A multi-chip testing apparatus

Abstract

The utility model provides a kind of multi-chip testing device, the device includes: shell, shell is equipped with installation cavity;Transmission assembly, it is set in installation cavity, transmission assembly is equipped with multiple parallel settings and synchronous transmission transmission channel;Multiple clamping modules, respectively corresponding installation is on multiple transmission channels, clamping module is used to clamp the chip to be detected;Multiple test modules, set in installation cavity, each test module is used to detect the different function of the chip to be detected, and multiple connection ports are set on each test module, the number of connection port on each test module is equal with the number of transmission channel;Test module and clamping module can be contact connection, to realize the function test to the chip to be detected;Transmission assembly is used to drive clamping module sequentially with multiple test modules contact connection, and stop temporarily in contact position;In the same test time period, each test module is only contact connection with one clamping module.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing equipment technology, and in particular to a multi-chip testing device. Background Technology

[0002] In the field of integrated circuit testing, a single chip typically needs to be tested sequentially by multiple functional test modules to verify the compliance of its logic functions, interface performance, electrical parameters, and other key performance indicators. Different functional tests rely on independently configured test modules for division of labor. Therefore, the testing equipment must have good module interoperability and adaptability to multi-functional test stations to ensure the integrity and accuracy of the testing process.

[0003] Existing multi-chip testing equipment generally adopts a design structure with fixed test channels and fixed test modules, which is mainly suitable for parallel and co-located testing of multiple chips. It is difficult to meet the requirements for time-division functional testing of the same chip by sequentially switching between multiple different test modules. Some solutions use robotic arms or switching mechanisms to achieve switching connections between the chip and multiple test modules, but these solutions have problems such as complex structure, low control precision, poor reliability, and insufficient contact consistency, making them unsuitable for multi-functional segmented testing scenarios of highly integrated chips.

[0004] Therefore, a multi-chip testing device is needed that can connect multiple clamping modules and multiple testing modules in an orderly manner, and complete efficient time-sharing testing of different functional modules of multiple chips, thereby effectively improving testing efficiency and reducing equipment manufacturing and operating costs. Utility Model Content

[0005] This utility model aims to at least solve one of the technical problems existing in the prior art. To this end, one objective of this utility model is to provide a multi-chip testing device in one possible embodiment, comprising: a housing having a mounting cavity; a transmission assembly disposed within the mounting cavity, the transmission assembly having multiple parallel and synchronously driven transmission channels; multiple clamping modules respectively mounted on the multiple transmission channels, the clamping modules being used to clamp a chip to be tested; multiple testing modules disposed within the mounting cavity, each testing module being used to test different functions of the chip to be tested, and each testing module having multiple connection ports, the number of connection ports being equal to the number of transmission channels; the testing modules and the clamping modules being contactably connected to achieve functional testing of the chip to be tested; the transmission assembly being used to drive the clamping modules to sequentially contact and connect with the multiple testing modules, and to briefly stop at the contact position; within the same testing time period, each testing module only contacts and connects with one clamping module.

[0006] In one possible implementation, the transmission assembly includes a conveyor belt fixedly disposed inside the housing, a plurality of transmission channels arranged parallel to the conveyor belt, each transmission channel having a mounting port for mounting the clamping module, and the plurality of mounting ports being evenly distributed along the transmission direction of the conveyor belt.

[0007] In one possible implementation, the conveyor belt includes a driving structure, a driven structure, and a main belt. The main bodies of the driving structure and the driven structure are fixedly disposed on the inner wall of the housing. The driving structure and the driven structure are respectively disposed at both ends of the main belt for driving the main belt to move along the conveying direction.

[0008] In one possible implementation, the conveyor belt, the drive structure, and the driven structure together enclose an installation space, and a plurality of test modules are disposed within the installation space, with the connection port of each test module used to contact and connect with the clamping module during the test.

[0009] In one possible implementation, the test modules are arranged in a linear array along the conveyor belt's transport direction.

[0010] In one possible implementation, the clamping module is fixedly connected to the main belt, so that the movement of the main belt drives the clamping module to move.

[0011] In one possible implementation, the mounting cavity is a rectangular cavity, and the conveyor belt is arranged along the length of the mounting cavity.

[0012] In one possible implementation, the main belt is an annular belt, and the driving structure and the driven structure are located at opposite ends of the main belt.

[0013] In one possible implementation, the connection port of the test module is provided with resiliently retractable contact pins.

[0014] In one possible implementation, an indicator light is also included to indicate the connection status between the clamping module and the test module.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. This utility model provides a multi-chip testing device, including a housing, a transmission assembly, multiple clamping modules, and multiple testing modules. The housing has a mounting cavity, the transmission assembly is disposed within the mounting cavity, and has multiple parallel and synchronously driven transmission channels. Multiple clamping modules are respectively mounted on each transmission channel for clamping the chip to be tested. Multiple testing modules are disposed within the mounting cavity, each testing module having multiple connection ports, the number of which equals the number of transmission channels. The testing modules and clamping modules can make contact connections to complete the functional testing of the chip to be tested. The transmission assembly drives the clamping modules to sequentially make contact with multiple testing modules, briefly stopping at the contact position. Simultaneously, the system controls that only one clamping module is allowed to connect to one testing module during each testing period, thereby avoiding test interference. Furthermore, through the synchronous drive of the transmission assembly, multiple chips sequentially enter each testing station for sub-item testing. The precise alignment and brief stop mechanism between the clamping modules and testing modules ensure the stability and accuracy of the testing connection. At the same time, through the parallel configuration of multiple modules, continuous and automated testing of multiple chips can be achieved. This structure features parallel testing channels, independent workstations, and coordinated actions, which improves testing efficiency, testing accuracy, and device reliability. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the structure of a multi-chip testing device provided in an embodiment of this utility model; Figure 2 for Figure 1 Top view; Figure 3 for Figure 2 A sectional view.

[0018] Explanation of reference numerals in the attached figures: 1. Housing; 2. Mounting cavity; 3. Transmission assembly; 4. Transmission channel; 5. Clamping module; 6. Test module; 7. Connection port; 8. Conveyor belt; 9. Mounting port; 10. Drive structure; 11. Driven structure; 12. Main belt; 13. Mounting space; 14. Indicator light. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0020] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0023] Figure 1 A schematic diagram of the structure of a multi-chip testing device provided in an embodiment of this utility model; Figure 2 for Figure 1 Top view; Figure 3 for Figure 2 A sectional view.

[0024] Please see Figure 1-3In one possible implementation, the system includes a housing 1 with a mounting cavity 2; a transmission assembly 3 disposed within the mounting cavity 2, the transmission assembly 3 having multiple parallel and synchronously driven transmission channels 4; multiple clamping modules 5 respectively mounted on the multiple transmission channels 4, the clamping modules 5 being used to clamp the chip to be tested; multiple test modules 6 disposed within the mounting cavity 2, each test module 6 being used to test different functions of the chip to be tested, and each test module 6 having multiple connection ports 7, the number of connection ports 7 on each test module 6 being equal to the number of transmission channels 4; the test modules 6 being contactably connected to the clamping modules 5 to realize functional testing of the chip to be tested; the transmission assembly 3 being used to drive the clamping modules 5 to sequentially contact and connect with the multiple test modules 6, and to briefly stop at the contact position; within the same test time period, each test module 6 only contacts and connects with one clamping module 5.

[0025] The device utilizes a transmission assembly 3 within the housing 1 to achieve parallel movement of multiple clamping modules 5. Each clamping module 5 moves along an independent transmission channel 4 and clamps a chip under test. Test modules 6 are fixedly installed inside the housing 1, arranged sequentially according to the transmission direction. Each module undertakes different functional testing tasks, including logic verification, current response, frequency matching, and temperature rise testing. Each functional test is completed in an independent module, ensuring stable and interference-free signals. Each test module 6 is equipped with a corresponding connection port 7 for each clamping module 5. The connection port 7 establishes a temporary electrical connection with the clamping module 5 through elastic contacts such as Pogo Pins. The transmission assembly 3 drives the clamping modules 5 forward and briefly stops in front of each test module 6, allowing each chip to sequentially pass through multiple functional tests. To achieve synchronous transmission, a multi-channel synchronous belt assembly (such as the Mitsuboshi S5M-4100-50 model) can be used to ensure precise alignment and uniform speed advancement of each clamping module 5 within the same operating cycle. To prevent test conflicts, the system is designed so that each test module 6 is connected to only one clamping module 5 at any given time, avoiding circuit interference and ensuring accurate measurements.

[0026] This design effectively solves the problems of low testing efficiency, large testing interference, and complex equipment structure in multi-chip batch testing. By adopting synchronous transmission channel 4, a parallel testing process for multiple chips is realized, allowing each chip to complete different functional tests sequentially without manual replacement of test positions, thus improving the automation level and processing capacity of the testing system. Each test module 6 is dedicated to one functional test, which is conducive to independent module optimization and subsequent maintenance, reducing overall maintenance costs. The short-time contact connection between clamping module 5 and test module 6 avoids the wear and tear caused by prolonged electrical contact, improving connection reliability and service life. Through integrated layout and precise synchronous control, this device can be widely used in full-function batch testing scenarios for multi-pin chips, BGA chips, and QFN packaged chips.

[0027] Without altering the basic structure of the device, the clamping module 5 can utilize different clamping structures depending on the chip packaging method. For example, for QFN chips, an SMC MHS2-20D circular gripper can be used. The connection port 7 of the test module 6 can also employ pluggable connectors instead of Pogo Pins to accommodate different packages and test current requirements. Using a slide rail drive instead of a synchronous belt drive can achieve higher transmission accuracy within a limited space. The transmission component 3 can also adopt a multi-motor segmented drive scheme to improve the system's scheduling flexibility. The test modules 6 can be arranged linearly or in a ring according to the chip testing process requirements to adapt to different spatial structures or production cycles.

[0028] Please see Figure 1-2 In one possible implementation, the transmission assembly 3 includes a conveyor belt 8, which is fixedly disposed inside the housing 1. A plurality of transmission channels 4 are arranged in parallel on the conveyor belt 8, and each transmission channel 4 is provided with a mounting port 9 for mounting a clamping module 5. The plurality of mounting ports 9 are evenly distributed along the transmission direction of the conveyor belt 8.

[0029] This structure achieves orderly arrangement and synchronous transmission of multiple chip clamping modules 5 by setting a main conveyor belt 8 inside the housing 1 and designing multiple transmission channels 4 to be distributed parallel to the length of the conveyor belt 8. The conveyor belt 8 can be made of a highly wear-resistant material, such as a steel wire reinforced polyurethane synchronous belt (Mitsubishi S5M-3500-25 model), and is installed inside the housing 1 and fixedly tensioned. Each transmission channel 4 is provided with a dedicated mounting port 9 for mounting the clamping module 5 (such as the SMC MHS3 series three-jaw pneumatic gripper). The mounting port 9 has a pre-reserved positioning groove and fastening hole to ensure that the clamping module 5 is firmly installed and in a consistent position. Along the movement direction of the conveyor belt 8, the multiple mounting ports 9 are arranged at equal intervals, so that the clamping modules 5 can enter under each test module 6 in sequence during the transmission process to complete chip testing.

[0030] This structure primarily addresses the problems of difficult installation, inconsistent positioning, and poor synchronization of the multi-chip clamping modules 5. Through a unified transmission structure and standardized installation interfaces, it achieves unified control and uniform speed movement of multiple clamping modules 5, avoiding chip misalignment or test sequence chaos caused by inconsistent transmission paths. Simultaneously, the parallel transmission channel 4 enables high-density chip arrangement within a limited space, significantly improving the device's testing parallelism and transmission efficiency. The equidistant design of the mounting ports 9 ensures consistent positional spacing of the clamping modules 5 during transmission, facilitating one-to-one correspondence with the test modules 6 and improving the accuracy of contact connections and test stability.

[0031] To meet the needs of different structural layouts and testing processes, this implementation also offers a certain degree of structural flexibility. The conveyor belt 8 can be replaced with a chain-plate conveyor structure (such as the TSUBAKI RS60 roller chain series) to improve load capacity or adapt to high-temperature working environments; the mounting port 9 can also adopt a chute-locking structure to achieve fine-tuning of the clamping module 5's position, enhancing compatibility with irregularly shaped chip fixtures. The number of transmission channels 4 can be increased or decreased according to testing parallelism requirements, and the installation spacing can also be optimized and adjusted according to chip size; simultaneously, it can be combined with an inductive encoder to achieve real-time monitoring and dynamic control of the clamping module 5's position, improving the overall automation level and scheduling accuracy of the system.

[0032] In one possible implementation, the conveyor belt 8 includes a drive structure 10, a driven structure 11, and a main belt 12. The main bodies of the drive structure 10 and the driven structure 11 are fixedly disposed on the inner wall of the housing 1. The drive structure 10 and the driven structure 11 are respectively disposed at both ends of the main belt 12 for driving the main belt 12 to move along the conveying direction.

[0033] This device achieves continuous conveying of the chip clamping module 5 by setting drive structures 10 and driven structures 11 at both ends of the conveyor belt 8, forming a complete closed loop of the main belt 12. The main belt 12 is made of steel wire skeleton polyurethane synchronous belt (such as Gates brand AT10-4000-50), which has high strength, high positioning accuracy and wear resistance, and is suitable for use in high-load precision testing equipment. The drive structure 10 includes a servo motor (such as a Panasonic A6 series 200W servo motor), a drive wheel and a tension adjustment mechanism, which is fixedly installed on one side of the inner wall of the housing 1 to control the movement rhythm of the main belt 12; the driven structure 11 is set on the opposite inner wall and consists of a driven wheel, a bearing seat and a limit block, which supports the operation of the main belt 12 and provides necessary rotation support. The two ends of the main belt 12 mesh with the drive wheel and the driven wheel respectively, forming a complete closed loop of transmission.

[0034] This structure significantly improves the stability and driving accuracy of the transmission system, solving the positioning errors and test offset problems caused by uneven transmission or asymmetrical force in traditional multi-chip testing equipment. The drive structure 10 precisely controls the transmission position and dwell time of each step through a servo system, ensuring that the clamping module 5 can stop accurately below the testing module 6, guaranteeing the stability and consistency of the chip testing connection. The relatively fixed positions of the drive wheel and the driven wheel ensure stable tension of the main belt 12, and the main belt 12 runs without jumping or shaking, thereby further improving the reliability of the entire testing process.

[0035] Please see Figure 2-3 In one possible implementation, the conveyor belt 8, the drive structure 10, and the driven structure 11 together enclose an installation space 13, and a plurality of test modules 6 are disposed within the installation space 13. The connection port 7 of each test module 6 is used to contact and connect with the clamping module 5 during the test.

[0036] In this embodiment, the conveyor belt 8 forms a closed annular motion channel, which, together with the drive structure 10 and driven structure 11 respectively located at its two ends, defines a geometrically stable installation space 13 inside the housing 1. This space is used to centrally arrange multiple test modules 6. Each test module 6 is installed inside the installation space 13 in a predetermined arrangement, such as in a straight line or arc along the conveying path of the main belt 12. This arrangement ensures high installation accuracy and facilitates unified wiring and maintenance. The test module 6 is an integrated electrical test unit, and a customized test board can be selected (e.g., using the NI PXIe-6556 high-speed digital test module 6). Each module includes several connection ports 7, which are used to establish short-term contact connections with the chip pins in the clamping module 5 to complete data acquisition and functional verification.

[0037] With the above structure, the chip under test moves with the main belt 12 within the clamping module 5. When it moves directly below the test module 6 and pauses briefly, the connection port 7 of the test module 6 electrically connects to the chip via contact components (such as highly elastic Pogo pins), enabling signal input and output. The entire testing process can be completed automatically within the conveyor cycle, and data acquisition, signal comparison, and status feedback can be performed in conjunction with an external control system, improving the level of testing automation. A strict one-to-one correspondence is maintained between the test module 6 and the clamping module 5, avoiding test conflicts caused by multiple chips being connected to the same test module 6 simultaneously, ensuring that each chip can independently and completely undergo various functional tests.

[0038] This solution achieves centralized spatial arrangement of test module 6 through structural enclosure, effectively saving the volume of test equipment, enhancing the structure's enclosure and anti-interference capabilities, while also simplifying the wiring complexity of test module 6 and facilitating module maintenance and replacement. The stable and independent test space helps maintain stable electrical environmental conditions, thereby improving the consistency and repeatability of test data.

[0039] Regarding alternative solutions, the installation space 13 can be designed as a closed cavity or an open channel structure according to the test requirements, such as using an aluminum profile frame and an anti-static acrylic plate to form a transparent observation window structure; the test module 6 can be arranged in a U-shaped, L-shaped or circular path to adapt to different equipment housing 1 structures and floor space requirements; the connection port 7 can also use a probe card structure to replace the Pogo probe to improve parallel testing capabilities; adding a temperature control unit (such as an air-cooled fan or a Peltier cooling chip) in the test space can further improve test reliability and environmental stability.

[0040] Please see Figure 1-2 In one possible implementation, the test modules 6 are arranged in a linear array along the conveying direction of the conveyor belt 8.

[0041] In this embodiment, multiple test modules 6 are arranged linearly in sequence according to the movement direction of the conveyor belt 8, forming a linear array structure. This linear array method facilitates the sequential passage of the chip through each functional test module 6 during the testing process, ensuring a clear test path and facilitating cycle control and position determination by the control system. Specifically, aluminum profile guide rails (such as the Bosch Rexroth 45×45 series) can be installed below the conveyor belt 8, with multiple test modules 6 evenly spaced along the conveying direction. The test modules 6 sequentially perform different types of testing tasks, such as logic function testing, voltage response testing, current stability testing, and thermal stress testing. Each module has a built-in independent control unit and data acquisition interface, allowing for integrated test process management using a LabVIEW-based software platform in conjunction with a PXI system.

[0042] Because the conveyor belt 8 and the test module 6 are aligned in the same linear direction, when the clamping module 5 moves with the main belt 12 below the designated test module 6, it ensures that the test position is aligned, reducing docking errors and thus improving the contact accuracy between the chip and the test module 6. Furthermore, the linear arrangement facilitates debugging and maintenance; the test modules 6 are independent of each other and can be replaced and calibrated individually, and it is also convenient to expand with more functional modules.

[0043] This linear array structure solves the problems of cluttered test module layout, excessive signal interference, and low space utilization in traditional test equipment. The linear arrangement has clear logic, facilitating path tracking and scheduling control during chip testing, making it particularly suitable for automated production line applications. This structure also offers excellent scalability; when new testing requirements are added, new test modules can be connected in series online without altering the existing system structure.

[0044] Please see Figure 1-3 In one possible implementation, the clamping module 5 is fixedly connected to the main belt 12, so that the movement of the main belt 12 drives the clamping module 5 to move.

[0045] This embodiment uses a method of directly fixing the clamping module 5 to the surface of the main belt 12 through a mechanical fastening structure, so that the clamping module 5 moves synchronously with the main belt 12 as a whole. The main belt 12 can be an industrial synchronous belt with a threaded hole structure or a guide groove structure, such as the AT series polyurethane reinforced synchronous belt (e.g., Gates AT10-5000 model). The belt surface has evenly distributed mounting holes or T-shaped grooves. The bottom of the clamping module 5 is equipped with mounting protrusions or fastening sliders, and it is directly installed on the main belt 12 by bolt connection or groove locking method, so that it forms a rigid connection relationship with the main belt 12.

[0046] During transmission, when the main belt 12 is driven by the drive structure 10, all clamping modules 5 mounted on it will maintain a relatively fixed position and move synchronously with the main belt 12, thereby ensuring that the chip in each clamping module 5 remains in a constant position throughout the entire test path without shifting. This structure avoids the complexity of requiring each clamping module 5 to be driven independently in the test path, simplifies mechanical design, and improves the accuracy of overall synchronous control. Since the clamping modules 5 have a clearly fixed position on the conveyor belt 8, the system can achieve precise positioning and test cycle control based on position encoder data.

[0047] This structural design effectively solves the problems of position drift, inconsistent driving, and high complexity during the movement of the multi-clamping module 5. By fixing it to the main belt 12, integrated transmission control is achieved, improving motion synchronization and system response speed, making it particularly suitable for high-density chip testing scenarios. At the same time, this design also reduces the clamping module 5's dependence on driving components, lowers maintenance complexity, and makes the transmission mechanism more compact.

[0048] The clamping module 5 can employ a magnetic fixing or quick-connect mechanical snap-fit ​​structure to meet different disassembly and assembly frequency requirements. If the main belt 12 uses a steel strip structure, a magnetic mounting base can be configured at the bottom of the clamping module 5 to achieve threadless installation and quick replacement. For applications that require periodic replacement of the clamping structure to adapt to different chip packages, a modular guide rail combined with a quick-lock structure can be used to achieve rapid sliding in / out of the clamping module 5. In addition, if the width of the conveyor belt 8 allows, multiple rows of clamping modules 5 can be installed along the width direction to achieve multi-column parallel testing and improve equipment throughput.

[0049] Please see Figure 1-3 In one possible implementation, the mounting cavity 2 is a rectangular cavity, and the conveyor belt 8 is arranged along the length direction of the mounting cavity 2.

[0050] In this embodiment, the mounting cavity 2 inside the housing 1 is designed as a rectangular cavity structure, which facilitates the regular arrangement of components on a plane. The conveyor belt 8 is arranged along the length direction of the mounting cavity 2, that is, the long side is the transmission direction, maximizing the extension of the transmission path and effectively utilizing the space of the housing 1. Inside the rectangular cavity, guide rail structures for supporting and guiding the conveyor belt 8 are set on both sides, and the transmission path is arranged in the middle to ensure that the clamping module 5 moves longitudinally with the conveyor belt 8 and passes through the area of ​​the test module 6. The test modules 6 are arranged sequentially along the direction of the conveyor belt 8 at the bottom or top of the rectangular cavity, depending on the test method (contact needle direction).

[0051] The rectangular cavity structure allows for a compact layout and symmetrical components, facilitating overall assembly and maintenance. The longitudinal arrangement of the conveyor belt 8 also offers significant spatial flexibility, allowing for the integration of a larger number of test modules 6 and clamping units, thus increasing test concurrency. In a typical design, the cavity dimensions can be referenced to 600mm × 200mm × 180mm (length × width × height), combining with the Mitsuboshi S5M series conveyor belt 8 and the NI PXI system to form a complete test setup.

[0052] The technical advantage of this structure lies in its clear relationship between the cavity geometry and the conveying direction, which improves the standardization of the device structure and the modular layout, thereby enhancing assembly efficiency and equipment consistency. It is particularly suitable for the industrial needs of mass-producing testing equipment. The rectangular cavity structure facilitates processing using aluminum alloy profiles or sheet metal parts, ensuring structural stability, high processing precision, and allowing for the provision of standard interfaces for future expansion. Arranging the conveyor belt 8 and modules along the long side also reduces internal wiring length, improving electrical wiring efficiency and anti-interference performance.

[0053] Please see Figure 1-3 In one possible implementation, the main belt 12 is an annular belt, and the driving structure 10 and the driven structure 11 are located at the two ends of the main belt 12, respectively.

[0054] In this embodiment, the main belt 12 is a closed-loop annular belt. The annular belt forms a closed loop around the entire transmission path, and its two ends are connected to the drive structure 10 and the driven structure 11, respectively, forming a complete cyclic transmission system. The main belt 12 can be an industrial annular synchronous belt with high wear resistance and low elongation, such as the Mitsuboshi AT10-4800 Endless Belt. The seamless design ensures smooth operation and uniform load distribution. The drive structure 10 is located at one end of the main belt 12 and typically includes a servo motor (such as a Panasonic A6 series 400W) and a matching reduction pulley to provide transmission power. The driven structure 11 is located at the other end and includes a driven pulley and an automatic tensioning mechanism to maintain a constant tension on the main belt 12.

[0055] A ring-shaped conveyor belt is laid out along the entire conveying path. Clamping modules 5 are fixedly mounted on the outer surface of the main belt 12, continuously conveying chips as the main belt 12 moves. Because the main belt 12 has a closed structure, all clamping modules 5 can return to their initial point after completing the testing process, forming a stable cyclic operation mechanism suitable for continuous batch testing tasks. The main belt 12 moves continuously along the testing path, moving each clamping module 5 one by one under the testing module 6 for functional testing before continuing operation. The entire process requires no manual intervention.

[0056] This solution provides a complete closed-loop transmission system, effectively solving the problems of path conflict, structural redundancy, and low return efficiency inherent in traditional reciprocating transmission methods. The ring belt design ensures that clamping module 5 is reusable, reducing the number of modules required and the frequency of replacement, thus improving system resource utilization efficiency. Simultaneously, this structure enables the device to operate stably for extended periods within a confined space, enhancing operational reliability and reducing maintenance cycles.

[0057] The annular main belt 12 can be replaced with a chain-type closed-loop transmission mechanism (such as the TSUBAKI sprocket system), suitable for heavy-duty chip fixture transmission requirements; the positions of the drive structure 10 and the driven structure 11 can be interchanged left and right, or even configured above and below the equipment, to accommodate different installation environments and spatial layouts; the material of the main belt 12 can be a double-tooth surface structure to achieve bidirectional positioning; the tensioning mechanism can be a cylinder-type automatic tensioning device to improve the lifespan and transmission stability of the main belt 12. If a breakpoint dynamic insertion test function is required, a dynamic bifurcation mechanism can also be set in the annular belt path to realize online switching and diversion of the clamping module 5.

[0058] Please see Figure 3 In one possible implementation, the connection port 7 of the test module 6 is provided with a resiliently retractable contact pin.

[0059] In this embodiment, each test module 6 has a set of resiliently extendable contact pins installed inside its connection port 7. These pins are used to establish a reliable temporary electrical connection with the chip pins held in the clamping module 5 during testing. The contact pins can be industrial-grade Pogo Pin probes (such as the Plastronics C93 series), which feature high elasticity, low contact resistance, and long wear life. Each connection port 7 has several contact pins arranged according to the chip package type, with the arrangement matching the chip pins. This ensures that after the clamping module 5 is positioned, the contact pins can securely contact the electrodes of the chip through the bottom or side.

[0060] The elastic structure of the contact pin typically consists of a spring pin core, a positioning housing 1, and a guide sleeve. The spring pin core can generate axial displacement when compressed, ensuring good contact force within a certain tolerance range. During testing, when the clamping module 5 moves under the drive of the conveyor belt 8 above the testing module 6 and pauses briefly, the chip, driven by its own weight or the clamp, presses against the contact pin at the connection port 7, completing the electrical circuit connection. After the test, the main belt 12 continues to run, and the contact pin automatically springs back to its original position, ready for the next contact.

[0061] This structure significantly improves the stability and repeatability of test connections, solving the problems of poor contact and test distortion caused by inaccurate positioning or insufficient clamping force in traditional connector interfaces. The flexible contact pins can adapt to pin deviations or slight displacements in chip packages and have an automatic compensation function; at the same time, its high-frequency contact performance is suitable for batch continuous testing scenarios, with low maintenance costs and high connection accuracy, especially suitable for leadless or pad-type chips such as BGA and QFN.

[0062] In the replacement design, different models of contact pins can be selected according to different test current, voltage, or frequency levels, such as high-current Pogo Pins (current > 5A) or high-speed signal pins (signal frequency > 3GHz). The connector 7 body can be designed with a dust cover and a micro-negative pressure sealing structure to improve long-term operational reliability, depending on the test environment. If the test module 6 has a modular board structure, the contact pins can also be integrated into the pluggable test head for easy replacement and standardized management. In addition, for special chip testing scenarios, conductive rubber pads or miniature clamping probe arrays can be used to replace Pogo Pins to improve contact adaptability and maintainability.

[0063] Please see Figure 1-3 In one possible implementation, an indicator light 14 is also included, which is used to indicate the connection status between the clamping module 5 and the test module 6.

[0064] This implementation adds an indicator light 14 module to the multi-chip testing device to indicate whether the clamping module 5 and the testing module 6 have been successfully connected. The indicator light 14 is typically an LED component (such as the OSRAM SFH 4059 series), installed in a visible position on the testing module 6, and linked to the connection detection circuit via an internal control system. When the clamping module 5 moves under the drive of the conveyor belt 8 and makes contact with the testing module 6, the testing module 6 detects a change in contact resistance or a connection signal, determines the contact status based on a preset threshold, and drives the corresponding indicator light 14 to illuminate. The light color can be differentiated according to the connection status: green indicates a normal connection, red indicates a failed connection, and yellow indicates testing in progress or pending testing.

[0065] The power supply and control signals of indicator light 14 can be uniformly wired through the main board of test module 6, and the status identification and drive control are performed by the main control unit (such as PLC or embedded microcontroller STM32F4 series). During the test, technicians can quickly determine whether the clamping module 5 is in good contact with the test module 6 based on the status of indicator light 14. If a connection abnormality or test failure occurs, an immediate response can be made to avoid data errors or chip damage caused by poor contact.

[0066] This architecture significantly enhances the visualization, real-time feedback, and troubleshooting capabilities of multi-chip testing equipment, making it particularly suitable for high-speed automated testing production lines. Real-time status alerts effectively reduce operational error rates, improve production efficiency, and facilitate quick location of faulty fixtures or connection points by maintenance personnel, thereby enhancing the maintainability and stability of the equipment.

[0067] The indicator light 14 can be replaced with a three-color signal tower light, an OLED small display screen, or a buzzer to adapt to different factory environments and personnel operating habits; it can also be integrated with industrial buses (such as Modbus, CANopen) to achieve unified monitoring of the network status of multiple devices; the connection status detection method can use Hall elements, capacitive proximity sensors, or photoelectric detection devices to achieve non-contact connection status identification; the indicator light 14 can also be installed in the centralized display area on the outside of the housing 1 for easy centralized observation from a distance.

[0068] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0069] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

[0070] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0071] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A multi-chip testing device, characterized in that, include: The housing has an installation cavity; A transmission assembly is disposed within the mounting cavity, and the transmission assembly is provided with multiple parallel and synchronously driven transmission channels; Multiple clamping modules are respectively installed on the multiple transmission channels, and the clamping modules are used to clamp the chip to be tested; Multiple test modules are disposed within the mounting cavity. Each test module is used to test different functions of the chip under test, and each test module is provided with multiple connection ports. The number of connection ports on each test module is equal to the number of transmission channels. The test module and the clamping module can be connected in contact to perform functional testing on the chip under test; The transmission assembly is used to drive the clamping module to sequentially contact and connect with multiple test modules, and to briefly stop at the contact position; During the same test period, each test module only contacts and connects with one clamping module.

2. The multi-chip testing device according to claim 1, characterized in that, The transmission assembly includes a conveyor belt, which is fixedly disposed inside the housing. Multiple transmission channels are arranged in parallel on the conveyor belt, and each transmission channel is provided with a mounting port for installing the clamping module. The multiple mounting ports are evenly distributed along the transmission direction of the conveyor belt.

3. The multi-chip testing device according to claim 2, characterized in that, The conveyor belt includes a driving structure, a driven structure, and a main belt. The main bodies of the driving structure and the driven structure are fixedly disposed on the inner wall of the housing. The driving structure and the driven structure are respectively disposed at both ends of the main belt and are used to drive the main belt to move along the conveying direction.

4. The multi-chip testing device according to claim 3, characterized in that, The conveyor belt, the driving structure, and the driven structure together form an installation space, and multiple test modules are arranged within the installation space. The connection port of each test module is used to contact and connect with the clamping module during the test.

5. The multi-chip testing device according to claim 4, characterized in that, The test modules are arranged in a linear array along the conveyor belt's conveying direction.

6. The multi-chip testing device according to claim 4, characterized in that, The clamping module is fixedly connected to the main belt, so that the movement of the main belt drives the clamping module to move.

7. The multi-chip testing device according to claim 4, characterized in that, The mounting cavity is a rectangular cavity, and the conveyor belt is arranged along the length of the mounting cavity.

8. The multi-chip testing device according to claim 6, characterized in that, The main belt is an annular belt, and the driving structure and the driven structure are located at both ends of the main belt, respectively.

9. The multi-chip testing device according to claim 4, characterized in that, The test module's connection port is equipped with retractable contact pins.

10. The multi-chip testing apparatus according to any one of claims 1-9, characterized in that, It also includes indicator lights, which are used to indicate the connection status between the clamping module and the test module.

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