earphone

Abstract

This utility model relates to the field of headphone technology and discloses a headphone, which includes: a sound-generating body, an ear cup, a heat-conducting component, and a heat-dissipating component; one end of the body along a first direction forms a sound-generating end, and the sound-generating end is provided with a sound-generating port; the heat-conducting component is a graphene component, which is connected to the sound-generating end and arranged around the sound-generating port, and the part of the heat-conducting component away from the sound-generating port has a first heat exchange surface; the heat-dissipating component is arranged at the edge of the sound-generating end and has a second heat exchange surface in its inner ring, and the wall surface of one side of the heat-dissipating component forms a heat dissipation surface; the ear cup is covered on the sound-generating end and connected to the heat-dissipating component. The heat-conducting component of this utility model has a large area and high heat conduction efficiency. The heat generated when the sound-generating unit is working can be efficiently and quickly conducted to the heat-dissipating component along the direction away from the sound-generating port through the heat-conducting component. The heat-dissipating component can transfer the heat to the outside through its own heat dissipation surface. The heat transfer path inside the headphone is smooth, which can avoid the phenomenon of heat accumulating inside the ear cup due to multiple layers of heat-conducting layers with different thermal conductivity.

Description

Technical Field

[0001] This utility model relates to the field of headphone technology, specifically to headphones. Background Technology

[0002] Over-ear headphones are popular due to their ability to effectively isolate external noise and their comfortable fit. However, after prolonged use, the temperature inside the earcups can rise, causing discomfort such as heat and sweating around the ears, thus affecting the user experience.

[0003] Currently, existing over-ear headphones typically incorporate a heat-conducting structure between the earcup and ear shell components to enhance their heat dissipation capabilities. This structure consists of multiple layers with varying thermal conductivity along its thickness. While this heat dissipation structure effectively dissipates heat, it can also conduct heat from inside the earcup to the space where the user's ear is located. Consequently, prolonged use can lead to heat buildup and poor wearing comfort. Utility Model Content

[0004] In view of this, the present invention provides an earphone to solve the problem of poor heat dissipation effect of the heat dissipation structure of existing earphones.

[0005] In a first aspect, this utility model provides an earphone with a first direction. The earphone includes: a sound-generating body, an ear cup, a heat-conducting component, and a heat-dissipating component. One end of the body along the first direction forms a sound-generating end, and a sound-generating unit is provided inside the body. The sound-generating end has a sound-generating port. The heat-conducting component is a graphene component, which is connected to the sound-generating end and arranged around the sound-generating port. The heat-conducting component extends along a direction away from the sound-generating port, and the portion of the heat-conducting component away from the sound-generating port has a first heat exchange surface. The heat-dissipating component is disposed at the edge of the sound-generating end and extends along the edge of the sound-generating end. The inner ring of the heat-dissipating component has a second heat exchange surface for abutting against the first heat exchange surface, and the wall surface of the heat-dissipating component on the side away from the sound-generating port forms a heat dissipation surface. The ear cup is disposed on the sound-generating end and connected to the heat-dissipating component.

[0006] Beneficial effects: By setting a heat-conducting component around the sound outlet on the sound-producing end and setting a heat sink component in contact with the heat-conducting component at the edge of the sound-producing end, this type of heat-conducting component has a large area and high thermal conductivity. The heat generated when the sound unit is working can be efficiently and quickly conducted to the heat sink component in the direction away from the sound outlet through the heat-conducting component. The heat sink component can transfer the heat to the outside through its own heat dissipation surface. The heat transfer path inside the earphone is smooth, which can avoid the phenomenon that heat is easily accumulated inside the ear cup due to multiple heat-conducting layers with different thermal conductivity. This effectively solves the problem of poor heat dissipation effect of the existing earphone heat dissipation structure.

[0007] In one alternative embodiment, the heat sink has a first connecting structure, the edge of the ear cup has a second connecting structure, and the ear cup is detachably connected to the first connecting structure via the second connecting structure.

[0008] Beneficial effects: The ear tips are detachable and connected to the heat sink, which makes them easy to install and remove. It also avoids the ear tips taking up space on the sound-emitting end, allowing the heat-conducting components to have more space.

[0009] In one alternative embodiment, a slot is provided on the heat dissipation surface, the slot having an opening facing away from the sound outlet, the slot forming a first connection structure, and the edge of the ear cup having a claw bent towards the inner circle, the claw engaging with the slot, the claw forming a second connection structure.

[0010] Beneficial effects: The first and second connection structures are simple and reliable, and can be detached by snap-fit, which facilitates the maintenance and replacement of components. In addition, the heat exchange area of ​​the heat sink and ear cup is large under this connection method, so the heat of the ear cup itself can also be transferred to the heat sink and dissipated efficiently.

[0011] In one optional embodiment, an annular groove is provided at the edge of the outer ring of the sound-emitting end, the opening of the annular groove facing the first direction and away from the sound-emitting port, and the heat sink is detachably disposed in the annular groove.

[0012] Beneficial effects: The annular groove can not only effectively accommodate heat dissipation components, but also play a role in positioning the heat dissipation components.

[0013] In one optional embodiment, the annular groove has a first groove wall extending along a first direction and a second groove wall perpendicular to the first direction; the edge of the heat-conducting element forms a first heat-conducting section, the first heat-conducting section extends along the first direction and covers the first groove wall, the wall surface of the heat-conducting element facing away from the first groove wall forms a first heat exchange surface, and the heat dissipation element is connected to the first groove wall through the first heat-conducting section.

[0014] Beneficial effects: In this combination of heat-conducting and heat-dissipating components, the area of ​​the first heat-conducting section is relatively large, which can effectively improve the heat exchange efficiency between the first heat-conducting section and the heat-dissipating component. In addition, it can make the heat inside the heat-dissipating component transfer efficiently in the direction away from the sound outlet, thus improving the heat dissipation effect.

[0015] In one alternative implementation, the heat sink is interference-fitted with the first heat-conducting section, and the heat sink abuts against the first groove wall through the first heat-conducting section.

[0016] Beneficial effects: No additional fasteners are needed; the fastening effect can be achieved through the structure of the heat sink and the first heat conduction section itself. In addition, the interference fit allows the first and second heat exchange surfaces to fit more tightly, ensuring the heat exchange effect.

[0017] In one optional embodiment, the sound-emitting end is provided with a groove with an opening facing the first direction, the sound-emitting port is disposed in the groove, the groove has a third groove wall extending along the first direction, and a fourth groove wall perpendicular to the first direction and disposed around the sound-emitting port; the heat-conducting component further includes a second heat-conducting section and a third heat-conducting section, the second heat-conducting section extends along the end face of the sound-emitting end, the third heat-conducting section extends along the third groove wall and the fourth groove wall, and the third heat-conducting section is connected to the first heat-conducting section through the second heat-conducting section.

[0018] Beneficial effects: This type of heat-conducting component extends along the structural surface of the sound-generating end, which has little impact on the sound generation effect while effectively increasing its own heat exchange area, ensuring its own heat conduction efficiency, and improving the heat dissipation effect.

[0019] In one optional embodiment, the ear cover includes a cover body and a heat insulation layer. The cover body is connected to a heat dissipation component, and the heat insulation layer is connected to the cover body along a first direction. The heat insulation layer is provided with vent holes.

[0020] Beneficial effects: The heat insulation layer can isolate the heat generated by the sound-generating body 1 during operation, preventing the heat from being quickly transferred to the space where the user's ears are located. In addition, the heat insulation layer is provided with vents, so that when the temperature of the space where the user's ears are located is high, the heat can also be transferred to the space where the heat-conducting component is located through the vents.

[0021] In one alternative embodiment, at least a portion of the insulation layer abuts against the heat-conducting element.

[0022] Beneficial effects: Using this combination, the heat from the insulation layer can be directly transferred to the heat-conducting components, enabling more efficient heat dissipation of the space enclosed by the casing and improving user comfort.

[0023] In one alternative embodiment, the heat sink is an aluminum ring; and / or, the heat-conducting element is bonded to the sound-generating end.

[0024] Beneficial effects: The heat dissipation ring has a simple and reliable structure, is easy to manufacture and lightweight, and the connection method of the heat conduction components is simple, requiring no connectors. Attached Figure Description

[0025] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is an exploded schematic diagram of an earphone according to an embodiment of the present utility model;

[0027] Figure 2 for Figure 1 The diagram shown is a 3D rendering of the headphones in their cut-out state, without the heat insulation layer shown.

[0028] Figure 3 for Figure 2 The image shown is a 3D illustration of the headphones without the ear tips.

[0029] Figure 4 for Figure 2 The headphones shown only display a three-dimensional schematic diagram of the sound-producing body;

[0030] Figure 5 for Figure 1 A three-dimensional schematic diagram of the heat-conducting component of the earphone shown.

[0031] Figure 6 for Figure 1 The image shows a 3D schematic of the headphones without the insulation layer.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1. Sound-generating body; 101. Sound-generating end; 102. Sound-generating unit; 103. Sound-generating port; 104. Annular groove; 1041. First groove wall; 1042. Second groove wall; 105. Groove; 1051. Third groove wall; 1052. Fourth groove wall;

[0034] 2. Thermal conductive components; 201. First thermal conductive section; 2011. First heat exchange surface; 202. Second thermal conductive section; 203. Third thermal conductive section;

[0035] 3. Heat sink; 301. Second heat exchange surface; 302. Heat dissipation surface; 303. First connection structure;

[0036] 4. Ear cover; 401. Cover body; 4011. Second connecting structure; 402. Heat insulation layer;

[0037] X, the first direction. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0039] The following is combined Figures 1 to 6 The following describes embodiments of the present invention.

[0040] According to an embodiment of the present invention, an earphone is provided, having a first direction X. The earphone includes: a sound-generating body 1, an ear cover 4, a heat-conducting component 2, and a heat-dissipating component 3. One end of the body along the first direction X forms a sound-generating end 101, and a sound-generating unit 102 is provided inside the body. A sound-generating port 103 is provided on the sound-generating end 101. The heat-conducting component 2 is a graphene component, connected to the sound-generating end 101 and arranged around the sound-dissipating port 103. The heat-conducting component 2 extends along a direction away from the sound-dissipating port 103, and the portion of the heat-conducting component 2 away from the sound-dissipating port 103 has a first heat exchange surface 2011. The heat-dissipating component 3 is disposed at the edge of the sound-generating end 101 and extends along the edge of the sound-generating end 101. The inner ring of the heat-dissipating component 3 has a second heat exchange surface 301 for abutting against the first heat exchange surface 2011. A heat-dissipating surface 302 is formed on the wall surface of the heat-dissipating component 3 on the side away from the sound-dissipating port 103. The ear cover 4 is covered on the sound-generating end 101 and connected to the heat-dissipating component 3.

[0041] The earphone using this embodiment has a heat-conducting component 2 arranged around the sound-emitting port 103 on the sound-emitting end 101, and a heat sink 3 arranged at the edge of the sound-emitting end 101 in contact with the heat-conducting component 2. This type of heat-conducting component 2 has a large area and high thermal conductivity. The heat generated when the sound-emitting unit 102 is working can be efficiently and quickly conducted to the heat sink 3 in a direction away from the sound-emitting port 103 through the heat-conducting component 2. The heat sink 3 can transfer the heat to the outside through its own heat dissipation surface 302. The heat transfer path inside the earphone is smooth, which can avoid the phenomenon that multiple heat-conducting layers with different thermal conductivity easily accumulate heat inside the ear cup 4, effectively solving the problem of poor heat dissipation effect of the existing earphone heat dissipation structure.

[0042] The first direction refers to Figure 1 The direction of the "X" indicated by the middle arrow.

[0043] In related technologies, the heat-conducting structure consists of multiple layers with different thermal conductivity along the thickness direction. In this type of heat-conducting structure, the heat-conducting layer with lower thermal conductivity is closer to the working component. When the working component of the earphone generates heat, the heat-conducting layer with lower thermal conductivity absorbs heat more slowly and transfers heat more slowly. Furthermore, because the heat-conducting layer with lower thermal conductivity is in close contact with the heat-conducting layer with higher thermal conductivity, the heat-conducting layer with lower thermal conductivity will block the heat exchange surface of the heat-conducting layer with higher thermal conductivity, further reducing the overall heat conduction efficiency of the heat-conducting structure. As a result, the overall heat dissipation effect of the heat-conducting structure is poor, and it is not possible to efficiently and quickly transfer the heat inside the earphone to the outside. Even after long-term use, heat accumulation will still occur.

[0044] Using the headphones of this embodiment, the heat-conducting component 2 is in direct contact with the sound-emitting end 101 and has high heat conduction efficiency. The heat-conducting component 2 with a large heat exchange area can efficiently transfer the heat inside the headphones to the outside, effectively avoiding the problem of heat accumulation inside the headphones.

[0045] In one possible implementation, such as Figure 2 and Figure 3 As shown, the heat sink 3 has a first connecting structure 303, and the edge of the ear sleeve 4 has a second connecting structure 4011. The ear sleeve 4 is detachably connected to the first connecting structure 303 through the second connecting structure 4011. The ear sleeve 4 is detachably connected to the heat sink 3, which facilitates disassembly and assembly, and also avoids the ear sleeve 4 occupying the arrangement space on the sound-emitting end 101, allowing the heat-conducting component 2 to have a larger arrangement space.

[0046] It is understood that, as an alternative implementation, the heat sink 3 and the ear sleeve 4 can also be detachably connected by fastening components such as bolts or connecting pins; the heat sink 3 and the ear sleeve 4 can also be fixedly connected by adhesive, and can be flexibly selected according to requirements.

[0047] The specific form of the first connecting structure 303 and the second connecting structure 4011 is not limited. One of them can be a lockable and unlockable fixing clip, and the other can be a flange or flange structure for cooperating with the fixing clip. Alternatively, one of them can be a claw, and the other can be a slot structure for fixedly cooperating with the claw.

[0048] In one possible implementation, the heat dissipation surface 302 is provided with a slot, which has an opening facing away from the sound outlet 103. The slot forms a first connecting structure 303. The edge of the ear cup 4 has a claw bent towards the inner circle. The claw engages with the slot, forming a second connecting structure 4011. The first connecting structure 303 and the second connecting structure 4011 are simple and reliable. They can be detached by snap-fit, which is convenient for maintenance and replacement of components. In addition, the heat exchange area of ​​the heat dissipation component 3 and the ear cup 4 is large under this connection method. Therefore, the heat of the ear cup 4 itself can also be transferred to the heat dissipation component 3 and dissipated efficiently.

[0049] It is understandable that the earcup 4 has a slot on its edge, while the heat sink 3 has a claw.

[0050] In one possible implementation, such as Figure 2 and Figure 3 As shown, an annular groove 104 is provided at the edge of the outer ring of the sound-emitting end 101. The opening of the annular groove 104 faces the first direction X and the direction away from the sound-emitting port 103. The heat sink 3 is detachably disposed in the annular groove 104. The annular groove 104 can not only effectively accommodate the heat sink 3, but also play a role in positioning the installation position of the heat sink 3.

[0051] Specifically, there is no limitation on the connection method of the heat sink 3. It can be detachably connected to the annular groove 104 by fasteners. Since the heat sink 3 is annular, it can also be engaged with the wall of the annular groove 104 by its own inner ring wall.

[0052] In one possible implementation, such as Figure 3 and Figure 4 As shown, the annular groove 104 has a first groove wall 1041 extending along the first direction X and a second groove wall 1042 perpendicular to the first direction X; the edge of the heat-conducting element 2 forms a first heat-conducting section 201, which extends along the first direction X and covers the first groove wall 1041. The wall surface of the heat-conducting element 2 facing away from the first groove wall 1041 forms a first heat exchange surface 2011. The heat sink 3 is connected to the first groove wall 1041 through the first heat-conducting section 201. In this form of cooperation between the heat-conducting element 2 and the heat sink 3, the area of ​​the first heat-conducting section 201 is relatively large, which can effectively improve the heat exchange efficiency between the first heat-conducting section 201 and the heat sink 3. In addition, it can make the heat inside the heat sink 3 efficiently transferred in a direction away from the sound outlet 103, thereby improving the heat dissipation effect.

[0053] It is understood that, as an alternative implementation, the first heat-conducting section 201 can also extend along a direction perpendicular to the first direction X, and the end face of the heat sink 3 away from the second groove wall 1042 forms the first heat exchange surface 2011, which can also achieve heat transfer.

[0054] In one possible implementation, such as Figure 2 As shown, the heat sink 3 is interference-fitted with the first heat conduction section 201. The heat sink 3 abuts against the first groove wall 1041 through the first heat conduction section 201. No additional fasteners are needed. The fastening effect can be achieved by the structure of the heat sink 3 and the first heat conduction section 201 themselves. In addition, the interference fit can make the first heat exchange surface 2011 and the second heat exchange surface 301 fit more tightly, ensuring the heat exchange effect.

[0055] It is understandable that, as an alternative implementation, the heat sink 3 and the first heat-conducting section 201 can also be fixed by other connection methods such as bonding or fastening components.

[0056] In addition, the heat sink 3 can also be connected to the second groove wall 1042 by means of bonding, fastening components, etc., to further improve the position fixation effect of the heat sink 3.

[0057] In one possible implementation, such as Figures 3 to 5As shown, the sound-emitting end 101 is provided with a groove 105 with an opening facing the first direction X. The sound-emitting port 103 is disposed in the groove 105. The groove 105 has a third groove wall 1051 extending along the first direction X, and a fourth groove wall 1052 disposed perpendicular to the first direction X and surrounding the sound-emitting port 103. The heat-conducting component 2 also includes a second heat-conducting section 202 and a third heat-conducting section 203. The second heat-conducting section 202 extends along the end face of the sound-emitting end 101, and the third heat-conducting section 203 extends along the third groove wall 1051 and the fourth groove wall 1052. The third heat-conducting section 203 is connected to the first heat-conducting section 201 through the second heat-conducting section 202. This type of heat-conducting component 2 extends along the structural surface of the sound-emitting end 101, which has little impact on the sound emission effect, while effectively increasing its own heat exchange area, ensuring its own heat conduction efficiency, and improving the heat dissipation effect.

[0058] Among them, such as Figure 4 As shown, the sound-emitting port 103 refers to the sound-emitting area with a porous structure, and is not strictly limited to a single hole structure.

[0059] In one possible implementation, such as Figure 2 As shown, the ear cover 4 includes a cover body 401 and a heat insulation layer 402. The cover body 401 is connected to the heat dissipation component 3. The heat insulation layer 402 is connected to the cover body 401 along the first direction X. The heat insulation layer 402 is provided with vent holes. The heat insulation layer 402 can isolate the heat generated by the sound-generating body 1 when it is working, and prevent the heat from being quickly transferred to the space where the user's ear is located. In addition, the heat insulation layer 402 is provided with vent holes. When the temperature of the space where the user's ear is located is high, the heat can also be transferred to the space where the heat-conducting component 2 is located through the vent holes.

[0060] In one possible implementation, such as Figure 2 As shown, at least a portion of the heat insulation layer 402 abuts against the heat conductor 2. With this type of engagement, the heat of the heat insulation layer 402 can be directly transferred to the heat conductor 2, which can dissipate heat more efficiently from the space enclosed by the sleeve 401 and improve user comfort.

[0061] Specifically, such as Figure 2 and Figure 5 As shown, since the second heat-conducting section 202 extends along the end face of the sound-emitting end 101, and the second heat-conducting section 202 is closest to the heat insulation layer 402, after the ear cover 4 is assembled, the heat insulation layer 402 is in contact with at least a part of the second heat-conducting section 202. In this form of fit, since the second heat-conducting section 202 is close to the heat sink 3, the heat of the part of the heat insulation layer 402 near the second heat-conducting section 202 can be efficiently transferred outward, thereby improving the heat dissipation effect.

[0062] In one possible implementation, the heat sink 3 is an aluminum ring; the heat conductor 2 is bonded to the sound-emitting end 101. The heat sink ring has a simple and reliable structure, is easy to manufacture and is lightweight. The connection method of the heat conductor 2 is simple and can be connected without the use of connectors.

[0063] It is understandable that, as an alternative implementation method, the heat sink 3 can also be a metal heat-conducting component such as a copper ring or an iron ring, or other types of heat-conducting components such as graphene components, as long as they can meet the heat conduction requirements.

[0064] The heat-conducting component 2 can also be connected to the sound-generating end 101 by means of snap-fit, clamping, bolt connection, etc.

[0065] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. An earphone having a first direction (X), characterized in that, include: The sound-generating body (1), ear covers (4), heat-conducting components (2), and heat dissipation components (3); The main body forms a sound-emitting end (101) at one end along the first direction (X), the main body is provided with a sound-emitting unit (102), and the sound-emitting end (101) is provided with a sound-emitting port (103); The heat-conducting component (2) is a graphene component. The heat-conducting component (2) is connected to the sound-emitting end (101) and arranged around the sound-emitting port (103). The heat-conducting component (2) extends in a direction away from the sound-emitting port (103). The portion of the heat-conducting component (2) away from the sound-emitting port (103) has a first heat exchange surface (2011). The heat sink (3) is disposed at the edge of the sound-emitting end (101) and extends along the edge of the sound-emitting end (101). The inner ring of the heat sink (3) has a second heat exchange surface (301) for abutting against the first heat exchange surface (2011). The wall surface of the heat sink (3) on the side away from the sound-emitting port (103) forms a heat dissipation surface (302). The ear cover (4) is placed over the sound-emitting end (101) and connected to the heat sink (3).

2. The earphone according to claim 1, characterized in that, The heat sink (3) has a first connecting structure (303), and the edge of the ear sleeve (4) has a second connecting structure (4011). The ear sleeve (4) is detachably connected to the first connecting structure (303) through the second connecting structure (4011).

3. The earphone according to claim 2, characterized in that, The heat dissipation surface (302) is provided with a slot, the slot having an opening facing away from the sound outlet (103), the slot forming the first connection structure (303), the edge of the ear cover (4) having a claw bent towards the inner circle, the claw engaging with the slot, the claw forming the second connection structure (4011).

4. The earphone according to any one of claims 1 to 3, characterized in that, The outer edge of the sound-emitting end (101) is provided with an annular groove (104), the opening of the annular groove (104) faces the first direction (X) and away from the sound-emitting port (103), and the heat sink (3) is detachably disposed in the annular groove (104).

5. The earphone according to claim 4, characterized in that, The annular groove (104) has a first groove wall (1041) extending along the first direction (X) and a second groove wall (1042) perpendicular to the first direction (X); The edge of the heat-conducting component (2) forms a first heat-conducting section (201), which extends along the first direction (X) and covers the first groove wall (1041). The wall surface of the heat-conducting component (2) away from the first groove wall (1041) forms the first heat exchange surface (2011). The heat dissipation component (3) is connected to the first groove wall (1041) through the first heat-conducting section (201).

6. The earphone according to claim 5, characterized in that, The heat sink (3) is interference-fitted with the first heat-conducting section (201), and the heat sink (3) abuts against the first groove wall (1041) through the first heat-conducting section (201).

7. The earphone according to claim 5, characterized in that, The sound-emitting end (101) is provided with a groove (105) with an opening facing the first direction (X), and the sound-emitting port (103) is disposed in the groove (105). The groove (105) has a third groove wall (1051) extending along the first direction (X) and a fourth groove wall (1052) disposed perpendicular to the first direction (X) and surrounding the sound-emitting port (103). The heat-conducting component (2) further includes a second heat-conducting section (202) and a third heat-conducting section (203). The second heat-conducting section (202) extends along the end face of the sound-emitting end (101), and the third heat-conducting section (203) extends along the third groove wall (1051) and the fourth groove wall (1052). The third heat-conducting section (203) is connected to the first heat-conducting section (201) through the second heat-conducting section (202).

8. The earphone according to any one of claims 1 to 3, characterized in that, The ear cover (4) includes a cover body (401) and a heat insulation layer (402). The cover body (401) is connected to the heat dissipation component (3). The heat insulation layer (402) is connected to the cover body (401) along the first direction (X). The heat insulation layer (402) is provided with ventilation holes.

9. The earphone according to claim 8, characterized in that, At least a portion of the heat insulation layer (402) abuts against the heat-conducting element (2).

10. The earphone according to any one of claims 1 to 3, characterized in that, The heat sink (3) is an aluminum ring; And / or, the heat-conducting element (2) is bonded to the sound-generating end (101).

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