A board card with ES chip based on AFDX aviation bus

Abstract

The utility model relates to the technical field of avionics communication system, especially with ES chip's board card based on AFDX aviation bus, including substrate, circuit, installation area. Through the composite use of two kinds of materials on the substrate, make the substrate in easy etching still guaranteed enough high strength, for high speed signal circuit line width and spacing increase to 1.5 times, promote high frequency signal integrity, upper end sealing strip and lower end edge sealing form double barrier, protection level reaches high, metal sheet and frame laser welding, realize airtightness protection, be applicable to corrosion environment. The scheme realizes the all -round upgrade of avionics equipment in signal integrity, mechanical strength, environmental tolerance and maintenance efficiency through material innovation, circuit optimization and sub -area protection strategy, significantly reduces the failure rate, prolongs the service period, is applicable to airborne computer, avionics control system and other key fields.

Description

Technical Field

[0001] This utility model relates to the field of avionics communication system technology, and in particular to a board card with an ES chip based on the AFDX avionics bus. Background Technology

[0002] "Board card" is a rather abstract term, and it's not necessary to strictly define its exact meaning or give it a rigorous definition. Generally, it refers to any PCB module that connects to a PC and performs specific functions such as communication and data exchange. Examples include data acquisition cards, motion control cards, and video acquisition cards.

[0003] Chinese Patent Publication No. CN216775108U discloses a circuit board, including a main circuit board and a capacitor circuit board. The main circuit board includes a capacitor arrangement area, and the capacitor circuit board is disposed in the capacitor arrangement area. At least one capacitor is formed in the capacitor circuit board, and at least one of the at least one capacitors is coupled to the main circuit board. The capacitor circuit board includes at least one capacitor structure layer. Each capacitor structure layer includes a first electrode layer, a first insulating layer, and a second electrode layer stacked sequentially. At least one of the at least one capacitors is located in a corresponding capacitor structure layer and includes a first electrode located in the first electrode layer of the corresponding capacitor structure layer and a second electrode located in the second electrode layer of the corresponding capacitor structure layer.

[0004] Therefore, the aforementioned board has the following problems:

[0005] Because aerospace equipment experiences greater vibrations and significant changes in air pressure during operation, more stringent protective measures are required; otherwise, it can easily lead to chip corrosion. Utility Model Content

[0006] Therefore, this utility model provides a board with an ES chip based on the AFDX aviation bus to overcome the problem of chip corrosion in the prior art.

[0007] To achieve the above objectives, this utility model provides a board with an ES chip based on the AFDX avionics bus, comprising:

[0008] This embodiment provides a board with an ES chip based on the AFDX avionics bus, including,

[0009] Electronic components are chips used to perform various computing tasks;

[0010] The substrate, which is a flat plate made of insulating material, serves as the carrier of the electronic components;

[0011] The circuit is formed on the substrate through an etching process, serving as a path for the transmission of control signals;

[0012] The mounting area is set on the substrate and has different areas according to the size of the electronic components to be mounted. It includes an exposed area for mounting large electronic components on the substrate and a closed area for mounting groups of electronic components on the substrate. The group of electronic components is a whole composed of several electronic components whose length or width is smaller than the standard size. The large electronic component is an electronic component whose length and width are both larger than the standard size.

[0013] A nested protective sleeve, which is disposed around the exposed electronic components, includes an upper end of the nested protective sleeve with a hollow structure, a middle section of the nested protective sleeve that is attached to the side of the electronic components, and a lower end of the nested protective sleeve that is connected to the substrate.

[0014] A protective enclosure, disposed around the electronic components in the closed area, includes a lower end of the protective enclosure covering the surface of the electronic components, a middle portion of the protective enclosure adhering to the side of the electronic components, and a lower end of the protective enclosure connected to the substrate.

[0015] Furthermore, the substrate is divided into an upper substrate disposed on the upper layer and a lower substrate disposed on the lower layer;

[0016] The upper substrate is made of an insulating material that is easy to etch;

[0017] The lower layer is made of a material with higher hardness and heat dissipation than the upper substrate.

[0018] The lower surface of the upper substrate is bonded to the upper surface of the lower substrate using an adhesive.

[0019] Furthermore, the circuit is etched using a corrosion-resistant material and disposed on the upper substrate;

[0020] The circuits are classified into ordinary signal circuits or high-speed signal circuits according to the speed at which they transmit information.

[0021] The width of the ordinary signal circuit and the minimum spacing between the two circuits are selected according to the standards of aviation circuits.

[0022] The high-speed signal circuit has a width that is several times that of the ordinary circuit, and the minimum arrangement spacing is several times that of the ordinary circuit.

[0023] Furthermore, the different mounting areas are distributed on the surface of the substrate, and their interiors are provided with pins that can be connected to the corresponding electronic components;

[0024] One end of the pin is connected to the circuit, and the other end is connected to the electronic component.

[0025] Furthermore, the nested protective sleeve is made of rubber material and is integrally molded, and is nested on the electronic components in the exposed area.

[0026] Furthermore, the upper end of the nested protective sleeve, which is an extension of the middle section of the nested protective sleeve, is provided with an upper sealing strip on the edge. The upper end of the nested protective sleeve covers the upper surface of the exposed electronic component, and the coverage range extends inward along the upper surface border until the pin can be wrapped.

[0027] The middle section of the nested protective sleeve is a wraparound structure that is nested around the exposed electronic components and connected to the other parts of the nested protective sleeve.

[0028] The lower end of the nested protective sleeve is an extension of the middle section of the nested protective sleeve, which is an outward folded edge. The folded edge is provided with fixing holes and a lower sealing strip, and is connected to the substrate through the fixing holes and the lower sealing strip.

[0029] Furthermore, the encapsulated protective shell is made of metal material and is integrally molded to cover the electronic component assembly in the closed area.

[0030] Furthermore, the upper part of the enclosed protective shell is a thin metal plate that can fit into the square frame formed by the middle section of the enclosed protective shell.

[0031] The middle section of the enclosed protective case is a wraparound structure nested around the electronic component group on the circuit board, used to connect to other parts of the protective case;

[0032] The lower end of the enclosed protective shell is an extended flange that connects to the lower part of the middle section of the enclosed protective shell. The flange is provided with fixing holes and a lower sealing strip, and is connected to the substrate through the fixing holes and the lower sealing strip.

[0033] Furthermore, the fixing holes are provided on two opposing extended edges of the nested protective sleeve or the enclosing protective shell that do not contact the circuit.

[0034] Furthermore, the lower sealing strip is disposed on the two opposing extended edges of the nested protective sleeve, or the enclosed protective shell, that contact the circuit.

[0035] Compared with the prior art, the beneficial effect of this utility model is that by using two materials in combination on the substrate, the substrate is easy to etch while ensuring sufficient strength, extending the service life of the substrate, and making the substrate suitable for aviation sites with high vibration intensity and harsh working conditions.

[0036] Furthermore, by differentiating between high-speed and ordinary circuits, different signal transmission requirements can be addressed. Ordinary circuits are chosen to save space when requirements are low, while high-speed circuits are selected when requirements are high, appropriately increasing line width and spacing. As line width and spacing increase, the electromagnetic coupling strength between adjacent signal lines weakens. This is because increased spacing keeps the electric and magnetic field distributions between signal lines relatively far apart, reducing overlap and thus lowering the possibility of crosstalk. This effectively reduces interference between different signals, enabling more accurate signal transmission and improving signal quality and reliability.

[0037] Furthermore, the nested protective sleeve is made of rubber, which is highly elastic, has a wide temperature resistance range, absorbs shocks, and can adapt to sudden temperature changes in aviation. The hollow design at the upper end of the protective sleeve maximizes the heat dissipation efficiency of the chip. The upper sealing strip and the lower folded edge seal form a double barrier, blocking moisture and salt spray corrosion, achieving a high level of protection.

[0038] Furthermore, the metal casing of the encapsulated protective shell provides shielding, suppressing the impact of high-frequency interference on sensitive component groups. The thin metal sheet is laser-welded to the frame, and combined with conductive gaskets, achieves airtight protection, suitable for corrosive environments. The metal casing serves as a heat dissipation channel, using thermally conductive adhesive to conduct heat from the components to the substrate or external heat sink, preventing overheating failure.

[0039] Furthermore, the nested protective sleeve, or the encasing protective shell, is fixedly connected by bolts to ensure the stability of the connection. The sealing strip provides a non-fixed connection to ensure the sealing of the sides with circuits on both sides. The sealing strip provides a buffer for the contact between the protective sleeve or protective shell and the circuit, ensuring that the circuit will not be damaged during vibration. Attached Figure Description

[0040] Figure 1 This is a schematic diagram of the overall structure of the board with an ES chip based on the AFDX aviation bus described in this embodiment;

[0041] Figure 2 This is a cross-sectional view of the nested protective sleeve described in this embodiment;

[0042] Figure 3 This is a side view of the nested protective sleeve described in this embodiment;

[0043] Figure 4 This is a cross-sectional view of the encapsulated protective shell described in this embodiment;

[0044] Figure 5 This is a top view of the protective shell described in this embodiment;

[0045] Figure 6 This is a schematic diagram of the circuit described in this embodiment. Detailed Implementation

[0046] To make the objectives and advantages of this utility model clearer, the utility model will be further described below with reference to the embodiments; it should be understood that the specific embodiments described herein are only for explaining this utility model and are not intended to limit this utility model.

[0047] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0048] It should be noted that in the description of this utility model, the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the direction or positional relationship are based on the direction or positional relationship shown in the drawings. This is only for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this utility model.

[0049] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0050] Please see Figure 1-6 As shown, Figure 1 This is a schematic diagram of the overall structure of the board with an ES chip based on the AFDX aviation bus described in this embodiment; Figure 2 This is a cross-sectional view of the nested protective sleeve described in this embodiment; Figure 3 This is a side view of the nested protective sleeve described in this embodiment; Figure 4 This is a cross-sectional view of the encapsulated protective shell described in this embodiment; Figure 5 This is a top view of the protective shell described in this embodiment; Figure 6 This is a schematic diagram of the circuit described in this embodiment.

[0051] This utility model provides a board card with an ES chip based on the AFDX avionics bus, including,

[0052] Electronic components are chips used to perform various computing tasks;

[0053] Substrate 3, which is a flat plate made of insulating material, serves as the carrier of the electronic components;

[0054] Circuit 4 is formed on the substrate 3 by etching process and serves as a path for control signal transmission;

[0055] The mounting area is set on the substrate 3 and has different areas according to the size of the electronic components to be mounted. It includes an exposed area where large electronic components are mounted on the substrate 3 and a closed area where groups of electronic components are mounted on the substrate 3. The group of electronic components is a whole composed of several electronic components whose length or width is smaller than the standard size. The large electronic components are electronic components whose length and width are both larger than the standard size.

[0056] In this embodiment, several exposure areas are concentrated Figure 1 The area within the box labeled T on the left represents the exposed area for each chip in this embodiment. Figure 1 The area within the box labeled L on the right, which is a large integrated chip composed of several small chips, is a closed area, and the ES chip is located in the leakage area.

[0057] In this embodiment, the standard dimensions are 20mm in length and 20mm in width.

[0058] Nested protective sleeve 1, which is disposed around the electronic components in the exposed area, includes an upper end 11 of the nested protective sleeve with a hollow structure, a middle section 12 of the nested protective sleeve that is attached to the side of the electronic components, and a lower end 13 of the nested protective sleeve that is connected to the substrate 3.

[0059] The encapsulated protective shell 2 is disposed around the electronic components in the closed area, and includes an upper end 21 of the encapsulated protective shell covering the surface of the electronic components, a middle section 22 of the encapsulated protective shell attached to the side of the electronic components, and a lower end 23 of the encapsulated protective shell connected to the substrate 3.

[0060] Specifically, the substrate 3 is divided into an upper substrate 31 disposed on the upper layer and a lower substrate 32 disposed on the lower layer;

[0061] The upper substrate 31 is made of an insulating material that is easy to etch;

[0062] The lower substrate 32 is made of a material with high mechanical strength and good heat dissipation.

[0063] The lower surface of the upper substrate 31 and the upper surface of the lower substrate 32 are bonded together with an adhesive, and the lower surface of the upper substrate 31 and the upper surface of the lower substrate 32 are formed into an integral structure without gaps.

[0064] In this embodiment, the upper material of substrate 3 is Rogers RO4350B polytetrafluoroethylene, and the lower material is an aluminum substrate.

[0065] By using a combination of two materials on the substrate, the substrate is easy to etch while ensuring sufficient strength, extending the service life of the substrate and making it suitable for aviation sites with high vibration intensity and harsh working conditions.

[0066] Specifically, the circuit 4 is etched using a corrosion-resistant material and disposed on the upper substrate 31;

[0067] The circuit 4 is divided into a normal signal circuit 41 or a high-speed signal circuit 42 according to the speed at which it transmits information.

[0068] The circuit 4 whose information transmission speed is within the standard transmission speed is the ordinary signal circuit 41;

[0069] The circuit 4 whose information transmission speed is outside the standard transmission speed is the high-speed signal circuit 42;

[0070] The width of the ordinary signal circuit 41 and the minimum spacing between the two circuits 4 are selected according to the standard of aviation circuit 4.

[0071] The high-speed signal circuit 42 has a width that is several times that of the ordinary circuit 4, and the minimum arrangement spacing is several times that of the ordinary circuit 4.

[0072] In this embodiment, the standard transmission speed is 0-10Gbps. For the high-speed signal circuit 42, the width of its circuit 4 and the minimum spacing between the two circuits 4 are both 1.5 times that of the ordinary signal circuit 41, which reduces signal crosstalk and impedance abrupt changes and improves the integrity of high-frequency signals.

[0073] By differentiating between high-speed and ordinary circuits, different signal transmission requirements can be addressed. Ordinary circuits are chosen to save space when requirements are low, while high-speed circuits are selected when requirements are high, appropriately increasing line width and spacing. When line width and spacing are increased, the electromagnetic coupling strength between adjacent signal lines weakens. This is because the increased spacing keeps the electric and magnetic field distributions between signal lines relatively far apart, reducing overlap and thus lowering the possibility of crosstalk. This effectively reduces interference between different signals, enabling more accurate signal transmission and improving signal quality and reliability.

[0074] Specifically, the different mounting areas are distributed on the surface of the substrate 3, and their interiors are provided with pins that can be connected to the corresponding electronic components.

[0075] One end of the pin is connected to circuit 4, and the other end is connected to electronic components.

[0076] Specifically, the nested protective sleeve 1 is made of rubber material and is integrally molded, and is nested on the electronic components in the exposed area.

[0077] Specifically, the upper end of the nested protective sleeve 1 is an extension of the middle section of the nested protective sleeve 1, and an upper sealing strip is provided on the edge. The upper end of the nested protective sleeve 1 covers the upper surface of the exposed electronic component, and the coverage range extends inward along the upper surface border until the pin can be wrapped.

[0078] The middle section of the nested protective sleeve 1 is a ring-shaped structure nested around the exposed electronic components and connected to the other parts of the nested protective sleeve 1.

[0079] The lower end of the nested protective sleeve 1 is an extension of the middle section of the nested protective sleeve 1, which is an outwardly folded edge. The folded edge is provided with a fixing hole 5 and a lower sealing strip 6, and is connected to the substrate 3 through the fixing hole 5 and the lower sealing strip 6.

[0080] The nested protective sleeve is made of rubber, which is highly elastic, has a wide temperature resistance range, absorbs shocks, and can adapt to sudden temperature changes in aviation. The hollow design at the top of the protective sleeve maximizes the heat dissipation efficiency of the chip. The upper sealing strip and the lower folded edge seal form a double barrier, blocking moisture and salt spray corrosion, achieving a high level of protection.

[0081] Specifically, the encapsulated protective shell 2 is made of metal material and is integrally molded to cover the electronic component group in the closed area.

[0082] Specifically, the upper end of the protective shell 2 is a thin metal plate that can fit into the square frame formed by the middle section of the protective shell 2.

[0083] The middle section of the enclosed protective shell 2 is a wraparound structure nested around the electronic component group on the board, used to connect other parts of the protective shell;

[0084] The lower end of the protective shell 2 is an extended folded edge that connects to the lower part of the middle section of the protective shell 2. The folded edge is provided with a fixing hole 5 and a lower sealing strip 6, and is connected to the substrate 3 through the fixing hole 5 and the lower sealing strip 6.

[0085] The encapsulated protective shell provides shielding, suppressing the impact of high-frequency interference on sensitive components. The thin metal sheet is laser-welded to the frame, and with the help of conductive gaskets, it achieves airtight protection, suitable for corrosive environments. The metal shell also serves as a heat dissipation channel, using thermally conductive adhesive to conduct heat from the components to the substrate or external heat sink, preventing overheating failure.

[0086] Specifically, the fixing holes 5 are provided on two opposite extended edges of the nested protective sleeve 1 or the covering protective shell 2 that do not contact the circuit 4.

[0087] Specifically, the lower sealing strip 6 is disposed on the two opposite outwardly extending edges of the nested protective sleeve, or the enclosing protective shell, that contact the circuit.

[0088] The nested protective sleeve, or the encasing protective shell, is fixedly connected by bolts to ensure the stability of the connection. The sealing strip provides a non-fixed connection to ensure the sealing of the sides with circuits. The sealing strip provides a buffer for the contact between the protective sleeve or shell and the circuit, ensuring that the circuit will not be damaged during vibration.

[0089] The following describes the working process of a board with an ES chip based on the AFDX avionics bus, in conjunction with the above structure.

[0090] The microcontroller chip on the board preprocesses the sensor or control commands, generates the aviation data to be transmitted, and allocates bandwidth and priority according to the data type. The preprocessed data is then transmitted to the ES chip through the circuit. The ES chip adds AFDX protocol header, IP / UDP header and checksum to the data, and copies it into two identical frames. The two identical frames are then sent to two signal transmission interfaces through the circuit.

[0091] In this process, each chip first receives power from the power supply module, and then the chip completes data processing and transmits the processed data to the next component or to the working component through the circuit.

[0092] The technical solution of this utility model has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

[0093] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A board with an ES chip based on the AFDX avionics bus, characterized in that, include, Electronic components are chips used to perform various computing tasks; The substrate, which is a flat plate made of insulating material, serves as the carrier of the electronic components; The circuit is formed on the substrate through an etching process, serving as a path for the transmission of control signals; The mounting area is set on the substrate and has different areas according to the size of the electronic components to be mounted. It includes an exposed area for mounting large electronic components on the substrate and a closed area for mounting groups of electronic components on the substrate. The group of electronic components is a whole composed of several electronic components whose length or width is smaller than the standard size. The large electronic component is an electronic component whose length and width are both larger than the standard size. A nested protective sleeve, which is disposed around the exposed electronic components, includes an upper end of the nested protective sleeve with a hollow structure, a middle section of the nested protective sleeve that is attached to the side of the electronic components, and a lower end of the nested protective sleeve that is connected to the substrate. A protective casing, disposed around the electronic component in the enclosed area, includes an upper section of the protective casing covering the surface of the electronic component, a middle section of the protective casing adhering to the side of the electronic component, and a protective casing covering the upper surface covering the surface covering the surface covering the electronic component. The lower end of the encapsulated protective shell that connects to the substrate.

2. The board with an ES chip based on the AFDX avionics bus according to claim 1, characterized in that, The substrate is divided into an upper substrate disposed on the upper layer and a lower substrate disposed on the lower layer; The upper substrate is made of an insulating material that is easy to etch; The lower layer is made of a material with higher hardness and heat dissipation performance than the upper substrate. The lower surface of the upper substrate is bonded to the upper surface of the lower substrate using an adhesive.

3. The board with an ES chip based on the AFDX avionics bus according to claim 2, characterized in that, The circuit is etched using a corrosion-resistant material and disposed on the upper substrate. The circuits are classified into ordinary signal circuits or high-speed signal circuits according to the speed at which they transmit information. The width of the ordinary signal circuit and the minimum spacing between the two circuits are selected according to the standards of aviation circuits. The high-speed signal circuit has a width that is several times that of the ordinary signal circuit, and its minimum arrangement spacing is several times that of the ordinary signal circuit.

4. The board with an ES chip based on the AFDX avionics bus according to claim 1, characterized in that, Different mounting areas are distributed on the surface of the substrate, and each area has pins that can be connected to corresponding electronic components. One end of the pin is connected to the circuit, and the other end is connected to the electronic component.

5. The board with an ES chip based on the AFDX avionics bus according to claim 4, characterized in that, The nested protective sleeve is made of rubber material and is integrally molded and nested on the electronic components in the exposed area.

6. The board with an ES chip based on the AFDX avionics bus according to claim 5, characterized in that, The upper end of the nested protective sleeve is an extension of the middle section of the nested protective sleeve, and an upper sealing strip is provided on the edge. The upper end of the nested protective sleeve covers the upper surface of the exposed electronic components, and the coverage range extends inward along the upper surface border until the pins can be wrapped. The middle section of the nested protective sleeve is a wraparound structure that is nested around the exposed electronic components and connected to the other parts of the nested protective sleeve. The lower end of the nested protective sleeve is an extension of the middle section of the nested protective sleeve, which is an outward folded edge. The folded edge is provided with fixing holes and a lower sealing strip, and is connected to the substrate through the fixing holes and the lower sealing strip.

7. The board with an ES chip based on the AFDX avionics bus according to claim 4, characterized in that, The encapsulated protective shell is made of metal material and is integrally molded to cover the electronic component group in the closed area.

8. The board with an ES chip based on the AFDX avionics bus according to claim 7, characterized in that, The upper part of the enclosed protective shell is a thin metal plate that can fit into the square frame formed by the middle section of the enclosed protective shell. The middle section of the enclosed protective case is a wraparound structure nested around the electronic component group on the circuit board, used to connect to other parts of the protective case; The lower end of the enclosed protective shell is an extended flange that connects to the lower part of the middle section of the enclosed protective shell. The flange is provided with fixing holes and a lower sealing strip, and is connected to the substrate through the fixing holes and the lower sealing strip.

9. The board with an ES chip based on the AFDX avionics bus according to claim 8, characterized in that, The fixing holes are provided on two opposite extended edges of the nested protective sleeve or the enclosing protective shell that do not contact the circuit.

10. The board with an ES chip based on the AFDX avionics bus according to claim 8, characterized in that, The lower sealing strip is disposed on the two opposite outwardly extending edges of the nested protective sleeve, or the enclosed protective shell, that contact the circuit.

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