A heating assembly capable of equalizing temperature in a heat generating region

Abstract

The utility model relates to electric heating technical field, concretely is a kind of heating assembly that can equalize heating area temperature, including base body, the heating surface e of base body is attached with conductive heating layer, the heating surface e of base body is provided with the heat conduction member for contacting the conductive heating layer conduction heat quantity.The utility model is attached with the heat conduction member for conduction heat quantity on the side of base body conductive heating layer, utilize the good heat conduction performance of heat conduction member to compensate or equalize the heating temperature of base body surface, so that the heating temperature of base body surface is more uniform, avoid the different temperature zone of heating area, further improve heating efficiency and heating quality, heated article can be heated evenly, facilitate user use.

Description

Technical Field

[0001] This utility model relates to the field of electric heating technology, specifically a heating component that can balance the temperature of the heating zone. Background Technology

[0002] In daily life, electric stoves, far-infrared stoves, tea stoves, grills, multi-functional cookers, rice cookers, electric saucepans, electric stew pots, electric medicine pots, electric kettles, and other household electric heating products, as well as commercial and industrial electric heating products that require uniform heating surface temperature, are all common electric heating appliances with various functions and uses. Electric heating devices are usually used when heating, and there is a wide variety of electric heating equipment on the market. Common electric heating equipment generally has a heating source for heating (such as a kettle heating base) and a heated object (such as a kettle containing water) for heating. It is very convenient to use for instant heating. However, in actual use, when the bottom of the heated object is uneven or the heating area is locally loaded, the temperature of the contact part of the loaded heating area will drop faster than that of the unloaded heating area, resulting in different temperature zones in the heating area. Even with multiple temperature sensors, it is impossible to accurately detect the temperature of different heating areas of the heating element or to evenly heat the heating area. This temperature difference within the heating area is not conducive to temperature control of the heating area of ​​the heating element, affecting heating efficiency and easily causing damage to the heated object.

[0003] To address the above shortcomings, we need to develop a heating component that can balance the temperature of the heating zone to meet the needs of a wide range of users. Utility Model Content

[0004] Regarding the aforementioned problem that existing electric heating equipment causes uneven temperature zones in the heating area when subjected to localized load, affecting heating efficiency and heating quality, the technical solution adopted by this utility model to solve this problem is:

[0005] A heating component capable of balancing the temperature of a heating zone includes a substrate, wherein a conductive heating layer is attached to the heating surface e of the substrate, and a heat-conducting element is provided on the heating surface e of the substrate for contacting the conductive heating layer to conduct heat.

[0006] The heating assembly described above, which can balance the temperature of the heating zone, further includes a temperature control probe for temperature control, wherein the probe end of the temperature control probe contacts the surface of the heat-conducting component.

[0007] As described above, a heating assembly that can balance the temperature of the heating zone has a heat insulation component installed on the outside of the heat conductor to prevent heat loss, and the heat insulation component has a mounting cavity for accommodating the heat conductor.

[0008] As described above, a heating component that can balance the temperature of the heating zone has a heat insulation component with a first detection hole through which the temperature control detection component passes. The temperature control detection component can be one of an NTC temperature sensor, a thermocouple sensor, a PTD temperature sensor, an infrared temperature sensor, or a semiconductor temperature sensor.

[0009] As described above, a heating assembly capable of balancing the temperature of a heating zone includes a first temperature control detector for detecting the heat-conducting component and a second temperature control detector for detecting the heated object. The second temperature control detector passes through the heat insulation component, the heat-conducting component, and the substrate, and extends to the supporting surface f of the substrate.

[0010] As described above, in a heating component that can balance the temperature of the heating zone, an insulating component or an insulating coating is further provided between the heat-conducting component and the conductive heating layer.

[0011] As described above, in a heating component that can balance the temperature of the heating zone, the conductive heating layer is attached to a substrate with a planar or curved structure, and the substrate is made of a brittle material.

[0012] In the heating assembly described above that can balance the temperature of the heating zone, the conductive heating layer is located within the area where the heat-conducting element contacts the substrate, or the maximum area c of the conductive heating layer is less than or equal to the contact area b of the heat-conducting element contacting the substrate.

[0013] As described above, a heating component capable of balancing the temperature of the heating zone includes a substrate with a conductive protective layer located in the area between the outer edge of the substrate and the outer edge of the conductive heating layer. The conductive protective layer and the conductive heating layer are spaced apart. The conductive protective layer is electrically connected to an external electrical control device for triggering power-off protection to form a power-on circuit. When the substrate is damaged, the conductive protective layer disconnects, causing the power-on circuit to break and triggering power-off protection.

[0014] As described above, in a heating component that can balance the temperature of the heating zone, the conductive heating layer is formed into a planar heating layer structure using one of the following materials: nano-metal oxide, nano-semiconductor oxide, graphene, or carbon paste.

[0015] The beneficial effects of this utility model are as follows:

[0016] 1. This utility model has a heat-conducting component installed on one side of the substrate with a conductive heating layer attached, which is used to conduct heat. The good thermal conductivity of the heat-conducting component is used to compensate or balance the heating temperature of the substrate surface, so that the heating temperature of the substrate surface is more uniform, avoiding different temperature zones in the heating area, further improving heating efficiency and heating quality, and the heated object can be heated evenly, which is convenient for users.

[0017] 2. Furthermore, this utility model has a heat insulation component installed on the outside of the heat-conducting component to block heat loss. This component can block and retain the heat of the conductive heating layer in the heat insulation cavity, thereby reducing the heat loss efficiency of the conductive heating layer. After the heat loss is blocked, the heat can be better concentrated at the heating position of the substrate. By blocking the heat loss through the heat insulation component, the heating effect can be further improved, thereby increasing the heating efficiency of the conductive heating layer. At the same time, it can also reduce the impact of heat loss on the placement environment.

[0018] 3. Furthermore, this utility model has a temperature control probe installed on the substrate for real-time detection and control of the temperature of the conductive heating layer. The temperature control probe can pass through the heat insulation component and directly contact the heat conductor, reducing detection errors. Corresponding through-hole structures are opened in the heat insulation component, making the structure more compact. On this basis, at least two types of temperature control probes can be used to monitor the heating temperature conducted to the heat conductor, further ensuring the accuracy of the detected heating temperature. It can also avoid the failure of a single temperature control probe affecting actual use. At the same time, it can also pass through the heat insulation component and the heat conductor to detect the bottom temperature of the heated body, ensuring the required temperature of the heated body and facilitating user use.

[0019] 4. Furthermore, the substrate of this utility model can be made of brittle material, which can more easily break and simultaneously disconnect the conductive protective layer when a danger occurs. The triggering method of immediately disconnecting once broken makes the power-off protection response faster. At the same time, the thermal expansion coefficient of brittle material is usually low, which can play a protective effect against overheating damage when applied to heating. It also has a stable structure that does not easily bend or deform, making it convenient for users to use. Attached Figure Description

[0020] Figure 1 This is a perspective view of a heating component of the present invention that can balance the temperature of the heating zone.

[0021] Figure 2 This is a second perspective view of a heating component of the present invention that can balance the temperature of the heating zone.

[0022] Figure 3 This is the third exploded perspective view of a heating component of the present invention that can balance the temperature of the heating zone.

[0023] Figure 4 This is the fourth exploded perspective view of a heating component of the present invention that can balance the temperature of the heating zone.

[0024] Figure 5 This is the fifth exploded perspective view of a heating component of the present invention that can balance the temperature of the heating zone.

[0025] Figure 6This is the sixth exploded perspective view of a heating component of the present invention that can balance the temperature of the heating zone. Detailed Implementation

[0026] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0027] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0028] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0029] Example 1

[0030] Figures 1 to 3 A heating assembly capable of balancing the temperature of a heating zone is shown, comprising a substrate 11, a conductive heating layer 12 attached to the heating surface e of the substrate 11, and a heat-conducting element 3 mounted on the heating surface e of the substrate 11 for contacting the conductive heating layer 12 to conduct heat.

[0031] Specifically, in this embodiment, the heating assembly includes an assembly housing 100 for mounting the base 11 and the heat-conducting element 3. The base 11 is mounted on the top of the assembly housing 100 for supporting and contacting the heated object. The base 11 has a heating surface e for attaching the conductive heating layer 12 and a supporting surface f for contacting the heated object. The supporting surface f is located on the side of the base 11 near the top. When energized, the heating surface e can generate heat and conduct the heat through the base 11 to the supporting surface f, thereby raising the temperature of the heated object.

[0032] In use, the object to be heated is placed on the supporting surface f of the substrate 11. After the conductive heating layer 12 of the substrate 11 is connected to the power supply, it begins to heat up. Part of the heat is conducted from the conductive heating layer 12 toward the object to be heated on the supporting surface f, and the other part of the heat is conducted from the conductive heating layer 12 toward the heat-conducting component 3 on the side of the heating surface e. After being heated, the heat-conducting component 3 diffuses the heat to the position where it contacts the substrate 11. When the heat diffuses beyond the range of the conductive heating layer 12, it can achieve the effect of equalizing the temperature of the heating area in the position of the substrate 11 where the conductive heating layer 12 is not attached. This allows the position of the substrate 11 where the conductive heating layer 12 is not attached to be heated, avoiding different temperature zones between the position of the substrate 11 where the conductive heating layer 12 is attached and the position of the substrate 11 where the conductive heating layer 12 is attached. This further improves the heating efficiency and heating quality, and the object to be heated can be heated evenly, making it convenient for users to use.

[0033] Furthermore, in some embodiments, Figures 3 to 4 Another heating component that can balance the temperature of the heating zone is shown. The base 11 can adopt a disc-shaped flat plate structure, which is suitable for heating some rotating structures (such as kettles, cups, tea sets, pots, etc.).

[0034] Furthermore, in some embodiments, Figure 2 and Figure 6 This invention illustrates another heating component that can balance the temperature of the heating zone. The base 11 can adopt a rectangular flat plate structure, which is suitable for heating some square or rectangular structures to meet the heating needs of products with different shapes and structures.

[0035] Furthermore, in some embodiments, the conductive heating layer 12 is located within the area of ​​the heat-conducting element 3 in contact with the substrate 11, or the maximum arrangement area c of the conductive heating layer 12 is less than or equal to the contact area b of the heat-conducting element 3 in contact with the substrate 11. When the contact area b of the heat-conducting element 3 in contact with the substrate 11 is greater than or equal to the maximum arrangement area c of the conductive heating layer 12, the temperature range of the heat-conducting element 3's balanced heating zone can cover most of the area of ​​the contact substrate 11, resulting in a better effect of balanced heat distribution.

[0036] Furthermore, in some embodiments, to address the potential electrical conductivity of certain materials used in the heat-conducting component, an insulating component 5 or an insulating coating is provided between the heat-conducting component 3 and the conductive heating layer 12 to prevent the heat-conducting component 3 from affecting the use of the conductive heating layer 12. The insulating component 5 is preferably made of one or more inorganic materials such as mica sheets, oxides, nitrides, glass, ceramics, and silicates. The insulating coating is preferably composed of one or more inorganic materials such as mica sheets, oxides, nitrides, glass, ceramics, and silicates.

[0037] Example 2

[0038] In this embodiment, the substrate 11 can adopt a planar structure or a curved structure to attach the conductive heating layer 12 to adapt to different product structures. The conductive heating layer 12 is a heating material attached to the surface of the substrate 11 to generate heat after being energized. The heating material can be attached to the surface of the substrate 11 by one of the following methods: physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), magnetron sputtering, etc. The area where the heating material is attached is the heating area. In addition, the substrate 11 can be made of one of the following brittle materials: glass, ceramic, stone, plastic, etc. Preferably, the substrate 11 is made of glass or ceramic. Glass or ceramic has the characteristic of being brittle and can be broken by external force. After the conductive protective layer is broken, the power-on circuit is broken, which is more likely to trigger the power-off protection. Glass has good light transmittance and aesthetics, and its appearance is more attractive when applied to the product. Glass or ceramic has good resistance to most chemical substances, is not easily corroded, and has high hardness. It will not be easily worn after long-term use. Glass or ceramic has a low coefficient of thermal expansion at high temperatures and is not easily expanded or deformed.

[0039] Optionally, in some embodiments, the substrate 11 may be made of one of the microcrystalline materials such as microcrystalline glass or microcrystalline ceramic. Preferably, the substrate 11 is made of microcrystalline glass as the main preparation material. At high temperatures, electrostatic ions will appear on the surface of the microcrystalline glass. When the temperature of the microcrystalline glass exceeds a certain temperature, the microcrystalline glass may have conductive properties, which can be discharged through the grounded conductive protective layer 13.

[0040] Example 3

[0041] The heating assembly in this embodiment also includes a temperature control probe 4 for temperature control. The temperature control probe 4 is installed on the assembly housing 100 and its probe end contacts the surface of the heat-conducting element 3. The temperature control probe 4 is electrically connected to the circuit connection between the conductive heating layer 12 and the power supply. Through the direct contact of the temperature control probe 4 with the heat-conducting element 3, the temperature rise of the heat-conducting element 3 is detected in real time, so as to control the temperature rise of the conductive heating layer 12 by adjusting the circuit.

[0042] Furthermore, in some embodiments, the temperature detection element 4 may be one of an NTC temperature sensor, a thermocouple sensor, a PTD temperature sensor, an infrared temperature sensor, or a semiconductor temperature sensor.

[0043] Furthermore, in some embodiments, at least two temperature control detectors 4 can be used to detect the surface of the heat-conducting component 3, which further ensures the accuracy of the detected heating temperature and can also avoid the failure of a single temperature control detector 4, thus affecting actual use and making it convenient for users.

[0044] Furthermore, in some embodiments, the temperature control detector 4 includes a first temperature control detector for detecting the heat-conducting component 3 and a second temperature control detector for detecting the heated object. The second temperature control detector passes through the heat insulation component 2, the heat-conducting component 3, and the substrate 11 and extends to the supporting surface f of the substrate 11. At least two temperature control detectors can be used to monitor the heat-conducting component 3 and the heated object respectively, which further ensures the accuracy of the detected heating temperature and can also avoid the failure of a single temperature control detector affecting actual use. At the same time, it can also pass through the heat insulation component and the heat-conducting component to detect the bottom temperature of the heated body, ensuring the required temperature of the heated body and facilitating user use.

[0045] Example 4

[0046] In this embodiment, a heat insulation component 2 is installed on the outside of the heat-conducting component 3 to prevent heat loss. The heat insulation component 2 has a heat-insulating cavity 23 for accommodating the heat-conducting component 3. When heating, the heat emitted by the conductive heating layer 12 is blocked by the heat insulation component 2, and the heat is retained in the sealed space between the substrate 11 and the heat insulation component 2. After being absorbed by the heat-conducting component 3, this heat is transferred to the contact area of ​​the heat-conducting component 3 covering the substrate 11, compensating the temperature of the area outside the heating area of ​​the substrate 11 or the load contact area, so that the entire substrate 11 can obtain a uniform heating temperature, balance the overall temperature rise, and achieve the effect of uniform heating and uniform heat distribution.

[0047] Furthermore, in some embodiments, the heat insulation member 2 has a first detection hole 21 and a second detection hole 22 for the temperature control detection member 4 to pass through, so as to accommodate different temperature control detection members 4 passing through the heat insulation member 2 to contact the surface of the heat-conducting member 3, or to allow the temperature control detection member 4 to pass through the heat insulation member 2 to contact the heated object.

[0048] Example 5

[0049] The substrate 11 in this embodiment also has a conductive protective layer 13. The conductive protective layer 13 is located in the area between the outer edge of the substrate 11 and the outer edge of the conductive heating layer 12. The conductive material of the conductive protective layer 13 can be attached to the surface of the substrate 11 by one of the following methods: physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), magnetron sputtering, etc. The area where the conductive material is attached is the conductive area. On this basis, the heating area and the conductive area are not connected or overlapped, and they are independent of each other. The conductive area surrounds the outer space of the heating area. The conductive protective layer 13 and the conductive heating layer 12 are spaced apart. The conductive protective layer 13 is electrically connected to an external electrical control device used to trigger power-off protection to form a power-on circuit. When the substrate 11 is damaged, the conductive protective layer 13 is disconnected, causing the power-on circuit to be disconnected and triggering power-off protection.

[0050] In use, the heating area of ​​the conductive heating layer 12 can be electrically connected to an external power supply (mains power or power supply equipment) to conduct electricity and generate heat. The conductive area of ​​the conductive heating layer 12 can be electrically connected to an external electrical control device used to trigger power-off protection to form a power circuit. Since the conductive material is attached to the surface of the substrate 11, the external electrical control device can detect the integrity of the power circuit in real time to determine whether the substrate 11 has been damaged or broken. When the substrate 11 is intact, the power circuit is conductive and is in normal use. When the substrate 11 is damaged or broken, the conductive area is simultaneously disconnected due to the damage to the substrate 11, causing the power circuit to be disconnected, which can be judged as an abnormal use state. Since the conductive material is formed on the substrate 11 by means of coating, adhesion, screen printing or physical vapor deposition, the conductive material itself does not have toughness and ductility. Therefore, when the substrate 11 is damaged or broken and affects the normal heating of the conductive heating layer 12, the damaged or broken part will inevitably pass through the conductive area surrounding the heating area before entering the heating area and damaging the heating material. On this basis, the substrate 11 is preferably made of a brittle material so that it can break more thoroughly when broken to ensure that the conductive material is disconnected. Therefore, when the substrate 11 is damaged or broken, the conductive material's attachment layer is broken. The breakage of the conductive material's attachment layer also means that the power circuit is broken. The power circuit is broken, which can immediately trigger the power-off protection mechanism of the external electrical control equipment, disconnect the circuit connecting the conductive heating layer 12 to avoid the risk of leakage. This achieves a power-off protection effect with fast response speed and high protection efficiency.

[0051] More specifically, the conductive protective layer 13 is a conductive material attachment path formed on the substrate 11 circumferentially around the heating area by means of coating, film or adhesive adhesion. The conductive protective layer 13 adopts an open ring structure and the thickness of the conductive protective layer 13 is less than 1 mm. One end of the conductive protective layer 13 has a first endpoint and the other end has a second endpoint. The first endpoint and the second endpoint are both connection terminals for connecting the conductive protective layer 13 to external electrical control equipment. After connecting to the external electrical control equipment, the first endpoint, the conductive protective layer 13, the second endpoint and the external electrical control equipment form a power circuit. When the conductive protective layer 13 is disconnected due to damage or breakage of the substrate 11, the power circuit will be broken. After the circuit is broken, the power-off protection mechanism of the external electrical control equipment can be triggered.

[0052] Optionally, in some embodiments, the conductive layer of the conductive protective layer 13 can be made of one of the following materials with good conductivity: gold, silver, copper, aluminum, tin, etc. Preferably, the conductive layer is laid with silver paste made of silver material. Silver paste has high conductivity, can effectively conduct current, reduce power loss, and silver paste is easy to form on the surface of the substrate 11, which is convenient for processing and production.

[0053] Example 6

[0054] In this embodiment, the conductive heating layer 12 is formed into a planar heating layer structure using one of the following materials: nano-metal oxide, nano-semiconductor metal oxide, graphene, carbon paste, etc. Preferably, the conductive heating layer 12 uses nano-semiconductor metal oxide as the conductive heating material, and the thickness of the conductive heating layer 12 is less than 1 mm. The nano-semiconductor metal oxide can be one of the following materials or a combination of multiple materials such as tin, antimony, nickel, and ammonium as nanoparticles. During fabrication, the nano-semiconductor metal oxide can be attached to the heating surface e of the substrate 11 by physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), magnetron sputtering, etc., and a fixed heating area is formed after high-temperature sintering.

[0055] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A heating component capable of balancing the temperature of a heating zone, comprising a substrate (11), characterized in that: The heating surface e of the substrate (11) is attached with a conductive heating layer (12), and the heating surface e of the substrate (11) is provided with a heat-conducting element (3) for contacting the conductive heating layer (12) to conduct heat.

2. The heating component capable of balancing the temperature of the heating zone according to claim 1, characterized in that: It also includes a temperature control probe (4) for temperature control, the probe end of which contacts the surface of the heat-conducting element (3).

3. A heating component capable of balancing the temperature of the heating zone according to claim 2, characterized in that: The heat-conducting element (3) is fitted with a heat-insulating element (2) on its outer side to prevent heat loss. The heat-insulating element (2) has a heat-insulating cavity (23) for accommodating the heat-conducting element (3).

4. A heating component capable of balancing the temperature of the heating zone according to claim 3, characterized in that: The heat insulation component (2) has a first detection hole (21) through which the temperature control detection component (4) passes. The temperature control detection component (4) can be one of an NTC temperature sensor, a thermocouple sensor, a PTD temperature sensor, an infrared temperature sensor, or a semiconductor temperature sensor.

5. A heating component capable of balancing the temperature of the heating zone according to claim 3, characterized in that: The temperature control detector (4) includes a first temperature control detector for detecting the heat-conducting component (3) and a second temperature control detector for detecting the heated object. The second temperature control detector passes through the heat insulation component (2), the heat-conducting component (3), and the substrate (11) and extends to the support surface f of the substrate (11).

6. A heating component capable of balancing the temperature of the heating zone according to claim 1, characterized in that: An insulating component (5) or an insulating coating is also provided between the heat-conducting component (3) and the conductive heating layer (12).

7. A heating component capable of balancing the temperature of the heating zone according to claim 1, characterized in that: The substrate (11) is attached to the conductive heating layer (12) in a planar or curved structure, and the substrate (11) is made of a brittle material.

8. A heating component capable of balancing the temperature of the heating zone according to claim 1, characterized in that: The conductive heating layer (12) is located within the area where the heat-conducting element (3) contacts the substrate (11), or the maximum area c of the conductive heating layer (12) is less than or equal to the contact area b of the heat-conducting element (3) in contact with the substrate (11).

9. A heating component capable of balancing the temperature of the heating zone according to claim 1, characterized in that: The substrate (11) also has a conductive protective layer (13), which is located in the area between the outer edge of the substrate (11) and the outer edge of the conductive heating layer (12). The conductive protective layer (13) and the conductive heating layer (12) are spaced apart. The conductive protective layer (13) is electrically connected to an external electrical control device for triggering power-off protection to form a power-on circuit. When the substrate (11) is damaged, the conductive protective layer (13) is disconnected, causing the power-on circuit to be disconnected and triggering power-off protection.

10. A heating component capable of balancing the temperature of the heating zone according to any one of claims 1-9, characterized in that: The conductive heating layer (12) is formed into a planar heating layer structure using one of the following materials: nano metal oxide, nano semiconductor metal oxide, graphene material, and carbon paste material.

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