A liquid-cooled board insulation pc strip assembly with optimized contact surface structure

Abstract

The utility model discloses a kind of liquid cooling plate insulation PC strip assemblies of optimization contact surface structure, including substrate, the one end surface of the substrate is connected with adhesive layer;The other end surface of the substrate is equipped with several height gradient hemispherical convex points, including the first gradient convex point in the middle part of substrate and the second gradient convex point in the edge of substrate;The same side of the convex point on the substrate is also provided with groove lines.The utility model has the advantages compared with prior art: provide a kind of liquid cooling plate insulation PC strip assemblies of optimization contact surface structure with stress compensation structure, realize interface contact pressure optimization and gel layer uniform control.

Description

Technical Field

[0001] This utility model relates to the field of thermal management technology for new energy batteries, specifically to a liquid-cooled plate insulating PC strip assembly with optimized contact surface structure. Background Technology

[0002] The existing method of directly filling the insulating layer between the liquid cooling plate and the battery cell with thermally conductive gel has the following technical drawbacks:

[0003] 1. Assembly stress caused insufficient gel layer thickness in the middle area (sinking effect), with a measured deviation exceeding ±0.15mm;

[0004] 2. Vibration during transportation causes direct contact between the battery cell and the liquid cooling plate, resulting in a blue film damage rate >5%;

[0005] 3. Uneven contact pressure distribution (local pressure difference > 30%) poses a risk of insulation failure;

[0006] 4. The heat conduction path is discontinuous, and the thermal resistance consistency is less than 90%. Utility Model Content

[0007] The technical problem to be solved by this utility model is to overcome the above-mentioned technical defects and provide a liquid-cooled plate insulating PC strip assembly with a stress compensation structure, which optimizes the interface contact pressure and controls the uniformity of the gel layer.

[0008] To solve the above-mentioned technical problems, the technical solution provided by this utility model is: a liquid-cooled plate insulating PC strip assembly with optimized contact surface structure, including a substrate, wherein an adhesive layer is connected to one end face of the substrate;

[0009] The other end face of the substrate is provided with a number of hemispherical protrusions with gradually varying heights, including a first gradient protrusion located in the middle of the substrate and a second gradient protrusion located at the edge of the substrate.

[0010] The substrate also has grooves on the same side as the protrusions.

[0011] As an improvement, the first gradient bump has a diameter of 1.2 mm and a height of 0.15 mm.

[0012] As an improvement, the second gradient bump has a diameter of 1.5 mm and a height of 0.25 mm.

[0013] As an improvement, the groove pattern includes radial main grooves and annular auxiliary grooves connected to the ends of the radial main grooves;

[0014] The annular auxiliary groove connects with the radial main groove to form a gel self-distribution channel.

[0015] As an improvement, a sealing flange with a height of 0.2 mm is formed on the edge of the substrate on the same side as the groove pattern.

[0016] As an improvement, release paper is also provided on the outside of the adhesive layer.

[0017] As an improvement, the substrate and the same side of the groove pattern are roughened.

[0018] The advantages of this invention compared with the prior art are as follows: In this application, stress compensation is achieved by using a gel self-distribution channel in conjunction with convex points with gradient settings. The convex points can buffer pressure, the flanges prevent gel overflow, and the groove network promotes uniform gel distribution. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a liquid-cooled plate insulating PC strip assembly with optimized contact surface structure.

[0020] Figure 2 This is a structural schematic diagram of the enlarged surface view of this application.

[0021] Figure 3 This is a structural schematic diagram of the side view of this application.

[0022] As shown in the figure: 1. Substrate; 2. Adhesive layer; 3. Hemispherical bumps; 4. First gradient bumps; 5. Second gradient bumps; 6. Radial main grooves; 7. Annular auxiliary grooves; 8. Sealing flanges; 9. Release paper. Detailed Implementation

[0023] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. Identical components are indicated by the same reference numerals.

[0024] It should be noted that the terms “front,” “back,” “left,” “right,” “up,” and “down” used in the following description refer to the directions shown in the attached diagram, while the terms “inside” and “outside” refer to the directions toward or away from the geometric center of a specific component, respectively.

[0025] To make the content of this utility model easier to understand, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0026] Combined with appendix Figure 1-3As shown, a liquid-cooled plate insulating PC strip assembly with optimized contact surface structure includes a substrate 1. An adhesive layer 2 is connected to one end face of the substrate 1. Release paper 9 is also provided on the outside of the adhesive layer 2. A plurality of hemispherical protrusions 3 with gradually varying heights are provided on the other end face of the substrate 1, including a first gradient protrusion 4 provided in the middle of the substrate 1 and a second gradient protrusion 5 provided at the edge of the substrate 1. Grooves are also provided on the substrate 1 on the same side as the protrusions.

[0027] The first gradient protrusion 4 has a diameter of 1.2 mm and a height of 0.15 mm, the second gradient protrusion 5 has a diameter of 1.5 mm and a height of 0.25 mm, and a sealing flange 8 is formed on the same side of the substrate 1 as the groove pattern, which is arranged along the perimeter of the substrate 1. The sealing flange 8 has a height of 0.2 mm, and the substrate thickness is 1 mm and the width is 12 mm when in use.

[0028] To facilitate gel filling, the groove pattern includes radial main grooves 6 and annular auxiliary grooves 7 connected to the ends of the radial main grooves 6. The annular auxiliary grooves 7 are connected to the radial main grooves 6 to form a gel self-distribution channel. At the same time, the substrate 1 and the same side of the groove pattern are roughened. Specifically, the contact surface is ground with 1200-grit sandpaper to form directional micro-textures (roughness Ra 0.8-1.2μm), specifically, it is ground with 1200-grit diamond sandpaper to form directional micro-textures with a depth of 0.8μm.

[0029] In one embodiment, the radial main grooves are spaced at 15° intervals and are assembled with SKJ-100Y flame-retardant adhesive film.

[0030] The trench network promotes uniform gel distribution, meeting the stringent operating requirements of high-energy-density battery packs, while the edge sealing: closed flanges prevent gel overflow, and low-height protrusions disperse assembly stress.

[0031] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0032] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0033] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A liquid-cooled board insulation PC strip assembly that optimizes contact surface structure, characterized by: It comprises a substrate (1), one end surface of which is connected with an adhesive layer (2); The other end surface of the substrate (1) is provided with a plurality of semispherical convex points (3) with varying heights, including first gradient convex points (4) arranged in the middle of the substrate (1) and second gradient convex points (5) arranged at the edges of the substrate (1); The same side of the substrate (1) as the convex points is also provided with a groove pattern.

2. A liquid cold plate insulated PC strip assembly with optimized contact surface structure according to claim 1, characterized in that: The first gradient convex points (4) have a diameter of 1.2 mm and a height of 0.15 mm.

3. A liquid-cooled board insulation PC strip assembly with optimized contact surface structure according to claim 2, characterized in that: The second gradient convex points (5) have a diameter of 1.5 mm and a height of 0.25 mm.

4. The liquid-cooled insulated PC strip assembly of claim 1, wherein: The groove pattern comprises radial main grooves (6) and annular auxiliary grooves (7) connected at the ends of the radial main grooves (6); The annular auxiliary grooves (7) and the radial main grooves (6) form a gel self-distribution channel.

5. A liquid-cooled board insulation PC strip assembly with optimized contact surface structure according to claim 4, characterized in that: The edge of the substrate (1) on the same side as the groove pattern is also formed with a sealing flange (8) arranged along the circumference of the substrate (1), and the sealing flange (8) has a height of 0.2 mm.

6. The liquid cold plate insulated PC strip assembly of claim 1, wherein: The outer side of the adhesive layer (2) is also provided with a release paper (9).

7. The liquid-cooled board insulation PC strip assembly of claim 5, wherein: The same side of the substrate (1) as the groove pattern is roughened.

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