A printed template for a chip electronic component

Abstract

The utility model relates to the technical field of electronic components, and specifically discloses a sheet type electronic component printing template, which comprises a template body, a plurality of template holes for tin paste leakage printing are arranged on the surface of the template body, the hole wall cross section of the template hole is a double ladder structure, the double ladder structure comprises three functional areas from top to bottom in sequence, an upper ladder area is located on one side of the upper surface of the template body, the opening size of which is larger than the actual size of the corresponding pad on the PCB, a lower ladder area is located on one side of the lower surface of the template body, the opening size of which is matched with the target size of the corresponding pad on the PCB, and a middle transition area connects the upper ladder area and the lower ladder area, and the surface of the middle transition area forms a smooth ladder-shaped arc surface, the phenomenon that the solder paste is pulled sharp or distorted can be fundamentally avoided during demolding through the double ladder structure, and the integrity and accuracy of the solder paste pattern are ensured.

Description

Technical Field

[0001] This utility model relates to the field of electronic component technology, and specifically discloses a printing template for chip electronic components. Background Technology

[0002] With the development of science and technology and the improvement of electronic manufacturing processes, as well as the miniaturization, performance, and reliability of electronic products, electronic components have evolved from large, heavy, and thick to small, light, and thin, giving rise to surface mount technology (SMT) and chip components. Chip components are a new type of miniature component with no or short leads. In the manufacturing process of chip components, the component chips are first placed into the die holes of a printed circuit board, and then solder paste is dripped into the die holes to solder the chips together, thus creating the chip component.

[0003] Chinese Patent No. CN222261678U discloses a printing template for surface-mount electronic components, including a fixed frame. A fixing groove is formed between the inner and outer walls on the right side of the fixed frame. Sliding grooves are formed on both the left and right sides of the inner wall of the fixed frame. A printing plate is arranged in the inner cavity of the fixed frame. Multiple die holes are formed on the top of the printing plate. A base plate is arranged directly below the fixed frame. A cutter is arranged on the top of the printing plate. A ball screw is arranged in the inner cavity of the fixing groove. After the surface-mount electronic components are soldered, the crank handle can be turned to drive the threaded rod to rotate clockwise and move the movable nut forward. At the same time, the cutter can be driven to move back and forth through the slide bar. The cutter can remove excess solder paste that overflows from the die holes to keep the surface of the electronic components flat. Compared with hand-held cutting, this cutter keeps moving horizontally when removing solder paste, which can ensure that the surface of the component is cut safely and flat.

[0004] While the aforementioned documents can ensure a safe and flat cut of the component surface, the solder paste is sticky. At the moment the stencil leaves the PCB, the solder paste adheres to the sidewall of the stencil opening, which can easily cause the solder paste pattern to become pointed or deformed, affecting the printing quality. For tiny openings, solder paste can easily remain and clog the opening, affecting production efficiency and yield. Therefore, a sheet-type electronic component printing stencil is needed to solve this problem. Utility Model Content

[0005] This utility model proposes a sheet-type electronic component printing template. Through a double-step structure, it can fundamentally avoid the phenomenon of solder paste being pulled into sharp points or twisted during demolding, thus ensuring the integrity and accuracy of the solder paste pattern.

[0006] This utility model is implemented as follows: a chip electronic component printing template includes a template body, the surface of which is provided with a plurality of mold holes for solder paste stencil printing, and the cross-section of the mold hole wall is a double-stepped structure.

[0007] The double-step structure comprises three functional areas from top to bottom:

[0008] The upper stepped area is located on one side of the upper surface of the template body, and its opening size is larger than the actual size of the corresponding pad on the PCB.

[0009] The lower stepped area is located on one side of the lower surface of the template body, and its opening size matches the target size of the corresponding pad on the PCB.

[0010] The intermediate transition area connects the upper and lower stepped areas, and its surface forms a smooth stepped arc surface.

[0011] As a preferred embodiment of the present invention, the opening contour of the upper stepped area is generally larger than the opening contour of the lower stepped area.

[0012] As a preferred embodiment of the present invention, the inner wall of the upper stepped area adopts a conical structure.

[0013] As a preferred embodiment of the present invention, the intermediate transition area is a circular arc transition structure.

[0014] As a preferred embodiment of the present invention for printing templates of sheet electronic components, the mold hole is a rectangular opening, and the rectangular outline of the upper stepped area is concentric with the rectangular outline of the lower stepped area.

[0015] The beneficial effects of this utility model are:

[0016] With its double-step structure, the solder paste primarily contacts the sidewalls of the lower step area during demolding. The presence of the upper step area creates a natural release space. When the mold body is lifted, the contact area and adhesion between the solder paste and the mold hole sidewalls on the mold body are greatly reduced, fundamentally preventing the solder paste from being pulled or twisted, thus ensuring the integrity and accuracy of the solder paste pattern. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0018] Figure 1 This is an overall structural diagram of a chip electronic component printing template according to the present invention.

[0019] Figure 2 This is a cross-sectional view of the die hole of a chip electronic component printing template according to the present invention.

[0020] The markings in the diagram are: 1. Template body; 2. Mold hole; 201. Upper stepped area; 202. Intermediate transition area; 203. Lower stepped area. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and specific embodiments to aid in understanding its content. Unless otherwise specified, the methods used in this invention are conventional methods; the raw materials and apparatus used, unless otherwise specified, are conventional commercially available products.

[0022] Please see Figure 1-2 A type of printed template for electronic components includes a template body 1. The surface of the template body 1 is provided with a plurality of mold holes 2 for solder paste stencil printing. The cross-section of the wall of the mold hole 2 is a double-stepped structure.

[0023] The double-tiered structure comprises three functional areas from top to bottom:

[0024] The upper stepped area 201 is located on one side of the upper surface of the template body 1, and its opening size is larger than the actual size of the corresponding pad on the PCB.

[0025] The lower step area 203 is located on one side of the lower surface of the template body 1, and its opening size matches the target size of the corresponding pad on the PCB.

[0026] The intermediate transition region 202 connects the upper stepped region 201 and the lower stepped region 203, and its surface forms a smooth stepped arc surface.

[0027] In this embodiment: the larger opening in the upper stepped area 201 facilitates the smooth and rapid filling of the mold hole 2 with solder paste applied by the scraper, reduces the resistance of the solder paste at the opening, and ensures that the bottom of the mold hole 2 is fully filled;

[0028] The lower stepped area 203 ensures that the solder paste pattern printed on the pads has a clear outline and precise position, fundamentally preventing the risk of solder paste overflow and bridging caused by excessively large openings.

[0029] Through the arc transition structure of the intermediate transition area 202, a gradual guiding channel is formed between the large opening of the upper stepped area 201 and the small opening of the lower stepped area 203. During the demolding process, the arc surface can effectively reduce the contact area and adhesion between the solder paste and the hole wall, guide the solder paste to smoothly shrink towards the center and separate from the hole wall, thereby achieving clean and complete solder paste release and forming a full and well-shaped solder paste body.

[0030] Furthermore, by designing the mold hole 2 as a double-step structure, during demolding, the solder paste mainly contacts the sidewall of the lower step area 203. Due to the existence of the upper step area 201, a natural release space is formed. When the template body 1 is lifted, the contact area and adhesion force between the solder paste and the sidewall of the mold hole 2 on the template body 1 are greatly reduced, thereby fundamentally avoiding the phenomenon of solder paste being pulled into a point or twisted, and ensuring the integrity and accuracy of the solder paste pattern.

[0031] As a technical optimization of this utility model, the opening contour of the upper stepped region 201 is generally larger than the opening contour of the lower stepped region 203.

[0032] In this embodiment, the opening profile of the upper stepped region 201 is larger than the opening profile of the lower stepped region 203. This size difference is the basis for forming the stepped structure and realizing its function.

[0033] As a technical optimization of this utility model, the inner wall of the upper stepped area 201 adopts a conical structure.

[0034] In this embodiment, the inner wall of the upper stepped region 201 adopts a conical structure, which can further assist the solder paste to flow to the bottom of the mold hole 2 and optimize the filling performance.

[0035] As a technical optimization of this utility model, the intermediate transition region 202 is a circular arc transition structure.

[0036] In this embodiment: the intermediate transition area 202 is an arc transition structure. The smooth arc surface can minimize the demolding resistance, avoid solder paste residue at sharp corners, and ensure the consistency of each printing.

[0037] As a technical optimization of this utility model, the mold hole 2 is a rectangular opening, and the rectangular outline of the upper stepped area 201 is concentric with the rectangular outline of the lower stepped area 203.

[0038] In this embodiment, by ensuring that the rectangular outline of the upper stepped area 201 is concentric with the rectangular outline of the lower stepped area 203, it can be ensured that the solder paste is formed evenly and symmetrically, and the force is balanced, thus avoiding uneven tension during component soldering.

[0039] The working principle and usage process of this utility model are as follows: During printing, the squeegee scrapes the solder paste across the surface of the template body 1, and the solder paste fills the mold hole 2. Due to the presence of the upper stepped area 201, more solder paste is accommodated in the upper part of the mold hole 2. When demolding, the template body 1 is lifted upward, and the solder paste body separates from the side wall of the lower stepped area 203. Since the upper stepped area 201 provides additional space, the "sucking" effect of the traditional vertical side wall is avoided, and the solder paste can be left cleanly on the solder pad, forming a full-shaped solder paste pattern without spikes.

[0040] In the description of this utility model, it should be understood that the terms "left", "right", "up", "down", "top", "bottom", "front", "back", "inner", "outer", "back", "middle", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0041] However, the above description is only a specific embodiment of this utility model and should not be construed as limiting the scope of implementation of this utility model. Therefore, any substitution of equivalent components or equivalent changes and modifications made in accordance with the scope of protection of this utility model should still fall within the scope of the claims of this utility model.

Claims

1. A chip electronic component printing template, comprising a template body (1), wherein the surface of the template body (1) is provided with a plurality of die holes (2) for solder paste stencil printing, characterized in that: The cross-section of the hole wall of the mold hole (2) is a double-stepped structure; The double-step structure comprises three functional areas from top to bottom: The upper stepped area (201) is located on one side of the upper surface of the template body (1), and its opening size is larger than the actual size of the corresponding pad on the PCB. The lower step area (203) is located on one side of the lower surface of the template body (1), and its opening size matches the target size of the corresponding pad on the PCB. The intermediate transition area (202) connects the upper stepped area (201) and the lower stepped area (203), and its surface forms a smooth stepped arc surface.

2. The printing template for a surface-mount electronic component according to claim 1, characterized in that: The opening profile of the upper stepped region (201) is generally larger than the opening profile of the lower stepped region (203).

3. The printing template for a surface-mount electronic component according to claim 1, characterized in that: The inner wall of the upper stepped area (201) adopts a conical structure.

4. The printing template for a surface-mount electronic component according to claim 1, characterized in that: The intermediate transition region (202) is a circular arc transition structure.

5. A printing template for surface-mount electronic components according to claim 1, characterized in that: The mold hole (2) is a rectangular opening, and the rectangular outline of the upper stepped area (201) is concentric with the rectangular outline of the lower stepped area (203).

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