A metallized film with thickness segment control of the metallized electrode layer

Abstract

The application discloses a metalized film with thickness segmentation control of a metalized electrode layer, relates to the technical field of metalized films, and comprises an organic film substrate, a titanium alloy transition layer deposited on the upper surface of the organic film substrate, a silver nanowire grid arranged on the upper surface of the titanium alloy transition layer, a deposition groove arranged on the upper surface of the titanium alloy transition layer on the right side of the silver nanowire grid, the height of the silver nanowire grid decreasing in a stepped manner from left to right, and a metalized electrode layer formed by vacuum evaporation arranged on the upper surface of the titanium alloy transition layer inside the silver nanowire grid and between the silver nanowire grid and the deposition groove, the height of the metalized electrode layer decreasing in a stepped manner from left to right.

Description

Technical Field

[0001] This invention belongs to the field of metallized thin film technology, specifically a metallized thin film with segmented thickness control of the metallized electrode layer. Background Technology

[0002] Metallized thin films, with their unique conductivity, mechanical flexibility, and functional tunability, have important applications in multiple fields. In the electronics and electrical fields, metallized thin films serve as the core material for metallized thin-film capacitors, exhibiting self-healing properties and ultra-high insulation resistance. They can also be used in transistor gates, source / drain electrodes, conductive films in interconnect layers, and electromagnetic shielding layers to meet the needs of micro- and nano-scale circuit integration. In the fields of new energy and optics, copper indium gallium selenide (CIGS) metallized thin films are used in photovoltaic modules for high-efficiency thin-film solar cells.

[0003] The utility model with announcement number CN205016384U discloses a metallized thin film with segmented control of the thickness of the metallized electrode layer, including an organic thin film and a metallized electrode layer formed by evaporating metal on the surface of the organic thin film. One side edge of the surface of the organic thin film is provided with a blank edge without evaporated metallized electrode layer. The thickness of the metallized electrode layer decreases linearly or stepwise from the side edge opposite to the blank edge to the inner edge of the blank edge.

[0004] In the process of developing this application, the following problems were discovered with this technology: In the aforementioned patent documents, the metallized electrode layer is directly deposited onto the surface of the organic thin film; however, when the thermal expansion difference between the organic thin film and the metal electrode is large, uneven shrinkage during cooling causes warping deformation. Local high temperatures during the evaporation process can easily cause non-uniform thermal deformation of the organic thin film, and the rapid heat dissipation at the edges leads to stress concentration in the metal layer; moreover, the residual stress during metal layer deposition is transmitted through the film substrate, causing a thickness distribution that is "thin at the edges and thick in the center," thereby inducing thickness shift. On the other hand, the surface of the organic thin film lacks active groups, making it difficult to form stable chemical bonds with metal atoms. The high temperature of evaporation causes thermal decomposition of the organic thin film surface, generating gaseous products that form micropore defects at the interface, resulting in poor bonding strength between the organic thin film and the metal electrode in this patent.

[0005] To address this, a metallized thin film with segmented thickness control of the metallized electrode layer is proposed. Utility Model Content

[0006] The purpose of this invention is to provide a metallized thin film with segmented thickness control of the metallized electrode layer in order to alleviate the thickness distribution deviation caused by thermal stress and improve the interfacial bonding strength.

[0007] The technical solution adopted in this utility model is as follows: A metallized thin film with segmented thickness control of the metallized electrode layer includes an organic thin film substrate. A titanium alloy transition layer is deposited on the upper surface of the organic thin film substrate. A silver nanowire mesh is disposed on the upper surface of the titanium alloy transition layer. A deposition groove is formed on the upper surface of the titanium alloy transition layer to the right of the silver nanowire mesh. The height of the silver nanowire mesh decreases stepwise from left to right. A metallized electrode layer formed by vacuum evaporation is disposed inside the silver nanowire mesh and on the upper surface of the titanium alloy transition layer between the silver nanowire mesh and the deposition groove. The height of the metallized electrode layer decreases stepwise from left to right.

[0008] Furthermore, the metallized electrode layer includes a main conductive layer, which is deposited on the upper surface of the titanium alloy transition layer by vacuum evaporation, and the upper surface of the main conductive layer is coated with an anti-oxidation zinc layer.

[0009] Furthermore, the main conductive layer is a copper conductive layer, and the thickness of the main conductive layer is 0.3-30 nm, while the thickness of the zinc oxide-resistant layer is 1-20 nm.

[0010] Furthermore, a blank edge area without vacuum evaporation is provided on the upper surface of the titanium alloy transition layer on the right side of the deposition groove.

[0011] Furthermore, the thickness of the titanium alloy transition layer is 1-5 nm.

[0012] Furthermore, the organic film substrate is a polycarbonate substrate, and the thickness of the organic film substrate is 0.175mm-2.5mm.

[0013] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are: 1. In this utility model, by adding a titanium alloy transition layer between the organic thin film substrate and the metallized electrode layer, the elastic modulus of the titanium alloy is between that of the organic thin film substrate and the metallized electrode layer, which can effectively alleviate the interfacial stress caused by the difference in thermal expansion coefficients. Moreover, the dense titanium alloy transition layer can inhibit the migration of metal atoms to the organic layer, avoid harmful reactions between the electrode material and the substrate, thereby improving the bonding strength between the metal and the organic film. Compared with CN205016384U, which directly connects the organic thin film substrate and the metallized electrode layer, this application can alleviate the thickness distribution shift caused by thermal stress and improve the interfacial bonding strength through the combination of the above structures.

[0014] 2. In this invention, a silver nanowire mesh with a stepped height decreasing feature is provided on the surface of the titanium alloy transition layer. The thickness gradient distribution of the metal vapor-deposited layer is achieved by guiding the physical morphology, and it serves as a conductive reference layer for thickness segment control. Compared with CN205016384U, which simply uses vapor deposition equipment for thickness control, this application can better control the thickness segment of the metallized electrode layer through the combination of the above structures. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the structure of the metallized electrode layer in this utility model; Figure 3 This is a top view of the silver nanowire mesh and deposition grooves on the organic thin film substrate in this invention.

[0016] The diagram is labeled as follows: 1-Organic thin film substrate, 2-Titanium alloy transition layer, 3-Silver nanowire mesh, 4-Metalized electrode layer, 5-Blank edge area, 21-Deposition groove, 41-Main conductive layer, 42-Antioxidant zinc layer. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below in conjunction with the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model. Example

[0018] Reference Figures 1-3A metallized thin film with segmented thickness control of the metallized electrode layer includes an organic thin film substrate 1, which is a polycarbonate substrate with a thickness of 0.175 mm to 2.5 mm. A titanium alloy transition layer 2 with a thickness of 1-5 nm is deposited on the upper surface of the organic thin film substrate 1. A silver nanowire mesh 3 is disposed on the upper surface of the titanium alloy transition layer 2, and a deposition groove 21 is formed on the upper surface of the titanium alloy transition layer 2 to the right of the silver nanowire mesh 3. Specifically, the titanium alloy transition layer is pre-deposited on the upper surface of the organic thin film substrate 1 using a PVD process. 2. The elastic modulus of the titanium alloy in the titanium alloy transition layer 2 is between that of the organic thin film substrate 1 and the metallized electrode layer 4, which can effectively alleviate the interfacial stress caused by the difference in thermal expansion coefficients. Moreover, the dense titanium alloy transition layer 2 can inhibit the migration of metal atoms to the organic layer, avoid harmful reactions between the electrode material and the substrate, and thus improve the bonding strength between the metal and the organic film. Compared with CN205016384U, which directly connects the organic thin film substrate 1 and the metallized electrode layer 4, this application can alleviate the thickness distribution shift caused by thermal stress and improve the interfacial bonding strength through the combination of the above structures.

[0019] Reference Figures 1-3 The height of the silver nanowire mesh 3 decreases in a stepped manner from left to right. Metallized electrode layers 4, formed by vacuum evaporation, are disposed inside the silver nanowire mesh 3 and on the upper surface of the titanium alloy transition layer 2 between the silver nanowire mesh 3 and the deposition groove 21. The height of the metallized electrode layer 4 decreases in a stepped manner from left to right. Specifically, a silver nanowire mesh 3 with a stepped height decrease is disposed on the surface of the titanium alloy transition layer 2. The thickness gradient distribution of the metallized layer is achieved through physical morphology guidance, serving as a conductive reference layer for thickness segmentation control. Compared to CN205016384U, which simply uses evaporation equipment for thickness control, this application, through the combination of the above structures, can better control the thickness segmentation of the metallized electrode layer 4.

[0020] Reference Figures 1-3 The metallized electrode layer 4 includes a main conductive layer 41, which is deposited on the upper surface of the titanium alloy transition layer 2 by vacuum evaporation. The upper surface of the main conductive layer 41 is coated with an anti-oxidation zinc layer 42. The main conductive layer 41 is a copper conductive layer, and the thickness of the main conductive layer 41 is 0.3-30 nm, while the thickness of the anti-oxidation zinc layer 42 is 1-20 nm. Specifically, the metal is directly deposited on the titanium alloy transition layer 2 by vacuum evaporation or sputtering to form a conductive layer with a thickness gradient. A blank edge area 5 without vacuum evaporation is provided on the upper surface of the titanium alloy transition layer 2 on the right side of the deposition groove 21. Specifically, the blank edge area 5 can provide a process buffer for metal end face spraying, prevent short circuit of the electrode plate, increase the creepage distance between electrodes, and effectively avoid edge discharge and arcing under working voltage.

[0021] The implementation principle of the metallized thin film embodiment of this application with segmented control of metallized electrode layer thickness is as follows: When using this device, a titanium alloy transition layer 2 is added between the organic thin film substrate 1 and the metallized electrode layer 4. The elastic modulus of the titanium alloy is between that of the organic thin film substrate 1 and the metallized electrode layer 4, which can effectively alleviate the interfacial stress caused by the difference in thermal expansion coefficients. Moreover, the dense titanium alloy transition layer 2 can inhibit the migration of metal atoms to the organic layer, avoid harmful reactions between the electrode material and the substrate, and thus improve the bonding strength between the metal and the organic film. Compared with CN205016384U, which directly connects the organic thin film substrate 1 and the metallized electrode layer 4, this application can alleviate the thickness distribution shift caused by thermal stress and improve the interfacial bonding strength through the combination of the above structures.

[0022] On the other hand, a silver nanowire mesh 3 with a stepped height decrease is set on the surface of the titanium alloy transition layer 2. The thickness gradient distribution of the metal vapor deposition layer is achieved by guiding the physical morphology, and it serves as a conductive reference layer for thickness segment control. Compared with CN205016384U, which simply uses vapor deposition equipment for thickness control, this application can better control the thickness segment of the metallized electrode layer 4 through the combination of the above structures.

[0023] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A metallized film with thickness segmentation control of the metallized electrode layer, comprising an organic film substrate (1), characterized in that: A titanium alloy transition layer (2) is deposited on the upper surface of the organic thin film substrate (1). A silver nanowire mesh (3) is provided on the upper surface of the titanium alloy transition layer (2). A deposition groove (21) is formed on the upper surface of the titanium alloy transition layer (2) to the right of the silver nanowire mesh (3). The height of the silver nanowire mesh (3) decreases stepwise from left to right. A metallized electrode layer (4) formed by vacuum evaporation is provided inside the silver nanowire mesh (3) and on the upper surface of the titanium alloy transition layer (2) between the silver nanowire mesh (3) and the deposition groove (21). The height of the metallized electrode layer (4) decreases stepwise from left to right.

2. A metallized film with thickness segment control of the metallized electrode layer as claimed in claim 1, characterized in that: The metallized electrode layer (4) includes a main conductive layer (41), which is deposited on the upper surface of the titanium alloy transition layer (2) by vacuum evaporation, and the upper surface of the main conductive layer (41) is coated with an anti-oxidation zinc layer (42).

3. A metallized film with thickness segment control of the metallized electrode layer as claimed in claim 2, characterized in that: The main conductive layer (41) is a copper conductive layer, and the thickness of the main conductive layer (41) is 0.3-30nm, and the thickness of the zinc oxide-resistant layer (42) is 1-20nm.

4. A metallized film with thickness segment control of the metallized electrode layer as recited in claim 1, wherein: A blank edge area (5) without vacuum evaporation is provided on the upper surface of the titanium alloy transition layer (2) on the right side of the deposition groove (21).

5. A metallized film with thickness segment control of the metallized electrode layer as recited in claim 1, wherein: The thickness of the titanium alloy transition layer (2) is 1-5 nm.

6. A metallized film with thickness segment control of the metallized electrode layer as defined in claim 1, characterized in that: The organic film substrate (1) is a polycarbonate substrate, and the thickness of the organic film substrate (1) is 0.175mm-2.5mm.

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