An electronic device

Abstract

The application discloses an electronic device, which comprises a first shell, a second shell, a third shell and a rotating shaft mechanism, the first shell, the second shell and the third shell are rotationally connected through the rotating shaft mechanism. In addition, the electronic device further comprises a system-level chip, a first radio frequency chip, a second radio frequency chip, a third radio frequency chip, a first radiator, a second radiator and a third radiator. The system-level chip, the first radio frequency chip and the first radiator are arranged in the first shell, the second radio frequency chip and the second radiator are arranged in the second shell, and the third radio frequency chip and the third radiator are arranged in the third shell. Therefore, not only the first radio frequency chip and the first radiator are arranged in the first shell, but also the second radio frequency chip and the second radiator are arranged in the second shell, and additionally, the third radio frequency chip and the third radiator are arranged in the third shell, more communication links can be established, the communication performance of the electronic device is improved, and the demand of the electronic device for the improvement of the communication link is met.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] With the rapid development of mobile communication technology and the widespread adoption of smart electronic devices, people's demands for electronic devices are increasing. While traditional smart electronic devices are already powerful enough in terms of functionality, they have limitations in terms of portability and flexibility. To address this issue, foldable electronic devices have emerged. Foldable electronic devices consist of a foldable stand and a flexible screen; the foldable stand enables the flexible screen to unfold and fold. Users can unfold the foldable electronic device to obtain a larger screen when needed, and fold it up when not in use to reduce its size and make it easy to carry.

[0003] As foldable electronic devices become increasingly feature-rich and their application scenarios expand, the number of devices they need to connect to increases, leading to a significant increase in the demand for communication links. Utility Model Content

[0004] This application provides an electronic device for increasing communication links.

[0005] In a first aspect, this application provides an electronic device comprising a first housing, a second housing, a third housing, and a rotating shaft mechanism, wherein the first housing, the second housing, and the third housing are rotatably connected via the rotating shaft mechanism. Additionally, the electronic device further includes a system-on-a-chip (SoC), a first radio frequency (RF) chip, a second RF chip, a third RF chip, a first radiator, a second radiator, and a third radiator. In this application, the SoC, the first RF chip, and the first radiator are disposed in the first housing; the first RF chip is connected to the SoC and coupled to the first radiator. The second RF chip and the second radiator are disposed in the second housing; the second RF chip is connected to the SoC and coupled to the second radiator. The third RF chip and the third radiator are disposed in the third housing; the third RF chip is connected to the SoC and coupled to the third radiator.

[0006] The electronic device in this application not only has a first radio frequency chip and a first radiator in the first housing, but also has a second radio frequency chip and a second radiator in the second housing, and additionally has a third radio frequency chip and a third radiator in the third housing. This allows for the establishment of more communication links, improves the communication performance of the electronic device, and meets the electronic device's need for enhanced communication links.

[0007] In one possible implementation, the third radio frequency chip includes the first short-range communication chip, and the third radiator includes the first short-range communication antenna. This allows for the establishment of more short-range wireless communication links, enabling traffic offloading and avoiding channel contention.

[0008] In one possible implementation, the first short-range communication chip includes a first short-range integrated chip, and the first short-range communication antenna includes one or more of the following: a first wireless fidelity (Wi-Fi) antenna, a first global navigation satellite system (GNSS) antenna, a first short-range precision positioning (SLP) antenna, a first short-range low-energy (SLE) antenna, a first Bluetooth (BT) antenna, and a first near-field communication (NFC) antenna. Furthermore, the first short-range integrated chip is coupled to one or more of the following antennas: the first Wi-Fi antenna, the first GNSS antenna, the first SLP antenna, the first SLE antenna, the first Bluetooth antenna, and the first NFC antenna. The first short-range integrated chip transmits and / or receives short-range wireless signals through the antenna coupled to it, thereby realizing short-range wireless communication.

[0009] For example, the first short-range integrated chip is a short-range communication system-on-a-chip that can share the radio frequency front end, which can reduce the chip footprint compared to a separate solution.

[0010] In one possible implementation, the frame of the third housing includes a first first short-range communication antenna and a second first short-range communication antenna. The first first short-range communication antenna and the second first short-range communication antenna respectively include a first Wi-Fi antenna, a first GNSS antenna and a first star flash SLP antenna, which can realize dual Wi-Fi communication function, dual GNSS communication function and SLP function, and realize service offloading to avoid channel contention.

[0011] In one possible implementation, the frame of the third housing includes a first first short-range communication antenna and a second first short-range communication antenna. The first first short-range communication antenna includes a first GNSS antenna and a first satellite flash SLP antenna, and the second first short-range communication antenna includes a first satellite flash SLE antenna, a first GNSS antenna, and a first satellite flash SLP antenna. This can realize dual GNSS communication function, SLP and SLE function, and can also realize service offloading to avoid channel contention.

[0012] In one possible implementation, the frame of the third housing includes a first first short-range communication antenna and a second first short-range communication antenna. The first first short-range communication antenna includes a first GNSS antenna and a first satellite flash SLP antenna, and the second first short-range communication antenna includes a first satellite flash SLE antenna and a first satellite flash SLP antenna. This can realize GNSS communication function, SLP and SLE function, and can also realize service offloading to avoid channel contention.

[0013] In one possible implementation, the first short-range communication chip includes a first Wi-Fi chip, and the first short-range communication antenna includes a second Wi-Fi antenna. The first Wi-Fi chip and the second Wi-Fi antenna are coupled to achieve Wi-Fi communication. For example, if the first radio frequency chip can achieve Wi-Fi communication functionality, the first Wi-Fi chip can also achieve Wi-Fi communication functionality, enabling the electronic device to achieve dual Wi-Fi communication functionality. In this case, the second short-range communication chip can execute service 3, and the first Wi-Fi chip can execute service 4, achieving service offloading and avoiding channel contention.

[0014] In one possible implementation, a first radio frequency (RF) front-end module and a first bandpass filter are further included, both disposed on a third circuit board within a third housing. The first RF front-end module is connected between the first Wi-Fi chip and the first bandpass filter, and the first bandpass filter is coupled to a second Wi-Fi antenna. The first Wi-Fi chip can feed RF signals to the second Wi-Fi antenna through the first RF front-end module, and the signals received by the second Wi-Fi antenna can be transmitted back to the first Wi-Fi chip through the first RF front-end module to achieve Wi-Fi communication.

[0015] In one possible implementation, the first short-range communication chip includes a first SLE (Sparkling Lightning) RF front-end module, and the first short-range communication antenna includes a second SLE antenna. The first SLE RF front-end module and the second SLE antenna are coupled to achieve SLE communication. Furthermore, this implementation can simplify the components on the third circuit board and reduce the power consumption and heat generation of the third circuit board.

[0016] In one possible implementation, a first switch and a second RF front-end module are also included. The first switch and the second RF front-end module are disposed on a first circuit board within a first housing. The first RF chip and the first radiator are coupled through the second RF front-end module. The control terminal and the first terminal of the first switch are respectively connected to the first RF chip, the second terminal of the first switch is connected to the first SLE antenna, and the third terminal of the first switch is connected to the second RF front-end module. By controlling the first switch, the first RF chip can feed RF signals to the second SLE antenna through the second RF front-end module. The signals received by the second SLE antenna can be transmitted back to the first RF chip through the second RF front-end module, realizing SLE communication. Furthermore, this implementation can simplify the components on the third circuit board and reduce the power consumption and heat of the third circuit board.

[0017] In one possible implementation, the first short-range communication chip includes a first satellite strobe SLP chip, and the first short-range communication antenna includes a second satellite strobe SLP antenna. The first satellite strobe SLP chip and the second satellite strobe SLP antenna are coupled together. The first satellite strobe SLP chip can be fed with radio frequency signals through the second satellite strobe SLP antenna, and the signals received by the second satellite strobe SLP antenna can be transmitted to the first satellite strobe SLP chip, realizing SLP communication. Furthermore, this implementation can simplify the components on the third circuit board and reduce the power consumption and heat of the third circuit board.

[0018] In one possible implementation, a third RF front-end module is also included, which is disposed on a third circuit board within a third housing. The first SLP chip and the second SLP antenna are coupled through the third RF front-end module. The first SLP chip can feed RF signals to the second SLP antenna through the third RF front-end module, and the signals received by the second SLP antenna can be transmitted back to the first SLP chip through the third RF front-end module.

[0019] In one possible implementation, the first short-range communication chip includes a first GNSS chip, and the first short-range communication antenna includes a second GNSS antenna, with the first GNSS chip coupled to the second GNSS antenna. The first GNSS chip can be fed with radio frequency signals through the second GNSS antenna, and the signals received by the second GNSS antenna can be transmitted to the first GNSS chip, thus realizing GNSS communication. Furthermore, this implementation can simplify the components on the third circuit board and reduce the power consumption and heat generation of the third circuit board.

[0020] In one possible implementation, a fourth RF front-end module is also included, which is disposed on a third circuit board within a third housing. The first GNSS chip and the second GNSS antenna are coupled through the fourth RF front-end module. The first GNSS chip can feed RF signals to the second GNSS antenna through the fourth RF front-end module, and the signals received by the second GNSS antenna can be transmitted back to the first GNSS chip through the fourth RF front-end module.

[0021] In one possible implementation, the first radio frequency chip includes a second short-range communication chip, and the first radiator includes a second short-range communication antenna. This allows for the establishment of more short-range wireless communication links, enabling traffic offloading and avoiding channel contention.

[0022] In one possible implementation, the second radio frequency chip includes a cellular chip, and the second radiator includes a cellular antenna. This allows for the establishment of a cellular communication link, and consequently, cellular communication can be implemented within the second housing.

[0023] In one possible implementation, the system-on-a-chip and the first radio frequency chip are disposed on the first circuit board in the first housing, and the first radiator is disposed on the frame of the first housing, which is beneficial to achieving more uniform omnidirectional coverage.

[0024] In one possible implementation, the second radio frequency chip is disposed on the second circuit board in the second housing, and the second radiator is disposed on the edge of the second housing, which is beneficial to achieving more uniform omnidirectional coverage.

[0025] In one possible implementation, the third radio frequency chip is disposed on the third circuit board in the third housing, and the third radiator is disposed on the frame of the third housing, which is beneficial to achieving more uniform omnidirectional coverage.

[0026] In one possible implementation, the pivot mechanism includes a first pivot mechanism and a second pivot mechanism. The first housing and the second housing are rotatably connected via the first pivot mechanism, and the first housing and the third housing are rotatably connected via the second pivot mechanism. Thus, during use, the first housing and the second housing can rotate towards or away from each other under the action of the first pivot mechanism, and the first housing and the third housing can rotate towards or away from each other under the action of the second pivot mechanism, thereby enabling the electronic device to close and unfold according to different usage scenarios. Attached Figure Description

[0027] Figure 1 A schematic diagram of an electronic device provided in an embodiment of this application in a flattened state;

[0028] Figure 2 A schematic diagram of a mobile terminal in a hovering state provided in an embodiment of this application;

[0029] Figure 3 This is a schematic diagram of the structure of an electronic device in an embodiment of this application;

[0030] Figure 4 A schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0031] Figure 5 A schematic diagram of another structure of the electronic device provided in the embodiments of this application;

[0032] Figure 6A A schematic diagram of another structure of the electronic device provided in the embodiments of this application;

[0033] Figure 6B A schematic diagram of another structure of the electronic device provided in the embodiments of this application;

[0034] Figure 6C A schematic diagram of another structure of the electronic device provided in the embodiments of this application;

[0035] Figure 7A A schematic diagram of another structure of the electronic device provided in the embodiments of this application;

[0036] Figure 7B A schematic diagram of another structure of the electronic device provided in the embodiments of this application;

[0037] Figure 7C A schematic diagram of the radio frequency link of the second Wi-Fi antenna provided in the embodiments of this application;

[0038] Figure 8A A schematic diagram of another structure of the electronic device provided in the embodiments of this application;

[0039] Figure 8B A schematic diagram of another structure of the electronic device provided in the embodiments of this application;

[0040] Figure 8C A schematic diagram of the radio frequency link of the second short-range communication chip and the second star flash SLE antenna provided in the embodiments of this application;

[0041] Figure 9A A schematic diagram of another structure of the electronic device provided in the embodiments of this application;

[0042] Figure 9B A schematic diagram of another structure of the electronic device provided in the embodiments of this application;

[0043] Figure 9C A schematic diagram of the radio frequency link of the second short-range communication chip and the second star flash SLP antenna provided in the embodiments of this application;

[0044] Figure 10AA schematic diagram of another structure of the electronic device provided in the embodiments of this application;

[0045] Figure 10B A schematic diagram of another structure of the electronic device provided in the embodiments of this application;

[0046] Figure 10C This is a schematic diagram of the radio frequency link of the system-on-a-chip, the second short-range communication chip, and the second GNSS antenna provided in the embodiments of this application.

[0047] Figure label:

[0048] 1-First housing; 2-Second housing; 3-Third housing; 4-First rotating mechanism; 5-Second rotating mechanism; 10-Electronic device; 11-First circuit board; 12-System-on-a-chip; 13-First RF chip; 131-Second short-range communication chip; 14-First radiator; 141 / 142 / 143 / 144 / 145-Second short-range communication antenna; 15-First switch; 16-Second RF front-end module; 161-Second switch; 162-Third switch; 163-Fifth bandpass filter; 164-Sixth bandpass filter; 17-Fifth RF front-end module; 21-Second circuit board; 22-Second RF chip; 221-Cellular chip; 23-Second radiator; 231 / 232 / 233 / 234 / 235-Cellular antenna; 31-Third circuit board; 32-Third RF chip; 32 1-First short-range communication chip; 3211-First short-range integrated chip; 3212-First Wi-Fi chip; 3213-First SLE radio frequency front-end module; 3214-First SLP radio frequency chip; 3215-First GNSS chip; 322-First radio frequency front-end module; 323-First bandpass filter; 324-Third radio frequency front-end module; 3241-Third bandpass filter; 3242-Third bandpass filter; 3243-Fourth switch; 325-Fourth radio frequency front-end module; 33-Third radiator; 331 / 332-First short-range communication antenna; 41-First flexible circuit board; 411-First signal transmission path; 51-Second flexible circuit board; 511-Second signal transmission path; 512-Third signal transmission path; 100-Foldable bracket; 200-Flexible display screen. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The specific operational methods in the method embodiments can also be applied to the device embodiments or system embodiments. It should be noted that in the description of this application, "multiple" can be understood as "at least two". Furthermore, it should be understood that in the description of this application, terms such as "first" and "second" are used only for distinguishing purposes and should not be construed as indicating or implying relative importance, nor as indicating or implying order.

[0050] It should be noted that the same reference numerals in the accompanying drawings of this application denote the same or similar structures, and therefore repeated descriptions of them will be omitted. Terms expressing position and direction described in this application are illustrative based on the accompanying drawings, but may be modified as needed, and all modifications are included within the scope of protection of this application. The accompanying drawings of this application are for illustrating relative positional relationships only and do not represent actual scale.

[0051] It should be noted that specific details are set forth in the following description to facilitate understanding of this application. However, the embodiments of this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the embodiments of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0052] To facilitate understanding of this application, the following explanations are provided for terms that may appear in the embodiments of this application.

[0053] Radiator: In an antenna, this is the device used to receive / transmit electromagnetic wave radiation. In some cases, the term "antenna" is narrowly defined as a radiator, which converts guided wave energy from a transmitter into radio waves, or converts radio waves into guided wave energy, for radiating and receiving radio waves. For example, the modulated high-frequency current energy (or guided wave energy) generated by the transmitter is transmitted to the transmitting radiator via a feed line, where it is converted into electromagnetic wave energy of a certain polarization and radiated in the desired direction. The receiving radiator converts electromagnetic wave energy of a certain polarization from a specific direction in space back into modulated high-frequency current energy, which is then transmitted to the receiver input via a feed line.

[0054] Exemplarily, any housing in an electronic device includes a frame that is circumferentially disposed around the periphery of the housing. Exemplarily, a frame primarily composed of conductive material can be referred to as a conductive frame or metal frame of the electronic device, suitable for industrial design (ID) with a metallic appearance. In one implementation, the outer surface of the frame is primarily made of a conductive material, such as a metal, thus forming the appearance of a metallic frame. In these implementations, the conductive portion of the frame including the outer surface can be used as an antenna radiator of the electronic device and is commonly referred to as a frame antenna.

[0055] In another implementation, the outer surface of the frame is primarily made of a non-conductive material, such as plastic, forming a non-metallic frame appearance suitable for non-metallic IDs. Exemplarily, the inner surface of the frame includes a conductive material, such as a metal. In this implementation, the conductive portion of the inner surface of the frame can be used as an antenna radiator for the electronic device. It is understood that the radiator (or the conductive material of the inner surface) disposed on the inner surface of the frame can be positioned close to the non-conductive material of the frame to minimize the volume occupied by the radiator and to be closer to the outside of the electronic device, achieving better signal transmission performance; this can also be referred to as a frame antenna. Furthermore, "the antenna radiator is positioned close to the non-conductive material of the frame" means that the antenna radiator can be tightly attached to the inner surface of the non-conductive material, embedded within the non-conductive material, or positioned close to the inner surface of the non-conductive material; for example, there can be a small gap between the antenna radiator and the inner surface of the non-conductive material. It is understood that both the conductive and non-conductive materials can be considered part of the frame.

[0056] A radio frequency integrated circuit (RFIC) is a combination of all components used for receiving and transmitting radio frequency (RF) signals. For example, an RF IC may include RF front-end modules (RF FEMs) and transceivers. In the case of a receiving antenna, the RF IC can be considered as the section from the first amplifier to the front-end transmitter. In a transmitting antenna, the RF IC can be considered as the section after the last power amplifier. In some cases, the RF IC may also integrate a feed unit. Typically, the feed unit is considered part of the antenna system, used to convert radio waves into electrical signals and vice versa. Antenna design should consider the maximum power transfer possibility and efficiency. For this purpose, the antenna feed impedance needs to be matched with the load resistance. The antenna feed impedance is a combination of resistance, capacitance, and inductance. To ensure maximum power transfer conditions, the load resistance and feed impedance should be matched, which can be achieved by considering frequency requirements and antenna design parameters such as gain, directivity, and radiation efficiency.

[0057] In some embodiments, the electronic device may further include a test socket (or RF socket or RF test socket). This test socket can be used to insert a coaxial cable to test the characteristics of the radiator of the RF front-end circuit or antenna. The RF front-end circuit can be considered as a circuit section coupled between the test socket and the transceiver. Exemplarily, the RF front-end circuit can be integrated as an RF front-end chip, or the RF front-end circuit and the transceiver can be integrated as an RF chip.

[0058] Operating Frequency Band: Regardless of the type of antenna, it always operates within a certain frequency range (bandwidth). For example, an antenna supporting the B40 band operates within the frequency range of 2300MHz to 2400MHz, or in other words, the antenna supports the B40 band. The frequency range that meets the specifications can be considered the operating frequency band supported by the antenna. Furthermore, the width of the operating frequency band is called the operating bandwidth. The operating bandwidth of an omnidirectional antenna may reach 3-5% of the center frequency. The operating bandwidth of a directional antenna may reach 5-10% of the center frequency. The operating bandwidth can be considered as a frequency range on both sides of the center frequency (e.g., the resonant frequency of a dipole), whose antenna characteristics are within the acceptable range of the center frequency.

[0059] Coupling: This can be understood as direct circuit coupling, such as directly connecting the output of an RF chip to an antenna port via a transmission line (e.g., microstrip line, coaxial line). Impedance matching is required to reduce reflection loss. Alternatively, it can be understood as indirect coupling, where two conductors conduct electricity through a gap or without contact. For example, signal transmission is achieved by forming an equivalent capacitance through coupling between two conductive parts.

[0060] To facilitate understanding of the electronic devices provided in the embodiments of this application, their application scenarios are first introduced below. The electronic devices in the embodiments of this application are applicable to terminal devices with communication functions. For example, they may refer to terminal devices employing one or more of the following communication technologies: Bluetooth (BT) communication technology, Global Positioning System (GPS) communication technology, Wireless Fidelity (Wi-Fi) communication technology, Global System for Mobile Communications (GSM) communication technology, Wideband Code Division Multiple Access (WCDMA) communication technology, Long Term Evolution (LTE) communication technology, 5G communication technology, and other future communication technologies. The electronic devices in the embodiments of this application include, but are not limited to, mobile phones, tablets, laptops, smart bracelets, smartwatches, smart helmets, and smart glasses. Furthermore, the aforementioned electronic devices may also be handheld devices with wireless communication functions, computing devices, other processing devices connected to a wireless modem, in-vehicle devices, electronic devices in 5G networks, or electronic devices in future evolved public land mobile networks (PLMNs), etc. The embodiments of this application do not limit these categories.

[0061] To meet users' demands for large displays and portability in electronic devices, multi-fold electronic devices, such as tri-fold, quad-fold, and penta-fold devices, are increasingly being used in people's daily lives. Taking a tri-fold electronic device as an example... Figure 1 , Figure 1 This is a schematic diagram of an electronic device in a flattened state according to an embodiment of this application. The electronic device 10 may include a foldable bracket 100 and a flexible display screen 200, with the flexible display screen 200 mounted on the foldable bracket 100. Furthermore, in this flattened state, the flexible display screen 200 is fully unfolded, at which point the display area of ​​the electronic device 10 is at its maximum.

[0062] You can continue to refer to Figure 1 The foldable support 100 of the electronic device 10 may include three housings and two pivot mechanisms. For ease of explanation, the three housings are named first housing 1, second housing 2, and third housing 3, and the two pivot mechanisms are named first pivot mechanism 4 and second pivot mechanism 5. The first pivot mechanism 4 is located between the first housing 1 and the second housing 2, and the first housing 1 and the second housing 2 are rotatably connected via the first pivot mechanism 4. The second pivot mechanism 5 is located between the first housing 1 and the third housing 3, and the first housing 1 and the third housing 3 are rotatably connected via the second pivot mechanism 5.

[0063] When in use, the first housing 1 and the second housing 2 can rotate towards or away from each other under the action of the first rotating shaft mechanism 4, and the first housing 1 and the third housing 3 can rotate towards or away from each other under the action of the second rotating shaft mechanism 5, so that the electronic device 10 can be closed and opened according to different usage scenarios.

[0064] Since electronic devices come in various forms during use, such as a flattened state, a hovering state, and a folded state, for ease of description, the angle between the first housing 1 and the second housing 2 is considered the first angle, and the angle between the first housing 1 and the third housing 3 is considered the second angle.

[0065] Flattened state: This refers to the state in which the first housing 1, the second housing 2, and the third housing 3 of the electronic device are fully unfolded. (See reference...) Figure 1 In the flattened state, the first angle between the first housing 1 and the second housing 2 can be between 175° and 185°, and the second angle between the first housing 1 and the third housing 3 can be between 175° and 185°. For example, in the flattened state, the first angle is 180° and the second angle is 180°.

[0066] Hovering state: This refers to the state where the first housing 1 and the second housing 2 are extended to a certain angle but not fully flattened. (See reference...) Figure 2 , Figure 2 This is a schematic diagram of a mobile terminal in a hovering state provided in an embodiment of this application. In this hovering state, the first angle between the first housing 1 and the second housing 2 can be between 45° and 175°, and the second angle between the second housing 2 and the third housing 3 can be between 45° and 175°.

[0067] Folded state: also known as closed state, that is, the first shell 1 and the second shell 2 are completely folded and closed, and the first shell 1 and the third shell 3 are completely folded and closed, then the first angle is 0° and the second angle is 0°. Alternatively, in some embodiments, the first angle may also be located between 0° and 45°, and the second angle may also be located between 0° and 45°.

[0068] In the embodiments of this application, the electronic device 10 includes, but is not limited to, mobile phones, tablet computers, laptop computers, e-book readers, cameras, wearable devices, or home electronic devices. For ease of understanding, in the embodiments of this application, a mobile phone is used as an example for illustration.

[0069] For example, the flexible display screen 200 is used to display information and provide an interactive interface for users. In various embodiments of this application, the flexible display screen 200 includes, but is not limited to, an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode (mini LED) display screen, a micro light-emitting diode (micro LED) display screen, a micro organic light-emitting diode (micro OLED) display screen, a mini organic light-emitting diode (mini OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, etc.

[0070] Exemplarily, the first housing 1, the second housing 2, and the third housing 3 can each form an installation space for mounting electronic components of the electronic device 10, such as circuit boards, batteries, receivers, speakers, or cameras. The circuit board can integrate electronic components such as the main controller, storage unit, antenna module, and power management module of the electronic device, while the battery can power the flexible display screen 200, circuit boards, receivers, speakers, cameras, and other electronic components. In one possible implementation, any two of the first housing 1, second housing 2, and third housing 3 may have installation spaces to distribute the components of the electronic device across each housing. In another possible implementation, only one of the first housing 1, second housing 2, or third housing 3 may have an installation space to centrally distribute the components of the electronic device within that installation space.

[0071] Figure 3 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application. (Refer to...) Figure 3 In this electronic device, the system-on-chip (SOC) 12 and the first radio frequency chip 13 are both disposed in the first housing 1, and the second radio frequency chip 22 is disposed in the second housing 2. Although a communication link can be established between the first radio frequency chip 13 and the second radio frequency chip 22 in this electronic device, as the functions of electronic devices become increasingly rich and application scenarios continue to expand, the number of devices that need to be connected during use increases, leading to a significant increase in the demand for communication links.

[0072] To increase communication links, refer to Figure 4 , Figure 4 This is a schematic diagram of an electronic device provided in an embodiment of this application. In this embodiment, the electronic device 10 includes: a system-on-a-chip (SoC) 12, a first radio frequency (RF) chip 13, a second RF chip 22, a third RF chip 32, a first radiator 14, a second radiator 23, and a third radiator 33. The SoC 12, the first RF chip 13, and the first radiator 14 are disposed in a first housing 1. The second RF chip 22 and the second radiator 23 are disposed in a second housing 2. The third RF chip 32 and the third radiator 33 are disposed in a third housing 3.

[0073] Furthermore, the first radio frequency chip 13 is connected to the system-on-a-chip 12 to enable signal transmission between the system-on-a-chip 12 and the first radio frequency chip 13. The first radio frequency chip 13 is coupled to the first radiator 14, thereby enabling the first radio frequency chip 13 to transmit and / or receive first radio frequency signals through the first radiator 14 to establish a communication link.

[0074] The second radio frequency chip 22 is connected to the system-on-a-chip 12 to enable signal transmission between the second radio frequency chip 22 and the system-on-a-chip 12. The second radio frequency chip 22 is coupled to the second radiator 23, thereby enabling the second radio frequency chip 22 to transmit and / or receive second radio frequency signals through the second radiator 23 to establish a communication link.

[0075] The third radio frequency chip 32 is connected to the system-on-a-chip 12 to enable signal transmission between the third radio frequency chip 32 and the system-on-a-chip 12. The third radio frequency chip 32 is coupled to the third radiator 33, thereby enabling the third radio frequency chip 32 to transmit and / or receive third radio frequency signals through the third radiator 33 to establish a communication link.

[0076] In this embodiment of the application, the electronic device 10 has a third radio frequency chip 32 and a third radiator 33 additionally provided in the third housing, and... Figure 3 Compared to the electronic devices shown, more communication links can be established, improving the communication performance of the electronic devices and meeting the needs of the electronic devices for improved communication links.

[0077] Furthermore, in the electronic device of this application embodiment, a third radio frequency chip 32 and a third radiator 33 are additionally provided in the third housing, which is equivalent to... Figure 3 The electronic device shown has a housing without radio frequency chips and radiators, but a third radio frequency chip 32 and a third radiator 33 have been added. This not only makes full use of space resources, but also enables the radio frequency chips and radiators to be rationally distributed in the electronic device, reducing the proportion of the same circuit board area occupied by different radio frequency chips.

[0078] Furthermore, in the electronic device of this application embodiment, by setting the system-on-a-chip 12 and the first radio frequency chip 13 in the first housing 1, setting the second radio frequency chip 22 in the second housing 2, and setting the third radio frequency chip 32 in the third housing 3, it is beneficial to improve the temperature uniformity of the three housings, thereby improving the temperature uniformity of the entire electronic device and improving the heat dissipation performance of the electronic device, so as to improve the user experience.

[0079] For example, refer to Figure 4 The first radiator 14 is disposed on the frame of the first housing 1, which facilitates more uniform omnidirectional coverage. Exemplarily, the frame of the first housing 1 is arranged circumferentially around the first housing 1. Furthermore, the frame of the first housing 1 is provided with a plurality of first radiators 14, indicated by a rectangular dashed frame. These plurality of first radiators 14 can be used to transmit signals of the same frequency band or signals of different frequency bands; this application does not limit their use. In addition, the specific positions of the plurality of first radiators 14 on the frame of the first housing 1 can be flexibly designed according to actual application requirements; this application does not limit their use.

[0080] For example, refer to Figure 4 The second radiator 23 is disposed on the frame of the second housing 2. Exemplarily, the frame of the second housing 2 is arranged circumferentially around the second housing 2. Furthermore, the frame of the second housing 2 is provided with a plurality of second radiators 23, indicated by a rectangular dashed frame. These plurality of second radiators 23 can be used to transmit signals of the same frequency band or signals of different frequency bands; this application does not limit their use. Moreover, the specific positions of the plurality of second radiators 23 on the frame of the second housing 2 can be flexibly designed according to actual application requirements; this application does not limit their use.

[0081] For example, refer to Figure 4 The third radiator 33 is disposed on the frame of the third housing 3. Exemplarily, the frame of the third housing 3 is arranged circumferentially around the third housing 3. Furthermore, the frame of the third housing 3 is provided with a plurality of third radiators 33, indicated by a rectangular dashed frame. These plurality of third radiators 33 can be used to transmit signals of the same frequency band or signals of different frequency bands; this application does not limit their use. Moreover, the specific positions of the plurality of third radiators 33 on the frame of the third housing 3 can be flexibly designed according to actual application requirements; this application does not limit their use.

[0082] It is understood that, in order to demonstrate the first radiator 14, the second radiator 23, and the third radiator 33 in the embodiments of this application, Figure 4 The illustration shows two first radiators 14, two second radiators 23, and two third radiators 33. In other embodiments of this application, the number of first radiators 14, second radiators 23, and third radiators 33 may be one, three, four, or more, and can be flexibly designed according to the needs of actual applications. This application does not limit this.

[0083] Furthermore, to clearly illustrate the structure of the electronic device in the embodiments of this application, this application uses a three-fold electronic device as an example for illustration. In other embodiments of this application, the electronic device may also be a four-fold, five-fold, or other multi-fold electronic device, and the structural relationship of the multi-fold electronic device satisfies the structural relationship of the three-fold electronic device described above, which will not be elaborated here.

[0084] Figure 5 This is another structural schematic diagram of the electronic device provided in an embodiment of this application. (Refer to...) Figure 5The electronic device 10 also includes a first circuit board 11, which is located in the first housing 1. The system-on-a-chip 12 and the first radio frequency chip 13 are disposed on the first circuit board 11. For example, the system-on-a-chip 12 and the first radio frequency chip 13 are respectively connected to the first circuit board 11, so that the system-on-a-chip 12 and the first radio frequency chip 13 can realize signal transmission through the first circuit board 11.

[0085] For example, refer to Figure 5 The electronic device 10 also includes a second circuit board 21, which is located in the second housing 2, and a second radio frequency chip 22 is disposed on the second circuit board 21. For example, the second radio frequency chip 22 is connected to the second circuit board 21. In order to realize communication between the system-on-a-chip 12 and the second radio frequency chip 22, the first circuit board 11 and the second circuit board 21 can be connected.

[0086] For example, refer to Figure 5 The electronic device 10 also includes a third circuit board 31, which is located in the third housing 3, and a third radio frequency chip 32 is disposed on the third circuit board 31. For example, the third radio frequency chip 32 is connected to the third circuit board 31. In order to realize communication between the system-on-a-chip 12 and the third radio frequency chip 32, the first circuit board 11 and the third circuit board 31 can be connected.

[0087] Understandably, Figure 5 This is merely an exemplary illustration of the distribution of the first circuit board 11, the second circuit board 21, and the third circuit board 31 in an electronic device, and should not be construed as limiting the shape and size of the first circuit board 11, the second circuit board 21, and the third circuit board 31.

[0088] It is worth mentioning that, in the electronic device provided in this application, in addition to the first radiator 14 disposed on the frame of the first housing 1, the second radiator 23 disposed on the frame of the second housing 2, and the third radiator 33 disposed on the frame of the third housing 3, it may also include radiators disposed within any one of the first housing 1, the second housing 2, and the third housing 3, such as radiators disposed on a circuit board. This can improve the utilization rate of any one of the first housing 1, the second housing 2, and the third housing 3, while also facilitating an increase in the number of antennas in the electronic device, thereby improving the communication performance of the electronic device.

[0089] In one embodiment of this application, the first radio frequency chip 13 can be used for transmitting and / or receiving short-range wireless signals. That is, the first radio frequency signal can be a short-range wireless signal, the first radio frequency chip 13 can be configured as a short-range communication chip, and the first radiator 14 can be configured as a short-range communication antenna, thereby establishing a short-range wireless communication link and enabling short-range wireless communication within the first housing 1. Exemplarily, the short-range communication antenna may include one or more of the following: a Wi-Fi antenna, a BT antenna, a short-range precision positioning (SLP) antenna, a short-range low energy (SLE) antenna, a near field communication (NFC) antenna, and a global navigation satellite system (GNSS) antenna.

[0090] For example, refer to Figure 5 , Figure 5 This is another schematic diagram of the electronic device provided in the embodiments of this application. The first radio frequency chip 13 is a second short-range communication chip 131, and the first radiator 14 includes second short-range communication antennas 141, 142, 143, 144, and 145. The second short-range communication chip 131 is coupled to the second short-range communication antennas 141 to 145 respectively. The second short-range communication chip 131 transmits and / or receives short-range wireless signals through the second short-range communication antennas 141 to 145.

[0091] For example, the second short-range communication chip 131 can be a short-range communication SOC. The short-range communication SOC integrates multi-mode wireless connectivity and can support any two, three, four, or all of the following communication protocols: Wi-Fi, GNSS, SLP, SLE, BT, and NFC. The short-range communication SOC can share the radio frequency front-end, which reduces the chip footprint compared to a separate solution.

[0092] Exemplarily, second short-range communication antennas 141 and 142 include a Wi-Fi antenna and a GNSS antenna, respectively. Second short-range communication antenna 143 includes a BT antenna, a SLE antenna, and a SLP antenna. Second short-range communication antennas 144 and 145 each include a Wi-Fi antenna. Exemplarily, the Wi-Fi antenna supports operating frequency bands including, but not limited to, the 2.4 GHz band or the 5 GHz band. The GNSS antenna supports operating frequency bands including, but not limited to, the GPS L5 band. The SLE antenna supports operating frequency bands including, but not limited to, the 2.4 GHz band. The SLP antenna supports operating frequency bands including, but not limited to, the 6.5 GHz band and / or the 8 GHz band.

[0093] Understandably, Figure 5 This is merely an exemplary demonstration of the distribution of the second short-range communication antennas 141-145 in an electronic device, and should not be construed as a limitation on the location and number of the second short-range communication antennas 141-145 or the specific antenna types.

[0094] Additionally, the second short-range communication antenna includes a Wi-Fi antenna and a GNSS antenna, indicating that the corresponding radiator is a shared radiator for both Wi-Fi and GNSS antennas, capable of transmitting both GPS and Wi-Fi signals. Similarly, the second short-range communication antenna includes a BT antenna, an SLE antenna, and an SLP antenna, indicating that the corresponding radiator is a shared radiator for all three types of antennas, capable of transmitting BT, SLE, and SLP signals.

[0095] In some embodiments, a cellular chip may be further disposed on the first circuit board 11, and a cellular antenna may be further disposed on the frame of the first housing 1, so that both short-range wireless communication and cellular communication can be realized in the first housing 1.

[0096] In one embodiment of this application, reference is made to... Figure 5 The electronic device 10 also includes a first flexible circuit board 41, which is connected to the first circuit board 11 and the second circuit board 21. This allows the first circuit board 11 and the second circuit board 21 to be connected via the first flexible circuit board 41, enabling signal transmission between them and thus facilitating communication between the system-on-a-chip 12 and the second radio frequency chip 22. For example, since the first circuit board 11 is disposed in the first housing 1 and the second circuit board 21 is disposed in the second housing 2, the first flexible circuit board 41 can pass through the first rotating shaft mechanism 4 to connect with the first circuit board 11 and the second circuit board 21.

[0097] For example, the second radio frequency chip 22 can be used to transmit and / or receive cellular signals, that is, the second radio frequency signal can be a cellular signal, the second radio frequency chip 22 can be configured as a cellular chip, and the second radiator 23 can be configured as a cellular antenna, thereby establishing a cellular communication link and enabling cellular communication in the second housing 2. For example, referring to... Figure 5 The second radio frequency chip 22 includes a cellular chip 221, and the second radiator 23 includes cellular antennas 231, 232, 233, 234, and 235. The cellular chip 221 is coupled to the cellular antennas 231 to 235 respectively. The cellular chip 221 transmits and / or receives cellular signals through the cellular antennas 231 to 235.

[0098] For example, cellular antennas 231-233 and 235 are cellular antennas that include mid-high band (MHB) parasitic modules. Cellular antenna 234 is a cellular antenna that includes a low-band (LB) parasitic module.

[0099] Understandably, Figure 5 This is merely an illustrative demonstration of the distribution of cellular antennas 231-235 in an electronic device and should not be construed as limiting the location, number, or specific type of cellular antennas 231-235. Furthermore, in Figure 5 In this application, the operating frequency bands supported by each cellular antenna may be the same or different, and this application does not limit them.

[0100] In one embodiment of this application, reference is made to... Figure 5 The electronic device 10 also includes a second flexible circuit board 51, which is connected to the first circuit board 11 and the third circuit board 31. This allows the first circuit board 11 and the third circuit board 31 to be connected via the second flexible circuit board 51, enabling signal transmission between them and thus facilitating communication between the system-on-a-chip 12 and the third radio frequency chip 32. For example, since the first circuit board 11 is disposed in the first housing 1 and the third circuit board 31 is disposed in the third housing 3, the second flexible circuit board 51 can pass through the second rotating shaft mechanism 5 to connect with both the first circuit board 11 and the third circuit board 31.

[0101] It is worth noting that this application does not limit the specific communication methods between the second RF chip 22 and the third RF chip 32 and the system-on-a-chip 12, respectively. As an example, see... Figure 5The second RF chip 22 and the system-on-a-chip 12 can be connected via a first signal transmission path 411, which is disposed on the first flexible circuit board 41. The third RF chip 32 and the system-on-a-chip 12 can be connected via a second signal transmission path 511, which is disposed on the second flexible circuit board 51. To meet the signal transmission rate requirements, the first signal transmission path 411 and the second signal transmission path 511 can be, for example, a high-speed serial point-to-point dual-channel high-bandwidth transmission (PCIE) bus, a universal asynchronous receiver / transmitter (UART) bus, a general-purpose input / output (GPIO) bus, or other lines used for high-speed signal transmission.

[0102] As electronic devices become increasingly feature-rich and their application scenarios expand, they typically require connection to multiple terminal devices during use, such as smartwatches, Bluetooth headsets, augmented reality (AR) glasses, virtual reality (VR) glasses, routers, screen projection devices, mice, and keyboards. This leads to a significant increase in the demand for short-range wireless communication links in electronic devices. For example, a third radio frequency (RF) chip 32 can be used for transmitting and / or receiving short-range wireless signals; that is, the third RF signal can be a short-range wireless signal. The third RF chip 32 can be configured as a short-range communication chip, and the third radiator 33 can be configured as a short-range communication antenna, thereby establishing an additional short-range wireless communication link. This allows short-range wireless communication to be realized within the third housing 3, meeting the growing demand for short-range wireless communication links in electronic devices.

[0103] For example, refer to Figure 5 The third radio frequency chip 32 includes a first short-range communication chip 321, and the third radiator 33 includes first short-range communication antennas 331 and 332. The first short-range communication chip 321 transmits and / or receives short-range wireless signals through the first short-range communication antennas 331 and 332. The second short-range communication chip 131 can perform service 1, and the first short-range communication chip 321 can perform service 2, increasing the short-range wireless communication link, achieving service offloading, and avoiding channel contention.

[0104] Understandably, Figure 5 This is merely an exemplary demonstration of the distribution of the first short-range communication antennas 331 and 332 in an electronic device, and should not be construed as a limitation on the location and number of the first short-range communication antennas 331 and 332.

[0105] In one embodiment of this application, reference is made to... Figure 6A , Figure 6A This is another schematic diagram of the structure of the electronic device provided in the embodiments of this application. The first short-range communication chip 321 includes a first short-range integrated chip 3211. The first short-range integrated chip 3211 can be a short-range communication SOC, which can share the radio frequency front-end, and can reduce the chip area compared with the separate solution.

[0106] The first short-range communication antennas 331 and 332 include one or more of a first Wi-Fi antenna, a first GNSS antenna, a first satellite strobe SLP antenna, a first satellite strobe SLE antenna, a first BT antenna, and a first NFC antenna. The first short-range integrated chip 3211 is coupled to one or more of the first Wi-Fi antenna, first GNSS antenna, first satellite strobe SLP antenna, first satellite strobe SLE antenna, first BT antenna, and first NFC antenna included in the first short-range communication antenna. The first short-range integrated chip 3211 transmits and / or receives short-range wireless signals through the antenna coupled to it, thereby realizing short-range wireless communication.

[0107] As an example, refer to Figure 6A The first short-range communication antenna 331 serves as the first short-range communication antenna, and the first short-range communication antenna 332 serves as the second short-range communication antenna. The first short-range communication antennas 331 and 332 may respectively include a first Wi-Fi antenna, a first GNSS antenna, and a first star shimmer (SLP) antenna. Thus, dual Wi-Fi communication, dual GNSS communication, and SLP functionality can be achieved. For example, in either the first short-range communication antennas 331 and 332, the first Wi-Fi antenna and the first GNSS antenna may share a common radiator, while the first star shimmer (SLP) antenna may be an independent star shimmer antenna.

[0108] For example, in the first short-range communication antenna 331, the first Wi-Fi antenna supports operating frequency bands including but not limited to the 5GHz band, the first GNSS antenna supports operating frequency bands including but not limited to the GPS L5 band, and the first SLP antenna supports operating frequency bands including but not limited to the 6.5GHz band and / or the 8GHz band. In the first short-range communication antenna 332, there are two first Wi-Fi antennas, one of which supports operating frequency bands including but not limited to the 2.4GHz band, and the other supports operating frequency bands including but not limited to the 5GHz band. The first GNSS antenna supports operating frequency bands including but not limited to the GPS L1 band, and the first SLP antenna supports operating frequency bands including but not limited to the 6.5GHz band and / or the 8GHz band.

[0109] Understandably, since the second short-range communication chip 131 can achieve Wi-Fi communication functionality, the first short-range integrated chip 3211 can also achieve Wi-Fi communication functionality, enabling electronic devices to achieve dual Wi-Fi communication capabilities, thereby achieving service offloading and avoiding channel contention. For example, the second short-range communication chip 131 can be used to connect to a router, and the first short-range integrated chip 3211 can be used to connect to a screen projection device, achieving screen splitting and projection functions, realizing service offloading, and avoiding channel contention.

[0110] As yet another example, see reference Figure 6B Figure 6B is a schematic diagram of another structure of the electronic device provided in the embodiments of this application. A first short-range communication antenna 331 serves as the first short-range communication antenna, and a first short-range communication antenna 332 serves as the second short-range communication antenna. Specifically, the first short-range communication antenna 331 includes a first GNSS antenna and a first satellite strobe SLP antenna, while the first short-range communication antenna 332 includes a first satellite strobe SLE antenna, a first GNSS antenna, and a first satellite strobe SLP antenna. This enables dual GNSS communication, SLP, and SLE functions, and also allows for service offloading to avoid channel contention. For example, the first satellite strobe SLP antenna and the first satellite strobe SLE antenna are independent satellite strobe antennas; that is, the first GNSS antenna and the first satellite strobe SLP antenna included in the first short-range communication antenna 331 each use different radiators, and the first GNSS antenna, the first satellite strobe SLE antenna, and the first satellite strobe SLP antenna included in the first short-range communication antenna 332 each use different radiators. The first satellite strobe SLE antenna and the first satellite strobe SLP antenna included in the first short-range communication antenna 332 can use different radiators or share a common radiator.

[0111] For example, in the first short-range communication antenna 331, the operating frequency bands supported by the first GNSS antenna include, but are not limited to, the GPS L5 band, and the operating frequency bands supported by the first satellite strobe SLP antenna include, but are not limited to, the 6.5 GHz band and / or the 8 GHz band. In the first short-range communication antenna 332, the operating frequency bands supported by the first GNSS antenna include, but are not limited to, the GPS L1 band, the operating frequency bands supported by the first satellite strobe SLE antenna include, but are not limited to, the 2.4 GHz band, and the operating frequency bands supported by the first satellite strobe SLP antenna include, but are not limited to, the 6.5 GHz band and / or the 8 GHz band.

[0112] As yet another example, see reference Figure 6CFigure 6C is a schematic diagram of another structure of the electronic device provided in the embodiments of this application. A first short-range communication antenna 331 serves as the first short-range communication antenna, and a first short-range communication antenna 332 serves as the second short-range communication antenna. Specifically, the first short-range communication antenna 331 includes a first GNSS antenna and a first satellite strobe SLP antenna, and the first short-range communication antenna 332 includes a first satellite strobe SLE antenna and a first satellite strobe SLP antenna. Therefore, GNSS communication, SLP, and SLE functions can be implemented, and service offloading can be achieved to avoid channel contention. Exemplarily, the first satellite strobe SLE antenna and the first satellite strobe SLP antenna can be independent satellite strobe antennas; that is, the first GNSS antenna and the first satellite strobe SLP antenna included in the first short-range communication antenna 331 use different radiators, and the first satellite strobe SLE antenna and the first satellite strobe SLP antenna included in the first short-range communication antenna 332 can use different radiators or share a common radiator.

[0113] For example, in the first short-range communication antenna 331, the first GNSS antenna supports operating frequency bands including but not limited to the GPS L5 band, and the first satellite flash SLP antenna supports operating frequency bands including but not limited to the 6.5 GHz band and / or the 8 GHz band. In the first short-range communication antenna 332, the first satellite flash SLE antenna supports operating frequency bands including but not limited to the 2.4 GHz band, and the first satellite flash SLP antenna supports operating frequency bands including but not limited to the 6.5 GHz band and / or the 8 GHz band.

[0114] Understandably, since the second short-range communication chip 131 can implement BT communication functionality, the first short-range integrated chip 3211 can also implement SLE communication functionality, enabling electronic devices to achieve dual communication connections, traffic offloading, and avoiding channel contention. For example, the second short-range communication chip 131 can be used to connect Bluetooth headsets, AR / VR glasses, smartwatches, etc., while the first short-range integrated chip 3211 can be used to connect keyboards, mice, etc.

[0115] In yet another embodiment of this application, reference is made to... Figure 7A , Figure 7A This is another schematic diagram of the electronic device provided in the embodiments of this application. The first short-range communication chip 321 includes a first Wi-Fi chip 3212. The first short-range communication antennas 331 and 332 each include a second Wi-Fi antenna, and the first Wi-Fi chip is coupled to each of the second Wi-Fi antennas. Thus, Wi-Fi communication can be realized.

[0116] For example, in the first short-range communication antenna 331, the second Wi-Fi antenna supports operating frequency bands including, but not limited to, the 2.4 GHz band or the 5 GHz band. In the first short-range communication antenna 332, the second Wi-Fi antenna supports operating frequency bands including, but not limited to, the 2.4 GHz band or the 5 GHz band. The operating frequency bands supported by the second Wi-Fi antenna in the first short-range communication antenna 331 and the second Wi-Fi antenna in the first short-range communication antenna 332 may be the same or different.

[0117] Understandably, since the second short-range communication chip 131 can perform Wi-Fi communication, the first Wi-Fi chip 3212 can also perform Wi-Fi communication, enabling the electronic device to achieve dual Wi-Fi communication functionality. Specifically, the second short-range communication chip 131 can execute service 3, and the first Wi-Fi chip 3212 can execute service 4, achieving service offloading and avoiding channel contention. For example, the second short-range communication chip 131 can be used to connect to a router, and the first Wi-Fi chip 3212 can be used to connect to a screen mirroring device, enabling screen splitting and screen mirroring functions. Alternatively, the second short-range communication chip 131 can be used to connect to certain frequency bands of the router (e.g., the low frequencies of the 2.4GHz band and the 5GHz band), and the first Wi-Fi chip 3212 can be used to connect to other frequency bands of the same router (e.g., the high frequencies of the 5GHz band), enabling connection to different frequency bands of the router. Alternatively, the second short-range communication chip 131 can be used to connect to the frequency band of a router (e.g., the low frequency of the 2.4GHz band or the 5GHz band), and the first Wi-Fi chip 3212 can be used to connect to the frequency band of another router (e.g., the high frequency of the 5GHz band), thereby realizing the connection function with the frequency bands of different routers.

[0118] As an example, refer to Figure 7B and Figure 7C , Figure 7B This is another structural schematic diagram of the electronic device provided in the embodiments of this application. Figure 7CThis is a schematic diagram of the radio frequency link of the second Wi-Fi antenna provided in an embodiment of this application. The electronic device also includes a first radio frequency front-end module (FEM) 322 and a first bandpass filter (BPF), which are disposed on a third circuit board 31. The first radio frequency front-end module 322 is connected between the first Wi-Fi chip 3212 and the first bandpass filter 323, and the first bandpass filter 323 is coupled to the second Wi-Fi antenna in the first short-range communication antenna 331 and / or 332. The first Wi-Fi chip 3212 can feed radio frequency signals to the second Wi-Fi antenna through the first radio frequency front-end module 322, and the signals received by the second Wi-Fi antenna can be transmitted to the first Wi-Fi chip 3212 through the first radio frequency front-end module 322.

[0119] Exemplarily, the first RF front-end module 322 includes a first power amplifier and a first low-noise amplifier (LNA). The second Wi-Fi chip 3212 can feed RF signals to the second Wi-Fi antenna through the first power amplifier. Furthermore, the signal received by the second Wi-Fi antenna can be transmitted to the second Wi-Fi chip 3212 through the first low-noise amplifier. It is understood that if the second Wi-Fi antenna supports an operating frequency band of 5GHz, the first RF front-end module 322 is a FEM applied to the 5GHz frequency band. This application does not limit which frequency band the first RF front-end module 322 is applied to.

[0120] For example, the first bandpass filter 323 is a full-band (FB) bandpass filter. This design can be adapted to low-cost board-level electronic devices and can coexist under strong signal conditions.

[0121] For example, the first bandpass filter 323 is an LB bandpass filter. This design can be adapted to situations where the second Wi-Fi antenna supports an operating frequency band of 5GHz sub-band.

[0122] In addition, the antenna isolation between the antenna connected to the second short-range communication chip 131 and the antenna connected to the first Wi-Fi chip 3212 can meet the requirements of 20dB to 25dB, and the board-level suppression can meet the requirements of 48dB to 52dB.

[0123] It is understood that the preceding other embodiments may also employ this approach. Figures 7A to 7C The solutions shown will not be repeated here.

[0124] In yet another embodiment of this application, reference is made to... Figure 8A , Figure 8AThis is another schematic diagram of the electronic device provided in the embodiments of this application. The first short-range communication chip 321 includes a first star-flash SLE RF front-end module 3213. The first short-range communication antenna 331 includes a second star-flash SLE antenna, and the first star-flash SLE RF front-end module 3213 is coupled to the second star-flash SLE antenna. Thus, SLE communication can be realized. Furthermore, this implementation can simplify the components on the third circuit board and reduce the power consumption and heat of the third circuit board.

[0125] For example, the operating frequency bands supported by the second star flash SLE antenna include, but are not limited to, the 2.4 GHz band.

[0126] Understandably, when the second short-range communication chip 131 can implement BT and / or SLE communication functions, the second SLE antenna can enable service offloading for electronic devices, avoiding channel contention. For example, the second short-range communication chip 131 can execute service 5, and the second SLE antenna can execute service 6.

[0127] As an example, refer to Figure 8B and Figure 8C , Figure 8B This is another structural schematic diagram of the electronic device provided in the embodiments of this application. Figure 8C This is a schematic diagram of the radio frequency link of the second short-range communication chip and the second stroboscopic SLE antenna provided in this embodiment of the application. The electronic device also includes a first switch 15 and a second radio frequency front-end module 16, which are disposed on the first circuit board 11. The first radio frequency chip 13 is coupled to the first radiator 14 through the second radio frequency front-end module 16. Taking the first radio frequency chip 13 as the second short-range communication chip 131 as an example, the second short-range communication chip 131 can feed radio frequency signals to the second stroboscopic SLE antenna through the second radio frequency front-end module 16, and the signals received by the second stroboscopic SLE antenna can be transmitted to the second short-range communication chip 131 through the second radio frequency front-end module 16. Furthermore, this implementation can also simplify the components on the third circuit board and reduce the power consumption and heat of the third circuit board.

[0128] The control terminal and the first terminal of the first switch 15 are respectively connected to the first RF chip 13, the second terminal of the first switch 15 is connected to the first SLE RF front-end module 3213, and the third terminal of the first switch 15 is connected to the second RF front-end module 16. The first RF chip 13 can be used to control the first switch 15, so that the first switch 15 is connected to the first SLE RF front-end module 3213, allowing the first RF chip 13 to feed RF signals to the second SLE antenna through the first SLE RF front-end module 3213. The signals received by the second SLE antenna can be transmitted to the second short-range communication chip 131 through the first SLE RF front-end module 3213. Thus, SLE communication function can be realized through the first switch 15, the first SLE RF front-end module 3213, and the second SLE antenna.

[0129] For example, refer to Figure 8B The first SLE RF front-end module 3213 and the first switch 15 can be connected via a third signal transmission path 512, which is disposed on the second flexible circuit board 51. For example, the third signal transmission path 512 can be a PCIE bus, UART bus, GPIO bus, or other lines used for high-speed signal transmission.

[0130] For example, refer to Figure 8C The first SLE (Sparkling Electro-Ray) RF front-end module 3213 includes a second amplifier assembly and a second bandpass filter. The second terminal of the first switch 15 is connected to the second amplifier assembly, the second amplifier assembly is connected to the second bandpass filter, and the second bandpass filter is coupled to the second SLE antenna. The second amplifier assembly may include a second LNA (Light Array Atmosphere) and a second power amplifier. The second short-range communication chip 131 can feed RF signals to the second SLE antenna through the second power amplifier and the second bandpass filter. The signals received by the second SLE antenna can be transmitted to the second short-range communication chip 131 through the second bandpass filter and the second LNA.

[0131] For example, the second star-flash SLE antenna can be a standalone star-flash antenna. Furthermore, the operating frequency bands supported by the second star-flash SLE antenna include, but are not limited to, the 2.4 GHz band.

[0132] For example, refer to Figure 8C The first end of the first switch 15 is connected to the BT / SLEC1 port of the second short-range communication chip 131. By controlling the first switch 15, the first Star Flash SLE RF front-end module 3213 can be connected to the BT / SLE C1 port of the second short-range communication chip 131, so as to realize BT / SLE communication connection through the first Star Flash SLE RF front-end module 3213, the first switch 15 and the second Star Flash SLE antenna.

[0133] For example, refer to Figure 8C The second RF front-end module 16 may include: a second switch 161, a third switch 162, a fifth bandpass filter 163, and a sixth bandpass filter 164. The third terminal of the first switch 15 is connected to the first terminal of the second switch 161. The second terminal of the second switch 161 is connected to the Wi-Fi C1 port of the second short-range communication chip 131. The third terminal of the second switch 161 is connected to the fifth bandpass filter 163, which is coupled to the Wi-Fi antenna in the second short-range communication antenna 141. Furthermore, the first terminal of the third switch 162 is connected to the BT / SLE C0 port of the second short-range communication chip 131. The second terminal of the third switch 162 is connected to the Wi-Fi C0 port of the second short-range communication chip 131. The third terminal of the third switch 162 is connected to the sixth bandpass filter 164, which is coupled to the Wi-Fi antenna in the second short-range communication antenna 142.

[0134] As an example, by controlling the first switch 15 and the second switch 161, the signal of the BT / SLE C1 port of the second short-range communication chip 131 can be transmitted through the fifth bandpass filter 163, the second switch 161, and the first switch 15 to the BT / SLE antenna in the second short-range communication antenna. Figure 8C (Not shown) feeds in an RF signal. Furthermore, the BT / SLE antenna in the second short-range communication antenna ( Figure 8C The signal received (not shown) can be transmitted to the BT / SLE C1 port of the second short-range communication chip 131 through the fifth bandpass filter 163, the second switch 161 and the first switch 15.

[0135] As an example, by controlling the second switch 161, the Wi-Fi C1 port of the second short-range communication chip 131 can feed radio frequency signals to the Wi-Fi antenna in the second short-range communication antenna 141 through the fifth bandpass filter 163 and the second switch 161. Furthermore, the signals received by the Wi-Fi antenna in the second short-range communication antenna 141 can be transmitted to the Wi-Fi C1 port of the second short-range communication chip 131 through the fifth bandpass filter 163 and the second switch 161.

[0136] As an example, by controlling the third switch 162, the BT / SLE C0 port of the second short-range communication chip 131 can transmit power through the sixth bandpass filter 164 and the third switch 162 to the BT / SLE antenna in the second short-range communication antenna. Figure 8C (Not shown) feeds in an RF signal. Furthermore, the BT / SLE antenna in the second short-range communication antenna ( Figure 8CThe received signal (not shown) can be transmitted to the BT / SLE C0 port of the second short-range communication chip 131 through the sixth bandpass filter 164 and the third switch 162.

[0137] As an example, by controlling the third switch 162, the Wi-Fi C0 port of the second short-range communication chip 131 can feed radio frequency signals to the Wi-Fi antenna in the second short-range communication antenna 142 through the sixth bandpass filter 164 and the third switch 162. Furthermore, the signals received by the Wi-Fi antenna in the second short-range communication antenna 142 can be transmitted to the Wi-Fi C0 port of the second short-range communication chip 131 through the sixth bandpass filter 164 and the third switch 162.

[0138] It is understood that the preceding other embodiments may also employ this approach. Figures 8A to 8C The solutions shown will not be repeated here.

[0139] In yet another embodiment of this application, reference is made to... Figure 9A , Figure 9A This is another schematic diagram of the electronic device provided in the embodiments of this application. The first short-range communication chip 321 includes a first satellite flash SLP chip 3214. The first short-range communication antennas 331 and 332 include a second satellite flash SLP antenna, and the first satellite flash SLP chip 3214 is coupled to the second satellite flash SLP antenna. The first satellite flash SLP chip 3214 can be fed with radio frequency signals through the second satellite flash SLP antenna, and the signals received by the second satellite flash SLP antenna can be transmitted to the first satellite flash SLP chip 3214, realizing SLP communication. Furthermore, this implementation can simplify the components on the third circuit board and reduce the power consumption and heat of the third circuit board.

[0140] For example, the operating frequency bands supported by the second satellite flash SLP antenna include, but are not limited to, the 6.5 GHz band and / or the 8 GHz band. The operating frequency bands supported by the second satellite flash SLP antennas in the first short-range communication antennas 331 and 332 may be the same or different.

[0141] Understandably, when the second short-range communication chip 131 can realize the Star Flash SLP communication function, the second short-range communication chip 131 can execute service 7, and the second Star Flash SLP antenna can execute service 8, thereby realizing service offloading and avoiding channel contention.

[0142] As an example, refer to Figure 9B and Figure 9C , Figure 9B This is another structural schematic diagram of the electronic device provided in the embodiments of this application. Figure 9CThis is a schematic diagram of the radio frequency link of the second short-range communication chip and the second SLP antenna provided in this embodiment of the application. The electronic device also includes a third radio frequency front-end module 324, which is disposed on a third circuit board 31. The first SLP chip 3214 and the second SLP antenna are coupled through the third radio frequency front-end module 324. The first SLP chip 3214 can feed radio frequency signals to the second SLP antenna through the third radio frequency front-end module 324, and the signals received by the second SLP antenna can be transmitted to the first SLP chip 3214 through the third radio frequency front-end module 324.

[0143] For example, refer to Figure 9C The third RF front-end module 324 may include a third bandpass filter 3241, a fourth bandpass filter 3242, and a fourth switch 3243. The third bandpass filter 3241 is connected to the transmit port Tx of the first SLP chip 3214, and is also connected to the first terminal of the fourth switch 3243. The fourth bandpass filter 3242 is connected to the receive port Rx (e.g., port Rx0) of the first SLP chip 3214, and is also connected to the second terminal of the fourth switch 3243. The third terminal of the fourth switch 3243 is coupled to the second SLP antenna in the first short-range communication antenna 331, and the fourth terminal of the fourth switch 3243 is coupled to the second SLP antenna in the first short-range communication antenna 332.

[0144] For example, by controlling the fourth switch 3243, the signal from the transmit port Tx of the first SLP chip 3214, after passing through the third bandpass filter 3241, can feed an RF signal into the second SLP antenna in the first short-range communication antenna 331. The signal received by the second SLP antenna in the first short-range communication antenna 332, after passing through the fourth bandpass filter 3242, is transmitted to the receive port Rx of the first SLP chip 3214.

[0145] For example, refer to Figure 9B and Figure 9C The first SLP chip 3214 is connected to the system-on-a-chip 12, and the system-on-a-chip 12 is connected to the second short-range communication chip 131. The signal output by the first SLP chip 3214 is transmitted to the second short-range communication chip 131 through the system-on-a-chip 12, thereby realizing communication between the first SLP chip 3214 and the second short-range communication chip 131.

[0146] It is understood that the preceding other embodiments may also employ this approach. Figures 9A to 9C The solutions shown will not be repeated here.

[0147] In yet another embodiment of this application, reference is made to... Figure 10A , Figure 10A This is another schematic diagram of the electronic device provided in this application embodiment. The first short-range communication chip 321 includes a first GNSS chip 3215. The first short-range communication antenna 331 includes a second GNSS antenna, and the first GNSS chip 3215 is coupled to the second GNSS antenna. The first GNSS chip 3215 can be fed with radio frequency signals through the second GNSS antenna, and the signals received by the second GNSS antenna can be transmitted to the first GNSS chip 3215 to realize GNSS communication. Furthermore, this implementation can simplify the components on the third circuit board and reduce the power consumption and heat of the third circuit board.

[0148] For example, the first GNSS chip 3215 can be a GNSS SOC, which can support frequency bands such as L1, L2, and L5, thereby improving positioning accuracy and anti-interference capability.

[0149] For example, the operating frequency bands supported by the second GNSS antenna include, but are not limited to, the GPS L5 band.

[0150] Understandably, when the second short-range communication chip 131 can realize the star-flash GNSS communication function, the second short-range communication chip 131 can execute service 9, and the second GNSS antenna can execute service 10, thereby realizing service splitting and avoiding channel contention.

[0151] As an example, refer to Figure 10B and Figure 10C , Figure 10B This is another structural schematic diagram of the electronic device provided in the embodiments of this application. Figure 10C This is a schematic diagram of the radio frequency (RF) link of the system-on-a-chip (SoC), the second short-range communication chip, and the second GNSS antenna provided in this embodiment of the application. The electronic device also includes a fourth RF front-end module 325, which is disposed on the third circuit board 31. The first GNSS chip 3215 and the second GNSS antenna are coupled through the fourth RF front-end module 325. The first GNSS chip 3215 can feed RF signals to the second GNSS antenna through the fourth RF front-end module 325, and the signals received by the second GNSS antenna can be transmitted back to the first GNSS chip 3215 through the fourth RF front-end module 325.

[0152] For example, the fourth RF front-end module 325 may include a third power amplifier and a third LNA. The first GNSS chip 3215 can feed RF signals to the second GNSS antenna through the third power amplifier, and the signals received by the second GNSS antenna can be transmitted to the first GNSS chip 3215 through the third LNA.

[0153] For example, refer to Figure 10CThe electronic device also includes a fifth radio frequency front-end module 17, which is disposed on the first circuit board 11. The second short-range communication chip 131 is connected to the fifth radio frequency front-end module 17, and the fifth radio frequency front-end module 17 is coupled to the GNSS antenna in the second short-range communication antenna 141.

[0154] For example, the fifth radio frequency front-end module 17 may include a fourth power amplifier and a fourth LNA. The second short-range communication chip 131 can feed radio frequency signals to the GNSS antenna in the second short-range communication antenna 141 through the fourth power amplifier. The signals received by the GNSS antenna in the second short-range communication antenna 141 can be transmitted to the second short-range communication chip 131 through the fourth LNA.

[0155] It is understood that the preceding other embodiments may also employ this approach. Figures 10A to 10C The solutions shown will not be repeated here.

[0156] The above description is only a specific implementation of this application, but the protection scope of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the protection scope of this application.

Claims

1. An electronic device, characterized in that, It includes a first housing, a second housing, a third housing, and a rotating shaft mechanism, wherein the first housing, the second housing, and the third housing are rotatably connected via the rotating shaft mechanism; The electronic device further includes a system-on-a-chip, a first radio frequency chip, a second radio frequency chip, a third radio frequency chip, a first radiator, a second radiator, and a third radiator, wherein: The system-on-a-chip, the first radio frequency chip, and the first radiator are disposed in the first housing, the first radio frequency chip is connected to the system-on-a-chip, and the first radio frequency chip is coupled to the first radiator. The second radio frequency chip and the second radiator are disposed in the second housing, the second radio frequency chip is connected to the system-on-a-chip, and the second radio frequency chip is coupled to the second radiator; The third radio frequency chip and the third radiator are disposed in the third housing. The third radio frequency chip is connected to the system-on-a-chip and coupled to the third radiator.

2. The electronic device according to claim 1, characterized in that, The third radio frequency chip includes a first short-range communication chip, and the third radiator includes a first short-range communication antenna.

3. The electronic device according to claim 2, characterized in that, The first short-range communication chip includes a first short-range integrated chip, and the first short-range communication antenna includes one or more of the following: a first Wi-Fi antenna, a first Global Navigation Satellite System (GNSS) antenna, a first Star-Signal Short-Range Positioning (SLP) antenna, a first Star-Signal Low-Power Short-Range (SLE) antenna, a first Bluetooth antenna, and a first near-field communication antenna. The first short-range integrated chip is coupled to one or more of the following: the first Wi-Fi antenna, the first GNSS antenna, the first SLP antenna, the first SLE antenna, the first Bluetooth antenna, and the first near-field communication antenna.

4. The electronic device according to claim 3, characterized in that, The frame of the third housing includes a first short-range communication antenna and a second first short-range communication antenna, wherein: The first short-range communication antenna and the second short-range communication antenna respectively include the first Wi-Fi antenna, the first GNSS antenna, and the first SLP (Sparkling Lightning Protocol) antenna; or... The first short-range communication antenna includes the first GNSS antenna and the first satellite strobe SLP antenna; the second short-range communication antenna includes the first satellite strobe SLE antenna, the first GNSS antenna, and the first satellite strobe SLP antenna; or... The first short-range communication antenna includes the first GNSS antenna and the first satellite flash SLP antenna, and the second short-range communication antenna includes the first satellite flash SLE antenna and the first satellite flash SLP antenna.

5. The electronic device according to any one of claims 2-4, characterized in that, The first short-range communication chip includes a first Wi-Fi chip, and the first short-range communication antenna includes a second Wi-Fi antenna, with the first Wi-Fi chip coupled to the second Wi-Fi antenna.

6. The electronic device according to claim 5, characterized in that, It also includes a first radio frequency front-end module and a first bandpass filter, wherein the first radio frequency front-end module and the first bandpass filter are disposed in a third circuit board in the third housing; The first radio frequency front-end module is connected between the first Wi-Fi chip and the first bandpass filter, and the first bandpass filter is coupled to the second Wi-Fi antenna.

7. The electronic device according to any one of claims 2-4, characterized in that, The first short-range communication chip includes a first SLE radio frequency front-end module, and the first short-range communication antenna includes a second SLE antenna. The first SLE radio frequency front-end module and the second SLE antenna are coupled together.

8. The electronic device according to claim 7, characterized in that, It also includes a first switch and a second radio frequency front-end module. The first switch and the second radio frequency front-end module are disposed on a first circuit board in the first housing. The first radio frequency chip is coupled to the first radiator through the second radio frequency front-end module. The control terminal and the first terminal of the first switch are respectively connected to the first RF chip, the second terminal of the first switch is connected to the first StarShine SLE RF front-end module, and the third terminal of the first switch is connected to the second RF front-end module.

9. The electronic device according to any one of claims 2-4, characterized in that, The first short-range communication chip includes a first star-flash SLP chip, and the first short-range communication antenna includes a second star-flash SLP antenna. The first star-flash SLP chip and the second star-flash SLP antenna are coupled together.

10. The electronic device according to claim 9, characterized in that, It also includes a third radio frequency front-end module, which is disposed in the third circuit board in the third housing; The first StarSpark SLP chip and the second StarSpark SLP antenna are coupled through the third radio frequency front-end module.

11. The electronic device according to any one of claims 2-4, characterized in that, The first short-range communication chip includes a first GNSS chip, the first short-range communication antenna includes a second GNSS antenna, and the first GNSS chip is coupled to the second GNSS antenna.

12. The electronic device according to claim 11, characterized in that, It also includes a fourth radio frequency front-end module, which is disposed in the third circuit board in the third housing; The first GNSS chip and the second GNSS antenna are coupled through the fourth radio frequency front-end module.

13. The electronic device according to any one of claims 1-4, characterized in that, The first radio frequency chip includes a second short-range communication chip, and the first radiator includes a second short-range communication antenna.

14. The electronic device according to any one of claims 1-4, characterized in that, The second radio frequency chip includes a cellular chip, and the second radiator includes a cellular antenna.

15. The electronic device according to any one of claims 1-4, characterized in that, The system-on-a-chip and the first radio frequency chip are disposed on the first circuit board in the first housing, and the first radiator is disposed on the frame of the first housing.

16. The electronic device according to any one of claims 1-4, characterized in that, The second radio frequency chip is disposed on the second circuit board in the second housing, and the second radiator is disposed on the frame of the second housing.

17. The electronic device according to any one of claims 1-4, characterized in that, The third radio frequency chip is disposed on the third circuit board in the third housing, and the third radiator is disposed on the frame of the third housing.

18. The electronic device according to any one of claims 1-4, characterized in that, The rotating shaft mechanism includes a first rotating shaft mechanism and a second rotating shaft mechanism. The first housing and the second housing are rotatably connected through the first rotating shaft mechanism, and the first housing and the third housing are rotatably connected through the second rotating shaft mechanism.

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