Semiconductor porcelainized capacitor

Abstract

This invention discloses a semiconductor ceramic capacitor, comprising epoxy packaging and a capacitor. The capacitor is housed inside the epoxy packaging. Pins are provided on one side of the epoxy packaging, including upper and lower pins. The upper pin is fixedly connected to the epoxy packaging, and adhesive is contained inside the upper pin. The lower pin is fixedly connected to the upper pin via a break-through column. This invention relates to the field of ceramic capacitor technology. When the ceramic capacitor needs to be connected to a circuit board, the lower pin moves upward to crush the break-through column and puncture the six-part capacitor. The 502 adhesive inside the adhesive cavity flows into the flow chamber and flow channel, enabling rapid connection between the pins and the circuit board. This process requires no soldering interference, resulting in quick and efficient installation.

Description

Technical Field

[0001] This utility model relates to the field of ceramic capacitor technology, specifically a semiconductor ceramic capacitor. Background Technology

[0002] Semiconductor ceramic capacitors are a type of capacitor in which a dielectric insulating layer is formed on the outer surface or inner surface between grains of barium titanate or strontium titanate semiconductor ceramics, with this layer serving as the dielectric. The dielectric layer is extremely thin, sometimes only a few tenths of a micrometer to several micrometers thick, making miniaturization of ceramic capacitors possible. They possess a very high dielectric constant, are small in size, and have high capacitance. They are mainly used in ultra-high frequency and very high frequency circuits for broadband bypassing and coupling, as well as in low-voltage circuits for broadband signal and frequency separation. They are widely used in radios, televisions, desktop computers, automobiles, and other complete systems.

[0003] There are several drawbacks to soldering ceramic capacitors to circuit boards. First, due to the hard and brittle nature of ceramic materials, ceramic capacitors are susceptible to thermal and mechanical stress during soldering, which can lead to cracking or cap detachment. Second, improper solder application, especially during temperature changes, can cause excessive solder to create high tension on the surface-mount capacitor, leading to internal breakage or cap detachment. Insufficient solder results in insufficient solder strength, making it easy for the capacitor to detach from the circuit board, causing an open circuit. Furthermore, assembly defects such as the tombstone effect can occur during soldering, affecting the reliability of the capacitor and the performance of the circuit. Therefore, strict control of soldering parameters and processes is necessary to avoid these drawbacks when soldering ceramic capacitors. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor ceramic capacitor to solve the problems mentioned in the background section and overcome its technical defects.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a semiconductor ceramic capacitor, including epoxy packaging and a capacitor, wherein the capacitor is housed inside the epoxy packaging, and a pin is provided on one side of the epoxy packaging, the pin including an upper pin and a lower pin, the upper pin being fixedly connected to the epoxy packaging, the upper pin containing glue, and the lower pin being fixedly connected to the upper pin through a breakable column.

[0006] As a further embodiment of this utility model: a semiconductor ceramic capacitor, wherein the upper pin includes a cavity and a six-part body, the lower pin includes a flow-spreading cavity and a needle, the needle has a piercing hole inside, the piercing hole is connected to the flow-spreading cavity, and the flow-spreading cavity is adapted to the cavity.

[0007] As a further embodiment of this utility model: a semiconductor ceramic capacitor further includes a six-part component, which is disposed between the cavity and the needle, and the needle is movably connected to the six-part component.

[0008] As a further embodiment of this utility model: a semiconductor ceramic capacitor, wherein a compensation area is provided on the side of the capacitor and the epoxy packaging, the compensation area being used to contain the expanding gas when the capacitor breaks down.

[0009] As a further embodiment of this utility model: a semiconductor ceramic capacitor further includes a filling region, which is disposed in the interlayer between the capacitor and the epoxy packaging in the circumferential direction, and the filling region is used for fire protection of the ceramic capacitor.

[0010] As a further embodiment of this utility model: a semiconductor ceramic capacitor, wherein the tip of the piercing hole has a cone-shaped structure, and both the six parts and the piercing pad are made of PU.

[0011] As a further embodiment of this utility model: a semiconductor ceramic capacitor, wherein the filling region is made of silicon oxide with high specific heat capacity and good fire resistance.

[0012] As a further embodiment of this utility model: a semiconductor ceramic capacitor, wherein the cavity is filled with 502 glue.

[0013] Compared with the prior art, the beneficial effects of this utility model include:

[0014] Because the capacitor is housed inside an epoxy package, and a pin is provided on one side of the epoxy package, the pin includes an upper pin and a lower pin. The upper pin is fixedly connected to the epoxy package and contains glue. The lower pin is fixedly connected to the upper pin through a breaking column. Specifically, the needle has a piercing hole inside, which is connected to the flow chamber. The flow chamber is adapted to the glue cavity. When the ceramic capacitor needs to be connected to the circuit board, the lower pin moves upward to crush the breaking column. After the piercing hole pierces the six-part component, the 502 glue inside the glue cavity flows into the flow chamber and flow groove, which can realize the rapid connection between the pin and the circuit board. This process does not require soldering interference, and the installation efficiency is fast and efficient.

[0015] Because a compensation area is provided on the side of the capacitor and the epoxy packaging, the compensation area is used to contain the expanding gas when the capacitor breaks down, and a filling area is set in the interlayer between the capacitor and the epoxy packaging in the circumferential direction. The filling area is used for fire protection of the ceramic capacitor. The filling area is made of silicon dioxide with high specific heat capacity and good fire resistance. Therefore, the ceramic capacitor can be protected by the compensation area and the filling area when it is used for a long time or when it breaks down, reducing the probability of fire. Attached Figure Description

[0016] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts. Wherein:

[0017] Figure 1 The schematic diagram shows an overall structural schematic diagram according to one embodiment of the present invention;

[0018] Figure 2 The diagram schematically shows a cross-sectional view of a pin according to one embodiment of the present invention;

[0019] Figure 3 A schematic cross-sectional view of an epoxy packaging according to one embodiment of the present invention is shown.

[0020] The diagram is labeled as follows: 1. Epoxy packaging; 2. Capacitor; 3. Pin; 4. Upper pin; 41. Glue cavity; 42. Six-part assembly; 5. Lower pin; 51. Flowing cavity; 52. Flowing channel; 53. Needle; 54. Piercing hole; 6. Compensation zone; 7. Exhaust zone; 8. Breaking column; 9. Piercing pad; 10. Filling zone. Detailed Implementation

[0021] It is readily understood that, based on the technical solution of this utility model, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of this utility model. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model and should not be considered as the entirety of this utility model or as limitations or restrictions on the technical solution of this utility model.

[0022] According to one embodiment of the present invention, a semiconductor ceramic capacitor is shown in conjunction with the accompanying drawings, including an epoxy package 1 and a capacitor 2. The capacitor 2 is housed inside the epoxy package 1. A pin 3 is provided on one side of the epoxy package 1. The pin 3 includes an upper pin 4 and a lower pin 5. The upper pin 4 is fixedly connected to the epoxy package 1. The upper pin 4 contains glue. The lower pin 5 is fixedly connected to the upper pin 4 through a breakable column 8.

[0023] Since the capacitor 2 is housed inside the epoxy packaging 1, a pin 3 is provided on one side of the epoxy packaging 1. The pin 3 includes an upper pin 4 and a lower pin 5. The upper pin 4 is fixedly connected to the epoxy packaging 1 and contains glue. The lower pin 5 is fixedly connected to the upper pin 4 through a breaking column 8. Specifically, the needle 53 has a piercing hole 54 inside, which is connected to the flow chamber 51. The flow chamber 51 is adapted to the glue cavity 41. When the ceramic capacitor needs to be connected to the circuit board, the lower pin 5 moves upward to crush the breaking column 8. After the piercing hole 54 pierces the six-part 42, the 502 glue inside the glue cavity 41 will flow into the flow chamber 51 and the flow channel 52, which can realize the rapid connection between the pin 3 and the circuit board. This process does not require welding interference and the installation efficiency is fast and efficient.

[0024] As a further embodiment of this utility model: a semiconductor ceramic capacitor, wherein the upper pin 4 includes a cavity 41 and a six-part body 42, and the lower pin 5 includes a flow-spreading cavity 51 and a needle 53, wherein the needle 53 has a piercing hole 54 inside, the piercing hole 54 is connected to the flow-spreading cavity 51, and the flow-spreading cavity 51 is adapted to the cavity 41.

[0025] As a further embodiment of this utility model: a semiconductor ceramic capacitor further includes a six-part body 42, which is disposed between the cavity 41 and the needle 53, and the needle 53 is movably connected to the six-part body 42.

[0026] As a further embodiment of this utility model: a semiconductor ceramic capacitor, wherein a compensation region 6 is provided on the side of the capacitor 2 and the epoxy packaging 1, and the compensation region 6 is used to contain the expanding gas when the capacitor breaks down.

[0027] As a further embodiment of this utility model: a semiconductor ceramic capacitor, further comprising a filling region 10, wherein the filling region 10 is disposed in the interlayer between the capacitor 2 and the epoxy packaging 1 in the circumferential direction, and the filling region 10 is used for fire protection of the ceramic capacitor.

[0028] Because a compensation area 6 is provided on the side of the capacitor 2 and the epoxy packaging 1, the compensation area 6 is used to contain the expanding gas when the capacitor breaks down, and the filling area 10 is provided in the interlayer between the capacitor 2 and the epoxy packaging 1 in the circumferential direction. The filling area 10 is used for fire protection of the ceramic capacitor. The filling area 10 is made of silicon dioxide with high specific heat capacity and good fire resistance. Therefore, the ceramic capacitor can be protected by the compensation area 6 and the filling area 10 when it is used for a long time or when it breaks down, reducing the probability of fire.

[0029] As a further embodiment of this utility model: a semiconductor ceramic capacitor, wherein the tip of the piercing hole 54 is a cone-shaped structure, and both the six-part component 42 and the piercing pad 9 are made of PU.

[0030] As a further embodiment of this utility model: a semiconductor ceramic capacitor, wherein the filling region 10 is made of silicon oxide with high specific heat capacity and good fire resistance.

[0031] As a further embodiment of this utility model: a semiconductor ceramic capacitor, wherein the cavity 41 is filled with 502 glue.

[0032] Working principle: Since the capacitor 2 is housed inside the epoxy packaging 1, a pin 3 is provided on one side of the epoxy packaging 1. The pin 3 includes an upper pin 4 and a lower pin 5. The upper pin 4 is fixedly connected to the epoxy packaging 1 and contains glue. The lower pin 5 is fixedly connected to the upper pin 4 through a breaking column 8. Specifically, the needle 53 has a piercing hole 54 inside, which is connected to the flow chamber 51. The flow chamber 51 is adapted to the glue cavity 41. When the ceramic capacitor needs to be connected to the circuit board, the lower pin 5 moves upward to crush the breaking column 8. After the piercing hole 54 pierces the six-part 42, the 502 glue inside the glue cavity 41 flows into the flow chamber 51 and the flow channel 52, which can realize the rapid connection between the pin 3 and the circuit board. This process does not require soldering interference and the installation efficiency is fast and efficient.

[0033] Because a compensation area 6 is provided on the side of the capacitor 2 and the epoxy packaging 1, the compensation area 6 is used to contain the expanding gas when the capacitor breaks down, and the filling area 10 is provided in the interlayer between the capacitor 2 and the epoxy packaging 1 in the circumferential direction. The filling area 10 is used for fire protection of the ceramic capacitor. The filling area 10 is made of silicon dioxide with high specific heat capacity and good fire resistance. Therefore, the ceramic capacitor can be protected by the compensation area 6 and the filling area 10 when it is used for a long time or when it breaks down, reducing the probability of fire.

[0034] The technical scope of this utility model is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this utility model, and all such modifications and variations should fall within the protection scope of this utility model.

Claims

1. A semiconductor ceramic capacitor, characterized in that, The device includes an epoxy package (1) and a capacitor (2). The capacitor (2) is housed inside the epoxy package (1). A pin (3) is provided on one side of the epoxy package (1). The pin (3) includes an upper pin (4) and a lower pin (5). The upper pin (4) is fixedly connected to the epoxy package (1). The upper pin (4) contains glue. The lower pin (5) is fixedly connected to the upper pin (4) through a break column (8).

2. A semiconductor ceramic capacitor according to claim 1, characterized in that, The upper needle (4) includes a glue cavity (41) and a six-part body (42), and the lower needle (5) includes a flow-spreading cavity (51) and a needle (53). The needle (53) has a piercing hole (54) inside, which is connected to the flow-spreading cavity (51). The flow-spreading cavity (51) is adapted to the glue cavity (41).

3. A semiconductor ceramic capacitor according to claim 2, characterized in that, It also includes a six-part component (42), which is disposed between the cavity (41) and the needle (53), and the needle (53) is movably connected to the six-part component (42).

4. A semiconductor ceramic capacitor according to claim 3, characterized in that, The capacitor (2) and the epoxy packaging (1) are provided with a compensation area (6) on the side, which is used to contain the expanding gas when the capacitor breaks down.

5. A semiconductor ceramic capacitor according to claim 4, characterized in that, It also includes a filling area (10), which is disposed in the interlayer between the capacitor (2) and the epoxy packaging (1) in the circumferential direction, and the filling area (10) is used for fire protection of the ceramic capacitor.

6. A semiconductor ceramic capacitor according to claim 5, characterized in that, The tip of the puncture hole (54) is a cone-shaped structure, and the six parts (42) and the puncture pad (9) are both made of PU.

7. A semiconductor ceramic capacitor according to claim 6, characterized in that, The filling area (10) is made of silicon dioxide with high specific heat capacity and good fire resistance.

8. A semiconductor ceramic capacitor according to claim 7, characterized in that, The glue cavity (41) contains 502 glue.

Images