A detection device for encapsulation wire bonding machine motion to position
Patent Information
- Application Number
- CN202522302464.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-30
- Publication Date
- 2026-08-18
- Estimated Expiration
- 2035-10-30
AI Technical Summary
这种方式不仅极大地增加了人员的工作负荷,而且受主观判断、视觉疲劳等因素影响,难以持续、可靠地发现毫米级的微小行程偏差,无法满足现代化智能制造对自动化和高可靠性的要求
本实用新型提供了一种用于封装焊线机运动到位的检测装置,通过设置与焊线机台控制系统通信连接的光电传感器、逻辑控制板及报警器,构建了一个独立的外挂式检测闭环,实现了对运动部件是否到位的实时、自动检测与报警。该装置有效克服了原有设备因无反馈机制而依赖人工目视检查的弊端,能即时发现毫米级的运动行程偏差,从根本上预防了因部件未到位而压伤芯片(DIE)的重大质量事故,显著提升了生产过程的可靠性、自动化程度和产品良率,且结构简单,无需改动设备原有控制系统,改造成本低、易于实施,很大程度上提高了本实用新型的可用性与可靠性。
Smart Images

Figure CN224651580U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of detecting the positioning of a wire bonding machine, specifically to a detection device for the positioning of a wire bonding machine. Background Technology
[0002] Wire bonding machines are key pieces of equipment in the semiconductor back-end packaging process, used to connect the electrodes of a die (DIE) to the pins of a lead frame using fine gold or copper wires. During this process, multiple actuators within the machine need to perform high-frequency, short-stroke (typically millimeter-level) precision coordinated movements. The accuracy with which these components move to their designated positions directly determines the stability of the wire bonding process and the quality of the finished product.
[0003] Currently, after the main control system of the wire bonding machine issues a motion command, it assumes that the actuator has completed the action according to the preset program. This solution lacks an effective detection and feedback mechanism to ensure that the actuator has moved accurately and precisely into position. However, when the actuator fails to move to the correct position (insufficient stroke) or becomes completely stuck due to mechanical wear, poor lubrication, drive failure, or obstruction by small foreign objects, the existing equipment cannot detect this abnormality in real time. Operators often only discover the fault in subsequent processes (such as chip damage or wire bonding failure) or after the equipment has been completely shut down, by which time a large number of products have been scrapped or the equipment has been damaged. In addition, in some cases, operators need to visually observe the movement of key components through the equipment's viewing window. This method not only greatly increases the workload of personnel, but is also affected by subjective judgment and visual fatigue, making it difficult to continuously and reliably detect minute stroke deviations down to the millimeter level, failing to meet the requirements of modern intelligent manufacturing for automation and high reliability.
[0004] Therefore, there is an urgent need for a device with a simple structure that does not require modification to the original control system of the equipment, can be externally installed and can detect in real time whether millimeter-level moving parts are in place, and can promptly alarm in case of abnormality, so as to solve the shortcomings of the above-mentioned existing technologies.
[0005] Therefore, the existing technology still needs further development. Utility Model Content
[0006] The purpose of this invention is to overcome the above-mentioned technical deficiencies and provide a detection device for the positioning of a wire bonding machine, so as to solve the problems existing in the prior art.
[0007] To achieve the above-mentioned technical objectives, this utility model provides a detection device for the positioning of a wire bonding machine, including a wire bonding machine platform and a wire bonding machine platform control system. The detection device further includes: A photoelectric sensor is installed on the wire bonding machine. The photoelectric sensor is communicatively connected to the control system of the wire bonding machine. The photoelectric sensor is used to detect the position of the incoming moving parts and generate a sensing signal. A logic control board is fixedly mounted on the wire bonding machine and electrically connected to the photoelectric sensor. The logic control board is used to receive the incoming material signal on the wire bonding machine and transmit the incoming material signal to the photoelectric sensor. An alarm is communicatively connected to the wire bonding machine control system and is used to issue an alarm signal according to the instructions of the wire bonding machine control system.
[0008] Specifically, it also includes relays, and the signal output terminal of the logic control board is connected to the electrical control circuit of the alarm through the relays.
[0009] Specifically, the detection device also includes an adjustable base, on which the photoelectric sensor is mounted, and the adjustable base is used to fix the photoelectric sensor.
[0010] Specifically, the adjustable base includes a mounting part for mounting a photoelectric sensor, an adjustment part, and a locking mechanism. By releasing the locking mechanism, the mounting part is driven to move relative to the adjustment part to adjust its position.
[0011] Specifically, the detection device further includes a calibration unit and a display unit. The calibration unit is communicatively connected to the alarm and is used to set the alarm parameters of the alarm. The display unit is communicatively connected to the photoelectric sensor and is used to display the sensing signal value of the photoelectric sensor.
[0012] Specifically, the logic control board is also equipped with an external signal interface for receiving motion start signals from the wire bonding machine equipment control system.
[0013] Specifically, the alarm is an audible and visual alarm.
[0014] Specifically, it also includes a protective housing, with the logic control board and the alarm located inside the protective housing.
[0015] Specifically, the external signal interface is connected in parallel to the signal output terminal of the wire bonding machine equipment control system via a communication line.
[0016] Specifically, the photoelectric sensor is a through-beam photoelectric sensor or a reflective photoelectric sensor.
[0017] Beneficial effects: This invention provides a detection device for the positioning of moving parts in a wire bonding machine. By setting up photoelectric sensors, a logic control board, and an alarm that are communicatively connected to the wire bonding machine's control system, an independent external detection closed loop is constructed, realizing real-time, automatic detection and alarm for whether moving parts are in position. This device effectively overcomes the drawbacks of the original equipment, which relies on manual visual inspection due to the lack of a feedback mechanism. It can instantly detect millimeter-level deviations in movement stroke, fundamentally preventing major quality accidents such as chip (DIE) damage caused by parts not being in position. It significantly improves the reliability, automation level, and product yield of the production process. Moreover, it has a simple structure, requires no modification to the original control system of the equipment, has low modification costs, and is easy to implement, greatly improving the usability and reliability of this invention. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of the detection device for the positioning of the wire bonding machine provided in a specific embodiment of this utility model; Figure 2 This is a schematic diagram of the adjustable base provided in a specific embodiment of the present utility model; The above figures include the following reference numerals: 1. Top connecting rod; 2. Guide sleeve; 3. Fixing bracket; 4. Locking screw; 5. Fine-tuning gap; 6. Mounting part. Detailed Implementation
[0019] To enable those skilled in the art to better understand the technical solution of this utility model, the technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Based on the embodiments in this application, other similar embodiments obtained by those skilled in the art without creative effort should all fall within the scope of protection of this application. Furthermore, directional terms mentioned in the following embodiments, such as "up," "down," "left," and "right," are only for reference to the directions in the accompanying drawings; therefore, the directional terms used are for illustrative purposes and not for limiting the scope of this utility model.
[0020] The present invention will be further described below with reference to the accompanying drawings and preferred embodiments.
[0021] like Figure 1 and Figure 2 As shown, the present invention provides a detection device for the positioning of a wire bonding machine. As an external independent module, it is installed on the existing wire bonding machine and works in conjunction with its original machine control system. It does not require modification of the host internal program and realizes automatic detection of whether the millimeter-level moving parts are in position.
[0022] See Figure 1In this embodiment, the detection device for the positioning of the wire bonding machine mainly includes a photoelectric sensor, a logic control board, and an alarm. The photoelectric sensor is mounted on the wire bonding machine platform and is communicatively connected to the wire bonding machine platform control system. The photoelectric sensor is used to detect the position of the incoming material moving parts and generate a sensing signal. The logic control board is fixedly mounted on the wire bonding machine platform and electrically connected to the photoelectric sensor. The logic control board is used to receive the incoming material signal on the wire bonding machine platform and transmit the incoming material signal to the photoelectric sensor. The alarm is communicatively connected to the wire bonding machine platform control system and is used to issue an alarm signal according to the instructions of the wire bonding machine platform control system.
[0023] Specifically, the photoelectric sensor is fixedly mounted on the wire bonding machine near the moving part to be detected via an adjustable base. The photoelectric sensor is preferably a through-beam type, comprising a transmitter and a receiver that are separated and precisely aligned. When the moving part (such as the wire clamping arm of the wire bonding machine) moves into the optical path between the transmitter and receiver, it blocks the light beam, causing a jump in the induced signal output by the receiver. Of course, depending on the detection environment, a reflective photoelectric sensor can also be used. This photoelectric sensor is communicatively connected to the wire bonding machine control system via a signal line (not shown in the figure) to upload its generated induced signal in real time.
[0024] Furthermore, the logic control board is fixedly installed in a suitable location on the wire bonding machine that does not affect operation, such as the inner wall of the chassis or an external bracket, using screws or other means. The logic control board is electrically connected to the photoelectric sensor via a cable. More importantly, the logic control board is equipped with an external signal interface (such as an I / O port or aviation connector) and is connected in parallel to the signal output terminal of the wire bonding machine's control system via a communication line. This parallel connection allows the logic control board to synchronously receive the "motion start" signal (i.e., material arrival signal) from the machine's control system and to feed back the processed signal (such as an alarm trigger signal) to the machine's control system.
[0025] In some specific implementations, the alarm is preferably an audible and visual alarm, including a buzzer and a warning light, to provide dual warnings through hearing and sight. The alarm is also connected to the wire bonding machine control system via a communication line to receive indication signals and execute alarm actions.
[0026] To further enhance control reliability and isolate strong and weak currents, the detection device also includes a relay. The signal output terminal of the logic control board is electrically connected to the control coil of the relay, while the normally open contact of the relay is connected in series in the power supply circuit of the alarm. When the logic control board determines that an alarm is needed, it outputs a signal to drive the relay to engage, thereby connecting the power supply to the alarm and causing it to emit an audible and visual alarm.
[0027] See Figure 2 In this embodiment, the adjustable base is a key mechanical structure for achieving millimeter-level precision adjustment. It mainly includes: an adjustment part fixed to the machine base by locking screws, a mounting part 6 for clamping and fixing the photoelectric sensor, and a locking mechanism.
[0028] Further, see Figure 2 The adjustable base includes a top connecting rod 1 and a guide sleeve 2. The top connecting rod 1 is cylindrical, and the guide sleeve 2 has an axial through hole. The top connecting rod 1 can be slidably inserted into the guide sleeve 2, forming an axial sliding fit. The locking mechanism includes a fixed bracket 3 and locking screws 4. The fixed bracket 3 is plate-shaped, and two locking screws 4 are provided on the fixed bracket 3. The fixed bracket 3 and the locking screws 4 cooperate to fix the guide sleeve 2 on the wire bonding machine. By loosening the locking screws 4, the operator can precisely fine-tune the position of the adjustable base, thereby driving the photoelectric sensor to make slight movements up and down, left and right, or in angles, ensuring that the optical path is aligned with the precise detection point of the moving part. After adjustment, tightening the locking screws 4 will fix it.
[0029] Further, see Figure 2 The adjustable base also includes a fine-tuning gap 5, which is located on one side of the fixed bracket 3. It is a narrow opening that runs through the side and is used to generate elastic deformation through external force to achieve fine-tuning in the horizontal direction. The width of the gap can be adjusted by a feeler gauge, thereby adjusting the position of the photoelectric sensor. The mounting part 6 is located below the fine-tuning gap 5 and is used to fix the photoelectric sensor.
[0030] In some specific embodiments, to achieve intelligent device settings, the logic control board integrates a calibration unit and a display unit. The calibration unit is materialized as one or more physical buttons (such as a "Teach" button) used to set alarm threshold parameters. Its workflow is as follows: when the device is in its normal position, the operator presses the "Teach" button, and the logic control board collects the sensor signal value (such as the AD conversion value) and stores it as a reference value (displayed as "0" on display unit 22). The display unit is a small LCD or LED display screen used to display the current sensor signal value in real time. When the device fails to reach its position during subsequent production, the sensor signal value will deviate from the reference value (e.g., displaying "70"), and the logic control board will determine this as an anomaly.
[0031] Understandably, to protect core electronic components from dust, oil, or accidental impacts in the workshop environment, the logic control board and alarm can be installed together inside a protective housing made of metal or engineering plastic and fixed to the wire bonding machine by a bracket.
[0032] It should be further explained that the working principle of this utility model is as follows: The wire bonding machine control system issues commands to initiate the movement of the moving parts. This signal is synchronously transmitted to the logic control board via parallel communication lines. Upon receiving the signal, the logic control board immediately activates the detection function. Photoelectric sensors continuously monitor the position of the moving parts. If the part moves into position within a predetermined time and blocks the light path, and the change in the sensed signal is within a threshold range, the logic control board determines it is normal and the process ends. If the part does not reach its position, the sensed signal is abnormal, and the logic control board activates the alarm via a relay, sending an alarm signal to the machine control system. The wire bonding machine control system can then trigger the alarm and perform safety operations such as pausing or slowing down at the software level. After hearing or seeing the alarm, the operator must confirm the fault on-site and clear the alarm before the equipment can continue operating.
[0033] It should be noted that this embodiment provides a detection device for the positioning of a wire bonding machine. By setting up photoelectric sensors, a logic control board, and an alarm that are communicatively connected to the wire bonding machine's control system, an independent external detection closed loop is constructed, realizing real-time, automatic detection and alarm for whether moving parts are in position. This device effectively overcomes the drawback of the original equipment, which relies on manual visual inspection due to the lack of a feedback mechanism. It can instantly detect millimeter-level deviations in movement stroke, fundamentally preventing major quality accidents such as chip (DIE) damage due to parts not being in position. It significantly improves the reliability, automation level, and product yield of the production process. Moreover, it has a simple structure, requires no modification to the original control system of the equipment, has low modification costs, and is easy to implement, greatly improving the usability and reliability of this utility model.
[0034] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Therefore, any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model's technical solution shall still fall within the scope of the present utility model's technical solution.
[0035] The technical features described above can be combined arbitrarily. Although not all possible combinations of these technical features are described, any combination of these technical features should be considered to be covered by this specification, provided that such combination does not contain contradictions.
[0036] The specific embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any other corresponding changes and modifications made based on the technical concept of this utility model should be included within the scope of protection of the claims of this utility model.
Claims
1. A detection device for detecting the movement of a wire bonder to a position, comprising a wire bonder table and a wire bonder table control system, characterized in that, The detection device further includes: A photoelectric sensor is installed on the wire bonding machine. The photoelectric sensor is communicatively connected to the control system of the wire bonding machine. The photoelectric sensor is used to detect the position of the incoming moving parts and generate a sensing signal. A logic control board is fixedly mounted on the wire bonding machine and electrically connected to the photoelectric sensor. The logic control board is used to receive the incoming material signal on the wire bonding machine and transmit the incoming material signal to the photoelectric sensor. An alarm is communicatively connected to the wire bonding machine control system and is used to issue an alarm signal according to the instructions of the wire bonding machine control system.
2. The apparatus for detecting the movement of a wire bonding machine according to claim 1, wherein It also includes a relay, and the signal output terminal of the logic control board is connected to the electrical control circuit of the alarm through the relay.
3. The detection device for detecting the positioning of a wire bonding machine according to claim 1, characterized in that, The detection device also includes an adjustable base, on which the photoelectric sensor is mounted, and the adjustable base is used to fix the photoelectric sensor.
4. The apparatus for detecting the movement of a wire bonding machine according to claim 3, wherein The adjustable base includes a mounting part for mounting a photoelectric sensor, an adjustment part, and a locking mechanism. By releasing the locking mechanism, the mounting part is driven to move relative to the adjustment part to adjust its position.
5. The apparatus for detecting the movement of a wire bonding machine according to claim 1, wherein The detection device further includes a calibration unit and a display unit. The calibration unit is communicatively connected to the alarm and is used to set the alarm parameters of the alarm. The display unit is communicatively connected to the photoelectric sensor and is used to display the sensing signal value of the photoelectric sensor.
6. The apparatus for detecting the movement of a wire bonding machine according to claim 1, wherein The logic control board is also equipped with an external signal interface for receiving motion start signals from the wire bonding machine equipment control system.
7. The apparatus for detecting the movement of a wire bonding machine according to claim 1, wherein The alarm is an audible and visual alarm.
8. The detection device for detecting the positioning of a wire bonding machine according to claim 1, characterized in that, It also includes a protective housing, with the logic control board and the alarm located inside the protective housing.
9. A detection device for detecting the positioning of a wire bonding machine according to claim 6, characterized in that, The external signal interface is connected in parallel to the signal output terminal of the wire bonding machine equipment control system via a communication line.
10. The detection device for detecting the positioning of a wire bonding machine according to claim 1, characterized in that, The photoelectric sensor is either a through-beam photoelectric sensor or a reflective photoelectric sensor.