Camera module with optimized resolving power

Abstract

The utility model embodiment belongs to camera module technical field. The utility model still relates to a camera module for optimizing analytic force, include: rigidly combined circuit board and carry on the photosensitive chip on rigidly combined circuit board, the photosensitive chip top is provided with lens, the area of rigidly combined circuit board carries photosensitive chip and is provided with the resist ink layer, and the resist ink layer is located the center at the photosensitive chip near rigidly combined circuit board one side, the resist ink layer is used for supporting photosensitive chip, to make photosensitive chip form present the curved surface of center than four around high, and the curved surface of photosensitive chip and the curved surface of lens are matched. The application increases the resist ink layer in the chip carrying area of rigidly combined circuit board, makes photosensitive chip form present the curved surface of center than four around high, this design cleverly caters to the positive field curvature phenomenon of lens itself, thereby realizes the state that center and four around are all most clear on picture.

Description

Technical Field

[0001] This utility model relates to the field of camera module technology, and more specifically, to a camera module with optimized resolution. Background Technology

[0002] In camera module manufacturing, resolution is a key factor affecting image quality. A camera module mainly consists of RFPC (rigid-flexible printed circuit board), image sensor, and lens. While the image sensor is typically planar, the optical curvature of the lens changes during manufacturing and baking. Especially after baking, the lens often develops a curved surface, exhibiting a positive field curvature phenomenon—that is, the center is higher than the edges. This positive field curvature results in the image plane at the edges being lower than the center during optical imaging. Consequently, when the center of the image is sharp, the edges are not in the sharpest position, severely impacting the overall resolution of the camera module and reducing product yield. Therefore, we propose an improved camera module with optimized resolution. Utility Model Content

[0003] The technical problem to be solved by this utility model embodiment is that the photosensitive chip is usually planar, while the lens is curved, which leads to a decrease in overall resolution.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: A camera module with optimized resolution includes: a rigid-flex circuit board and a photosensitive chip mounted on the rigid-flex circuit board. A lens is disposed above the photosensitive chip. A solder resist ink layer is disposed in the area of ​​the rigid-flex circuit board where the photosensitive chip is mounted, and the solder resist ink layer is located at the center of the side of the photosensitive chip closest to the rigid-flex circuit board. The solder resist ink layer is used to support the photosensitive chip so that the photosensitive chip has a curved surface that is higher at the center than at the periphery, and the curved surface of the photosensitive chip matches the curved surface of the lens.

[0005] As an improvement of this utility model, the optical distance between the lens and the photosensitive chip is the same at the center and at the four corners.

[0006] As an improvement of this utility model, a protective shell is provided on the rigid-flexible circuit board, and a camera module support is connected to the side of the protective shell away from the rigid-flexible circuit board, and the photosensitive chip is located inside the protective shell.

[0007] As an improvement of this utility model, the protective shell is fixed to the camera module support and the rigid-flexible circuit board by double-sided adhesive.

[0008] As an improvement of this utility model, a lens barrel is provided in the middle of the camera module support, and the lens is disposed inside the lens barrel.

[0009] As an improvement of this utility model, the outer surface of the lens barrel and the inner wall of the camera module support are both provided with threads, and the lens barrel and the camera module support are connected by threads.

[0010] As an improvement of this utility model, the solder resist ink layer is formed by using solder resist ink.

[0011] As an improvement of this utility model, the rigid-flexible circuit board includes a rigid circuit board and a flexible circuit board connected to the rigid circuit board, wherein the solder resist ink layer, the photosensitive chip and the protective shell are all disposed on the rigid circuit board.

[0012] As an improvement of this utility model, a filter is also provided inside the protective shell, and the filter is located between the photosensitive chip and the lens.

[0013] As an improvement of this utility model, the protective shell has a step for setting a filter, and the filter is attached to the step by optical adhesive.

[0014] Compared with the prior art, the embodiments of this utility model have the following main advantages: To address the issue that existing technologies typically feature planar image sensors and curved lenses, leading to a decrease in overall resolution, this application adds a solder resist ink layer to the chip mounting area of ​​a rigid-flexible circuit board. This makes the image sensor appear as a curved surface with a higher center than the edges. This design cleverly caters to the positive field curvature of the lens itself, thus achieving the clearest image in both the center and the edges. This design improves the image clarity of the camera module. Attached Figure Description

[0015] Figure 1 A schematic diagram of the structure of the camera module with optimized resolution provided in this application; Figure 2 This is a schematic diagram of the structure of the photosensitive chip and lens provided in this application; Figure 3 A schematic diagram of the structure of the photosensitive chip provided in this application when mounted on a rigid-flex circuit board; Figure 4 A schematic diagram of the solder resist ink provided in this application; Figure 5 A schematic diagram of the solder resist ink provided in this application.

[0016] The image shows: 1. Photosensitive chip; 2. Lens; 201. Lens barrel; 202. Camera module bracket; 203. Protective shell; 3. Rigid-flex circuit board; 301. Rigid circuit board; 302. Flexible circuit board; 4. Solder resist ink layer; 5. Filter. Detailed Implementation

[0017] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The reference herein to "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0018] As described in the background section, resolution is one of the key factors affecting image quality in the production of camera modules. Camera modules are mainly composed of RFPC (rigid-flexible printed circuit board), chips, and lenses. During the manufacturing and baking process, the optical field curvature of the lens changes. In particular, after baking, the lens often becomes curved, exhibiting a positive field curvature phenomenon, that is, the optical surface is higher in the center than at the periphery. This positive field curvature phenomenon causes the image plane at the periphery to be lower than the center during optical imaging. Therefore, when taking a picture, the center is clear, but the periphery is not in the clearest position, which seriously affects the overall resolution of the camera module and reduces the product yield.

[0019] To solve this technical problem, this utility model provides a camera module with optimized resolution.

[0020] For details, please refer to Figures 1-4 The camera module with optimized resolution specifically includes: The rigid-flex circuit board 3 and the photosensitive chip 1 mounted on the rigid-flex circuit board 3 are provided. A lens 2 is disposed above the photosensitive chip 1. A solder resist ink layer 4 is disposed in the area of ​​the rigid-flex circuit board 3 where the photosensitive chip 1 is mounted. The solder resist ink layer 4 is located at the center of the side of the photosensitive chip 1 closest to the rigid-flex circuit board 3. The solder resist ink layer 4 is used to support the photosensitive chip 1 so that the photosensitive chip 1 presents a curved surface with the center being higher than the surrounding area. The curved surface of the photosensitive chip 1 matches the curved surface of the lens 2.

[0021] The camera module with optimized resolution provided by this utility model adds a solder resist ink layer 4 to the chip mounting area of ​​the rigid-flexible circuit board 3, so that the shape of the photosensitive chip 1 presents a curved surface with the center higher than the periphery. This design cleverly caters to the positive field curvature phenomenon of the lens 2 itself, thereby achieving the state where the center and the periphery are the clearest in the picture. This design improves the shooting clarity of the camera module.

[0022] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0023] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0025] Embodiment 1 of the camera module with optimized resolution of this utility model Please refer to Figures 1-4 The camera module with optimized resolution of this utility model includes: a rigid-flex circuit board 3 and a photosensitive chip 1 mounted on the rigid-flex circuit board 3. A lens 2 is disposed above the photosensitive chip 1. A solder resist ink layer 4 is disposed in the area of ​​the rigid-flex circuit board 3 where the photosensitive chip 1 is mounted. The solder resist ink layer 4 is located at the center of the side of the photosensitive chip 1 closest to the rigid-flex circuit board 3. The solder resist ink layer 4 is used to support the photosensitive chip 1 so that the photosensitive chip 1 presents a curved surface with the center being higher than the surrounding area, and the curved surface of the photosensitive chip 1 matches the curved surface of the lens 2.

[0026] Figure 5 In the above, a represents the ideal state: both the lens 2 and the photosensitive chip 1 are planar, resulting in a flat image plane; b represents the problem of the prior art: the lens 2 has positive field curvature, while the photosensitive chip 1 is planar, causing the image plane to be curved; c represents the solution of this application: the lens 2 has positive field curvature, and the photosensitive chip 1 is supported by the solder resist ink layer 4 to form a curved surface with a high center and low periphery, restoring the image plane to a flat surface, thereby achieving optimized resolution.

[0027] Because field curvature is one of the most common aberrations in optical systems, if the photosensitive chip 1 is flat, when it is combined with the lens 2 which has natural field curvature, the edge light rays will focus at a farther position on the photosensitive chip 1, resulting in blurred edges. This design ensures that all light rays can be clearly focused on the surface of the photosensitive chip 1 by matching the field curvature of the photosensitive chip 1 with that of the lens 2.

[0028] Furthermore, the optical distance between the lens 2 and the photosensitive chip 1 is consistent at the center and at the four corners, thereby achieving the clearest state in the center and all four sides of the image during optical imaging, thus optimizing the resolution of the module.

[0029] The solder resist ink layer 4 is not limited to a single thickness. Instead, based on the specific positive field curvature parameters of the lens 2, the printing thickness and distribution of the solder resist ink layer 4 are adjusted to achieve precise control of the curved surface shape of the photosensitive chip 1, which is high in the center and low around the edges.

[0030] Embodiment 2 of the camera module with optimized resolution of this utility model Furthermore, in this invention, a protective shell 203 is provided on the rigid-flexible circuit board 3. A camera module support 202 is connected to the side of the protective shell 203 away from the rigid-flexible circuit board 3, and the photosensitive chip 1 is located inside the protective shell 203. The protective shell 203 and the camera module support 202 cooperate to provide protection for the photosensitive chip 1, reduce damage to the photosensitive chip 1 from external factors, ensure the normal operation of the photosensitive chip 1, thereby maintaining the performance of the camera module and indirectly optimizing the module's resolution.

[0031] Furthermore, the protective shell 203 is fixed to the camera module support 202 and the rigid-flexible circuit board 3 by double-sided adhesive. The double-sided adhesive is firmly bonded, which can ensure the connection stability between the components, reduce the displacement of components due to loosening, and affect the image quality. At the same time, a seal is formed at the bonding point to prevent dust, moisture and other substances from entering the camera module, reduce damage to components such as the photosensitive chip 1, ensure that the camera module can work stably in various environments, and optimize the module resolution.

[0032] Furthermore, a lens barrel 201 is provided in the middle of the camera module support 202, and the lens 2 is placed inside the lens barrel 201. The lens barrel 201 is used to support the lens 2, and the lens barrel 201, together with the camera module support 202 and the protective shell 203, further protects the photosensitive chip 1.

[0033] Furthermore, the outer surface of the lens barrel 201 and the inner wall of the camera module support 202 are both provided with threads, and the lens barrel 201 and the camera module support 202 are connected by threads. In actual use, it may be necessary to adjust the distance between the lens 2 and the photosensitive chip 1 according to different shooting needs. The threaded connection method facilitates distance adjustment, which can meet the shooting requirements in different scenarios, making the camera module more adaptable and flexible, ensuring clear imaging at different distances, and optimizing the module resolution.

[0034] Furthermore, the solder resist ink layer 4 is made of solder resist ink, usually an epoxy resin-based solder resist, which has good thermal stability and mechanical strength, and can maintain the stability of the curved surface shape of the photosensitive chip 1 for a long time.

[0035] The thickness of the solder resist ink layer 4 is adjusted according to the field curvature parameters of the lens 2, such as the radius of curvature. Specifically, the field curvature distribution data of the lens 2 is obtained through optical inspection equipment, such as a field curvature measuring instrument. The required surface profile of the photosensitive chip 1, i.e., the height difference Δh between the center and the edge, is calculated. By controlling the number of printing layers of the solder resist ink 4 or the photolithography process, the thickness distribution of the solder resist ink layer 4 is matched with Δh, and finally the consistency between the surface of the photosensitive chip 1 and the field curvature of the lens 2 is achieved.

[0036] Embodiment 3 of the camera module with optimized resolution of this utility model The camera module of this utility model with optimized resolution further includes a rigid-flexible circuit board 3 comprising a rigid circuit board 301 and a flexible circuit board 302 connected to the rigid circuit board 301. The solder resist ink layer 4, the photosensitive chip 1, and the protective shell 203 are all disposed on the rigid circuit board 301. The rigid circuit board 301 has good mechanical strength and stability, and can provide stable support for the solder resist ink layer 4, the photosensitive chip 1, and the protective shell 203, ensuring the positional accuracy and stability of each component. The flexible circuit board 302 can meet the bending requirements of the camera module during installation and use, giving the camera module better adaptability and flexibility, and optimizing the module's resolution.

[0037] Furthermore, a filter 5 is also provided inside the protective housing 203, which is located between the photosensitive chip 1 and the lens 2. The filter 5 can filter out unwanted light and only allow light of specific wavelengths to pass through, thereby reducing stray light interference with imaging and improving the contrast and clarity of the image.

[0038] Furthermore, the protective housing 203 has a step for setting the filter 5, and the filter 5 is attached to the step with optical adhesive. The step can provide accurate positioning for the filter 5, ensuring the positional accuracy of the filter 5. The optical adhesive is firmly attached and has good optical performance, which can ensure the stability of the filter 5, reduce light loss and reflection at the attachment point, and improve imaging quality.

[0039] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A camera module with optimized resolution, characterized in that, include: A rigid-flex circuit board (3) and a photosensitive chip (1) mounted on the rigid-flex circuit board (3). A lens (2) is disposed above the photosensitive chip (1). A solder resist ink layer (4) is disposed in the area of ​​the rigid-flex circuit board (3) where the photosensitive chip (1) is mounted. The solder resist ink layer (4) is located at the center of the side of the photosensitive chip (1) close to the rigid-flex circuit board (3). The solder resist ink layer (4) is used to support the photosensitive chip (1) so that the photosensitive chip (1) presents a curved surface with the center higher than the surrounding area. The curved surface of the photosensitive chip (1) matches the curved surface of the lens (2).

2. The camera module with optimized resolution according to claim 1, characterized in that, The optical distance between the lens (2) and the photosensitive chip (1) is consistent at the center and at the four corners.

3. The camera module with optimized resolution according to claim 1, characterized in that, A protective shell (203) is provided on the rigid-flex circuit board (3). A camera module support (202) is connected to the side of the protective shell (203) away from the rigid-flex circuit board (3), and the photosensitive chip (1) is located inside the protective shell (203).

4. The camera module with optimized resolution according to claim 3, characterized in that, The protective shell (203) is fixed to the camera module support (202) and the rigid-flexible circuit board (3) by double-sided adhesive.

5. The camera module with optimized resolution according to claim 3, characterized in that, The camera module support (202) has a lens barrel (201) in the middle, and the lens (2) is disposed inside the lens barrel (201).

6. The camera module with optimized resolution according to claim 5, characterized in that, The outer surface of the lens barrel (201) and the inner wall of the camera module support (202) are both provided with threads, and the lens barrel (201) and the camera module support (202) are threadedly connected.

7. The camera module with optimized resolution according to claim 1, characterized in that, The solder resist ink layer (4) is formed by solder resist ink.

8. The camera module with optimized resolution according to claim 3, characterized in that, The rigid-flex circuit board (3) includes a rigid circuit board (301) and a flexible circuit board (302) connected to the rigid circuit board (301). The solder resist ink layer (4), the photosensitive chip (1) and the protective shell (203) are all disposed on the rigid circuit board (301).

9. The camera module with optimized resolution according to claim 3, characterized in that, The protective shell (203) is also provided with a filter (5), which is located between the photosensitive chip (1) and the lens (2).

10. The camera module with optimized resolution according to claim 9, characterized in that, The protective shell (203) has a step on which a filter (5) is disposed, and the filter (5) is attached to the step by optical adhesive.

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