the chip to be tested into the corresponding transfer module. The two transfer modules carry the chip to be tested and move alternately to the test module for testing.

[0015] In some embodiments, the material handling module further includes a top-side imaging component, which is used to capture top-side images of the chip to be tested and the chip that has passed the test.

[0016] The chip testing equipment also includes a multi-faceted vision module, which is used to acquire bottom and side peripheral images of the chip under test during the process of the pick-and-place module transferring the chip under test. The multi-faceted vision module is also used to acquire bottom and side peripheral images of the chip under test during the process of the pick-and-place module transferring the qualified chip.

[0017] The pick-and-place module is used to remove the chip under test when at least one of the top surface image, bottom surface image and side peripheral surface image of the chip under test has an abnormality mark, and is used to transfer the qualified chip to the unloading module when none of the top surface image, bottom surface image and side peripheral surface image of the qualified chip has an abnormality mark.

[0018] In some embodiments, the transfer module includes a transfer stage, a chuck, and multiple heating elements. The chuck is disposed on the transfer stage and has multiple bearing areas. The heating elements are disposed on the chuck and correspond one-to-one with the bearing areas. The chuck has liquid cooling channels that flow sequentially through each of the bearing areas. Each heating element cooperates with the liquid cooling channels to regulate the temperature of each of the bearing areas.

[0019] In some embodiments, a storage module is further included, the storage module including a reheating zone, a dummy chip zone and / or a defective chip zone, the pick-and-place module is used to transfer the tested low-temperature chip on the placement module to the reheating zone, and to transfer the tested defective chip to the defective chip zone, and to transfer the dummy chip delivered by the transfer module to the placement module to the dummy chip zone.

[0020] In some embodiments, a card-changing module is further included, which is configured to move to the test module to change the pin card during card changing, and / or,

[0021] The chip testing equipment also includes a probe cleaning module, which is used to move to the testing module to clean the probe tips when there is dirt on the probe tips located on the test module pin card.

[0022] In some embodiments, the test module includes a mounting base, a test probe holder, and a plurality of leveling components. All the leveling components are arranged at circumferential intervals along the test probe holder and are supported between the mounting base and the test probe holder. At least one of the leveling components extends and retracts to adjust the levelness of the test probe holder.

[0023] Compared with the prior art, this application has the following beneficial effects:

[0024] In this application, the chip testing equipment described above utilizes a loading module that expands the mounting film and lifts the chip under test from it, facilitating the pick-and-place module's chip handling and improving chip handling efficiency. The positioning module places the chip under test onto the transfer module, captures its position, and re-picks and adjusts it if its position deviates from the set position, thus improving chip placement accuracy. This results in high testing precision and efficiency for the chip testing equipment. In this application, the loading module, pick-and-place module, positioning module, transfer module, testing module, and unloading module work together to achieve automated chip testing with high efficiency. Attached Figure Description

[0025] Figure 1 This is an overall layout diagram of the chip testing equipment in one embodiment of this application;

[0026] Figure 2 for Figure 1 The diagram shows the structure of the chip testing equipment shown, in which the two transfer modules work with the card replacement module, the needle cleaning module, and the testing module.

[0027] Figure 3 A schematic diagram illustrating the application of a feeding module for preparing a loaded chip and mounting film in some embodiments;

[0028] Figure 4 for Figure 3 The diagram shown illustrates the application of a feeding module that carries chips and mounting films.

[0029] Figure 5 for Figure 3 Another view of the feeding module shown;

[0030] Figure 6 for Figure 3 The diagram shown is a bottom view of the feeding module.

[0031] Figure 7 This is a schematic diagram of the placement module in one embodiment of this application;

[0032] Figure 8 for Figure 7 The diagram shows the structure of the shuttle assembly and the first drive assembly in the positioning module.

[0033] Figure 9 for Figure 7 The diagram shows the structure of the picking component in the placement module.

[0034] Figure 10 for Figure 7 The rear view of the positioning module shown is without the support base;

[0035] Figure 11 for Figure 7 The diagram shows the structure of the second driving component and the picking component working together in the positioning module.

[0036] Figure 12 for Figure 2 The diagram shows the structure of the chip testing equipment in which the transfer base cooperates with the transfer drive components of the first transfer module and the second transfer module;

[0037] Figure 13 for Figure 2 The diagram shows the structure of the chip testing equipment after it has been rotated at a certain angle.

[0038] Figure 14 for Figure 13 An enlarged schematic diagram of partial structure A of the chip testing equipment shown;

[0039] Figure 15 for Figure 2 A schematic diagram of the chip testing equipment from another perspective;

[0040] Figure 16 for Figure 15 An enlarged schematic diagram of a partial structure B of the chip testing equipment shown;

[0041] Figure 17 for Figure 15 An enlarged schematic diagram of a partial structure C of the chip testing equipment shown;

[0042] Figure 18 This is a schematic diagram of the structure of a multi-faceted visual module in one embodiment of this application;

[0043] Figure 19 for Figure 18 The main view of the multi-faceted visual module shown;

[0044] Figure 20 This is a schematic diagram of the structure of the storage module in one embodiment of this application.

[0045] Icon labels:

[0046] 10000, Chip testing equipment;

[0047] 1000a, Feeding module; 100a, Film expanding frame; 200a, Film expanding assembly; H, Film expanding hole; 201a, Film expanding base; 202a, Film expanding ring; 203a, Material receiving plate; 204a, Baffle; 205a, Positioning gap; 206a, Clearance position; 300a, Ejector pin assembly; 310a, Coarse adjustment assembly; 320a, Fine adjustment assembly; 330a, Ejector pin section; 400a, Clamping assembly; 410a, Gripper;

[0048] 1000b, Material handling module;

[0049] 1000c, Positioning Module; 1000c1, First Positioning Module; 1000c2, Second Positioning Module; 100c, Support Base; 200c, Support Beam; 300c, Shuttle Assembly; 310c, Transfer Unit; 311c, Third End; 312c, Fourth End; 320c, Shuttle Unit; 400c, Pickup Assembly; 401c, Mounting Structure; 402c, Nozzle Unit; 500c, Vision Assembly; 600c, First Drive Assembly; 610c, Fixing Part; 611c, First End; 612c, Second End; 620c, Moving Part; 700c, Second Drive Assembly; 710c, First Stator; 720c, First Mover; 800c, Adjustment Assembly; 900c, Inertia Counteracting Assembly;

[0050] O, Positioning receiving station; M, Positioning transfer station;

[0051] 1000d, card changing module; 100d, card changing platform;

[0052] 1000e, Transfer module; 100e, First transfer module; 200e, Second transfer module; 300e, Transfer stage; 400e, X-axis drive unit; 500e, Y-axis drive unit; 600e, Z-axis drive unit; 700e, Transfer base;

[0053] 1000f, test module; 100f, test pin tray; 200f, leveling assembly;

[0054] 1000g needle cleaning module; 100g needle cleaning platform;

[0055] 1000h, multi-faceted vision module; 100h, side detection component; 200h, bottom detection component; 300h, moving unit; 400h, bottom detection unit;

[0056] 1000j, material feeding module; 100j, first material feeding module; 200j, second material feeding module;

[0057] 1000k, material storage module; 100k, support frame; 200k, first material storage assembly; 201k, first support platform; 202k, first material storage tray; 203k, heating element; 300k, second material storage assembly; 301k, second support platform; 302k, second material storage tray; 303k, third material storage tray; 400k, motion assembly. Detailed Implementation

[0058] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0059] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0060] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0061] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0062] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0063] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0064] Please see Figure 1 This application provides a chip testing device 10000, which can be used to perform performance testing on unpackaged chips or packaged chips.

[0065] The chip testing equipment 10000 includes a loading module 1000a, a picking and placing module 1000b, a positioning module 1000c, a transfer module 1000e, a testing module 1000f, and a unloading module 1000j.

[0066] The loading module 1000a is used to expand the mounting film and lift the chip to be tested from the mounting film. The pick-and-place module 1000b is used to pick up the lifted chip to be tested and transfer it to the positioning module 1000c. The pick-and-place module 1000b is also used to transfer the qualified chip to the unloading module 1000j. The positioning module 1000c is used to place the chip to be tested on the transfer module 1000e and photograph the position of the chip to be tested. If the position of the chip to be tested does not match the set position, the chip to be tested is picked up again and its position is adjusted. The positioning module 1000c is also used to pick up and transfer the tested chip on the transfer module 1000e. The transfer module 1000e is used to move the chip to be tested on it to the testing module 1000f for testing, and after the test is completed, it moves the tested chip back.

[0067] The chip under test is mounted on a mounting film. During actual operation, the loading module 1000a fixes and expands the mounting film, and also lifts the chip under test from the mounting film to facilitate separation. Next, the pick-and-place module 1000b picks up the lifted chip under test and transfers it to the positioning module 1000c. The positioning module 1000c receives the chip under test and places it onto the transfer module 1000e. After the chip under test is positioned, the positioning module 1000c captures the position of the chip under test on the transfer module 1000e. If the position of the chip under test does not match the set position, the positioning module 1000c picks up the chip under test again and moves it to place it in its set position. Next, the transfer module 1000e moves the chip to be tested to the test module 1000f for testing. After the test is completed, the transfer module 1000e moves the tested chip back to the area that the positioning module 1000c can pick up. Then, the positioning module 1000c picks up the tested chip from the transfer module 1000e and moves it to the area that the pick-up and drop-off module 1000b can pick up. If the tested chip is a qualified chip, the pick-up and drop-off module 1000b moves the qualified chip from the positioning module 1000c to the unloading module 1000j for unloading.

[0068] In this application, the loading module 1000a expands the mounting film and lifts the chip under test from it, facilitating the pick-and-place module 1000b's pick-up and improving chip pick-up efficiency. The positioning module 1000c places the chip under test onto the transfer module 1000e, captures its position, and re-picks and adjusts its position if it deviates from the set position, thus improving chip placement accuracy. This results in the chip testing equipment 10000 having high testing precision and efficiency. In this application, the loading module 1000a, pick-and-place module 1000b, positioning module 1000c, transfer module 1000e, testing module 1000f, and unloading module 1000j work together to achieve automated chip testing with high efficiency.

[0069] Please refer to the following: Figure 1 and Figure 2In some embodiments, there are two sets of placement modules 1000c and transfer modules 1000e, and each placement module 1000c and transfer module 1000e corresponds to another. The pick-and-place module 1000b is used to pick up the chip to be tested that has been lifted up and transfer it to any placement module 1000c. The placement module 1000c is used to receive the chip to be tested transferred by the corresponding placement module 1000c and place the chip to be tested to the corresponding transfer module 1000e. The two transfer modules 1000e carry the chip to be tested and move alternately to the test module 1000f for testing.

[0070] As an example, the structures and working principles of the two placement modules 1000c are exactly the same, and the structures and working principles of the two transfer modules 1000e are also exactly the same.

[0071] Two sets of positioning modules 1000c are defined as the first positioning module 1000c1 and the second positioning module 1000c2, respectively. Two sets of transfer modules 1000e are defined as the first transfer module 100e and the second transfer module 200e, respectively. The chip testing module 1000f has an initial state. In the initial state, the first positioning module 1000c1 and the second positioning module 1000c2 are arranged along the X direction on opposite sides of the testing module 1000f. The first transfer module 100e is arranged on the same side as the first positioning module 1000c1, and the second transfer module 200e is arranged on the other side. In addition, the first positioning module 1000c1 and the first transfer module 100e, as well as the second positioning module 1000c2 and the second transfer module 200e, all extend along the Y direction. The pick-and-place module 1000b is located on the side of the first positioning module 1000c1 facing away from the first transfer module 100e along the Y direction. The loading module 1000a and unloading module 1000j are both located on the side of the pick-and-place module 1000b facing away from the first positioning module 1000c1 along the Y direction, and are arranged at intervals along the X direction. This design improves the compactness of the chip testing equipment 10000 layout.

[0072] Taking the material handling module 1000b, the first positioning module 1000c1, the first transfer module 100e, the testing module 1000f, and the unloading module 1000j as an example, in actual operation, the material handling module 1000b picks up the chip to be tested that has been lifted up and transfers it to the first positioning module 1000c1. The first positioning module 1000c1 receives the chip to be tested and places it on the first transfer module 100e. Next, the first transfer module 100e transfers the chip to be tested to the test module 1000f for testing. After the test is completed, the first transfer module 100e drives the tested chip back to the area that the first positioning module 1000c1 can pick up. Then, the first positioning module 1000c1 picks up the tested chip on the first transfer module 100e and transfers it to the area that the pick-up and drop-off module 1000b can pick up. If the tested chip is a qualified chip, the pick-up and drop-off module 1000b transfers the tested chip on the first positioning module 1000c1 to the unloading module 1000j for unloading.

[0073] The working process of the material pick-and-place module 1000b in conjunction with the second placement module 1000c2, the second transfer module 200e, the testing module 1000f, and the unloading module 1000j is exactly the same as the working process of the material pick-and-place module 1000b in conjunction with the first placement module 1000c1, the first transfer module 100e, the testing module 1000f, and the unloading module 1000j, so it will not be described again here.

[0074] It is worth noting that in this application, there are two unloading modules 1000j, one designated as the first unloading module 100j and the other as the second unloading module 200j. The first unloading module 100j is positioned along the X-direction between the loading module 1000a and the second unloading module 200j. If the tested chip is a qualified chip, the unloading module 1000b transfers the tested chip from the first positioning module 1000c1 to the first unloading module 100j for unloading. If the tested chip is a failed chip, the unloading module 1000b transfers the tested chip from the first positioning module 1000c1 to the second unloading module 100j for unloading into the defective product area. A qualified chip refers to a chip that passes the electrical performance test as determined by the testing module 1000f. A failed chip refers to a chip that fails the electrical performance test as determined by the testing module 1000f. In this embodiment, by setting up two sets of placement modules 1000c, transfer modules 1000e, and unloading modules 1000j, the two placement modules 1000c, transfer modules 1000e, and unloading modules 1000j cooperate with each other. The two placement modules 1000c alternately place chips on their respective transfer modules 1000e, and the two transfer modules 1000e can alternately move to the test module 1000f for testing. This allows the test module 1000f to alternately test the chips to be tested on the two transfer modules 1000e, increasing the number of chips that can be tested per unit time and improving testing efficiency.

[0075] Please see Figure 3 and Figure 4 In some embodiments, the loading module 1000a includes a film expansion frame 100a, a film expansion assembly 200a, and a ejector assembly 300a. The film expansion assembly 200a is movably disposed on the film expansion frame 100a along the Y direction, and the ejector assembly 300a is arranged on one side of the film expansion assembly 200a in the first direction Z. The film expansion assembly 200a has a film expansion hole H that extends along the Z direction. The film expansion assembly 200a is used to clamp and expand the mounting film circumferentially, exposing the mounting film to the film expansion hole H. The ejector assembly 300a is used to lift the chip to be tested from the mounting film through the film expansion hole H, so that the chip to be tested can be separated from the mounting film under the action of the pick-and-place module 1000b.

[0076] The film expansion assembly 200a is used to expand the mounting film, onto which the chip to be tested is attached. In practical applications, the middle part of the expanded mounting film is located within the area of ​​the expansion hole H. When the ejector assembly 300a moves along the Z direction, it passes through the expansion hole H and acts on the mounting film to lift the area where the chip to be tested is located, making it easier for the pick-and-place module 1000b to remove the chip. Understandably, when the chip to be tested is located at the film expansion assembly 200a, the chip is positioned upwards.

[0077] Please refer to Figure 2 and Figure 4 In some embodiments, the film expansion assembly 200a includes a film expansion base 201a, a film expansion ring 202a, a material support plate 203a, and a baffle 204a. The film expansion ring 202a is disposed on the film expansion base 201a and surrounds to form a film expansion hole H. The material support plate 203a is movably disposed on the film expansion base 201a along the Z direction and arranged around the film expansion ring 202a. The film expansion base 201a is movably disposed on the film expansion frame 100a along the Y direction. The baffle 204a avoids the film expansion hole H and is located on the side of the material support plate 203a away from the film expansion base 201a in the X direction, and a positioning gap 205a is formed between the baffle and the material support plate 203a in the first direction Z.

[0078] In the embodiments of this application, the X, Y, and Z directions are mutually perpendicular. In practical applications, Z corresponds to the vertical direction, and the X and Y directions correspond to two perpendicular horizontal directions.

[0079] Specifically, the support plate 203a and the baffle 204a are annular, and the projection of the film expansion ring 202a along the first direction Z is located within the inner ring of the annular projection of both along the first direction Z. The baffle 204a may, but is not limited to, be fixed above the support plate 203a, forming a gap with the support plate 203a for positioning the mounting film. In practical applications, a metal ring is reinforced on the edge of the mounting film, and the metal ring is positioned within the positioning gap 205a. The support plate 203a can be raised and lowered relative to the base in the first direction Z. After the mounting film is positioned in the positioning gap 205a, since the film expansion ring 202a remains stationary, the support plate 203a drives the baffle 204a to move closer to the base, pulling the edge of the mounting film downward, causing the mounting film to be continuously stretched, thus achieving film expansion. The spacing between the chips to be tested on the mounting film is increased, facilitating chip picking by the material picking assembly.

[0080] Please see Figure 3 , Figure 5 and Figure 6 The ejector pin assembly 300a includes an ejector pin portion 330a exposed by the expansion hole H. Typically, the tip of the ejector pin portion 330a is the adsorption end, and an adsorption air channel is provided within the ejector pin portion 330a, connecting a vacuum generator and the adsorption end. The adsorption end is used to adsorb and mount the membrane. The ejector pin assembly 300a also includes a coarse adjustment component 310a and a fine adjustment component 320a. The coarse adjustment component 310a is movably mounted on the frame along the X direction. The fine adjustment component 320a is disposed on the coarse adjustment component 310a and is used to drive the fine adjustment component 320a to move along the Z direction. The fine adjustment component 320a is connected to the ejector pin portion 330a and is used to drive the ejector pin portion 330a to move along the Z direction. The adjustment stroke of the fine adjustment component 320a is less than the adjustment stroke of the coarse adjustment component 310a.

[0081] Specifically, the ejector pin 330a is mounted on the fine-tuning component 320a, which is mounted on the coarse-tuning component 310a, which is mounted on the film expansion frame 100a. The ejector pin 330a moves relative to the film expansion frame 100a in the X-direction with the coarse-tuning component 310a, and in conjunction with the movement of the film expansion component 200a in the Y-direction, the ejector pin 330a can move horizontally to any position below the chip under test at the mounting film location. Under the action of the coarse-tuning component 310a, the ejector pin 330a can perform a wide-range, rapid adjustment in the Z-direction, allowing it to quickly rise to a position close to the chip under test. Then, the fine-tuning component 320a adjusts the position of the ejector pin 330a in the Z-direction with high precision, ensuring that the ejector pin 330a smoothly supports the mounting film area where the chip under test is located.

[0082] The feeding module 1000a has a pin 330a that can move relative to the frame in the X direction via a coarse adjustment component 310a, and a film expansion component 200a that can move relative to the frame in the Y direction. The combination of the two allows the pin 330a to be adjusted to any position relative to the mounting film in the horizontal plane. When the pin 330a moves in the X direction, it can make full use of the space occupied by the film expansion component 200a in the X direction without expanding the space occupied by the feeding module 1000a in the X direction, thereby reducing the space occupied by the feeding module 1000a.

[0083] Furthermore, the ejector pin 330a is positioned in the first direction Z by coarse adjustment component 310a and fine adjustment component 320a working together. This not only speeds up the adjustment process but also prevents the ejector pin 330a from damaging the mounting film and improves the positional accuracy of the ejector pin 330a.

[0084] The coarse adjustment component 310a can be a coarse adjustment cylinder or a coarse adjustment motor in conjunction with a coarse adjustment lead screw to drive the fine adjustment component 320a for large-stroke adjustment in the first direction Z. The fine adjustment component 320a can be a fine adjustment cylinder with higher motion precision or a fine adjustment motor in conjunction with a fine adjustment lead screw to drive the ejector pin 330a for small-stroke adjustment in the first direction Z. The specific forms of the coarse adjustment component 310a and the fine adjustment component 320a are not limited here.

[0085] Please see Figures 3 to 6The loading module 1000a also includes a clamping assembly 400a and a loading box. The clamping assembly 400a is movably mounted on the frame along the Y direction. The clamping assembly 400a includes grippers 410a for clamping the chip to be tested. When the clamping assembly 400a moves along the Y direction, it can clamp the chip to be tested in the loading box and transport the clamped chip to be tested to the positioning gap 205a. The baffle 204a is provided with a clearance position 206a communicating with the positioning gap 205a. The clearance position 206a is located on the movement trajectory of the gripper 410a in the Y direction. The baffle 204a has clearance positions 206a on opposite sides in the Y direction. The clearance positions 206a pass through the baffle 204a in the Y direction and are connected to the positioning gap 205a, so that the gripper 410a of the clamping assembly 400a can transport the clamped chip to be tested into the positioning gap 205a during the process of the gripper 410a moving from the feeding side of the baffle 204a to the discharging side of the baffle 204a.

[0086] The clamping component 400a and the feeding box are conventional technologies in this field, so they will not be described in detail here.

[0087] Please see Figure 1 , Figures 7 to 9 In some embodiments, the chip testing equipment 10000 has a positioning receiving station O and a positioning transfer station M; the positioning module 1000c includes a support beam 200c, a shuttle assembly 300c, a pickup assembly 400c, and a vision assembly 500c, all of which are connected to the support beam 200c. The shuttle assembly 300c moves relative to the support beam 200c between the positioning receiving station O and the positioning transfer station M. The shuttle assembly 300c receives the chip to be tested at the positioning receiving station O and transfers it to the positioning transfer station M. The shuttle assembly 300c is also used to transfer the tested chip from the positioning transfer station M to the positioning receiving station O. The vision assembly 500c is used to capture the position of the chip to be tested at the positioning transfer station M and the position of the chip to be tested on the transfer module 1000e. The chip under test is placed on the transfer module 1000e according to the position of the chip under test at the transfer station M in the placement process. When the placement position of the chip under test on the transfer module 1000e is inconsistent with the set position, the pick-up component 400c picks up the chip under test again and adjusts the position of the chip under test. The pick-up component 400c is also used to pick up and transfer the tested chip on the transfer module 1000e.

[0088] In actual operation, the shuttle assembly 300c receives the chip to be tested at the placement receiving station O and transfers it to the placement transfer station M. The vision assembly 500c is used to capture the position of the chip to be tested at the placement transfer station M. The picking assembly 400c adjusts its own position according to the position of the chip to be tested at the placement transfer station M to accurately pick up the chip to be tested, and then moves the chip to be tested and places it on the transfer module 1000e. After the chip to be tested is placed on the transfer module 1000e, the vision component 500c captures the position of the chip on the transfer module 1000e. If the chip is not placed correctly, i.e., its position on the transfer module 1000e does not match the set position, the pickup component 400c re-picks up the chip and, based on the position captured by the vision component 500c, readjusts the chip's position before repositioning it to match the set position. After the test, the pickup component 400c also picks up the tested chip from the transfer module 1000e and transfers it to the placement transfer station M. At this time, the shuttle component 300c, located at the placement transfer station M, receives the tested chip from the pickup component 400c and moves it to the placement receiving station O for pickup by the pick-up and drop-off module 1000b.

[0089] The shuttle assembly 300c, the pickup assembly 400c and the vision assembly 500c work together to realize the transfer and positioning of the chip under test. Since the vision assembly 500c can capture the position of the chip under test, the chip under test can be transferred and positioned accurately.

[0090] Specifically, the positioning module 1000c also includes a support base 100c, and a support beam 200c is mounted on the support base 100c, forming the mounting foundation for the support beam 200c. The extension direction of the support beam 200c is consistent with the line connecting the positioning receiving station O and the positioning transfer station M, that is, the support beam 200c extends along the X direction. The positioning receiving station O is located outside the extension length of the support beam 200c to facilitate docking with the pick-and-place module 1000b, realizing the transfer of the chip to be tested or the chip already tested. The positioning transfer station M and the transfer module 1000e are located within the extension length of the support beam 200c. This arrangement reduces the extension length of the support beam 200c, thereby reducing the footprint of the entire chip testing equipment 10000.

[0091] Please see Figure 7 and Figure 8In some embodiments, the positioning module 1000c further includes a first driving component 600c, which includes a fixed part 610c and a movable part 620c. The fixed part 610c is connected to the support beam 200c, and the movable part 620c is movably disposed on the fixed part 610c along the X direction. The shuttle assembly 300c is connected to the movable part 620c, and the first end 611c of the fixed part 610c extends beyond the support beam 200c along the X direction to ensure that the shuttle assembly 300c can move to the positioning receiving station O.

[0092] Optionally, the first drive assembly 600c is a linear motor, which includes a stator and a mover, with the stator serving as the fixed part 610c and the mover serving as the movable part 620c.

[0093] It should be understood that in some other embodiments, the first drive component 600c may be configured in other ways, such as setting the first drive component 600c as a linear module, which is not limited here.

[0094] The second end 612c of the fixing part 610c along the X direction is located within the extension length of the support beam 200c, and the direction of the second end 612c pointing to the first end 611c is the positive direction of the X direction. The shuttle assembly 300c includes a transfer unit 310c and a shuttle unit 320c. The transfer unit 310c has a third end 311c and a fourth end 312c that are connected to each other. The third end 311c is connected to the movable part 620c, and the fourth end 312c extends in the positive direction of the X direction relative to the third end 311c. The shuttle assembly 300c is connected to the fourth end 312c and extends in the positive direction of the X direction relative to the fourth end 312c.

[0095] With this configuration, the shuttle assembly 300c can extend outward as far as possible along the positive X direction, and also allows the first station to be located as far as possible beyond the extension length of the support beam 200c, so that the external structure can place the chip onto the shuttle assembly 300c or remove the chip from the shuttle assembly 300c.

[0096] Please see Figure 7 The positioning module 1000c also includes a second drive assembly 700c, which is connected to the support beam 200c. The pickup assembly 400c is mounted on the second drive assembly 700c. The second drive assembly 700c drives the pickup assembly 400c to move relative to the support beam 200c along the X direction. Thus, all pickup assemblies 400c are driven by the second drive assembly 700c, simplifying the structural design of the positioning module 1000c.

[0097] Optionally, see Figure 7 and Figure 11The second drive assembly 700c is a linear motor and includes a first stator 710c and two first movers 720c. The first stator 710c is connected to the support beam 200c. The two first movers 720c are movably mounted on the first stator 710c in the X direction. One first mover 720c can drive the pickup assembly 400c to move in the X direction relative to the first stator 710c, and the other first mover 720c can drive the pickup assembly 400c to move in the X direction relative to the first stator 710c.

[0098] It should be understood that in some other embodiments, the second drive component 700c may be configured in other ways, such as configuring the second drive component 700c as the first linear module, which is not limited here.

[0099] Please see Figure 7 and Figure 9 The pickup component 400c includes a mounting structure 401c and a nozzle unit 402c. The mounting structure 401c is connected to the second drive component 700c. Both the pickup component 400c and the nozzle unit 402c are mounted on the mounting structure 401c. The nozzle unit 402c is used to pick up and put down the chip.

[0100] For some specific implementation methods, please refer to [link / reference]. Figure 7 The pickup assembly 400c also includes an adjustment unit 800c, and at least one of the nozzle unit 402c and vision assembly 500c is positionally adjustable between the adjustment unit 800c and the mounting structure 401c.

[0101] Please see Figure 9 In some embodiments, the nozzle unit 402c is connected to the mounting structure 401c via an adjustment unit 800c, which adjusts the position between the nozzle unit 402c and the mounting structure 401c. The vision component 500c is directly connected to the mounting structure 401c. In other embodiments, the vision component 500c is connected to the mounting structure 401c via an adjustment unit 800c, which adjusts the position between the vision component 500c and the mounting structure 401c. The nozzle unit 402c is directly connected to the mounting structure 401c. In some specific embodiments, the vision component 500c is connected to the mounting structure 401c via an adjustment unit 800c, and the suction unit 402c is connected to the mounting structure 401c via an adjustment unit 800c. The adjustment unit 800c connected to the vision component 500c adjusts the position between the vision component 500c and the mounting structure 401c, and the adjustment unit 800c connected to the suction unit 402c adjusts the position between the suction unit 402c and the mounting structure 401c.

[0102] The pickup assembly 400c includes two nozzle units 402c, which are distributed along the X direction on both sides of the pickup assembly 400c. By including two nozzle units 402c, the pickup assembly 400c can simultaneously transport multiple chips, improving work efficiency.

[0103] Specifically, when the pickup assembly 400c includes two nozzle units 402c, each nozzle unit 402c is connected to the mounting structure 401c via an adjustment assembly 800c. The adjustment assembly 800c is used to adjust the adsorption surface of its corresponding nozzle unit 402c to be parallel to the first plane. Generally, the first plane is parallel to the plane where the chip is located. When the chip is supported on the support surface, the first plane is also parallel to the support surface supporting the chip.

[0104] It is conceivable that in other embodiments, the pickup component 400c may also be provided with only one nozzle unit 402c or more than two nozzle units 402c, which is not limited here.

[0105] In some embodiments, please refer to Figure 10 The positioning module 1000c also includes an inertia counterbalancing component 900c, which is movably mounted on the support beam 200c in the X direction and opposite to the movement direction of the pickup component 400c, in order to counteract the motion inertia of the pickup component 400c.

[0106] That is, when the pickup component 400c moves in the positive X direction, the inertia counterbalancing component 900c moves in the opposite X direction; when the pickup component 400c moves in the opposite X direction, the inertia counterbalancing component 900c moves in the positive X direction, so that the motion directions of the inertia counterbalancing component 900c and the pickup component 400c are always opposite, in order to cancel out the inertia of the pickup component 400c. Here, inertia is a physical quantity describing the magnitude of an object's motion inertia, usually including rotational inertia and linear inertia. The inertia known in this paper is linear inertia, which is directly related to the object's mass.

[0107] In the aforementioned positioning module 1000c, when the pickup component 400c moves along the X direction to transport the chip, the inertia counterbalancing component 900c is controlled to move in the opposite direction to the pickup component 400c. This allows the inertia counterbalancing component 900c to counteract the inertia of the pickup component 400c, thereby reducing the impact of inertia on the acceleration and response speed of the pickup component 400c when moving between workstations, and improving the acceleration and response speed of the pickup component 400c when moving between workstations. Furthermore, the inertia counterbalancing component 900c, in addition to counteracting the inertia of the pickup component 400c, can also reduce vibration problems caused by inertia, improve the stability of the chip movement driven by the pickup component 400c, and improve the positioning accuracy when picking up and placing chips.

[0108] In some embodiments, the pickup component 400c and the inertia counterbalancing component 900c are positioned on opposite sides of the support beam 200c along the Y direction. By positioning the pickup component 400c and the inertia counterbalancing component 900c on opposite sides of the support beam 200c along the Y direction, it is ensured that the inertia counterbalancing component 900c can completely counteract the motion inertia of the pickup component 400c without causing additional swaying.

[0109] In some embodiments, the transfer module 1000e includes a transfer stage 300e, a chuck, and a plurality of heating elements 203k. The chuck is disposed on the transfer stage 300e and has a plurality of bearing areas. The heating elements 203k are disposed on the chuck and correspond one-to-one with the bearing areas. The chuck has liquid cooling channels that flow sequentially through each bearing area. Each heating element 203k cooperates with the liquid cooling channels to regulate the temperature of each bearing area.

[0110] The transfer stage 300e is used to mount the chuck, which has placement positions for placing the chip. Each carrier area has one or more placement positions. Each heating element 203k is used to maintain the temperature of its corresponding carrier area. Liquid cooling channels allow coolant to circulate; as the coolant flows through each carrier area, it absorbs heat and cools the area.

[0111] Each heating element 203k works in conjunction with the liquid cooling channel to regulate the temperature of each carrier area, thereby heating or cooling the chip under test (TBT) and enabling various temperature tests. For example, when the TBT needs to be tested at a low temperature, the heating element 203k in its carrier area is turned off, and cooling is achieved solely by the coolant. When the TBT needs to be tested at a higher temperature, the heating element 203k in its carrier area is turned on, and the output power of the heating element 203k is increased to raise the temperature of the TBT and meet the requirements of the higher temperature test.

[0112] Each heating element 203k is set up independently and does not interfere with each other, thus forming multiple bearing areas that can be independently temperature controlled. According to the testing requirements of different chips under test, the temperature of different bearing areas where different chips under test are located can be independently controlled to meet the diverse testing requirements of chips under test.

[0113] Please see Figure 2 , Figures 12 to 14In some embodiments, the transfer module 1000e further includes a transfer base 700e and a transfer drive assembly. The transfer drive assembly includes an X-axis drive unit 400e, a Y-axis drive unit 500e, and a Z-axis drive unit 600e. The X-axis drive unit 400e is mounted on the transfer base 700e, the Y-axis drive unit 500e is mounted on the X-axis drive unit 400e, and the Z-axis drive unit 600e is mounted on the Y-axis drive unit 500e. The transfer stage 300e is connected to the Z-axis drive unit 600e.

[0114] The test module 1000f includes a test pin holder platform 100f. During actual operation, the X-axis drive unit 400e drives the transfer stage 300e to move along the X-direction, and / or the Y-axis drive unit 500e drives the transfer stage 300e to move along the Y-direction, enabling the transfer stage 300e to reach the bottom of the test pin holder platform 100f. After the transfer stage 300e is at the bottom of the test pin holder platform 100f, the Z-axis drive unit 600e drives the transfer stage 300e to move in the Z-direction until the chip under test on the transfer stage 300e contacts the pin holder on the test pin holder platform 100f, thereby enabling the probe to perform performance testing on the chip on the transfer stage 300e. After the test is completed, the transfer stage 300e, under the action of the X-axis drive unit 400e, the Y-axis drive unit 500e, and the Z-axis drive unit 600e, moves the tested chip back.

[0115] The specific forms of the X-axis drive unit 400e, Y-axis drive unit 500e, and Z-axis drive unit 600e are not limited here.

[0116] By setting up X-axis drive unit 400e, Y-axis drive unit 500e and Z-axis drive unit 600e, the transfer module 1000e drives the chip under test to move in multiple directions, so that the chip can be aligned with the probe and the test accuracy is improved.

[0117] Please see Figure 2 In some embodiments, the test module 1000f includes a test pin holder stage 100f and a plurality of leveling components 200f. All leveling components 200f are arranged at circumferential intervals along the test pin holder stage 100f and supported between the transfer base 700e and the test pin holder stage 100f. At least one leveling component 200f extends and retracts to adjust the levelness of the test pin holder stage 100f.

[0118] Specifically, the test pin card stage 100f has a cutout area, the pin card is installed on the test pin card stage 100f, and the probe on the pin card passes through the cutout area and protrudes from the bottom of the test pin card stage 100f, so as to be able to contact the chip.

[0119] As an example, the test pin carrier 100f is rectangular, and there are four leveling components 200f, which correspond one-to-one with the four corners of the test pin carrier 100f. The leveling components 200f are supported at the corresponding corners.

[0120] As an example, the leveling assembly 200f may include a leveling motor and a leveling screw, the leveling motor being connected to the leveling screw and the leveling screw being connected to the test probe holder stage 100f.

[0121] By setting multiple leveling components 200f, the levelness of the test probe holder stage 100f can be adjusted to ensure stable operation of the probe insertion test. Probe insertion refers to the operation where the probe contacts the chip.

[0122] Please see Figure 2 , Figure 15 and Figure 16 In some embodiments, the chip testing device 10000 further includes a card changing module 1000d, which is used to move to the testing module 1000f to change the pin card during card changing.

[0123] The chip testing equipment 10000 has an initial state. In the initial state, the card switching module 1000d and the first transfer module 100e are located on the same side.

[0124] The card-changing module 1000d is connected to the X-axis drive unit 400e of the transfer drive assembly of the first transfer module 100e. Under the action of the card-changing module 1000d, it moves along the X-direction to the bottom of the test pin carrier stage 100f. This design reduces the design of the drive structure that drives the card-changing module 1000d to move along the X-axis direction, making the chip testing equipment 10000 simple in structure and low in manufacturing cost.

[0125] Furthermore, the card changing module 1000d includes a card changing platform 100d and a card changing lifting assembly. The card changing lifting assembly is mounted on the X-axis drive unit 400e of the first drive assembly 600c and connected to the card changing platform 100d. When a card change is required, the X-axis drive unit 400e of the first drive assembly 600c drives the card changing module 1000d to move along the X-direction, allowing the card changing module 1000d to reach the bottom of the test pin card platform 100f. After the card changing module 1000d is located at the bottom of the test pin card platform 100f, the card changing lifting assembly drives the card changing platform 100d to move in the Z-direction to the card changing height. The card is then locked by the locking assembly on the test pin card platform 100f, thus completing the card change. Then, the card changing platform 100d descends to a safe height, and the X-axis drive unit 400e of the first drive assembly 600c resets the card changing module 1000d, completing the automatic card change. If card removal is required, the X-axis drive unit 400e of the first drive component 600c drives the card changing module 1000d to move below the test pin card platform 100f. Then, the card changing lifting component drives the card changing platform 100d to rise to the card removal height. The locking component on the pin card platform unlocks the pin card. After the pin card falls onto the card changing platform 100d, it descends to a safe height. Then, the card changing module 1000d resets, and the pin card is manually removed.

[0126] The specific form of the locking component is not limited here; it is only necessary to ensure that the locking component can lock or unlock the pin card.

[0127] Please see Figure 2 , Figure 15 and Figure 17 In some embodiments, the chip testing equipment 10000 further includes a probe cleaning module 1000g, which is used to move to the test module 1000f to clean the probe tips when they are dirty on the probe card located on the test module 1000f. By setting up the probe cleaning module 1000g, the time and effort required for manual cleaning of probe tips are reduced, resulting in high cleaning efficiency.

[0128] Specifically, the cleaning module 1000g contains cleaning consumables such as paper, sponge, etc. for cleaning the probe tip.

[0129] As an example, when the chip testing equipment 10000 is in its initial state, the needle clearing module 1000g and the second transfer module 200e are located on the same side of the testing module 1000f.

[0130] As an example, the cleaning module 1000g is connected to the Y-axis drive unit 500e of the second transfer module 200e, and the cleaning module 1000g moves along the X and Y directions under the driving action of the X-axis drive unit 400e and the Y-axis drive unit 500e of the second transfer module 200e, respectively. This reduces the need for drive structures to drive the cleaning module 1000g along the X and Y directions, resulting in a simple structure and low manufacturing cost for the chip testing equipment 10000.

[0131] The needle cleaning module 1000g includes a needle cleaning lifting assembly and a needle cleaning platform 100g. The needle cleaning lifting assembly is mounted on the Y-axis drive unit 500e of the second transfer module 200e and connected to the needle cleaning platform 100g. The needle cleaning lifting assembly drives the needle cleaning platform 100g to move up and down in the Z direction. When the probe tip is dirty, the X-axis drive unit 400e of the second transfer module 200e drives the needle cleaning platform 100g to move in the X direction, and / or the Y-axis drive unit 500e of the second transfer module 200e drives the needle cleaning platform 100g to move in the Y direction, so that the needle cleaning platform 100g can reach the bottom of the test needle holder platform 100f. After the cleaning stage 100g is located at the bottom of the test needle holder stage 100f, the cleaning lifting assembly drives the cleaning stage 100g to move in the Z direction until the cleaning consumables on the cleaning stage 100g come into contact with the probe tip on the test needle holder stage 100f, thereby achieving the cleaning of the probe tip.

[0132] As an example, the material handling module 1000b can be a four-axis robot, a five-axis robot, or other structures, which are conventional technologies in this field and will not be described in detail here.

[0133] Please see Figure 1 In some embodiments, the pick-and-place module 1000b further includes a top-side imaging component, which is used to acquire top-side images of the chip under test and the qualified chip; the chip testing equipment 10000 further includes a multi-faceted vision module 1000h, which is used to acquire bottom-side and side-peripheral images of the chip under test during the transfer of the chip under test by the pick-and-place module 1000b, and to acquire bottom-side and side-peripheral images of the qualified chip during the transfer of the qualified chip by the pick-and-place module 1000b; the pick-and-place module 1000b is used to remove the chip under test when at least one of the top-side, bottom-side, and side-peripheral images of the chip under test has an abnormality mark, and to transfer the qualified chip to the unloading module 1000j when none of the top-side, bottom-side, and side-peripheral images of the qualified chip have an abnormality mark, specifically to the first unloading module 100j.

[0134] It is worth mentioning that once the chip has completed the test, it becomes a tested chip. Based on the test results, it can be determined whether the tested chip is a qualified chip or a failed chip.

[0135] For the chip under test, the pick-and-place module 1000b picks up the chip under test from the loading module 1000a and, during the transfer to the multi-faceted vision module 1000h, captures a top-face image of the chip under test using a top-face imaging component. Then, the pick-and-place module 1000b places the chip under test at the multi-faceted vision module 1000h. The multi-faceted vision module 1000h captures bottom and side-peripheral images of the chip under test. If at least one of the top, bottom, or side-peripheral images of the chip under test shows an abnormality (e.g., cracks, dirt), the chip under test is determined to be a defective chip, and the pick-and-place module 1000b removes the chip under test and stores it in the defective chip area.

[0136] For a chip that passes the test, the pick-and-place module 1000b picks up the chip from the positioning module 1000c and, during the transfer to the multi-faceted vision module 1000h, captures a top-face image of the chip using a top-face imaging component. Then, the pick-and-place module 1000b places the chip at the multi-faceted vision module 1000h. The multi-faceted vision module 1000h captures bottom and side-peripheral images of the chip. If at least one of the top, bottom, or side-peripheral images of the chip contains an abnormality marker, the chip is determined to be a defective chip, and the pick-and-place module 1000b removes it and stores it in the defective chip area. If none of the top, bottom, or side-peripheral images contain an abnormality marker, the chip is determined to be a qualified chip, and the pick-and-place module 1000b places it into the first unloading module 100j for unloading.

[0137] Please see Figure 18 and Figure 19 It is worth mentioning that the chips that fail the test will also be picked up by the pick-and-place module 1000b in sequence through the transfer module 1000e and the placement module 1000c. Since the chips that fail the test are defective, the multi-faceted vision module 1000h does not need to take pictures of the chips that fail the test. The pick-and-place module 1000b picks up the chips that fail the test on the placement module 1000c and places them into the defective product area through the second unloading module 200j.

[0138] The defective product area and the defective chip area are not the same. The defective product area is used to store chips that fail the electrical performance test (measured by test module 1000f) and have not undergone the vision test by multi-face vision module 1000h. The defective chip area is used to store chips that fail the top-face photography component and the vision test by multi-face vision module 1000h. That is, it stores chips that have not undergone electrical performance test and have failed the vision test, or chips that have passed the electrical performance test but have failed the vision test.

[0139] As an example, the multi-faceted vision module 1000h includes two side detection components 100h and a bottom detection component 200h, which are arranged at intervals along the X or Y direction. Taking the arrangement of the two side detection components 100h at intervals along the X direction as an example, the two sides of the chip (as indicated by arrow P) in the X direction face the two side detection components 100h respectively. The two side detection components 100h perform visual detection on the two sides of the chip in the X direction respectively.

[0140] A bottom surface detection assembly 200h is disposed below the chip. This assembly includes a moving unit 300h and a bottom surface detection unit 400h mounted on the moving unit 300h. The bottom surface detection unit 400h is used to acquire an image of the bottom surface of the chip. The moving unit 300h can controllably move the bottom surface detection unit 400h to adjust the position of the bottom surface detection assembly 200h relative to the chip.

[0141] In practical use, the pick-and-place module 1000b transfers the chip requiring image acquisition between the two side detection components 100h, so that the two sides of the chip in the X direction face the two side detection components 100h respectively, and the bottom surface of the chip faces the bottom detection component 200h. Then, the two side detection components 100h take pictures of the two sides of the chip in the X direction, i.e., acquire images of the two sides of the chip separately; the bottom detection component 200h takes a picture of the bottom surface of the chip. Next, the pick-and-place module 1000b rotates the chip 90° and places it again between the two side detection components 100h, so that the other two sides of the chip that have not yet been image acquired face the two side detection components 100h respectively. Then, the two side detection components 100h again take pictures and acquire images of the two undetected sides of the chip. After acquiring images of the four sides and the bottom surface of the chip, the pick-and-place module 1000b transfers the chip based on its own image acquisition and detection results and the image acquisition results of the multi-face vision module 1000h.

[0142] The structure of the bottom detection component 200h and the two side detection components 100h can be varied. It is only necessary to ensure that the bottom detection component 200h can acquire images of the bottom surface of the chip and that the two side detection components 100h can acquire images of the two opposite sides of the chip.

[0143] Please see Figure 1 and Figure 20 In some embodiments, the chip testing equipment 10000 further includes a storage module, which includes a reheating zone, a dummy chip zone, and / or a defective chip zone. The pick-and-place module 1000b is used to transfer the tested low-temperature chips on the placement module 1000c to the reheating zone, and to transfer the defective chips (i.e., chips that pass the electrical performance test but fail the visual test) to the defective chip zone, and to transfer the dummy chips conveyed by the transfer module 1000e to the placement module 1000c to the dummy chip zone.

[0144] It is understandable that the chip that fails the test on the positioning module 1000c is the chip that failed the test on the test module 1000f and was returned to the positioning module 1000c via the transfer module 1000e.

[0145] Specifically, the tested chips also include cryogenic chips, which are qualified chips and require image inspection using the same top-side imaging component and multi-faceted vision inspection module as the qualified chips mentioned above. After the cryogenic chip passes the image inspection, the pick-and-place module 1000b places the cryogenic chip in the warming zone, and after the cryogenic chip returns to room temperature, the pick-and-place module 1000b transfers the cryogenic chip to the unloading module 1000j for unloading.

[0146] It's worth noting that the rewarming zone can also be used to temporarily store chips that need to be retested. Retesting refers to chips whose test results are questionable and require retesting. The order in which these chips circulate among the modules is roughly the same as the order in which the previously tested cryogenic chips circulate, so it will not be elaborated on here.

[0147] Dummy chips are non-chips. When performing batch testing of chips on a chip testing device (10,000), if the number of chips is insufficient, dummy chips are used to replace them to ensure that the chip quantity meets the requirements. If the number of chips is sufficient, dummy chips are not needed and can be temporarily stored in the dummy chip area.

[0148] In actual operation, the pick-and-place module 1000b removes the dummy chip from the dummy chip area and transfers it to the placement module 1000c. Then, the dummy chip is placed on the placement position of the transfer stage 300e and moves to the testing module 1000f under the action of the transfer stage 300e. After the chip testing is completed, the dummy chip returns with the transfer stage 300e. Next, it flows through the placement module 1000c and returns to the dummy chip area for storage under the action of the pick-and-place module 1000b.

[0149] The defective chip area is used to store defective chips, which include test-passed chips and chips to be tested that failed the inspection by the top-facing camera component and the multi-faceted vision module 1000h, as well as test-failed chips that failed the inspection by the test module 1000f.

[0150] By setting up a storage module, various chips can be centrally stored, making operation convenient.

[0151] As an example, the storage module includes a support frame 100k, a first storage component 200k, and a second storage component 300k. The first storage component 200k includes a first support platform 201k and a first storage tray 202k. The first support platform 201k is mounted on the support frame 100k, and the first storage tray 202k is disposed on the first support platform 201k for storing chips requiring retesting and tested low-temperature chips transferred by a robotic arm. The second storage component 300k includes a second support platform 301k, a second storage tray 302k, and a third storage tray 303k. The second support platform 301k is mounted on the support frame 100k. The second support platform 301k has a first support area and a second support area. A second storage tray 302k and a third storage tray 303k are disposed on the second support platform 301k. The second storage tray 302k is located in the first support area of ​​the second support platform 301k and is used to store defective components. The third storage tray 303k is located in the second support area of ​​the second support platform 301k and is used to store dummy components. Thus, the storage module uses the first storage tray 202k to receive components awaiting retest transferred from the pick-and-place module 1000b, uses the second storage tray 302k to receive defective components transferred from the pick-and-place module 1000b, and uses the third storage tray 303k to receive dummy components transferred from the pick-and-place module 1000b. This achieves classified storage of components awaiting retest, defective components, and dummy components, eliminating the need for a separate storage module for each type of component, significantly reducing the number of storage modules, reducing the required space, and improving space utilization.

[0152] It should also be noted that, since the tested cryogenic chips are generally in a low-temperature state, they need to be heated before being fed into the storage container to bring them to room temperature. To achieve this heating, in some embodiments, the first storage assembly 200k further includes a heating element 203k disposed on the first support platform 201k. Thus, the heat generated by the heating element 203k is transferred through the first support platform 201k to the first storage tray 202k, thereby heating the tested cryogenic chips stored on the first storage tray 202k and bringing them to room temperature.

[0153] Specifically, in this embodiment, the top surface of the first storage tray 202k has multiple first storage slots, each used to store a chip awaiting retesting and a tested low-temperature chip. The top surface of the second storage tray 302k has multiple second storage slots, each used to store a defective chip. The top surface of the third storage tray 303k has multiple third storage slots, each used to store a dummy chip.

[0154] In embodiments of this application, the storage module further includes a motion component 400k, and a support frame 100k is mounted on the motion component 400k. The motion component 400k can controllably drive the support frame 100k to move along the X and / or Y directions to the pick-up range of the pick-up and drop-off module 1000b.

[0155] When it is necessary to receive the chip transferred by the pick-and-place module 1000b, the motion component 400k drives the support frame 100k to move to the pick-and-place module 1000b's pick-and-place range, ensuring that the pick-and-place module 1000b can transfer the chip to the first storage tray 202k, or the second storage tray 302k, or the third storage tray 303k.

[0156] It should also be noted that the movement of the support frame 100k is driven by the motion component 400k, thereby realizing the movement of the first storage tray 202k, the second storage tray 302k, and the third storage tray 303k. On the one hand, this simplifies the movement of the material handling module 1000b, thus simplifying the structure of the material handling module 1000b; on the other hand, it makes the maintenance of the storage module and the replacement of the first storage tray 202k, the second storage tray 302k, and the third storage tray 303k more convenient.

[0157] Please see Figure 1The aforementioned chip testing equipment 10000 utilizes a loading module 1000a that expands the mounting film and lifts the chip under test from it, facilitating chip picking by the pick-and-place module 1000b and improving chip picking efficiency. The positioning module 1000c places the chip under test onto the transfer module 1000e, captures its position, and re-picks and adjusts its position if it deviates from the set position, thus improving chip placement accuracy. This results in the chip testing equipment 10000 achieving high testing precision and efficiency. In this application, the loading module 1000a, pick-and-place module 1000b, positioning module 1000c, transfer module 1000e, testing module 1000f, and unloading module 1000j work together to achieve automated chip testing with high efficiency.

[0158] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0159] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A chip testing apparatus, characterized by comprising: The chip testing equipment includes a loading module (1000a), a picking and placing module (1000b), a positioning module (1000c), a transfer module (1000e), a testing module (1000f), and a unloading module (1000j). The loading module (1000a) is used to expand the mounting film and lift the chip to be tested from the mounting film. The picking and placing module (1000b) is used to pick up the lifted chip to be tested and transfer it to the positioning module (1000c). The picking and placing module (1000b) is also used to transfer the qualified chip to the unloading module (1000j). The positioning module (1000c) is used to place the chip to be tested on the transfer module (1000e) and photograph the position of the chip to be tested. If the position of the chip to be tested does not match the set position, the chip to be tested is picked up again and its position is adjusted. The positioning module (1000c) is also used to pick up and transfer the tested chip on the transfer module (1000e). The transfer module (1000e) is used to move the chip to be tested on it to the testing module (1000f) for testing, and after the test is completed, it moves the tested chip back.

2. The chip testing apparatus according to claim 1, wherein The loading module (1000a) includes a film expansion assembly (200a) and a ejector assembly (300a). The film expansion assembly (200a) has an expansion hole (H). The film expansion assembly (200a) is used to clamp and expand the mounting film circumferentially, and expose the mounting film to the expansion hole (H). The ejector assembly (300a) is used to lift the chip to be tested from the mounting film through the expansion hole (H).

3. The chip testing apparatus according to claim 1, wherein The chip testing equipment has a placement receiving station (O) and a placement transfer station (M). The positioning module (1000c) includes a support beam (200c), a shuttle assembly (300c), a pickup assembly (400c), and a vision assembly (500c). The shuttle assembly (300c), the pickup assembly (400c), and the vision assembly (500c) are all connected to the support beam (200c). The shuttle assembly (300c) moves relative to the support beam (200c) between the positioning receiving station (O) and the positioning transfer station (M). The shuttle assembly (300c) receives the chip to be tested at the positioning receiving station (O) and transfers the chip to be tested to the positioning transfer station (M). The shuttle assembly (300c) is also used to transfer the tested chip at the positioning transfer station (M) to the positioning receiving station (O). The vision component (500c) is used to capture the position of the chip under test located at the placement transfer station (M) and the position of the chip under test on the transfer module (1000e). The pick-up component (400c) places the chip under test onto the transfer module (1000e) according to the position of the chip under test at the placement transfer station (M). When the placement position of the chip under test on the transfer module (1000e) does not match the set position, the pick-up component (400c) picks up the chip under test again and adjusts the position of the chip under test. The pick-up component (400c) is also used to pick up and transfer the tested chip on the transfer module (1000e).

4. The chip testing apparatus according to claim 3, wherein The extension direction of the support beam (200c) is consistent with the line direction connecting the placement receiving station (O) and the placement transfer station (M), and the placement receiving station (O) is located outside the extension length range of the support beam (200c), while the placement transfer station (M) and the transfer module (1000e) are located within the extension length range of the support beam (200c).

5. The chip testing apparatus according to claim 1, wherein The placement module (1000c) and the transfer module (1000e) are both in two sets, and the placement module (1000c) and the transfer module (1000e) correspond one-to-one. The pick-and-place module (1000b) is used to pick up the chip to be tested that has been lifted up and transfer it to any of the placement modules (1000c). The placement module (1000c) is used to receive the chip to be tested transferred by the corresponding placement module (1000c) and place the chip to be tested on the corresponding transfer module (1000e). The two transfer modules (1000e) carry the chip to be tested and move alternately to the test module (1000f) for testing.

6. The chip testing apparatus according to claim 1, wherein The material handling module (1000b) also includes a top-side imaging component, which is used to capture top-side images of the chip to be tested and the chip that has passed the test. The chip testing equipment also includes a multi-faceted vision module (1000h), which is used to acquire bottom and side peripheral images of the chip under test during the transfer of the chip under test by the pick-and-place module (1000b), and the multi-faceted vision module (1000h) is used to acquire bottom and side peripheral images of the chip under test during the transfer of the qualified chip by the pick-and-place module (1000b). The pick-and-place module (1000b) is used to remove the chip under test when at least one of the top surface image, the bottom surface image and the side peripheral surface image of the chip under test has an abnormality mark, and is used to transfer the chip under test to the unloading module (1000j) when none of the top surface image, the bottom surface image and the side peripheral surface image of the qualified chip have an abnormality mark.

7. The chip testing apparatus according to claim 1, wherein The transfer module (1000e) includes a transfer stage (300e), a chuck, and multiple heating elements (203k). The chuck is disposed on the transfer stage (300e) and has multiple bearing areas. The heating elements (203k) are disposed on the chuck and correspond one-to-one with the bearing areas. The chuck has liquid cooling channels that flow sequentially through each bearing area. Each heating element (203k) cooperates with the liquid cooling channels to regulate the temperature of each bearing area.

8. The chip testing apparatus according to claim 1, wherein It also includes a storage module, which includes a reheating zone, a dummy chip zone, and / or a defective chip zone. The pick-and-place module (1000b) is used to transfer the tested low-temperature chip on the placement module (1000c) to the reheating zone, and to transfer the tested defective chip to the defective chip zone, and to transfer the dummy chip conveyed by the transfer module (1000e) to the placement module (1000c) to the dummy chip zone.

9. The chip testing apparatus according to claim 1, wherein It also includes a card changing module (1000d), which is used to move to the test module (1000f) to change the pin card during card changing, and / or, The chip testing equipment also includes a probe cleaning module (1000g), which is used to move to the test module (1000f) to clean the probe tips when there is dirt on the probe tips located on the probe card of the test module (1000f).

10. The chip testing apparatus according to claim 1, wherein The test module (1000f) includes a mounting base, a test probe holder (100f), and multiple leveling components (200f). All the leveling components (200f) are arranged at circumferential intervals along the test probe holder (100f) and supported between the mounting base and the test probe holder (100f). At least one of the leveling components (200f) can extend and retract to adjust the levelness of the test probe holder (100f).

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