A heat dissipation module, a projector and an electronic product

Abstract

The utility model relates to the field of projector, especially a heat dissipation module, projector and electronic product, including the hot plate, semiconductor refrigerator and radiator, one side of the hot plate is opposite the heat source, the other side of the hot plate is attached the cold side of semiconductor refrigerator, the radiator includes the heat absorption part and the heat release part, the heat absorption part is attached the hot surface of semiconductor refrigerator, the heat absorption part can conduct to the heat release part that the heat absorption part absorbs, the heat release part is used for emitting the heat absorption part absorbs the heat, the utility model gives consideration to the working performance and the heat dissipation demand.

Description

Technical Field

[0001] This utility model belongs to the field of projectors, and in particular relates to a heat dissipation module, a projector, and electronic products. Background Technology

[0002] The core components of a projector mainly consist of three parts: the optical engine (which mainly includes the light source, imaging chip, and optical lens assembly), the drive control module, and the auxiliary system. The performance of the optical engine is closely related to temperature. High temperatures can reduce the photoelectric conversion efficiency of the light source in the optical engine, resulting in problems such as decreased projector brightness and severe color distortion. Long-term operation at high temperatures will also shorten the projector's lifespan.

[0003] Common consumer projectors are rarely used in high-temperature environments or for short periods of time. They usually cope with high-temperature environments by actively reducing the projector's brightness (reducing the power consumption of the light source) and relaxing the temperature specifications of the light source. This affects the projector's working performance and fails to meet both the projector's working performance and heat dissipation requirements. Summary of the Invention

[0004] The technical problem to be solved by this utility model is to provide a heat dissipation module, a projector, and an electronic product, addressing the issue that existing projectors cannot simultaneously meet the requirements of projector performance and heat dissipation.

[0005] To address the aforementioned issues, this utility model provides a heat dissipation module, comprising a heat spreader, a semiconductor cooler, and a heat sink. One side of the heat spreader faces the heat source, and the other side of the heat spreader is in contact with the cold surface of the semiconductor cooler. The heat sink includes a heat-absorbing part and a heat-releasing part. The heat-absorbing part is in contact with the hot surface of the semiconductor cooler. The heat absorbed by the heat-absorbing part can be conducted to the heat-releasing part, and the heat-releasing part is used to dissipate the heat absorbed by the heat-absorbing part.

[0006] Optionally, the heat spreader includes a first heat pipe and a substrate, the substrate having a receiving groove extending from the center to the edge of the substrate, and the first heat pipe being placed in the receiving groove.

[0007] Optionally, the receiving groove includes a first straight groove and two second straight grooves, the two second straight grooves are located at both ends of the length direction of the first straight groove, the first straight groove is connected to the second straight grooves at both ends respectively, and there is an arc transition between the first straight groove and the second straight grooves.

[0008] Optionally, multiple receiving slots and first heat pipes are provided, with each receiving slot and the first heat pipe corresponding to one another, and each first heat pipe being built into one receiving slot.

[0009] Optionally, the radiator includes a heat exchange plate, heat dissipation fins, and a second heat pipe, wherein the two ends of the second heat pipe are respectively connected to the heat exchange plate and the heat dissipation fins; The heat exchange plate constitutes the heat absorption section, which is in contact with the hot surface of the semiconductor cooler; the heat dissipation fins constitute the heat release section.

[0010] Optionally, multiple heat exchange plates and multiple second heat pipes are provided, with each heat exchange plate and multiple second heat pipes corresponding one-to-one, and each end of each second heat pipe being connected to the heat exchange plate and the heat dissipation fins respectively.

[0011] Optionally, the device also includes a fan mounted on the heat sink fins.

[0012] Optionally, the semiconductor cooler includes a cooling element and a heat insulation layer disposed around the cooling element; the cold side and the hot side of the semiconductor cooler are respectively located on both sides of the cooling element.

[0013] On the other hand, this utility model also provides a projector, which includes an optical engine, indicator lights, and the aforementioned heat dissipation module. At least one indicator light is respectively provided on three circumferential surfaces of the optical engine. At least two heat dissipation modules are provided, one of which has a heat dissipation plate as a first heat dissipation plate and the other has a heat dissipation plate as a second heat dissipation plate. The first heat dissipation plate includes two interconnected sub-plates, which are respectively facing the indicator lights on adjacent two side surfaces of the optical engine. The second heat dissipation plate is in the shape of a straight plate and is facing the indicator lights on the other side surface of the optical engine.

[0014] Furthermore, this utility model also provides an electronic product, characterized in that it includes a heat source and the aforementioned heat dissipation module; the heat dissipation module has a heat spreader facing the heat source.

[0015] This utility model provides a heat dissipation module, a projector, and an electronic product. In this embodiment, heat from the heat source is conducted to a heat spreader, which then conducts the heat to the cold surface of a thermoelectric cooler. The thermoelectric cooler transfers the heat to a heat sink, which releases the heat to the outside. The thermoelectric cooler is characterized by being noiseless, vibration-free, refrigerant-free, small in size, and lightweight. It is also reliable, easy to operate, and allows for easy adjustment of cooling capacity. As an active heat dissipation component, the thermoelectric cooler can precisely control the temperature of the cooling surface by adjusting the input current / voltage to control the temperature of the hot surface. When the temperature of the heat source increases, the temperature of the cold surface and the heat spreader are reduced, effectively lowering the temperature of the heat source. This ensures that the heat source is handled at a reasonable temperature, balancing performance and heat dissipation requirements. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the actual application of the heat dissipation module provided in one embodiment of the present invention; Figure 2 This is a structural diagram of the substrate of the heat dissipation module provided in one embodiment of the present invention; Figure 3 for Figure 1 An explosion diagram; Figure 4 This is an exploded view of the heat sink of the heat dissipation module provided in one embodiment of the present invention; Figure 5 This is a three-dimensional exploded view of the heat sink of the heat dissipation module provided in one embodiment of the present invention.

[0018] The reference numerals in the accompanying drawings are as follows: 1. Heat spreader; 10. Receiving groove; 101. First straight groove; 102. Second straight groove; 11. Substrate; 12. First heat pipe; 13. First heat spreader; 131. Sub-board; 14. Second heat spreader; 2. Semiconductor cooler; 22. Hot surface; 23. Cooling component; 24. Insulation layer; 3. Heat sink; 31. Heat exchange plate; 32. Second heat pipe; 33. Heat dissipation fins; 4. Fan; 5. Optical engine; 6. Indicator light. Detailed Implementation

[0019] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0020] In the description of this utility model, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] like Figures 1 to 5 As shown, an embodiment of the present invention provides a heat dissipation module, including a heat spreader 1, a thermoelectric cooler 2, and a heat sink 3; one side of the heat spreader 1 faces the heat source, and the other side of the heat spreader 1 is attached to the cold surface of the thermoelectric cooler 2; the heat sink 3 includes a heat absorption part and a heat release part, the heat absorption part is attached to the hot surface 22 of the thermoelectric cooler 2, the heat absorbed by the heat absorption part can be conducted to the heat release part, and the heat release part is used to dissipate the heat absorbed by the heat absorption part.

[0023] In this embodiment, the thermoelectric cooler 2 refers to a device that generates cooling energy using the thermoelectric effect of semiconductors, also known as a thermoelectric cooler. When two different metals are connected by a conductor and a direct current is applied, the temperature at one junction decreases, while the temperature at the other junction increases.

[0024] The heat spreader 1 facing the heat source includes the following situations: First, the heat spreader 1 is in contact with the heat source, and heat exchange is achieved between the heat spreader 1 and the heat source through heat conduction. Alternatively, the heat spreader 1 and the heat source can be separated, but the distance is reduced. In this case, heat exchange is achieved between the heat spreader 1 and the heat source through heat radiation.

[0025] In this embodiment, the heat from the heat source is conducted to the heat spreader 1, which then conducts the heat to the cold surface of the thermoelectric cooler 2. The thermoelectric cooler 2 transfers the heat to the heat sink 3, which then releases the heat to the outside. The thermoelectric cooler 2 is characterized by being noiseless, vibration-free, requiring no refrigerant, small in size, and lightweight. It is also reliable, easy to operate, and allows for easy adjustment of cooling capacity. As an active heat dissipation component, the TEC can precisely control the temperature of the cooling surface by adjusting the input current / voltage to control the temperature of the hot surface 22. When the temperature of the heat source increases, the temperature of the cold surface is reduced, thereby reducing the temperature of the heat spreader 1 and effectively lowering the temperature of the heat source. This ensures that the heat source is processed at a reasonable temperature, balancing performance and heat dissipation requirements.

[0026] In one embodiment, the heat spreader 1 includes a first heat pipe 12 and a substrate 11. A receiving groove 10 is provided on one side surface of the substrate 11, extending from the center of the substrate 11 to the edge. The first heat pipe 12 is placed in the receiving groove 10. In this embodiment, both the first heat pipe 12 and the second heat pipe 32 are heat pipes. A heat pipe is a heat transfer element with extremely high thermal conductivity. It transfers heat through the evaporation and condensation of liquid in a fully enclosed vacuum tube. It utilizes fluid principles such as capillary action to achieve a cooling effect similar to that of a refrigerator compressor and has very high thermal conductivity.

[0027] The first heat pipe 12 is welded onto the substrate 11. In this embodiment, the substrate 11 is a copper plate or an aluminum plate. If it encounters a heat source with concentrated heat, the temperature of the part of the substrate 11 facing the heat source is higher than that of other parts. Therefore, the temperature is uniformly transferred to other parts of the substrate 11 through the first heat pipe 12, so that the temperature of each part of the substrate 11 is as uniform as possible, and thus the temperature can be uniformly conducted to the semiconductor cooler 2.

[0028] Specifically, the receiving groove 10 includes a first straight groove 101 and two second straight grooves 102. The two second straight grooves 102 are located at both ends of the length direction of the first straight groove 101. The first straight groove 101 is connected to the second straight grooves 102 at both ends respectively. The first straight groove 101 and the second straight groove 102 are arc-shaped transitions. That is, in this embodiment, the receiving groove 10 is U-shaped and is disposed on the surface of the substrate 11 facing the light source. The first straight groove 101 of the receiving groove 10 is located at the center of the substrate 11, and the second straight grooves 102 extend from the center of the substrate 11 to the edge.

[0029] In one embodiment, multiple receiving slots 10 and first heat pipes 12 are provided, with each receiving slot 10 and first heat pipe 12 corresponding to one another, and each first heat pipe 12 is built into a receiving slot 10.

[0030] In this embodiment, there are two receiving grooves 10. The openings of the two receiving grooves 10 are opposite to each other. The first straight grooves 101 of the two receiving grooves 10 are close to each other, and the second straight grooves 102 of the two receiving grooves 10 extend from the center of the substrate 11 to the edge, thereby conducting the heat from the center of the substrate 11 to the edge, so that the temperature on the heat spreader 1 is uniform.

[0031] In one embodiment, the heat sink 3 includes a heat exchange plate 31, heat dissipation fins 33, and a second heat pipe 32. The two ends of the second heat pipe 32 are respectively connected to the heat exchange plate 31 and the heat dissipation fins 33. The heat exchange plate 31 forms a heat absorption part to fit the hot surface 22 of the semiconductor cooler 2. The heat dissipation fins 33 form a heat dissipation part.

[0032] In this embodiment, the heat exchange plate 31 conducts the heat from the hot surface 22 to the second heat pipe 32, which in turn conducts the heat to the heat dissipation fins 33. The heat dissipation fins 33 have a large heat dissipation surface area 22, which allows the heat to be conducted to the outside more quickly.

[0033] In one embodiment, multiple heat exchange plates 31 and multiple second heat pipes 32 are respectively provided, with each heat exchange plate 31 and multiple second heat pipes 32 corresponding one-to-one. The two ends of each second heat pipe 32 are connected to the heat exchange plate 31 and the heat dissipation fin 33, respectively. In this embodiment, the area of ​​each heat exchange plate 31 is smaller than the area of ​​the hot surface 22, and the area of ​​the multiple heat exchange plates 31 combined is equal to the area of ​​the hot surface 22. After multiple combinations, the heat exchange plates 31 are attached to the same hot surface 22. At this time, each heat exchange plate 31 is connected to the same heat dissipation fin 33 through its corresponding second heat pipe 32, and each heat exchange plate 31 conducts heat from the hot surface 22 to the same heat dissipation fin 33.

[0034] In one embodiment, a fan 4 is also included, which is mounted on the heat sink fins 33. The fan 4 is used to increase the heat transfer efficiency of the heat sink fins 33, and to quickly dissipate heat to the atmosphere through the flowing air.

[0035] In one embodiment, the thermoelectric cooler 2 includes a cooling element 23 and a heat insulation layer 24 surrounding the cooling element 23; the cold surface and hot surface 22 of the thermoelectric cooler 2 are located on opposite sides of the cooling element 23. In this embodiment, the cooling element 23 is block-shaped, with its two opposite end faces forming the hot surface 22 and the cold surface, respectively, and the heat insulation layer 24 is fitted onto the four sides of the outer periphery of the cooling element 23. In other embodiments, the cooling element 23 may also be circular, thus the heat insulation layer 24 is fitted onto the outer periphery of the cooling element 23.

[0036] On the other hand, this utility model also provides a projector, which includes an optical engine 5, indicator lights 6, and the aforementioned heat dissipation module. At least one indicator light 6 is provided on each of the three circumferential surfaces of the optical engine 5. At least two heat dissipation modules are provided, one of which has a heat dissipation plate 1 called a first heat dissipation plate 13 and the other has a heat dissipation plate 1 called a second heat dissipation plate 14. The first heat dissipation plate 13 includes two interconnected sub-plates 131, which are respectively facing the indicator lights 6 on adjacent side surfaces of the optical engine 5. The second heat dissipation plate 14 is in the shape of a straight plate and is facing the indicator lights 6 on the other side surface of the optical engine 5.

[0037] Referring to the accompanying drawings, the projector's optical engine 5 in this embodiment has a total of four LEDs on its three sides. Each LED is an indicator light 6. Two LEDs are located on the same side of the optical engine 5, and the other two LEDs are located on the other sides of the optical engine 5. Therefore, two heat dissipation modules are used for these four LEDs. One heat dissipation module has a heat dissipation plate 1 called a first heat dissipation plate 13, which is L-shaped and includes two sub-plates 131, each of which faces one LED. The other heat dissipation module has a heat dissipation plate 1 called a second heat dissipation plate 14, which is a straight plate and faces two LEDs located on the same side surface of the optical engine 5 to dissipate heat from both LEDs simultaneously.

[0038] In one embodiment, the present invention also provides an electronic product, including a heat source and the above-described heat dissipation module; the heat dissipation module has a heat spreader 1 facing the heat source.

[0039] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A heat dissipation module, characterized in that, Includes heat spreaders, thermoelectric coolers, and heat sinks; One side of the heat spreader faces the heat source, and the other side of the heat spreader is in contact with the cold surface of the semiconductor cooler. The heat sink includes a heat-absorbing part and a heat-releasing part. The heat-absorbing part is in contact with the hot surface of the semiconductor cooler. The heat absorbed by the heat-absorbing part can be conducted to the heat-releasing part. The heat-releasing part is used to dissipate the heat absorbed by the heat-absorbing part. The heat spreader includes a first heat pipe and a substrate. A receiving groove is provided on the substrate. The receiving groove extends from the center of the substrate to the edge. The first heat pipe is placed in the receiving groove.

2. The heat dissipation module according to claim 1, characterized in that, The receiving groove includes a first straight groove and two second straight grooves. The two second straight grooves are located at both ends of the length direction of the first straight groove. The first straight groove is connected to the second straight grooves at both ends respectively, and there is an arc transition between the first straight groove and the second straight grooves.

3. The heat dissipation module according to claim 2, characterized in that, Multiple receiving slots and multiple first heat pipes are provided, and each receiving slot and each first heat pipe corresponds to one of the receiving slots. Each first heat pipe is built into one receiving slot.

4. The heat dissipation module according to claim 1, characterized in that, The radiator includes a heat exchange plate, heat dissipation fins, and a second heat pipe, with the two ends of the second heat pipe connected to the heat exchange plate and the heat dissipation fins, respectively. The heat exchange plate constitutes the heat absorption section, which is in contact with the hot surface of the semiconductor cooler; the heat dissipation fins constitute the heat release section.

5. The heat dissipation module according to claim 4, characterized in that, Multiple heat exchange plates and multiple second heat pipes are respectively provided, and the multiple heat exchange plates and multiple second heat pipes correspond one-to-one. The two ends of each second heat pipe are respectively connected to the heat exchange plate and the heat dissipation fins.

6. The heat dissipation module according to claim 4, characterized in that, It also includes a fan, which is mounted on the heat sink fins.

7. The heat dissipation module according to claim 1, characterized in that, The semiconductor cooler includes a cooling element and a heat insulation layer surrounding the cooling element; the cold side and the hot side of the semiconductor cooler are located on both sides of the cooling element, respectively.

8. A projector, characterized in that, The projector includes an optical engine, indicator lights, and a heat dissipation module as described in any one of claims 1-7. At least one indicator light is provided on each of the three circumferential surfaces of the optical engine. At least two heat dissipation modules are provided, one of which has a heat dissipation plate as a first heat dissipation plate and the other has a heat dissipation plate as a second heat dissipation plate. The first heat dissipation plate includes two interconnected sub-plates, which are respectively facing the indicator lights on adjacent side surfaces of the optical engine. The second heat dissipation plate is in the shape of a straight plate and is facing the indicator lights on the other side surface of the optical engine.

9. An electronic product, characterized in that, It includes a heat source and a heat dissipation module as described in any one of claims 1-7; the heat dissipation module has a heat spreader facing the heat source.

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