A high power density laser power supply
Patent Information
- Application Number
- CN202521958132.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-11
- Publication Date
- 2026-08-18
- Estimated Expiration
- 2035-09-11
AI Technical Summary
现有激光电源多采用将电路板单层平铺设置的结构形式,其整机体积较大,难以满足市场对高功率密度激光电源产品的需求
本实用新型采用叠层设置的方式,通过在电路板上设置通孔或缺口,使器件错列设置,能够进一步降低器件占用空间,进而降低体积,提高功率密度。并通过采用一端面为斜面,且外表面设有凸台的螺钉柱,能够满足对多个电路板的支撑安装和导电接地。
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Figure CN224653381U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of laser power supply technology, and in particular to a high power density laser power supply. Background Technology
[0002] Laser power supplies have wide applications in industrial manufacturing, medical aesthetics, scientific research, and other fields. Existing laser power supplies mostly employ a structure where a single layer of circuit board is laid flat, resulting in a large overall size that fails to meet market demand for high-power-density laser power supplies. Furthermore, when multiple circuit boards need to be grounded, separate grounding wires are typically used to connect them to a grounding busbar, which is inconvenient.
[0003] Therefore, there is an urgent need for a laser power source that is small in size and has a high power density. Utility Model Content
[0004] In order to overcome the above-mentioned problems in existing laser power supplies, this invention provides a high power density laser power supply.
[0005] This utility model provides a high power density laser power supply, including a power board, a control board, and a wiring board stacked together. The control board and the wiring board are mounted on top of the power board via screw posts. The control board and the wiring board are provided with through holes or notches. The power board is provided with a BUCK voltage regulation circuit composed of MOSFETs, diodes, and inductors. The inductors pass through the through holes or notches of the control board and the wiring board.
[0006] According to one specific embodiment, in the laser power supply described above, the terminal block is provided with an input terminal, an output terminal, a fast fuse, and a filter capacitor; the fast fuse and the filter capacitor are respectively located near the input terminal and the output terminal.
[0007] According to one specific embodiment, in the laser power supply described above, the control board is electrically connected to the power board via wires or pins, and is used to control the operation of the MOS transistors in the power board.
[0008] According to one specific embodiment, in the laser power supply described above, the wiring board is disposed between the wide surface of the power board and the control board, and the inductor passes through a through hole or notch.
[0009] According to one specific embodiment, in the laser power supply described above, one end face of the screw post is beveled, and a mounting hole is provided in the middle.
[0010] According to one specific embodiment, in the laser power supply described above, the outer surface of the screw post is further provided with a boss for supporting the control board or wiring board.
[0011] According to one specific embodiment, in the laser power supply described above, the mounting hole is provided with an internal thread for engaging with a conventional external thread support column.
[0012] According to a specific embodiment, in the above-mentioned laser power supply, the substrate of the power board is an aluminum substrate or a copper substrate, and a circuit layer is provided on the top surface of the substrate; the aluminum substrate or copper substrate is provided with a countersunk hole corresponding to the inclined surface of the screw post, and the inclined surface of the screw post abuts and is electrically connected to the countersunk hole.
[0013] According to one specific embodiment, the laser power supply further includes a heat sink, and the aluminum or copper substrate of the power board is mounted on the heat sink, and the aluminum or copper substrate is grounded.
[0014] According to one specific embodiment, in the laser power supply described above, the power board is provided with a first region and a second region, wherein the first region is provided with a MOS transistor and a diode, and the second region is provided with an inductor.
[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention employs a stacked arrangement, using through holes or notches on the circuit board to stagger the arrangement of components, thereby reducing the space occupied by the components, reducing the overall size, and increasing power density. Furthermore, by using screw posts with a beveled end face and a boss on the outer surface, it can support and install multiple circuit boards and ensure conductive grounding. Attached Figure Description
[0016] Figure 1 A schematic diagram of a high power density laser power supply provided for an embodiment of this utility model; Figure 2 A schematic diagram of the power board provided in an embodiment of this utility model; Figure 3 This is a schematic diagram of the structure of the terminal block and power board provided in the embodiment of this utility model; Figure 4 This is a schematic diagram of the cross-sectional structure of the screw post provided in an embodiment of the present utility model; Figure 5 This is a schematic diagram of a high power density laser power supply provided in another embodiment of the present invention.
[0017] Marked in the image: 100 - Power board, 101 - MOSFET, 102 - Diode, 103 - Inductor, 104 - Heat sink; 200 - Terminal block, 201 - Fast fuse, 202 - Filter capacitor; 300-Control Panel; 400 - Screw post, 401 - Boss, 402 - External thread support post, 403 - Support ring, 404 - Screw. Detailed Implementation
[0018] The present invention will be further described in detail below with reference to specific embodiments. However, it should not be construed as limiting the scope of the present invention to the following embodiments; all technologies implemented based on the content of the present invention fall within the scope of the present invention.
[0019] Unless otherwise specified, the use of terms such as "upper," "lower," "left," "right," "center," "inner," and "outer" to indicate orientation or positional relationships in the description of specific embodiments of this utility model is based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product / equipment / device is typically placed during use. These terms are merely for the purpose of facilitating the description of the utility model solution or simplifying the description in specific embodiments, enabling those skilled in the art to quickly understand the solution, and do not indicate or imply that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific positional relationship. Therefore, they should not be construed as limitations on this utility model.
[0020] Furthermore, the use of terms such as "horizontal," "vertical," "suspended," and "parallel" does not imply that the corresponding device / component / element must be absolutely horizontal, vertical, suspended, or parallel, but rather that it can be slightly tilted or have a deviation. For example, "horizontal" merely means that its direction is more horizontal relative to "vertical," not that the structure must be completely horizontal, but can be slightly tilted. Alternatively, it can be simplified to mean that the corresponding device / component / element, when set in a "horizontal," "vertical," "suspended," or "parallel" direction, can have an error / deviation of ±10% relative to the corresponding direction, more preferably within ±8%, more preferably within ±6%, more preferably within ±5%, and more preferably within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its function in the present invention.
[0021] Furthermore, the use of terms such as "first," "second," and "third" in terminology is merely for distinguishing descriptions of identical or similar components and should not be interpreted as emphasizing or implying the relative importance of a particular component.
[0022] Furthermore, in the description of the embodiments of this utility model, "several", "multiple", and "several" represent at least two. The number can be any number, such as two, three, four, five, six, seven, eight, or nine, and can even exceed nine.
[0023] Furthermore, in the description of the technical solution of this utility model, unless otherwise explicitly specified / limited / restricted, the terms "set up," "install," "connect," "link," "equipped with," "laid out," and "arranged" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to common connection methods in the art, such as welding, riveting, bolting, and threaded connections. Such connections can be mechanical, electrical, or communication connections; they can be direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components.
[0024] The core function of a laser power supply is to convert input electrical energy into a high-voltage pulse or constant current output suitable for exciting laser media (such as xenon lamps or semiconductor lasers). Existing laser power supplies employ a modular PCB design to optimize heat dissipation, increase power density, and maintain signal integrity. A typical structure includes a power layer, a control layer, and a power supply layer. These often use a single, flat PCB layer, resulting in a large overall size and limiting diverse application scenarios. Furthermore, in this flat design, the conductive posts on the PCB are primarily planar bosses, making it difficult to achieve effective electrical connection with the PCB's heatsink base.
[0025] This invention focuses on reducing the overall size of the laser power supply by employing a stacked configuration to provide a high-power-density laser power supply. The optimized connection structure effectively reduces the power supply's size and provides excellent heat dissipation. The following detailed description and explanation of specific embodiments further illustrate this invention.
[0026] Please refer to Figure 1 The diagram shows a structural schematic of a high power density laser power supply provided by an embodiment of the present invention, including a power board 100, a control board 300, and a wiring board 200 stacked together. The control board 300 and the wiring board 200 are mounted above the power board 100 by screw posts 400. The control board 300 and the wiring board 200 are provided with through holes or notches.
[0027] Please refer to Figure 2 The diagram shows a schematic of the power board provided in the embodiment of the present invention. The power board 100 is provided with a BUCK voltage regulation circuit composed of a MOS transistor 101, a diode 102 and an inductor 103. The inductor 103 passes through the through holes or notches of the control board 300 and the terminal block 200.
[0028] Specifically, the power board 100, terminal block 200, and control board 300 are stacked from bottom to top to form a layered structure, with the terminal block 200 positioned between the wide surfaces of the power board 100 and the control board 300. To ensure the layered structure is accommodating, corresponding through holes or notches are provided in the terminal block 200 and the control board 300, allowing the inductor 103 on the power board 100 to be placed within the layered structure.
[0029] Further, please refer to Figure 3 This diagram illustrates the structure of the terminal block and power board provided in this embodiment of the invention. The terminal block 200 includes an input terminal, an output terminal, a fast fuse 201, and a filter capacitor 202. The fast fuse 201 and the filter capacitor 202 are respectively located near the input terminal and the output terminal. Depending on the power supply configuration, the terminal block 200 may also contain high-power devices, such as the fast fuse 201 and the filter capacitor 202. The control board 300 also includes through holes or notches designed for the high-power devices on the terminal block 200, allowing it to be incorporated into a multilayer structure.
[0030] In this invention, the aforementioned stacked structures are connected by screw posts 400. Please refer to [reference needed]. Figure 4 The diagram shows a cross-sectional view of the screw post 400 provided in an embodiment of the present invention. One end face of the screw post 400 is beveled, and a mounting hole is provided in the middle. Further, the outer surface of the screw post 400 is also provided with a boss 401 for supporting the control board 300 or the wiring board 200. It is understood that the above-mentioned stacked arrangement can be adjusted in order according to actual conditions. The mounting hole is provided with an internal thread for mating with a conventional external thread support post 402. Preferably, as shown... Figure 4 As shown, a support ring 403 that mates with the screw post can also be provided on the terminal block 200 to support the control board 300.
[0031] In one possible implementation, the power board 100 has an aluminum or copper substrate as its base, with a circuit layer on its top surface. The aluminum or copper substrate has countersunk holes corresponding to the beveled surfaces of the screw posts 400, and the beveled surfaces of the screw posts 400 are electrically connected to these countersunk holes. The screw posts 400 ensure a good electrical connection between the laser power supply and the heat sink. The power board 100 has a first region and a second region. The first region contains a MOSFET 101 and a diode 102, and is an area where no through-holes or notches are required on the PCB. The second region contains an inductor 103, and is an area where through-holes or notches are required on the PCB.
[0032] Furthermore, in this invention, the laser power supply also includes a heat sink 104, please refer to [reference needed]. Figure 5This illustration shows a structural schematic diagram of a high power density laser power supply according to another embodiment of the present invention. The aluminum or copper substrate of the power board 100 is mounted on the heat sink 104, and the aluminum or copper substrate is grounded. Simultaneously, the grounding layer on the bottom surface of the power board 100, the wiring board 200, and the control board 300 can be electrically connected to the aluminum or copper substrate via screw posts 400, achieving convenient and centralized grounding.
[0033] Based on the above technical solution, this utility model adopts a stacked arrangement method. By setting through holes or notches on the circuit board, the components are arranged in a staggered manner, which can further reduce the space occupied by the components, thereby reducing the volume and increasing the power density. Furthermore, this utility model also uses screw posts with a beveled end face and a boss on the outer surface to achieve support and installation of multiple circuit boards, good grounding connection, and compact arrangement of multi-layer circuit boards.
[0034] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A high power density laser power supply, characterized in that, The device includes a power board (100), a control board (300), and a terminal block (200) stacked together. The control board (300) and the terminal block (200) are mounted above the power board (100) by screw posts (400). The control board (300) and the terminal block (200) are provided with through holes or notches. The power board (100) is provided with a BUCK voltage regulation circuit composed of a MOSFET (101), a diode (102), and an inductor (103). The inductor (103) passes through the through holes or notches of the control board (300) and the terminal block (200).
2. The high power density laser power supply according to claim 1, characterized in that, The terminal block (200) is provided with an input terminal, an output terminal, a fast fuse (201), and a filter capacitor (202); the fast fuse (201) and the filter capacitor (202) are respectively located near the input terminal and the output terminal.
3. A high power density laser power supply according to claim 1, characterized in that, The control board (300) is electrically connected to the power board (100) via wires or pins and is used to control the operation of the MOS transistor (101) in the power board (100).
4. A high power density laser power supply according to claim 1, characterized in that, The terminal block (200) is located between the wide surfaces of the power board (100) and the control board (300), and the inductor (103) passes through a through hole or notch.
5. A high power density laser power supply according to claim 1, characterized in that, One end face of the screw post (400) is beveled, and a mounting hole is provided in the middle.
6. A high power density laser power supply according to claim 5, characterized in that, The outer surface of the screw post (400) is also provided with a boss (401) for supporting the control board (300) or the terminal block (200).
7. A high power density laser power supply according to claim 6, characterized in that, The mounting hole is provided with internal threads for use with a conventional external thread support column (402).
8. A high power density laser power supply according to claim 5, characterized in that, The power board (100) has an aluminum substrate or a copper substrate as its base, and a circuit layer is provided on the top surface of the base. The aluminum substrate or copper substrate has a countersunk hole corresponding to the inclined surface of the screw post (400), and the inclined surface of the screw post (400) is electrically connected to the countersunk hole.
9. A high power density laser power supply according to claim 1, characterized in that, It also includes a heat sink (104), on which the aluminum or copper substrate of the power board (100) is mounted, and the aluminum or copper substrate is grounded.
10. A high power density laser power supply according to claim 1, characterized in that, The power board (100) is provided with a first region and a second region, wherein the first region is provided with a MOSFET (101) and a diode (102), and the second region is provided with an inductor (103).