Electronic device protective case

Abstract

The application discloses an electronic device protective shell and belongs to the technical field of electronic device accessories. The electronic device protective shell comprises a back plate, a frame and a heat conducting piece. The frame and the back plate enclose an installation space for installing an electronic device. The heat conducting piece is located in the installation space and arranged on the back plate. A temperature equalizing structure is further arranged on the back plate and arranged around the heat conducting piece. The heat conducting piece is correspondingly attached to the heating area of the mobile phone, so that the heat can be quickly conducted to the heat conducting piece, and then conducted to the back plate through the heat conducting piece. The heat is dispersed by the temperature equalizing structure, and the heat exchange between the back plate and the external environment is achieved, so that the purpose of rapid heat dissipation is achieved.

Description

Technical Field

[0001] This application belongs to the field of electronic device accessories technology, and in particular relates to a protective case for electronic devices. Background Technology

[0002] When mobile phones and other electronic devices are working, the operation of electronic components often leads to localized overheating. For example, when playing games on a mobile phone, the CPU area tends to generate significant heat; during wireless charging, the area where the phone's back contacts the wireless charger generates heat due to the wireless energy transfer between them. Users typically use protective cases on their phones, causing heat to accumulate between the case and the phone (cases are usually made of plastic, which has poor thermal conductivity), further increasing the temperature. For instance, when the phone detects this increased temperature during wireless charging, either the wireless charger or the phone itself may reduce its charging power. This power reduction can cause the phone to lag, and the wireless charger to slow down charging, negatively impacting the user experience. Utility Model Content

[0003] This application aims to improve the technical problem in the prior art where the heat between the protective case and the mobile phone cannot be dissipated well, which affects the function of the mobile phone. For example, when the wireless charger or the mobile phone detects that its own temperature has increased, it will trigger a power reduction, which affects the user experience.

[0004] This application provides a protective case for an electronic device, including: a backplate, a frame, and a heat-conducting component;

[0005] The frame and the back plate enclose an installation space for mounting electronic devices; the heat-conducting component is located within the installation space and is disposed on the back plate; a temperature equalization structure is also provided on the back plate, and the temperature equalization structure is disposed around the heat-conducting component.

[0006] According to one embodiment of this application, the inner surface of the back plate is provided with a first mounting portion and a second mounting portion, the second mounting portion is disposed around the first mounting portion, the heat-conducting element is disposed on the first mounting portion, and the temperature equalization structure is disposed on the second mounting portion.

[0007] According to one embodiment of this application, the heat-conducting element is a sheet structure and is attached to the first mounting portion, and the surface of the heat-conducting element is higher than the inner surface of the back plate, and the thickness of the heat-conducting element is 0.1mm-5mm.

[0008] According to one embodiment of this application, the temperature equalization structure includes a flow guide groove, which is disposed on the surface of the second mounting portion. The flow guide groove includes a plurality of grooves, which surround the heat-conducting element and are spaced apart in a direction away from the heat-conducting element.

[0009] According to one embodiment of this application, the flow channel includes a first flow channel and a second flow channel; the first flow channel is arranged around the heat-conducting component; the second flow channel is located around the first flow channel, and the second flow channel extends along the width direction of the back plate and extends from one side of the back plate to the other side of the back plate.

[0010] According to one embodiment of this application, the heat-conducting component has a circular structure. When the electronic device is placed in the installation space, the heat-conducting component corresponds to the wireless charging area of ​​the electronic device. The first flow channel has an annular structure, and the second flow channel has an arc-shaped structure.

[0011] According to one embodiment of this application, an airflow channel is also included, the airflow channel being disposed on the side of the frame facing the mounting space, and the airflow channel extending circumferentially along the back panel.

[0012] According to one embodiment of this application, the airflow channel includes a plurality of airflow slots spaced apart on the frame, the plurality of airflow slots being arranged circumferentially along the back plate and / or along the width direction of the frame.

[0013] According to one embodiment of this application, the airflow channel includes a plurality of airflow slots spaced apart on the frame, and the airflow slots disposed near the back plate are connected to the second guide slot, or the plurality of airflow slots are all connected to the second guide slot.

[0014] According to one embodiment of this application, the outer surface of the back panel is provided with a third mounting portion, the third mounting portion being positioned corresponding to the first mounting portion, and the electronic device protective case further includes a magnetic bracket, the magnetic bracket being disposed on the third mounting portion.

[0015] The above-described one or more technical solutions in the embodiments of this application have at least one of the following technical effects:

[0016] This application incorporates a heat-conducting element on the inner surface of the backplate of the protective casing. When the electronic device is installed in the mounting space, the heat-conducting element rapidly conducts heat from the heat-generating areas of the electronic device to the backplate, preventing heat concentration and ensuring the functionality of the electronic device. Simultaneously, the temperature-equalizing structure of the backplate forces heat to diffuse outward along a predetermined path by altering the surface morphology of the backplate, preventing heat accumulation and distributing heat over a larger area, thus increasing the heat dissipation area. Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0018] Figure 1 This is a schematic diagram of the structure of the electronic device protective case and mobile phone provided in the embodiments of this application;

[0019] Figure 2 This is an exploded view of the electronic device protective case and mobile phone provided in the embodiments of this application;

[0020] Figure 3 This is an exploded view of the electronic device protective case provided in the embodiments of this application;

[0021] Figure 4 This is a partial enlarged view of the electronic device protective case provided in the embodiments of this application;

[0022] Figure 5 yes Figure 3 Further exploded views;

[0023] Figure 6 This is a schematic diagram of the structure of the electronic device protective case provided in the embodiments of this application;

[0024] Figure 7 This is an exploded view from another angle of the electronic device protective case provided in the embodiments of this application.

[0025] Figure label:

[0026] 100. Border;

[0027] 110. Base frame; 111. Mounting hole; 112. Step; 120. Side frame; 130. Airflow channel; 200. Back panel;

[0028] 210. First mounting section; 220. Flow guide channel; 230. Third mounting section;

[0029] 221. First guide channel; 222. Second guide channel;

[0030] 231. Magnetic bracket; 300. Thermal conductive component;

[0031] a. Installation space; b. Mobile phone. Detailed Implementation

[0032] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0033] Taking wireless charging of electronic devices as an example, users typically put a protective case on their electronic devices and then place the device, with the case on, against a wireless charger to wirelessly charge it. The wireless energy transfer between the electronic device and the wireless charger generates heat. For instance, the electromagnetic field generated by the wireless charger's transmitting coil induces a current in the phone's receiving coil, causing the receiving coil to heat up. Energy loss occurs during wireless charging, and other metal components besides the phone's receiving coil may also generate induced currents, causing them to heat up. Furthermore, if there is a misalignment between the wireless charger's transmitting coil and the phone's receiving coil, power conversion cannot function properly, and excess power is released as heat.

[0034] In other words, when heat continues to accumulate, the wireless charger or the phone will trigger a power reduction after detecting that its own temperature has risen. After the phone reduces its power, it will cause the phone to lag, and the various electronic components inside the phone that are constantly in a high-temperature state will age faster or even be damaged. After the wireless charger reduces its power, it will cause the charging to slow down, affecting the user experience.

[0035] This application proposes a protective case for electronic devices to dissipate heat between the electronic device and the wireless charger, thereby lowering its surface temperature, increasing the charging current, enhancing charging power, saving charging time, ensuring normal operation of the electronic device, and improving the user experience. This protective case can also be used to dissipate heat generated by other electronic components, based on the same principle as dissipating heat between the electronic device and the wireless charger, and will not be elaborated further here.

[0036] The following description uses mobile phone b as an example to illustrate the protective case for an electronic device according to an embodiment of this application.

[0037] Please see Figure 1 and Figure 2 The protective case for electronic devices includes: a frame 100, a back panel 200, and a heat-conducting component 300.

[0038] Please see Figure 2 and Figure 5 The frame 100 surrounds the back panel 200 and together with the back panel 200 forms an installation space a, allowing the mobile phone b to be installed in the installation space a. Specifically, the frame 100 includes a bottom frame 110 and a side frame 120 connected to each other. The side frame 120 is perpendicular to the bottom frame 110 and surrounds the periphery of the bottom frame 110. When the back panel 200 is placed on the bottom frame 110, it can form the installation space a together with the side frame 120. More specifically, the bottom frame 110 has a mounting hole 111, and the bottom frame 110 has a step 112 around the mounting hole 111. The back panel 200 is placed on the step 112 and closes the mounting hole 111.

[0039] The heat-conducting component 300 is located on the side of the back plate 200 facing the mounting space a. The heat-conducting component 300 is situated within the mounting space a and is either fixedly connected to the back plate 200 or detachably connected. In practice, the heat-conducting component 300 can be welded to the back plate 200 or glued to it. The detachable connection allows for replacement of the heat-conducting component 300. When the old heat-conducting component 300 exhibits poor heat conduction, a new one can be installed, extending the service life of the protective shell.

[0040] The backplate 200 is also provided with a heat-equalizing structure, which is located around the heat-conducting component 300. By changing the surface morphology of the backplate 200, heat is forced to diffuse outward along a predetermined path, avoiding heat accumulation and dispersing heat to a larger area, thereby increasing the heat dissipation area.

[0041] In summary, this application provides a heat-conducting element 300 on the inner surface of the back plate 200 of the protective shell. When the electronic device is installed in the installation space a, the heat-conducting element 300 can quickly conduct the heat from the wireless charging area of ​​the electronic device to the back plate 200, so as to avoid heat concentration in the wireless charging area. The temperature-equalizing structure of the back plate 200 forces the heat to diffuse outward along a predetermined path by changing the surface morphology of the back plate 200, thereby avoiding heat accumulation and dispersing the heat to a larger area, thus increasing the heat dissipation area.

[0042] The backplate 200 can be a thermally conductive backplate or made of a material with a higher thermal conductivity to accelerate heat dissipation into the air. Specifically, the backplate 200 includes a matrix and thermally conductive fillers dispersed within the matrix. More specifically, the matrix of the backplate 200 is PC (polycarbonate), and the thermally conductive fillers include at least one of alumina, magnesium oxide, boron nitride, carbon fiber, or graphite. The thermally conductive fillers have high thermal conductivity and form multiple heat conduction paths within the matrix to improve the overall thermal conductivity of the backplate 200.

[0043] It should be noted that the performance of the ordinary PC and the backplane 200 was tested, and the results are shown in the table below.

[0044]

[0045]

[0046] Compared with ordinary PCs, the back panel 200 of this application has a higher density and better thermal conductivity, but its mechanical properties are lower than those of ordinary PCs. Consequently, it is more prone to breakage when dropped. To address this issue, a soft rubber layer is wrapped around the frame 100 of the electronic device protective case to reduce the impact on the back panel 200 during drops, thereby effectively preventing the back panel 200 from cracking.

[0047] Please see Figure 3In some embodiments, the inner surface of the back plate 200 is provided with a first mounting portion 210 and a second mounting portion, the second mounting portion is arranged around the first mounting portion 210, the heat-conducting element 300 is provided in the first mounting portion 210, and the temperature equalization structure is provided in the second mounting portion.

[0048] The first mounting portion 210 can be a plane, recess, or protrusion located in the central area of ​​the inner surface of the back plate 200; the first mounting portion 210 can also be a plane, recess, or protrusion located in the end area of ​​the back plate 200. Its function is to provide stable mounting positioning for the heat-conducting component 300, and to correspond to the position of the heat-generating area of ​​the mobile phone, thereby facilitating rapid heat conduction. The second mounting portion refers to the area formed around the first mounting portion, and its function is to support the temperature-equalizing structure to achieve heat diffusion.

[0049] Specifically, the first mounting part 210 is in direct contact with the wireless charging area of ​​the mobile phone b (or other areas that generate significant heat, such as the area where the CPU is located), so that heat can be quickly conducted to the heat-conducting component 300. The temperature-equalizing structure of the second mounting part guides the heat transferred by the heat-conducting component 300 outward. This enclosed layout allows heat to be transferred from the core area to the periphery, which is more conducive to heat dissipation.

[0050] In some embodiments, the heat-conducting element 300 is a sheet structure and is attached to the first mounting portion 210, and the surface of the heat-conducting element 300 is higher than the inner surface of the back plate 200, and the thickness of the heat-conducting element 300 is 0.1mm-5mm.

[0051] The heat-conducting component 300 has a sheet-like structure and is attached to the first mounting portion 210. This sheet-like structure maximizes the contact area between the heat-conducting component and the phone, facilitating rapid heat conduction. Its planar extensibility also ensures more even heat distribution and makes it easier to adhere to the first mounting portion 210, resulting in a secure connection that is less prone to falling off. The design of the heat-conducting component 300's surface protruding above the inner surface of the back panel 200 allows the phone b to be installed in the mounting space a, ensuring a tight fit between the heat-conducting component 300 and the surface of the phone b, eliminating localized thermal resistance caused by assembly gaps.

[0052] Specifically, the thickness of the heat-conducting component 300 ranges from 0.1mm to 5mm. It should be noted that if the heat-conducting component 300 is too thin, molding becomes difficult; for example, if the thickness is less than 0.1mm, the molding yield is low, and it may also result in the heat-conducting component 300 not adhering tightly to the phone surface. Conversely, if the heat-conducting component 300 is too thick, thermal resistance increases; for example, if the thickness is greater than 5mm, the thermal conductivity deteriorates. This application, within the range of mass-producible processes, maintains the thickness of the heat-conducting component 300 between 0.1mm and 5mm, achieving a good molding yield while ensuring good thermal conductivity.

[0053] In practice, the heat-conducting component 300 can be a flexible sheet of thermally conductive phase-change material, such as a flexible graphene sheet, which fits tightly against the phone b and the back panel 200 to achieve gapless contact. Compared to a hard contact between the heat-conducting component 300 and the phone b, this protects the surface of the phone b from scratches and is more conducive to heat conduction.

[0054] In some embodiments, the temperature equalization structure includes a flow guide groove disposed on the surface of the second mounting portion. The flow guide groove includes a plurality of grooves, which surround the heat-conducting element and are spaced apart in a direction away from the heat-conducting element.

[0055] In this embodiment, the heat guide groove is a groove structure located on the surface of the second mounting part, used to guide the direction of heat flow. Specifically, after heat is transferred to the back plate 200 through the heat conductor 300, it is guided by the heat guide groove to diffuse in different directions. The spaced heat guide grooves can prevent excessive heat accumulation on a single path, and at the same time, the heat guide grooves can increase the area of ​​the inner surface of the back plate 200, thereby increasing the heat dissipation area and facilitating the rapid dispersion of heat.

[0056] Please see Figure 3 In some embodiments, the flow channel 220 includes a first flow channel 221 and a second flow channel 222; the first flow channel 221 is arranged around the first mounting portion 210, and the second flow channel 222 is located on the periphery of the first flow channel 221, that is, the second flow channel 222 is arranged on the side of the first flow channel 221 away from the first mounting portion 210, so the heat concentrated by the heat conductor 300 can diffuse towards the direction of the second flow channel 222; the second flow channel 222 extends from one side of the back plate 200 in the width direction to the other side of the back plate 200 in the width direction.

[0057] In actual implementation, there are multiple second guide channels 222. These multiple second guide channels 222 are distributed along the length of the back plate 200 and on both sides of the first mounting part 210, so that heat can diffuse to both sides to improve the uniformity of heat dissipation.

[0058] The first guide channel 221 can be an annular groove structure surrounding the heat-conducting element 300, which absorbs the concentrated heat transferred by the heat-conducting element 300 and forms an initial diffusion path. The second guide channel 222 can be an arc-shaped groove extending laterally along the back plate 200, which transfers the heat dispersed by the first guide channel 221 to the side areas along the width direction of the back plate 200, thereby expanding the heat dissipation area. In this embodiment, the hierarchical layout of the first guide channel 221 and the second guide channel 222 forms a gradient structure, making the most of the limited space and enabling better heat transfer.

[0059] In some embodiments, the heat-conducting element 300 has a circular structure. When the mobile phone b is placed in the installation space a, the heat-conducting element 300 corresponds to the wireless charging area of ​​the mobile phone b. The first guide groove 221 has an annular structure, and the second guide groove 222 has an arc-shaped structure.

[0060] In this embodiment, when mobile phone b is wirelessly charged, the heat generated in the wireless charging area is transferred to the back plate 200 through the circular heat conductor 300. The first guide groove 221 forms an annular heat dissipation channel around the heat conductor 300, uniformly diffusing the heat radially to the outer area of ​​the back plate 200. The arc-shaped structure of the second guide groove 222 forms a multi-directional heat flow path on the surface of the back plate 200, increasing the heat dissipation area by extending the heat conduction path. Since the wireless receiving coil inside the mobile phone is generally circular, the shape of the heat conductor 300 can be perfectly matched with the wireless charging area, shortening the heat conduction path. At the same time, the circular structure (compared to square, rectangular, etc. structures) can leave more space for the guide groove, which is more conducive to the rapid dissipation of heat; and the combination of annular and arc-shaped guide grooves can avoid the accumulation of heat in local areas, which is more conducive to the rapid dissipation of heat.

[0061] Please see Figure 4 In some embodiments, the frame 100 has an airflow channel 130 on the side facing the mounting space a, and the airflow channel 130 extends circumferentially along the back plate 200.

[0062] The end of the airflow channel 130 is connected to the outside through the charging port and microphone port on the frame 100; when the mobile phone b is in the installation space a, the frame 100 abuts against the side wall of the mobile phone b, and the airflow channel 130 is set towards the side wall of the mobile phone b.

[0063] The aforementioned airflow channel 130 utilizes a principle similar to the "chimney principle," which leverages the natural convection phenomenon caused by the difference in air density due to temperature variations. When the air temperature inside the airflow channel 130 is higher than the outside air temperature, the density of the inside air decreases, while the density of the outside air increases. Under the influence of this density difference, the air inside the airflow channel 130 forms natural convection with the cold outside air.

[0064] In this embodiment, the airflow channel 130 guides the hot air generated by the heat generated by the mobile phone b to form convection with the external cold air, which accelerates the heat dissipation between the frame 100 and the mobile phone b, and avoids the accumulation of heat on the side of the mobile phone b, so as to better achieve heat dissipation of the mobile phone b.

[0065] In some examples, the airflow channel 130 includes a plurality of airflow slots spaced apart on the frame 100, the plurality of airflow slots being arranged circumferentially along the back panel 200 and / or along the width direction of the frame 100.

[0066] In this example, the airflow channel refers to the path formed on the frame to promote airflow. Specifically, the airflow slots arranged along the width or circumference of the frame 100 can guide the air to circulate along the outer edge of the back plate 200, promoting the diffusion of heat from the area where the heat conductor 300 is located. This increases the airflow range and the heat dissipation area.

[0067] In other examples, the airflow channel 130 includes a plurality of airflow slots spaced apart on the frame 100, and the airflow slots located near the back plate 200 are connected to the second guide channel 222, or the plurality of airflow slots are all connected to the second guide channel 222.

[0068] In this example, the airflow channel refers to the path formed on the frame that promotes airflow. Specifically, the airflow slot near the back plate 200 can be directly connected to the second guide slot 222 to form a linkage, so that heat can be exchanged with the external environment through the airflow slot during the conduction process, further increasing the heat dispersion area and increasing the heat dissipation area.

[0069] Please see Figure 6 and Figure 7 In some embodiments, the outer surface of the back plate 200 is provided with a third mounting part 230, which corresponds to the position of the first mounting part 210. The third mounting part 230 is provided with a magnetic bracket 231, which is used to magnetically attach the wireless charger. One end of the magnetic bracket 231 can rotate relative to the other end of the magnetic bracket 231.

[0070] In this embodiment, the third mounting part 230, the magnetic bracket 231, the first mounting part 210 and the heat-conducting component 300 are aligned so that the receiving coil of the mobile phone b is precisely aligned with the transmitting coil of the wireless charger, thereby reducing energy loss and additional heat generation caused by the misalignment of the receiving coil of the mobile phone b and the transmitting coil of the wireless charger.

[0071] Meanwhile, the magnetic bracket 231 is generally made of metal, which has a high thermal conductivity, and can also serve a heat dissipation function, transferring heat from the wireless charger to the back plate 200 for heat dissipation. It should be noted that after the electronic device protective case is equipped with the magnetic bracket 231, and one end of the magnetic bracket 231 rotates relative to the other end so that one end of the magnetic bracket 231 is not coplanar with the other end, one end of the magnetic bracket 231 can support a flat surface, such as a table, allowing the phone b to be in a horizontal position for convenient video viewing. When the phone b is low on battery, one end of the magnetic bracket 231 is rotated in the opposite direction relative to the other end so that one end of the magnetic bracket 231 is coplanar with the other end, and the entire magnetic bracket 231 is magnetically attached to the wireless charger. In practice, the magnetic bracket 231 can be made of metal.

[0072] Please see Figure 7 In actual execution, the third mounting part 230 is recessed towards the first mounting part 210, and the side of the magnetic bracket 231 facing away from the third mounting part 230 is inside the third mounting part 230.

[0073] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0074] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0075] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0076] In the description of this application, "multiple" means two or more.

[0077] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact through another feature between them.

[0078] In the description of this application, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.

[0079] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0080] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A protective case for an electronic device, characterized in that, include: Backplate, frame, and heat-conducting components; The frame and the back panel enclose an installation space for mounting electronic devices; The heat-conducting component is located within the installation space and is disposed on the back plate; a temperature equalization structure is also disposed on the back plate, and the temperature equalization structure is disposed around the heat-conducting component.

2. The electronic device protective case according to claim 1, characterized in that, The inner surface of the back plate is provided with a first mounting part and a second mounting part, the second mounting part is arranged around the first mounting part, the heat-conducting component is arranged in the first mounting part, and the temperature equalization structure is arranged in the second mounting part.

3. The electronic device protective case according to claim 2, characterized in that, The heat-conducting component is a sheet-like structure and is attached to the first mounting part, and the surface of the heat-conducting component is higher than the inner surface of the back plate. The thickness of the heat-conducting component is 0.1mm-5mm.

4. The electronic device protective case according to claim 2, characterized in that, The temperature equalization structure includes a flow guide groove, which is disposed on the surface of the second mounting part. The flow guide groove includes a plurality of grooves, which surround the heat-conducting component and are spaced apart in a direction away from the heat-conducting component.

5. The electronic device protective case according to claim 4, characterized in that, The flow channel includes a first flow channel and a second flow channel; the first flow channel is arranged around the heat-conducting component; the second flow channel is located around the first flow channel and extends along the width direction of the back plate, extending from one side of the back plate to the other side of the back plate.

6. The electronic device protective case according to claim 5, characterized in that, The heat-conducting component has a circular structure. When the electronic device is placed in the installation space, the heat-conducting component corresponds to the wireless charging area of ​​the electronic device. The first flow channel has an annular structure, and the second flow channel has an arc-shaped structure.

7. The electronic device protective case according to claim 5, characterized in that, It also includes an airflow channel, which is located on the side of the frame facing the mounting space and extends circumferentially along the back panel.

8. The electronic device protective case according to claim 7, characterized in that, The airflow channel includes a plurality of airflow slots spaced apart on the frame, the plurality of airflow slots being arranged circumferentially along the back plate and / or along the width direction of the frame.

9. The electronic device protective case according to claim 7, characterized in that, The airflow channel includes a plurality of airflow slots spaced apart on the frame. The airflow slots located near the back plate are connected to the second guide slot, or all of the plurality of airflow slots are connected to the second guide slot.

10. The electronic device protective case according to any one of claims 2-6, characterized in that, The outer surface of the back panel is provided with a third mounting part, which corresponds to the position of the first mounting part. The electronic device protective case also includes a magnetic bracket, which is located on the third mounting part.

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