Display module structure

Abstract

The utility model embodiment belongs to display module technical field. The utility model still relates to a kind of display module structure, comprising: display screen main body, drive IC and FPC binding position, wherein drive IC and FPC binding position are designed at the upper and lower ends of display screen main body respectively, and ITO wiring is connected between drive IC and FPC binding position. The application is by drive IC and FPC binding position respectively set in the upper and lower ends of display screen main body, shorten the lower frame length of display screen main body, compared with conventional COG design scheme, the frame size of the utility model is reduced, meet the demand of consumer to ultra-narrow frame product, improve the market competitiveness of product.

Description

Technical Field

[0001] This utility model relates to the field of display module technology, and more specifically, to a display module structure. Background Technology

[0002] As people's living standards continue to improve, smart wearable devices such as bracelets and watches are becoming increasingly popular, and market competition is becoming more and more intense. Consumers have higher and higher requirements for the appearance of smart wearable devices, especially fashion wearable products. OEMs are pursuing the ultimate bezel design to increase the screen ratio of their products and meet consumers' demand for ultra-narrow bezel display modules. However, in the existing COG (ChipOnGlass, i.e., the chip is directly bonded to the glass) structure display module design, due to the limitation of the IC (integrated circuit) and FPC (flexible circuit board) bonding position size, the bezel often cannot be further reduced, which does not meet consumers' expectations for ultra-narrow bezel products. Specifically, in conventional COG-type display module designs, a driver IC is bonded below the display's viewing area. Above the driver IC, ITO (Indium Tin Oxide, primarily used for creating transparent conductive coatings in liquid crystal displays) traces output drive signals to the glass viewing area to display the relevant image. Below the driver IC are FPC bonding pads for bonding the FPC, which connects to the motherboard. The motherboard transmits relevant power and drive timing signals through the FPC to ensure the IC functions correctly. Conventional COG solutions place the FPC bonding pads below the driver IC on the glass, resulting in a wider bottom bezel, which does not meet the design requirements for ultra-narrow bezels. Therefore, we propose an improved display module structure. Utility Model Content

[0003] The technical problem to be solved by this utility model embodiment is that the FPC bonding bit is designed below the driver IC, resulting in a wider bottom bezel of the glass.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: A display module structure includes: a display screen body, a driver IC, and an FPC bonding position, wherein the driver IC and the FPC bonding position are respectively designed at the upper and lower ends of the display screen body, and an ITO trace connects the driver IC and the FPC bonding position.

[0005] As an improvement of this utility model, the ITO traces are distributed on the left and right edges of the display screen body, and the input signal of the driver IC is electrically connected through the ITO traces and the FPC bonding bits.

[0006] As an improvement of this utility model, the driver IC is located at the top of the display body, while the FPC mounting position remains at the bottom of the display body. By setting the driver IC and FPC mounting position at the top and bottom ends of the display body respectively, the length of the bottom bezel of the display body is shortened. Compared with the conventional COG design, the bezel size of this utility model is reduced, which meets the consumer demand for ultra-narrow bezel products and enhances the market competitiveness of the product.

[0007] As an improvement of this utility model, the FPC binding bit is bound to the main screen FPC.

[0008] As an improvement of this utility model, EMI shielding films are attached to both the front and back of the main screen FPC. With the increasing popularity and application of electronic devices, the electromagnetic environment is becoming more and more complex, and electromagnetic interference is becoming more and more prominent. As an electronic device that is relatively sensitive to electromagnetic interference, the display module needs to take effective shielding measures to ensure its normal operation. Attaching an EMI shielding film is a simple and effective shielding method. It can block the propagation of electromagnetic waves and reduce the impact of electromagnetic interference on the display module.

[0009] As an improvement of this utility model, an FPC reinforcing plate is connected to the end of the main screen FPC away from the FPC binding position, and a gold finger is provided on the side of the main screen FPC away from the FPC reinforcing plate.

[0010] As an improvement of this utility model, the surface of the gold finger is provided with an anti-corrosion layer, which is a gold-plated layer; this improves the corrosion resistance of the gold finger and extends its service life. During long-term use, the gold finger may be corroded by factors such as moisture, oxygen, and chemicals in the environment, leading to poor contact or signal transmission interruption. The gold-plated layer has good corrosion resistance and can effectively prevent the gold finger from being corroded, ensuring the reliability of signal transmission.

[0011] As an improvement of this utility model, a CELL filling seal is provided on the side of the display screen body, and the CELL filling seal is located on the left or right side of the display screen body.

[0012] As an improvement of this utility model, the edge of the CELL filling and sealing port is chamfered.

[0013] As an improvement of this utility model, the back of the display screen body is provided with insulating double-sided adhesive, and a release film is attached to the side of the insulating double-sided adhesive away from the display screen body.

[0014] Compared with the prior art, the embodiments of this utility model have the following main advantages: To address the issue of a wide bottom bezel in existing technologies where the FPC bonding pad is located below the driver IC, this application shortens the bottom bezel length by placing the driver IC and FPC bonding pad at the top and bottom of the display body, respectively. Compared to conventional COG designs, this invention reduces the bezel size, meeting consumer demand for ultra-narrow bezel products and enhancing the product's market competitiveness. Attached Figure Description

[0015] Figure 1 This is a structural schematic diagram of the display module structure provided in this application; Figure 2 This is a structural schematic diagram of the main body of the display screen provided in this application; Figure 3 A partial structural schematic diagram of the main body of the display screen provided in this application; Figure 4 This is a schematic diagram of the structure of the main screen FPC provided in this application.

[0016] The image shows: 1. Display screen body; 102. Driver IC; 103. FPC bonding position; 104. CELL filling and sealing; 2. Main screen FPC; 201. EMI shielding film; 202. FPC reinforcement plate. Detailed Implementation

[0017] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The reference herein to "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0018] As described in the background section, in conventional COG-type display module designs, a driver IC is bonded below the display screen's viewing area. Above the driver IC, there are ITO (Indium Tin Oxide, mainly used to make transparent conductive coatings for liquid crystal displays) traces that output drive signals to the glass viewing area to display the relevant image. Below the driver IC is the FPC bonding pad, used to bond the FPC. The FPC connects to the motherboard, and the motherboard transmits relevant power and drive timing signals through the FPC to enable the IC to work normally. Conventional COG solutions design the FPC bonding pad on the glass below the driver IC, resulting in a wider bottom bezel of the glass, which does not meet the design requirements for ultra-narrow bezels.

[0019] To solve this technical problem, this utility model provides a display module structure.

[0020] For details, please refer to Figures 1-4 The display module structure specifically includes: The display body 1, driver IC 102, and FPC bonding position 103 are respectively designed at the upper and lower ends of the display body 1, and ITO traces are connected between driver IC 102 and FPC bonding position 103.

[0021] The display module structure provided by this utility model shortens the length of the lower bezel of the display body 1 by setting the driver IC 102 and FPC binding position 103 at the upper and lower ends of the display body 1 respectively. Compared with the conventional COG design, the bezel size of this utility model is reduced, which meets the consumer demand for ultra-narrow bezel products and enhances the market competitiveness of the product.

[0022] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0023] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0025] Embodiment 1 of the display module structure of this utility model Please refer to Figures 1-4The display module structure of this utility model includes: a display screen body 1, a driver IC 102, and an FPC bonding position 103. The driver IC 102 and the FPC bonding position 103 are respectively designed at the upper and lower ends of the display screen body 1, and an ITO trace connects the driver IC 102 and the FPC bonding position 103. By setting the driver IC 102 and the FPC bonding position 103 at the upper and lower ends of the display screen body 1, this application shortens the length of the lower bezel of the display screen body 1. Compared with the conventional COG design, the bezel size of this utility model is reduced, which meets the consumer demand for ultra-narrow bezel products and enhances the market competitiveness of the product.

[0026] Furthermore, the ITO traces are distributed on the left and right bezels of the display body 1. The input signal of the driver IC 102 is electrically connected to the FPC bonding position 103 through the ITO traces. Distributing the ITO traces on the left and right bezels reduces mutual interference between traces, reduces signal attenuation and noise, and ensures that the input signal of the driver IC 102 can be stably and accurately transmitted to the FPC bonding position 103. This ensures the normal operation of the display module, improves the quality of the display effect, and reduces the situation where single-sided traces occupy a large space on one side.

[0027] Furthermore, the driver IC 102 is located at the top of the display body 1, while the FPC bonding bit 103 is located at the bottom of the display body 1.

[0028] Embodiment 2 of the display module structure of this utility model Furthermore, in the display module structure of this utility model, the FPC binding position 103 is bound to the main screen FPC2; the binding of the main screen FPC2 realizes the connection between the display body 1 and the external circuit, which is the basis for the normal operation of the display module. It can transmit the signals generated by the display body 1 to the external device for processing, and at the same time, it can also transmit the control signals of the external device to the display body 1 to realize the control of the display content.

[0029] Furthermore, EMI shielding film 201 is attached to both the front and back of the main screen FPC2. With the increasing popularity and application of electronic devices, the electromagnetic environment is becoming more and more complex, and electromagnetic interference is becoming more and more prominent. As an electronic device that is relatively sensitive to electromagnetic interference, the display module needs to take effective shielding measures to ensure its normal operation. Attaching EMI shielding film 201 is a simple and effective shielding method. It can block the propagation of electromagnetic waves and reduce the impact of electromagnetic interference on the display module.

[0030] Furthermore, an FPC reinforcing plate 202 is connected to the end of the main screen FPC2 away from the FPC binding position 103, and a gold finger is provided on the side of the main screen FPC2 away from the FPC reinforcing plate 202; the FPC reinforcing plate 202 enhances the strength of the corresponding part of the main screen FPC2 and the gold finger, making it easier to insert and remove the gold finger; the gold finger facilitates reliable connection with external connectors, ensuring the quality of signal transmission.

[0031] Furthermore, the surface of the gold fingers is provided with an anti-corrosion layer, which is a gold-plated layer with a thickness of 0.01-0.05 micrometers. This improves the corrosion resistance of the gold fingers and extends their service life. During long-term use, the gold fingers may be corroded by factors such as moisture, oxygen, and chemicals in the environment, leading to poor contact or signal transmission interruption. The gold-plated layer has excellent corrosion resistance, which can effectively prevent the gold fingers from being corroded and ensure the reliability of signal transmission. The gold-plated layer also has excellent conductivity, which can reduce the contact resistance between the gold fingers and external connectors, improve the efficiency and quality of signal transmission, reduce energy loss during signal transmission, improve signal strength and stability, and thus improve the display effect.

[0032] Embodiment 3 of the display module structure of this utility model Furthermore, in the display module structure of this utility model, a CELL filling seal 104 is provided on the side of the display body 1, and the CELL filling seal 104 is located on the left or right side of the display body 1.

[0033] Furthermore, the edge of the CELL filling seal 104 is chamfered with an angle of 30°-60° to reduce stress concentration at the CELL filling seal 104. In the manufacturing process of the liquid crystal display module, the CELL filling seal 104 refers to the process of filling liquid crystal material into the cavity (i.e., CELL) formed between two glass substrates and then sealing the filling port. In traditional display module designs, the CELL filling seal 104 is usually located at the top, but in this application, it is placed on the side to avoid the CELL filling seal 104 affecting the setting of the driver IC 102.

[0034] Furthermore, the back of the display body 1 is provided with insulating double-sided adhesive, and a release film is attached to the side of the insulating double-sided adhesive away from the display body 1. The insulating double-sided adhesive is used for bonding when the main screen FPC2 is bent to the back of the display body 1, and the release film is used for dust prevention before the insulating double-sided adhesive is used.

[0035] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; conversely, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A display module structure, characterized in that, include: The display body (1), driver IC (102) and FPC bonding position (103) are designed at the upper and lower ends of the display body (1), respectively, and ITO traces are connected between the driver IC (102) and the FPC bonding position (103).

2. The display module structure according to claim 1, characterized in that, The ITO traces are distributed on the left and right edges of the display body (1), and the input signal of the driver IC (102) is electrically connected through the ITO traces and the FPC binding bit (103).

3. The display module structure according to claim 1, characterized in that, The driver IC (102) is located at the top of the display body (1), while the FPC bonding bit (103) is located at the bottom of the display body (1).

4. The display module structure according to claim 1, characterized in that, The FPC binding bit (103) is bound to the main screen FPC (2).

5. The display module structure according to claim 4, characterized in that, The front and back of the main screen FPC (2) are both covered with EMI shielding film (201).

6. The display module structure according to claim 4, characterized in that, The main screen FPC (2) is connected to an FPC reinforcement plate (202) at one end away from the FPC binding position (103), and the side of the main screen FPC (2) away from the FPC reinforcement plate (202) is provided with gold fingers.

7. The display module structure according to claim 6, characterized in that, The surface of the gold finger is provided with an anti-corrosion layer, which is a gold-plated layer.

8. The display module structure according to claim 1, characterized in that, The display body (1) is provided with a CELL filling seal (104) on its side, and the CELL filling seal (104) is located on the left or right side of the display body (1).

9. The display module structure according to claim 8, characterized in that, The edges of the CELL filling seal (104) are chamfered.

10. The display module structure according to claim 1, characterized in that, The back of the display screen body (1) is provided with insulating double-sided adhesive, and a release film is attached to the side of the insulating double-sided adhesive away from the display screen body (1).

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