Water-cooling heat-dissipation type chip package testing device

Abstract

The utility model belongs to the field of encapsulation test technology especially, a kind of water-cooling heat dissipation type chip encapsulation test device, including the encapsulation shell with air inlet hole and the circuit board body placed in the encapsulation shell, further include: air guide mechanism, including the cold collection box being communicated with the air inlet hole and being fixed on the inner wall of the encapsulation shell, the circulating water cooling pipe being penetrated in the encapsulation shell and the one side of the rapid cooling box and the first air pipe being communicated in the top of the cold collection box, corresponding to the circuit board body upper side and lower side are equipped with air jet board and the air pipe being communicated on the air jet board, one end of the air pipe is fixed with the connection spout of the first air pipe pluggable. The utility model structure is simple, by upper and lower double air jet board simultaneously conveying cold air, form three-dimensional heat dissipation structure, significantly improve the heat dissipation efficiency of circuit board body, quickly reduce the heat generated in testing process, facilitate people to use.

Description

Technical Field

[0001] This utility model relates to the field of packaging and testing technology, and in particular to a water-cooled heat dissipation chip packaging and testing device. Background Technology

[0002] With the rapid development of electronic technology, chip performance is constantly improving, but so is its power consumption. The heat accumulation caused by high power consumption has become a key factor restricting further improvements in chip performance and reliability. Water cooling technology has gradually gained attention due to its efficient heat dissipation capabilities and stable cooling effect. Water cooling uses circulating water as a cooling medium to quickly remove the heat generated by the chip, thereby effectively reducing the chip's operating temperature and improving its operational stability and lifespan.

[0003] In existing technologies, when cooling the circuit board, the cool air passes freely across the board. Since the heat of the circuit board is generated at the top and bottom, the cool air cannot be directed towards the board, resulting in low heat dissipation efficiency. To address this issue, we propose a water-cooled chip packaging and testing device. Utility Model Content

[0004] The purpose of this invention is to solve the problem that when cooling the circuit board body, the cold air passes freely through the circuit board, and because the heat of the circuit board body is generated at the top and bottom, the cold air cannot be blown onto the circuit board body, resulting in low heat dissipation efficiency. Therefore, a water-cooled heat dissipation type chip packaging test device is proposed.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A water-cooled heat dissipation type chip packaging and testing device includes a packaging shell with an air inlet and a circuit board body placed inside the packaging shell, and further includes: The air guiding mechanism includes a cold collection box fixed on the inner wall of the packaging shell and communicating with the air inlet, a circulating water cooling pipe passing through the packaging shell and one side of the quench box, and a first air guiding pipe communicating with the top of the cold collection box. Air jet plates are provided above and below the circuit board body, and an air delivery pipe communicating with the upper air jet plate is provided. One end of the air delivery pipe is fixed with a connecting pipe that can be plugged into the first air guiding pipe, and a second air guiding pipe communicating with the lower air jet plate and communicating with the cold collection box is provided.

[0006] Furthermore, a fan and a dustproof screen for filtering gas impurities are installed inside the air inlet. An exhaust port is provided on the side of the encapsulation shell that is symmetrical to the air inlet. The filtered air first absorbs the cooling capacity of the circulating water cooling pipe through the cold collection box, and then is delivered to the jet plate through the air guide pipe to achieve pre-cooling and uniform distribution of cold air.

[0007] Furthermore, the top of the encapsulation shell is detachably mounted with a top cover that is fixedly connected to the jet plate, and the gas delivered by the jet plate can quickly dissipate heat from the top of the circuit board body.

[0008] Furthermore, a support rod and a suction cup mounted on the top of the support rod for fixing the circuit board body are fixed inside the bottom wall of the packaging shell.

[0009] Furthermore, each of the four bottom corners of the encapsulation shell is equipped with a support foot that provides stability to the encapsulation shell.

[0010] Compared with the prior art, the advantages of this utility model are: 1. This solution uses suction cups to fix the circuit board body, and the sealed installation of the package shell and top cover ensures testing stability and facilitates subsequent maintenance operations; 2. This solution delivers cool air simultaneously through dual jet plates (top and bottom), forming a three-dimensional heat dissipation structure that significantly improves the heat dissipation efficiency of the circuit board and quickly reduces the heat generated during testing. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the structure of a water-cooled heat dissipation chip packaging and testing device proposed in this utility model; Figure 2 This utility model proposes a water-cooled heat dissipation type chip packaging and testing device. Figure 1 Enlarged diagram of part A in the diagram; Figure 3 This utility model proposes a water-cooled heat dissipation type chip packaging and testing device. Figure 1 Enlarged diagram of part B in the image.

[0013] The correspondence between the numbers in the attached diagram is as follows: 1. Encapsulation shell; 2. Cold collection box; 201. Circulating water cooling pipe; 202. First air guide pipe; 203. Jet plate; 204. Air supply pipe; 205. Connecting tube; 206. Second air guide pipe; 3. Circuit board body; 4. Support rod; 401. Suction cup; 5. Dustproof net; 501. Fan; 502. Exhaust port; 6. Top cover. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Reference Figures 1-3 A water-cooled heat dissipation type chip packaging and testing device includes a packaging shell 1 with an air inlet and a circuit board body 3 placed inside the packaging shell 1, and further includes: The air guiding mechanism includes a cold collection box 2 fixed on the inner wall of the packaging shell 1 and communicating with the air inlet, a circulating water cooling pipe 201 passing through the packaging shell 1 and one side of the quench box, and a first air guiding pipe 202 connected to the top of the cold collection box 2. A jet plate 203 is provided above and below the circuit board body 3, and an air supply pipe 204 connected to the upper jet plate 203 is provided. One end of the air supply pipe 204 is fixed with a connecting tube 205 that can be plugged into the first air guiding pipe 202, and a second air guiding pipe 206 connected to the lower jet plate 203 and communicating with the cold collection box 2.

[0016] The air enters the first air duct 202 and the second air duct 206. The air in the first air duct 202 is delivered to the upper jet plate 203 through the air supply pipe 204 and blown towards the top of the circuit board body 3 for heat dissipation. Meanwhile, the cold air in the second air duct 206 is delivered to the lower jet plate 203 and blown towards the bottom of the circuit board body 3 for heat dissipation. The simultaneous delivery of cold air from the upper and lower parts enables the circuit board body 3 to quickly achieve the effect of heat dissipation.

[0017] In this embodiment, a fan 501 and a dustproof net 5 that can be detachably installed in the air inlet for filtering gas impurities are installed in the air inlet. An exhaust hole 502 is provided on the side of the encapsulation shell 1 that is symmetrical with the air inlet. The dustproof net 5 ensures that the airflow drawn into the encapsulation shell 1 by the fan 501 achieves a dust-free effect.

[0018] In this embodiment, the top of the encapsulation shell 1 is detachably mounted with a top cover 6 that is fixedly connected to the jet plate 203.

[0019] In this embodiment, a support rod 4 and a suction cup 401 for fixing the circuit board body 3 are fixed inside the bottom wall of the packaging shell 1. The circuit board body 3 is fixed by the suction cup 401, which, together with the sealing installation of the packaging shell 1 and the top cover 6, ensures the stability of the test and facilitates subsequent maintenance operations.

[0020] In this embodiment, the bottom four corners of the encapsulation shell 1 are equipped with support feet that provide stability to the encapsulation shell 1.

[0021] The implementation principle of the water-cooled heat dissipation chip packaging and testing device in this application embodiment is as follows: the chip is installed on the circuit board body 3 by a UV curing machine, the circuit board body 3 is placed in the packaging shell 1, the circuit board body 3 is fixed by a suction cup 401, and then the top cover 6 is installed on the packaging shell 1. At the same time, the connecting tube 205 is inserted into the first air guide tube 202, so that the air supply tube 204 is connected to the first air guide tube 202, ensuring that the gas in the first air guide tube 202 can smoothly enter the air supply tube 204. Then, the circuit board body 3 can be tested by an external tester to see if there are faults such as short circuits.

[0022] When heat is generated during the testing process of the circuit board body 3, the inlet and outlet of the circulating water cooling pipe 201 are connected to an external water cooling source. The fan 501 is started, and outside air enters through the air inlet. First, it passes through the dust filter 5 to block dust and impurities in the air, preventing dust and impurities from entering the packaging shell 1 and contaminating the circuit board body 3. The filtered air enters the cold collection box 2 and carries away the cold air emitted from the circulating water cooling pipe 201. It then enters the first air guide pipe 202 and the second air guide pipe 206. The air entering the first air guide pipe 202 is delivered to the upper jet plate 203 through the air supply pipe 204 and blown towards the top of the circuit board body 3 for heat dissipation. Meanwhile, the cold air in the second air guide pipe 206 is delivered to the lower jet plate 203 and blown towards the bottom of the circuit board body 3 for heat dissipation. The simultaneous delivery of cold air from the top and bottom enables the circuit board body 3 to quickly achieve the effect of heat dissipation.

[0023] All structures in this application can be customized in terms of material and length according to actual usage. The attached drawings are schematic structural diagrams, and the actual dimensions can be adjusted accordingly.

[0024] The above description is only a preferred embodiment of this practice, but the scope of protection of this embodiment is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the scope of the technology disclosed in this embodiment, based on the technical solution and the inventive concept of this embodiment, should be covered within the scope of protection of this embodiment.

Claims

1. A water-cooled heat-dissipation type chip package testing apparatus comprising a package case having an air inlet hole and a circuit board body disposed in the package case, characterized in that, Also include: The air guide mechanism includes a cold collection box fixed on the inner wall of the packaging shell and communicated with the air inlet hole, a circulating water cooling pipe penetrating through the packaging shell and one side of the cold collection box, and a first air guide pipe communicated with the top of the cold collection box. Corresponding to the upper and lower parts of the circuit board body, air injection plates are arranged, and a gas supply pipe is communicated with the upper air injection plate. One end of the gas supply pipe is fixedly provided with a connecting plug which is plug-in connected with the first air guide pipe. A second air guide pipe is communicated with the lower air injection plate and the cold collection box.

2. The water-cooled heat-dissipating chip package testing device according to claim 1, wherein, A fan is installed in the air inlet hole, and a dust screen for filtering gas impurities is detachably installed in the air inlet hole. The packaging shell is provided with an exhaust hole on the side symmetrical to the air inlet hole.

3. The water-cooled heat-dissipating chip package testing device according to claim 1, wherein, A top cover fixedly connected with the air injection plate is detachably installed on the top of the packaging shell.

4. The water-cooled heat-dissipating chip package testing device according to claim 1, wherein, A support rod is fixedly arranged in the bottom wall of the packaging shell, and a suction disc for fixing the circuit board body is installed at the top end of the support rod.

5. The water-cooled heat-sinked die package testing apparatus of claim 1, wherein Supporting feet are installed at the four corners of the bottom of the packaging shell to provide stable support for the packaging shell.

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