High-temperature-resistant strong and weak current integrated multi-core connector

Abstract

The utility model discloses a kind of high-temperature-resistant strong and weak electric integrated multicore connector, belong to electric connection technical field. Including plug and socket, its insulating body center is equipped with the central ventilation passage through along axial direction, and continuous heat dissipation passage is formed after inserting. Insulating body is equipped with multilayer concentric ring base, interlayer annular cavity is communicated with central air duct, and constitutes parallel heat dissipation air duct. Inner layer annular base installs strong current terminal, outer layer weak current terminal is laid, realize thermoelectric separation, effectively increase the creepage distance between strong and weak electricity. Overall high-temperature-resistant insulating material is integrally formed. Through the comprehensive heat management framework of central ventilation passage, parallel air duct, annular base and thermoelectric partition layout, effectively solve the problems, such as strong and weak electric integrated multicore connector low heat dissipation efficiency, insufficient insulation reliability under high temperature, heat source influence weak signal, with the advantages of strong heat dissipation capacity, high insulation safety, compact and reliable structure, suitable for aerospace, nuclear power plant and other high-temperature, high-reliability integrated application scenarios.

Description

Technical Field

[0001] This utility model relates to the field of electrical connector technology, specifically to a multi-core connector that integrates high-voltage and low-voltage circuits and is suitable for high-temperature environments. Background Technology

[0002] As devices rapidly evolve towards miniaturization and functional integration, the need to integrate high-power power transmission and low-level signal transmission within the same connector is becoming increasingly prominent. However, this integrated design of strong and weak current circuits also brings many technical challenges: the Joule heat generated by high-current contacts during long-term operation is difficult to dissipate effectively, leading to a sharp increase in the internal temperature of the connector.

[0003] This leads to a series of chain problems: (1) Accelerating the aging of insulating materials, resulting in a decrease in mechanical strength and insulation performance, and increasing the risk of failure; (2) High temperature causes the oxidation of the contact surface to intensify, increasing the contact resistance, which in turn generates more heat, forming a vicious cycle of "heat-resistance", which may eventually lead to the degradation of connector performance or even burnout; (3) The accumulated heat and unstable contact resistance will seriously interfere with the transmission quality and stability of adjacent weak electrical signals.

[0004] In addition, traditional multi-core connectors generally use a solid insulated body structure, which has low thermal conductivity and lacks heat dissipation paths, acting like an "insulation shell" and further aggravating the accumulation of heat.

[0005] Currently, the industry typically uses external thermal management methods such as adding cooling fans or metal heat sinks to solve this problem. However, this undoubtedly increases the size, structural complexity, and manufacturing cost of the system, which contradicts the original intention of miniaturizing and integrating the equipment.

[0006] Therefore, there is an urgent need to develop a multi-core connector that integrates strong and weak currents, which breaks through the heat dissipation bottleneck in terms of structure and has self-heating capability, and can operate stably and reliably in high-temperature environments, so as to solve the above-mentioned technical problems. Utility Model Content

[0007] The purpose of this invention is to overcome the shortcomings of the prior art and provide a high-temperature resistant integrated multi-core connector for both strong and weak current. It does not rely on external heat dissipation components, but forms a heat dissipation channel through its internal structure, and uses natural convection to dissipate heat, reduce temperature rise, and ensure its long-term reliable operation in high-temperature environments.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: A high-temperature resistant multi-core connector for both strong and weak current applications includes a plug and a socket. The plug has a plug insulating body and several pins. The socket has a socket insulating body and several holes adapted to the plug. Both the plug insulating body and the socket insulating body have a central ventilation channel extending through the mating direction at their axial centers. When the plug and socket are fully mated, their central ventilation channels are coaxially aligned, forming a continuous axial heat dissipation channel for dissipating internal heat of the connector.

[0009] Furthermore, both the plug insulation body and the socket insulation body are provided with multiple layers of annular bases concentrically distributed around the central ventilation duct. Annular cavities are formed between adjacent annular bases, and these annular cavities are fluidly connected to the central ventilation duct, collectively constituting a multi-path parallel annular heat dissipation system. This structure enhances air convection heat dissipation, improves structural strength, reduces volume, saves materials, and increases creepage distance. The interlayer cavities facilitate radial heat dissipation.

[0010] Furthermore, the pin and the socket are respectively installed in the mounting holes of the corresponding annular base, and radial gaps are provided between the outer periphery of the pin and the inner wall of the mounting hole, and between the outer periphery of the socket and the inner wall of the mounting hole in the insertion contact section, forming an annular cavity in the pin contact section.

[0011] The annular cavity of the needle contact section, the annular cavity between the adjacent annular base, and the central ventilation duct (3) are fluidly connected to form a multi-parallel heat dissipation duct.

[0012] Furthermore, the multi-layer annular base comprises at least two layers: an inner high-current layer and an outer low-current layer. The high-current layer houses high-current pins and sockets and is located adjacent to the central ventilation channel to achieve efficient heat dissipation. The inner high-current layer houses low-current signal pins and sockets and is located away from the central ventilation channel, forming a "hot inside, cold outside" thermal-electrical partition to naturally thermally isolate high-heat-generating components from heat-sensitive signal components, thereby improving the reliability and stability of the connector.

[0013] The high-current, high-heat-generating contacts are placed in the inner ring near the central ventilation duct, while the heat-sensitive low-current signal contacts are placed in the outer ring where the temperature is relatively lower, thus achieving natural thermal isolation.

[0014] Furthermore, the weak current layer (5) consists of two layers, with a reinforcing rib structure between the two layers.

[0015] Furthermore, the pin is mounted in the mounting hole of the annular base via an elastic fastener. This elastic fastener provides radial support to the pin and effectively suppresses axial or radial displacement during use. Simultaneously, this fixing method leaves a small gap between the outer wall of the pin and the inner wall of the mounting hole. This small gap serves a dual purpose: allowing airflow and facilitating pin replacement.

[0016] Furthermore, the plug insulation body and its annular base and guide cylinder are integrally formed structures; the socket insulation body and its annular base and guide cylinder are also integrally formed structures.

[0017] Furthermore, the inner wall of the central ventilation duct is provided with axially extending guide grooves or spirally distributed guide fins to guide airflow along an axial or spiral path to enhance the forced / natural convection heat transfer efficiency.

[0018] Furthermore, both the plug insulation body and the socket insulation body are provided with mounting holes around their periphery for connection with external mounting structures.

[0019] Furthermore, the plug insulating body, socket insulating body, annular base, guide cylinder, and guide sleeve are all made of high-temperature resistant insulating material, and the relative thermal index RTI of the high-temperature resistant insulating material is greater than 180°C.

[0020] Furthermore, the high-temperature resistant insulating material is at least one of liquid crystal polymer (LCP), polyphenylene sulfide (PPS), or polyetherimide (PEI).

[0021] Furthermore, the connector also includes a temperature sensor, which is located in the low-voltage signal terminal area of ​​the socket or plug, for monitoring temperature and outputting a temperature signal.

[0022] The beneficial effects of this utility model are as follows: 1. High-efficiency passive heat dissipation: By setting up a central ventilation duct, a powerful suction force is generated using the "chimney effect" to continuously exhaust hot air from the core area, while cool air is replenished through paths such as the annular cavity, forming efficient convection. This, along with the annular cavity, forms multiple parallel heat dissipation air ducts, significantly enhancing overall heat dissipation capacity and reducing the overall temperature rise of the connector.

[0023] 2. Adaptable to high-temperature environments: The plug and socket insulators are made of high-temperature resistant materials with RTI≥180°C, ensuring the mechanical strength and insulation stability of the connectors for long-term operation in high-temperature environments. Combined with the ventilation duct structure, it significantly delays material aging.

[0024] 3. Internal Thermal-Electrical Isolation and Interference Resistance: Employing a concentric layout of "high-voltage internally, low-voltage externally," the high-heat-generating high-voltage contacts are placed in the inner ring near the central ventilation duct for priority heat dissipation, while sensitive low-voltage signal contacts are placed in the cooler outer ring, achieving natural physical isolation. This structure not only effectively avoids thermal interference, but also, the annular cavity structure ensures ventilation while increasing creepage distance, thus improving electrical safety.

[0025] 4. High reliability and long lifespan: Excellent heat dissipation performance slows down material aging and contact oxidation, improving the reliability and lifespan of the connector.

[0026] 5. Low cost and high efficiency: All heat dissipation and isolation improvements are achieved through structural redesign and material selection, without the need for additional heat dissipation parts or complex processes, effectively controlling manufacturing costs while improving performance.

[0027] In summary, this utility model integrates a comprehensive thermal management strategy that combines structural heat dissipation (ventilation duct), material heat resistance (RTI), and layout heat avoidance (zoning), thereby improving the reliability, safety, and service life of multi-core connectors in high-temperature and high-power application scenarios. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the plug and socket of this utility model in the plug-in state.

[0029] Figure 2 This is a schematic diagram of the plug and socket of this utility model in their separated state.

[0030] Figure 3 This is a cross-sectional view of the structure of the present invention with the plug and socket separated. In the figure: 1. Plug insulating body; 2. Socket insulating body; 3. Central ventilation duct; 4. High-voltage layer; 5. Low-voltage layer; 6. Guide cylinder; 7. Guide sleeve. Detailed Implementation

[0031] The technical solution of this utility model will now be described in detail with reference to the accompanying drawings. It should be understood that the following description is merely illustrative and should not be construed as limiting the scope of protection of this invention.

[0032] Example 1 See Figures 1-3 This embodiment provides a heat dissipation structure for a connector, the core of which lies in setting a through-type central ventilation channel in the connector's insulator to achieve efficient heat dissipation. The connector includes a plug and a socket. The plug has a plug insulating body 1 and several pins. The socket has a socket insulating body 2 and several holes adapted to the plug. At the axial center position of both the plug insulating body 1 and the socket insulating body 2, a central ventilation channel 3 is formed that is completely through-type in the mating direction. When the plug and socket are fully mated, their central ventilation channels 3 are coaxially aligned, forming a continuous, unobstructed axially through-type heat dissipation channel that runs through the entire internal core area of ​​the connector.

[0033] The central ventilation duct breaks through the limitations of the "closed insulation" structure caused by the use of solid insulators in traditional connectors, providing a direct and low-resistance physical path for the discharge of internal heat and constructing the basic path for active heat dissipation inside the connector.

[0034] Its heat dissipation mechanism is based on natural convection driven by temperature difference (i.e., the "chimney effect"): when the connector operates under high current conditions, the Joule heat generated at the high-voltage contact points raises the temperature of the air inside the connector and reduces its density; while the air temperature at both ends of the channel or in the external environment is relatively low and the density is relatively high. Under the buoyancy force caused by the density difference, the hot air flows upward (or towards the low-temperature end) along the channel, while the cold air continuously enters from the other end, thus forming a stable air circulation within the through channel.

[0035] This airflow phenomenon, formed by the combined effects of structural guidance, heat source drive, and sealed boundary constraints, can achieve passive self-heating without any external power (such as a fan), significantly improving the thermal management capability of the connector.

[0036] Through this central ventilation channel, heat can be directly carried away from the areas of the connector most prone to heat accumulation (such as the root of the contact and the inside of the insulator), effectively avoiding the problems caused by long-term heat accumulation in traditional structures: (1) accelerated thermal aging of insulating materials and decreased insulation performance; (2) aggravated oxidation of metal contacts and increased contact resistance, forming a vicious cycle; (3) local overheating caused material deformation, carbonization and even failure.

[0037] Compared to long-path, high-thermal-resistance heat dissipation methods that rely on heat conduction from the outer casing, this solution significantly shortens the heat dissipation path and improves heat dissipation response speed and efficiency by constructing an in-situ convection channel at the center of the insulating body. It is especially suitable for enclosed, low-wind-speed, or high-power-density application scenarios.

[0038] The structure of this embodiment has the following features: (1) It is the first to have a through-type central air duct, which provides a direct heat dissipation path for the inside of the connector; (2) It utilizes the "chimney effect" to achieve heat dissipation without source, which is energy-saving and reliable; (3) It eliminates the airflow dead zone and improves the heat dissipation uniformity; (4) It has a simple structure, is suitable for injection molding process, and is easy to integrate and mass-produce.

[0039] In summary, this embodiment constructs an efficient internal heat dissipation channel by setting an axially through central ventilation channel in the connector insulation body, which solves the technical problems of heat accumulation, excessive temperature rise and decreased reliability caused by the lack of effective heat dissipation path in traditional solid connectors, and provides an innovative solution for the thermal management of high-power, high-density connectors.

[0040] Example 2 Based on Embodiment 1, this embodiment provides multiple layers of annular bases concentrically distributed around the central ventilation duct 3 on both the plug insulation body 1 and the socket insulation body 2. Adjacent annular bases maintain a certain distance (preferably 1-2 mm) to form an annular cavity surrounding the central ventilation duct. These annular bases are integrally injection molded with the insulation body and are used for pressing and fixing pins or sockets. Simultaneously, the annular cavities are fluidly connected to the central ventilation duct 3, together forming a main-branch type, multi-path parallel three-dimensional heat dissipation airflow system.

[0041] The central ventilation duct 3 serves as the main axial airflow, running through the center of the connector and guiding airflow in the core heat source area. The annular cavity, acting as a radial auxiliary airflow, is distributed around the central airflow, encircling the core area of ​​the connector. The annular cavity and the central ventilation duct remain connected in the mated state, forming a three-dimensional, interconnected composite airflow network. The annular base not only provides mechanical support and electrical insulation, but its hollow structure also naturally increases the creepage distance between strong and weak current contacts, enhancing electrical safety. The internal hollow structure reduces material usage, lightens weight, and lowers manufacturing costs, while also facilitating flow filling and demolding during injection molding.

[0042] Heat dissipation principle and synergistic mechanism: The heat dissipation process in this embodiment is a three-dimensional convection cycle driven by the "chimney effect".

[0043] 1. The "chimney effect" generates "core pull": The Joule heat generated by the operation of the high-current contacts in the inner ring first heats the air in the central ventilation duct 3. The hot air temperature rises and density decreases, and it rises rapidly under the action of buoyancy and is discharged towards the rear end of the connector. This process will create a local negative pressure (suction force) in the channel, which constitutes the "core pull" of the entire heat dissipation system.

[0044] 2. Annular cavity forms "auxiliary air intake" radial heat dissipation: The aforementioned negative pressure attracts cooler external air at a lower temperature, which enters from the front of the connector and is driven by the pressure difference to flow into the annular cavities of each layer. As the cool air flows through the annular cavity, it exchanges heat with the annular base that carries the contacts, carrying away the heat accumulated on its surface and around it, thus achieving effective cooling of the interlayer area.

[0045] 3. "Synergistic enhancement" achieved, with multi-path convergence and efficient exhaust: After heat exchange, the air temperature rises and the density decreases, converging along the annular cavity towards the central ventilation duct 3, and finally flowing into the main air duct, where it is exhausted along with the main airflow. Thus, the central ventilation duct 3 (axial main duct) and the interlayer annular cavity (auxiliary air duct) constitute a highly efficient and synergistic passive heat dissipation system, achieving three-dimensional heat dissipation of "internal heat and external cold, from the inside out".

[0046] This embodiment achieves "breathing" heat dissipation of the connector itself through the synergistic mechanism of "central ventilation duct + layered annular cavity", which has the following significant advantages: 1. Significantly improves heat dissipation efficiency and uniformity. Compared to a single central air duct, this solution increases the total effective ventilation area by approximately 3 times, effectively eliminating the "heat dissipation blind spots" or "edge overheating" problems existing in traditional structures, and solving the uneven phenomenon of "cold center and hot edge".

[0047] 2. Systematic innovation, not simply the superposition of features. The central air duct and the annular cavity do not exist independently, but rather achieve airflow linkage and functional synergy through the pressure difference generated by the "chimney effect," forming a systemic heat dissipation effect of "1+1>2."

[0048] 3. Multifunctional integrated structure. The ring base achieves mechanical fixation and electrical insulation while its structure naturally forms a heat dissipation channel and increases the creepage distance, realizing the integration of structural, heat dissipation, and electrical safety functions, thereby improving overall reliability.

[0049] 4. Strong compatibility and wide applicability. This air duct system can achieve natural convection cooling by relying on temperature difference, or it can be used in conjunction with internal fans or air ducts to achieve forced convection cooling. It is especially suitable for harsh operating conditions such as closed environments, high power density, and long-term operation.

[0050] 5. The process is feasible and easy to mass-produce. All structural features can be integrally molded using injection molds, requiring no additional processing, resulting in low cost and suitability for mass production.

[0051] Compared to traditional solid connectors or shallow heat dissipation structures with only local slots, this solution achieves full-area, deep-level, and proactive heat dissipation management through a three-dimensional, interconnected airflow network. This helps solve key technical problems such as insulation aging, contact oxidation, and decreased reliability caused by heat accumulation in high-power connectors.

[0052] Example 3 Building upon the aforementioned embodiments, this embodiment proposes a locally enhanced heat dissipation scheme based on a micro-gap ventilation structure, targeting the electrical contact points as the primary heat source. This involves constructing a surrounding heat dissipation cavity in the assembly area of ​​the pins and sockets to achieve targeted cooling of hot spots, thereby improving the thermal reliability of the connector. Specifically: The pins and sockets are respectively fixed in the mounting holes of the annular bases on the plug insulating body 1 and the socket insulating body 2. In the mated state, the pins are inserted into the sockets to form an electrical connection, and the mating contact section (i.e., the electrical contact interface) is the "hot spot" area where Joule heat is most concentrated.

[0053] To improve heat dissipation in this area, this embodiment introduces a radial micro-gap in the structural design: a certain gap is maintained between the outer wall of the pin and the inner wall of the mounting hole; a certain gap is also maintained between the outer wall of the pin hole and the inner wall of the mounting hole. Preferably, the radial gap is controlled within the range of 0.05 to 0.2 mm.

[0054] These micro-gap gaps form a continuous, annular cavity (also known as a "micro-gap ventilation cavity") around the mating contact section, encircling the pin-socket contact interface. This cavity does not exist in isolation, but is fluidly connected with the interlayer annular cavity between adjacent annular bases and the central ventilation channel 3, together forming a complete three-dimensional heat dissipation airflow system that runs through the inside of the connector.

[0055] Heat dissipation mechanism and working process: When the connector is powered on, the contact interface between the pins and the socket generates a large amount of Joule heat due to the contact resistance, causing the ambient air temperature to rise rapidly. The density of the hot air decreases, and under the action of buoyancy, it flows upward along the central ventilation channel and is discharged, resulting in a decrease in the internal pressure of the channel and the formation of local negative pressure (i.e., the "chimney effect" suction force).

[0056] Driven by this pressure difference, cooler external air is continuously drawn in and flows along the following path: part of the airflow enters the central ventilation duct for axial convection; more importantly, part of the airflow is diverted through the interlayer annular cavity and finally enters the contact annular cavity, directly passing over the outer surface of the pin-socket contact interface to achieve close-range forced convection cooling of the hottest area.

[0057] This "airflow directly to the heat source surface" structure breaks through the limitations of traditional connectors where contacts are covered by insulating materials, the heat dissipation path is long, and the thermal resistance is high, achieving precise and efficient targeted heat dissipation.

[0058] This embodiment achieves enhanced heat dissipation at the contact points through a micro-gap structure, which has the following advantages: (1) Precise heat dissipation and significant temperature reduction. The cooling airflow acts directly on the contact interface with the largest heat generation, effectively avoiding local overheating. (2) Blocking the vicious cycle of "heat-resistance". After the temperature rise is reduced, the trend of contact resistance growth is suppressed, blocking the positive feedback cycle of "temperature rise → increased resistance → increased Joule heat → further temperature rise", thus improving electrical stability. (3) Reusable structure and low cost. The contact point annular cavity is not additionally processed, but is naturally formed by utilizing the assembly gap between the pin / hole and the mounting hole, without increasing the complexity of the mold or additional processes, which is low-cost and easy to implement. (4) Enhancing system connectivity and uniformity. The originally "isolated" contact area is incorporated into the overall air duct network, expanding the heat dissipation system from "axial + radial" to "axial + radial + point-to-surface coordination", improving the heat dissipation uniformity and overall efficiency. (5) Improving long-term reliability. It effectively delays contact oxidation, reduces electro-corrosion, and avoids material softening, welding, or burning due to overheating, significantly improving the reliability of connectors under high load and long-term operating conditions.

[0059] Example 4 Based on the aforementioned embodiments, this embodiment proposes a thermal-electrical coordinated layered wiring structure for integrated strong and weak current connectors. By optimizing the spatial layout of electrical contacts, it achieves a synergistic improvement in heat dissipation performance and signal reliability.

[0060] Specifically, the multi-layer ring base in the plug and socket is clearly divided according to functional requirements as follows: inner high-voltage layer 4: close to the central ventilation duct 3, used to lay out power pins and sockets for transmitting high current; outer low-voltage layer 5: located on the outer ring of the ring structure, used to lay out low-level, high-sensitivity signal pins and sockets.

[0061] This layout is optimized based on the temperature gradient distribution characteristics inside the connector: since the central ventilation duct 3 serves as the main heat dissipation channel, the surrounding area has active airflow and sufficient heat exchange, forming an area with relatively low internal temperature and optimal heat dissipation conditions for the connector. Although the outer ring area is far from the main air duct, it still has good thermal stability because the heat generated by weak electrical signals is extremely small and auxiliary heat dissipation can be achieved through the interlayer annular cavity.

[0062] Therefore, this embodiment adopts the setting principle of "heat source near heat dissipation and signal far away from heat": high-heat-generating electrical contacts are arranged in the central high heat dissipation area to ensure that the Joule heat energy generated by them is quickly dissipated and to avoid local overheating; heat-sensitive low-heat signal lines are arranged in the peripheral low heat interference area, away from high-temperature heat sources, to effectively reduce thermal coupling effect.

[0063] This "internal heat and external cold" layout strategy breaks through the limitations of traditional connectors that are "wired only according to electrical functions". It introduces the concept of thermal management-oriented layout optimization for the first time, and reflects the systematic design idea of ​​"determining power based on heat".

[0064] Beneficial effects: (1) Achieve thermal-electrical functional decoupling of strong and weak electrical systems. Through spatial partitioning, high-heat-generating components and heat-sensitive components are physically isolated, cutting off the direct heat conduction path from the strong electrical heat source to the weak electrical signal area, fundamentally blocking the signal interference problem caused by thermal coupling, and solving the key bottleneck in the high integration of strong and weak electrical systems. (2) Significantly improve the thermal stability and transmission reliability of weak electrical signals. Compared with the traditional uniform mixed distribution scheme, the working temperature of the weak electrical area of ​​this structure is significantly reduced, effectively suppressing the problems of increased signal noise, time delay drift, and impedance changes caused by high temperature, significantly improving signal integrity and anti-interference ability, reducing the bit error rate, and ensuring the stable transmission of high-speed, low-level signals. (3) Optimize the heat dissipation performance of strong electrical contacts and improve power carrying capacity. The strong electrical layer is arranged close to the central ventilation duct and is in the best heat dissipation area. Combined with the natural convection in the aforementioned embodiment, it can efficiently dissipate Joule heat, reduce contact temperature rise, suppress contact resistance growth, block the positive feedback loop of "temperature rise → resistance increase → further heat generation", and improve safety and long-term reliability under high current conditions. (4) Highly integrated structure, strong compatibility, and easy expansion. This partitioning scheme is fully compatible with the central ventilation duct, annular cavity, and micro-gap ventilation structure in the aforementioned embodiments, and can be seamlessly integrated into the overall three-dimensional heat dissipation duct system without the need for additional processing steps. At the same time, this partitioning concept can be extended to three-layer or higher structures (e.g., inner layer for high voltage, middle layer for low voltage, and outer layer for shielding), which is suitable for more complex multi-functional integration needs and has good scalability and engineering application prospects.

[0065] Example 5 This embodiment improves the pin fixing method by proposing an elastic fixing structure that combines mechanical stability and heat dissipation. The pin is installed in the mounting hole of the annular base using an elastic fixing element (such as an elastic retaining ring, wave washer, or elastic metal sheet). This elastic fixing element provides radial support while ensuring a uniform, minute gap is maintained between the pin and the inner wall of the mounting hole.

[0066] Its working principle is as follows: the elastic preload can effectively suppress the axial movement and radial loosening of the pins during vibration or insertion and removal operations, ensuring stable and reliable electrical contact; at the same time, the maintained gap not only ensures the structural strength, but also provides a channel for airflow, becoming part of the heat dissipation system and achieving effective cooling of the pins.

[0067] The advantages of this structure are: (1) It achieves a balance between mechanical fixation, heat dissipation performance and replaceability. The elastic structure can absorb assembly errors and thermal expansion stress, improve the durability of the connector under harsh working conditions, and avoid the insulator cracking or contact deformation that may be caused by traditional interference fit. (2) The small gap significantly improves heat dissipation efficiency while ensuring electrical safety. Cooling air can flow through the surface of the pin, especially achieving targeted heat dissipation in the "contact annular cavity" area where heat is concentrated. (3) The structure is simple, which facilitates the disassembly and replacement of the pin, improves the maintainability and service life of the product, and is compatible with existing injection molding and assembly processes. No additional processing is required, making it suitable for mass production.

[0068] Example 6 Based on the aforementioned embodiments, this embodiment further improves the guiding efficiency of airflow and the convective heat transfer capability inside the connector by adding a flow guiding structure to the inner wall of the central ventilation duct 3 to optimize airflow characteristics and significantly enhance heat dissipation performance.

[0069] Specifically, the flow guiding structure is located on the inner surface of the central ventilation duct 3, and can be: Axial guide groove: A groove or rib extending axially along the inner wall of the ventilation duct, used to reduce airflow resistance, guide airflow smoothly, and reduce flow pressure drop; Spiral guide fins: Protruding fins distributed spirally along the inner wall are used to induce airflow to generate rotational motion, prolonging its flow path and residence time in the channel.

[0070] Working principle and technical mechanism: The central ventilation duct is the "main channel" of the connector heat dissipation air duct system, and the airflow state inside it directly affects the overall heat dissipation efficiency. In traditional smooth inner wall structures, the airflow tends to form a stable laminar flow, with a thicker boundary layer, resulting in low heat exchange efficiency and limited heat dissipation capacity.

[0071] This embodiment achieves the following physical effect by introducing a flow guiding structure: (1) Disrupts the boundary layer and enhances turbulent heat transfer. The guide fins create periodic disturbances to the airflow, disrupting the stability of the thermal boundary layer, promoting the mixing of hot and cold air and the continuous renewal of the thermal boundary layer, and significantly improving the convective heat transfer coefficient. (2) Extends the airflow path and increases the heat transfer time. The spiral structure causes the airflow to move along a spiral trajectory, effectively extending its flow path in the channel and improving the heat transfer efficiency per unit air volume. (3) Enhances the suction force of the "chimney effect". Under natural convection conditions, the spiral-induced rotating airflow can enhance the guiding effect of buoyancy and improve the negative pressure suction capacity in the channel; under forced convection conditions, it can make more efficient use of external wind pressure and improve wind energy utilization.

[0072] Beneficial effects: (1) Significantly improves heat dissipation efficiency. Compared with smooth inner wall channels, the heat dissipation capacity of the central ventilation channel is significantly improved after adding spiral guide fins, and the temperature in the central area is significantly reduced under the same temperature difference. (2) Achieves efficient heat exchange at low wind speeds. This solution achieves efficient heat dissipation under low wind speeds or natural convection conditions through internal flow channel optimization, avoiding dependence on external large-volume forced air cooling, saving energy and suitable for high power density scenarios with closed and limited space. (3) Compact structure and integrated functions. The spiral guide fins have the dual functions of "guide" and "turbulence", with a compact structure, requiring no additional space, and are integrated with the central ventilation channel design, without increasing assembly complexity. (4) Feasible process and low cost. The guide structure can be formed in one injection mold without subsequent processing, resulting in low manufacturing cost and suitability for mass production.

[0073] This embodiment breaks away from the traditional approach of simply increasing ventilation area to improve heat dissipation. Instead, it improves the heat exchange efficiency per unit airflow by refining the internal flow channel design and adjusting the flow pattern. It is particularly suitable for enclosed devices or highly integrated systems that cannot rely on external fans, providing an innovative solution for efficient thermal management within limited spaces.

[0074] Example 7 This embodiment focuses on optimizing the sealing and guiding structure of the mating interface to ensure the continuity and airtightness of the heat dissipation channel.

[0075] The technical solution is as follows: A guide cylinder 6 protrudes from the end face of the plug insulation body 1, and its inner hole is an extension of the central ventilation channel 3 on the plug side; a guide sleeve 7 is correspondingly protruded from the end face of the socket insulation body 2, and its inner diameter is adapted to the outer diameter of the guide cylinder 6. When the plug and socket are fully inserted, the guide cylinder 6 is inserted into the guide sleeve 7, and its end face is sealed against the end face of the socket insulation body 2; the inner hole of the guide cylinder 6 is coaxially connected with the central ventilation channel 3 in the socket insulation body 2, together forming a continuous axial heat dissipation channel.

[0076] The guide cylinder 6 and the guide sleeve 7 form an interlocking guiding mechanism to ensure the accuracy of the interlocking; while the end face seal prevents airflow from leaking from the interface gap, forcing the cooling airflow to circulate through the internal heat dissipation channel. This integrated "guiding + sealing" structure ensures the continuity of airflow in the central ventilation duct during dynamic interlocking.

[0077] The advantage is that it avoids the "bypass air leakage" phenomenon caused by tiny gaps in traditional docking structures, ensuring the integrity and efficiency of the heat dissipation channel.

[0078] This solution addresses the technical problem of reduced heat dissipation efficiency due to unsealed interfaces. Especially in forced air cooling systems, it ensures that all cooling air energy is used for internal heat dissipation, thereby improving the reliability of system-level thermal management.

[0079] Example 8: To ensure the long-term insulation performance and structural integrity of the connector in extremely harsh environments such as nuclear power plants, this embodiment selects a special engineering plastic that can withstand high temperatures of 260°C and has good radiation resistance as the insulation material. It works in conjunction with the aforementioned heat dissipation structure to build a triple protection mechanism of "active heat dissipation + passive heat resistance + radiation resistance stability" to meet the high reliability requirements of electrical connectors for equipment in the nuclear island.

[0080] Preferred materials include: Polyetheretherketone (PEEK): Continuous operating temperature up to 250°C, short-term resistance to temperatures above 260°C, excellent mechanical strength, chemical stability and moderate radiation resistance, suitable for non-high radiation areas within nuclear islands; Polyimide (PI): Short-term temperature resistance can reach above 300°C. After modification, it has good resistance to gamma rays and neutron irradiation and is suitable for high-radiation areas. Polyphenylene sulfide (PPS): RTI ≥ 200°C, with excellent dimensional stability, low moisture absorption and good radiation resistance, suitable for long-term humid and hot + radiation environments; Liquid crystal polymer (LCP): RTI ≥ 200°C, extremely low moisture absorption, maintains high insulation resistance even in high temperature and high humidity environments, suitable for sealing through parts.

[0081] Note: 260°C is the upper limit of the design temperature for some systems in a nuclear power plant (such as the PWR primary loop bypass and the steam generator blowdown system). This temperature is also close to the transient peak temperature under certain accident conditions. The materials selected in this embodiment can operate stably for a long time at this temperature, or maintain structural integrity under short-term overheating conditions.

[0082] The above materials are not only heat-resistant, but also possess the following key properties required for nuclear-grade applications: 1. High glass transition temperature (Tg): It is not easily softened or deformed at high temperatures, thus maintaining mechanical rigidity; 2. Low hygroscopicity: Prevents insulation degradation or hydrolytic aging caused by humid and hot environments; 3. Excellent radiation resistance: It is not easily embrittled, cracked, or degraded in electrical properties under gamma ray or neutron irradiation; 4. High flame retardancy and low gas release: Meets the strict limits on smoke density and toxic gas release of nuclear-grade materials (such as IEEE 383 and IEC 60754 standards).

[0083] This embodiment breaks through the traditional passive mode of "relying solely on materials to withstand high temperatures" and proposes a system-level thermal management strategy: (1) Active heat dissipation. A three-dimensional heat dissipation system composed of a central ventilation duct, annular cavity, and micro-gap air duct reduces the actual working temperature of the contacts and local areas, thereby reducing the thermal load on the materials; (2) Passive heat resistance. High RTI materials such as PEEK and PI, which can withstand 260°C, are used to ensure that the insulation integrity can still be maintained under limited heat dissipation or accident conditions; (3) Radiation-resistant design. The intrinsic radiation resistance of the materials + structural sealing protection improve the reliability throughout the entire life cycle. (3) The three work together to achieve a safe and reliable connection of the connector under high temperature, high humidity, strong radiation, and long-cycle operation conditions.

[0084] Beneficial effects: (1) Meets the stringent operating conditions of nuclear power plants. It can operate stably for a long time in high temperature and radiation environment of 260°C, and is suitable for key electrical connection systems in the nuclear island, improving the safety level of nuclear power equipment. (2) Improves reliability in extreme environments. It avoids insulation failure, loose contact or structural cracking caused by thermal aging, radiation embrittlement and moisture absorption expansion of materials, significantly extending the maintenance cycle and service life. (3) Supports integrated molding of complex functions. The selected materials can be precision injection molded to form complex internal geometric features such as central ventilation channels, annular bases and flow guiding structures, ensuring the integration of heat dissipation and electrical functions. (4) Solves the technical bottleneck of traditional materials. It overcomes the problems of conventional engineering plastics (such as PBT and nylon) being prone to hydrolysis under high temperature and humidity, easy to become embrittled under radiation, and rapid aging failure at 260°C, providing a reliable material and structural solution for nuclear-grade connectors.

[0085] Example 9 To achieve intelligent thermal management of the connector, this embodiment integrates temperature sensing functionality. A temperature sensor (such as an NTC thermistor or digital temperature chip) is installed in the area where the low-voltage signal pins / holes are mounted on the socket or plug (i.e., the low-voltage layer) to monitor the temperature of that area in real time and output a signal.

[0086] An NTC temperature sensor is embedded near the outer base, and its signal line is output through a dedicated pin to connect to the control system, enabling real-time temperature monitoring and overheat alarm.

[0087] Low-voltage areas are most sensitive to temperature, and temperature changes here directly reflect the degree of thermal interference. Sensors feed temperature data back to the main control system, which can trigger protection mechanisms such as over-temperature alarms, automatic load reduction, and activation of auxiliary cooling fans.

[0088] The advantage lies in upgrading the connector from "passive heat dissipation" to "active thermal management," achieving status awareness and closed-loop control. This solves the problems of traditional connectors lacking status feedback and being unable to predict failure risks, especially in unattended or high-reliability systems, significantly improving operational safety and maintenance efficiency.

[0089] This utility model constructs an efficient, reliable, and maintainable high-temperature multi-core connector solution through a comprehensive approach of "central ventilation duct + annular layered base + thermoelectric zone layout + flow guidance enhancement + high temperature resistant materials," which has significant practical value and broad market prospects.

Claims

1. A high-temperature resistant, high-voltage, low-voltage integrated multi-core connector, characterized in that: The device includes a plug and a socket. The plug has a plug insulating body (1) and several pins. The socket has a socket insulating body (2) and several holes that are adapted to the plug. The plug insulating body (1) and the socket insulating body (2) are both provided with a central ventilation channel (3) that runs through the insertion direction at their axial center. When the plug and the socket are fully inserted, the central ventilation channels (3) of the two are coaxially connected to form a continuous axial heat dissipation channel.

2. The high-temperature resistant integrated multi-core connector for both high and low voltage electrical circuits according to claim 1, characterized in that: Both the plug insulation body (1) and the socket insulation body (2) are provided with multi-layered annular bases concentrically distributed around the central ventilation duct (3); annular cavities are formed between adjacent annular bases, and the annular cavities are fluidly connected with the central ventilation duct (3) to jointly form a multi-parallel annular heat dissipation duct.

3. The high-temperature resistant integrated multi-core connector for both strong and weak current as described in claim 2, characterized in that: The pin and the socket are respectively installed in the mounting holes of the corresponding annular base, and radial gaps are provided between the outer periphery of the pin and the inner wall of the mounting hole, and between the outer periphery of the socket and the inner wall of the mounting hole in the insertion contact section, forming an annular cavity in the pin contact section. The annular cavity of the needle contact section, the annular cavity between the adjacent annular base, and the central ventilation duct (3) are fluidly connected to form a multi-parallel heat dissipation duct.

4. The high-temperature resistant integrated multi-core connector for both strong and weak current as described in claim 2, characterized in that: The multi-layer ring base includes an inner high-voltage layer (4) and an outer low-voltage layer (5); the high-voltage layer (4) is provided with high-current pins and sockets, and the low-voltage layer is provided with low-voltage signal pins and sockets.

5. The multi-core connector according to claim 4, characterized in that: The pin is installed in the mounting hole of the annular base by an elastic fastener, and a micro gap is left between the outer wall of the pin and the inner wall of the mounting hole.

6. The high-temperature resistant multi-core connector for both high and low voltage electrical circuits according to any one of claims 1 to 5, characterized in that, The inner wall of the central ventilation duct (3) is provided with axially extending guide grooves or spirally distributed guide fins to guide the airflow along the axial or spiral path.

7. The high-temperature resistant multi-core connector for both high and low voltage electrical circuits according to any one of claims 1 to 5, characterized in that, The end face of the plug insulation body (1) is provided with a guide cylinder (6), and the inner hole of the guide cylinder is the extension of the central ventilation channel (3) on the plug side; the end face of the socket insulation body (2) is provided with a guide sleeve (7), and the inner diameter of the guide sleeve (7) is adapted to the outer diameter of the guide cylinder (6); when the plug and the socket are fully inserted, the guide cylinder (6) is inserted into the guide sleeve (7), and its end face is sealed and abutted against the end face of the socket insulation body (2); the inner hole of the guide cylinder (6) is coaxially connected with the central ventilation channel (3) in the socket insulation body (2), and together they form a continuous axial heat dissipation channel.

8. The high-temperature resistant multi-core connector for both high and low voltage electrical circuits according to any one of claims 1 to 5, characterized in that: The plug insulation body (1) and the socket insulation body (2) are made of high-temperature resistant insulation material, and the relative thermal index RTI of the high-temperature resistant insulation material is greater than 180°C.

9. The high-temperature resistant integrated multi-core connector for both strong and weak current as described in claim 8, characterized in that: The high-temperature resistant insulating material is at least one of liquid crystal polymer (LCP), polyphenylene sulfide (PPS), or polyetherimide (PEI).

10. The high-temperature resistant multi-core connector for both high and low voltage electrical circuits according to any one of claims 1 to 5, characterized in that, The connector also includes a temperature sensor, which is located in the low-voltage signal terminal area of ​​the socket or plug to monitor the temperature and output a temperature signal.

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