Circuit board, printed web and electronic device

Abstract

The application discloses a circuit board, a printed net and an electronic device. The circuit board comprises a circuit board body (110), a first solder pad (120) and a second solder pad (130). The circuit board body (110) comprises a first layout surface (111) and a second layout surface (112). The first layout surface (111) is connected with the second layout surface (112). The first solder pad (120) and the second solder pad (130) are connected with the circuit board body (110) and are arranged on the first layout surface (111) and the second layout surface (112) respectively. The first layout surface (111) intersects with the second layout surface (112), and the first solder pad (120) is connected with the second solder pad (130). The above scheme can solve the problem that the circuit board in the related art cannot make full use of the layout space.

Description

Technical Field

[0001] This application belongs to the field of circuit board design technology, specifically relating to a circuit board, a printed circuit board, and an electronic device. Background Technology

[0002] With the development of technology, electronic products are becoming increasingly complex, resulting in a growing number of electronic components within them. This leads to an increase in the number of electronic components arranged on the circuit boards of these products, necessitating the efficient use of circuit board space. How to fully utilize the circuit board space to accommodate more electronic components is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0003] This utility model discloses a circuit board, a printed screen, and an electronic device to solve the problem that the circuit board in the related technology has difficulty in making full use of the layout space.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution: In a first aspect, this application discloses a circuit board, which includes a circuit board body, a first pad, and a second pad. The circuit board body includes a first layout surface and a second layout surface. The first layout surface is connected to the second layout surface. The first pad and the second pad are both connected to the circuit board body and are respectively disposed on the first layout surface and the second layout surface. The first layout surface intersects with the second layout surface, and the first pad is connected to the second pad.

[0005] Secondly, this application discloses a printing screen, which is used to print solder paste on the circuit board described in the first aspect to construct the first pad and the second pad. The printing screen has a first printing hole and a second printing hole. The first layout surface has a first area to be printed, and the second layout surface has a second area to be printed. The first area to be printed and the second area to be printed are connected. When the printed mesh covers the first fabrication surface for printing solder paste on the circuit board, the first printed hole is opposite to the first area to be printed, so as to form the first pad by printing solder paste on the first area to be printed through the first printed hole; the second printed hole is opposite to the second area to be printed, so as to form the second pad by printing solder paste on the second area to be printed through the second printed hole.

[0006] Thirdly, this application discloses an electronic device, which includes the circuit board described in the second aspect.

[0007] The technical solution adopted in this utility model can achieve the following technical effects: The circuit board disclosed in this application improves the structure of the circuit board involved in the related technology by setting the circuit board body as a structural component including a first layout surface and a second layout surface, and connecting and intersecting the first layout surface and the second layout surface, so that the side of the circuit board body can be set as a layout surface. Furthermore, by setting a first pad and a second pad respectively on the first layout surface and the second layout surface, electronic components can be placed on the side of the circuit board body, so as to make full use of the layout space of the circuit board. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the circuit board structure disclosed in the embodiments of this application; Figure 2 This is a schematic diagram of the circuit board disclosed in an embodiment of this application from another perspective; Figure 3 This is a schematic diagram of the structure of multiple circuit boards disclosed in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of the printing screen disclosed in the embodiments of this application; Figure 5 This is a partial structural schematic diagram of the printing screen disclosed in the embodiments of this application. It should be noted that... Figure 4 and Figure 5 The dashed lines in the diagram indicate the connections between the corresponding structures.

[0009] Explanation of reference numerals in the attached figures: 100 - Circuit board, 110 - Circuit board body, 111 - First mounting surface, 112 - Second mounting surface, 120 - First pad, 130 - Second pad 200 - Printing screen, 210 - First printing hole, 220 - Second printing hole, 230 - Printing area. Detailed Implementation

[0010] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0011] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and are not used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and are not limited in number; for example, a first object can be one or more.

[0012] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0013] Please refer to Figures 1 to 5 This application discloses a circuit board 100, which includes a circuit board body 110, a first pad 120, and a second pad 130.

[0014] The circuit board body 110 is the basic component of the circuit board 100. The circuit board body 110 provides mounting positions for other components of the circuit board 100. The first pad 120 and the second pad 130 are both located on the circuit board body 110. In addition, the circuit board body 110 can also form some functional spaces or structures, such as forming an electromagnetic shielding layer.

[0015] The circuit board body 110 includes a first layout surface 111 and a second layout surface 112. The first layout surface 111 is connected to the second layout surface 112. Both the first layout surface 111 and the second layout surface 112 can be used to lay out electronic components.

[0016] The first layout surface 111 is connected to the second layout surface 112, and the first layout surface 111 and the second layout surface 112 intersect. One of the first layout surface 111 and the second layout surface 112 can be the upper surface or the lower surface of the circuit board body 110, and the other can be the side surface of the circuit board body 110. This allows electronic components to be laid not only on the upper surface or the lower surface of the circuit board body 110, but also on the side surface of the circuit board body 110. The upper surface and the lower surface of the circuit board body 110 can be two surfaces of the circuit board body 110 that are opposite to each other in the thickness direction. The upper surface and the lower surface of the circuit board body 110 can be perpendicular to the thickness direction of the circuit board body 110, and the side surface of the circuit board body 110 can be located between the upper surface and the lower surface of the circuit board body 110.

[0017] Specifically, the included angle formed between the first layout surface 111 and the second layout surface 112 can be an obtuse angle or a right angle. Wherein, the included angle formed between the first layout surface 111 and the second layout surface 112 is a right angle, that is, the first layout surface 111 and the second layout surface 112 are perpendicular to each other.

[0018] The first pad 120 and the second pad 130 are the core components in the circuit board 100 for fixing electronic components on the circuit board 100. The first pad 120 and the second pad 130 are both connected to the circuit board body 110 and are respectively located on the first layout surface 111 and the second layout surface 112. The first pad 120 is connected to the second pad 130, so that electronic components can be fixed on the first layout surface 111 and the second layout surface 112 respectively through the first pad 120 and the second pad 130.

[0019] The circuit board 100 disclosed in this application improves the structure of the circuit board 100 involved in related technologies by setting the circuit board body 110 as a structural component including a first layout surface 111 and a second layout surface 112, and connecting and intersecting the first layout surface 111 and the second layout surface 112, so that the side of the circuit board body 110 can be set as a layout surface. Furthermore, by setting a first pad 120 and a second pad 130 on the first layout surface 111 and the second layout surface 112 respectively, electronic components can be arranged on the side of the circuit board body 110, so as to make full use of the layout space of the circuit board 100.

[0020] Furthermore, as mentioned above, this structure can not only arrange electronic components on the upper or lower surface of the circuit board body 110, but also arrange electronic components on the side of the circuit board body 110, thereby enabling more complex layout design of the circuit board 100 in three-dimensional space, and thus making it suitable for application scenarios that require compact layout, such as portable devices or modular systems.

[0021] In addition, the connection between the first pad 120 and the second pad 130 facilitates the shortening of the corresponding signal path, which helps to reduce signal delay and loss, improve the quality of high-frequency signal transmission, and this structure makes the overall appearance of the circuit board 100 neater and more beautiful, which is conducive to improving the overall appearance quality of the product.

[0022] Of course, in other embodiments, the first pad 120 and the second pad 130 can be staggered, which facilitates flexible arrangement of the first pad 120 and the second pad 130, thereby providing more space for the traces in the circuit board body 110, reducing the overlap of signal lines in the thickness direction of the circuit board body 110, thus helping to reduce wiring conflicts. Moreover, this structure can plan signal paths more flexibly and reduce signal crossing and interference.

[0023] Furthermore, the circuit board body 110 may also include a third layout surface, at least one of the first layout surface 111 and the second layout surface 112 may intersect and be connected to the third layout surface, and a third pad may be provided on the third layout surface, so that electronic components can be installed on the third layout surface of the circuit board 100, so as to make fuller use of the layout space of the circuit board 100.

[0024] Optionally, the third layout surface may be parallel to the first layout surface 111. In this case, the first layout surface 111 may be the upper surface of the circuit board body 110, the third layout surface may be the lower surface of the circuit board body 110, and the second layout surface 112 may be the side surface of the circuit board 100.

[0025] In a further technical solution, there can be multiple first pads 120 and multiple second pads 130. Multiple first pads 120 can be disposed on a first layout surface 111, and multiple second pads 130 can be disposed on a second layout surface 112. The multiple first pads 120 can be connected to the multiple second pads 130 in a one-to-one correspondence.

[0026] This structure can support the installation of more electronic components, including some large electronic components that require multiple solder pads for proper mounting and securing. This allows for a greater number and variety of electronic components, expanding design flexibility. Furthermore, by providing multiple first solder pads 120 and multiple second solder pads 130, this structure ensures that even if some solder pads fail, others can continue to function, thus improving system reliability.

[0027] In the optional technical solutions, the first layout surface 111 and the second layout surface 112 can be perpendicular. This structure is relatively simple, facilitates large-scale processing, helps reduce processing costs, and this structure facilitates the close bonding design of the circuit board 100 with other components, thereby saving space.

[0028] Furthermore, the area of ​​the first layout surface 111 can be larger than the area of ​​the second layout surface 112. Specifically, the first layout surface 111 can be the upper surface or the lower surface of the circuit board body 110. Correspondingly, the second layout surface 112 can be the side surface of the circuit board body 110. This structure can avoid the circuit board body 110 being too thick, which would cause heat to be concentrated and difficult to dissipate.

[0029] Based on the circuit board 100 disclosed in the embodiments of this application, the embodiments of this application further disclose a printing screen 200. The disclosed printing screen 200 is used to print solder paste on the circuit board 100 as described in any of the above embodiments. The printing screen 200 has a first printing hole 210 and a second printing hole 220. A first printing area is provided on a first layout surface 111, and a second printing area is provided on a second layout surface 112. The first printing area and the second printing area are connected to form a connected first pad 120 and a second pad 130.

[0030] In the specific working process, when the printing screen 200 covers the first layout surface 111 to print solder paste on the circuit board 100, the first printing hole 210 is opposite to the first area to be printed, so as to print solder paste on the first area to be printed through the first printing hole 210 to construct the first pad 120. Specifically, the solder paste can flow onto the first area to be printed through the first printing hole 210, thereby printing the solder paste onto the first area to be printed to construct the first pad 120.

[0031] At the same time, the second printing hole 220 is opposite to the second printing area, so as to print solder paste on the second printing area through the second printing hole 220 to construct the second pad 130. Specifically, the solder paste can flow through the second printing hole 220 onto the second printing area, thereby printing the solder paste onto the second printing area to construct the second pad 130.

[0032] In this structure, solder paste can be printed on the first and second printing areas simultaneously using the same printing screen 200. This avoids the need to set up additional printing screens to print solder paste on the second printing area after printing solder paste on the first printing area, thereby simplifying the process steps, improving process efficiency, and reducing costs.

[0033] Furthermore, the shape of the first printing hole 210 can be adapted to the shape of the first printing area, so that solder paste can be accurately printed onto the first printing area through the first printing hole 210, thereby improving the printing accuracy of the printing screen 200.

[0034] Optionally, the first printing hole 210 and the second printing hole 220 can be connected, thereby facilitating the processing of the printed mesh 200. Of course, when the first pad 120 and the second pad 130 are staggered, the first area to be printed and the second area to be printed can be staggered, and correspondingly, the first printing hole 210 and the second printing hole 220 can be staggered, and the two can be isolated from each other.

[0035] Furthermore, in one embodiment, when the first layout surface 111 is perpendicular to the second layout surface 112, the length of the second printing hole 220 in its width direction can be 0.03-0.05mm, so that an appropriate amount of solder paste can flow through the second printing hole 220 to the second printing area, ensuring that the solder paste can be printed onto the second printing area to construct the second pad 130. This structure can avoid the second printing hole 220 being too short in its width direction, making it difficult for the solder paste to flow onto the second printing area, thus making it difficult to construct the second pad 130, or the second printing hole 220 being too long in its width direction, causing excessive solder paste to flow onto the second printing area, which would easily lead to waste.

[0036] It should be noted that the width direction of the second printing hole 220 can be parallel to the first fabrication surface 111. When the first fabrication surface 111 is perpendicular to the second fabrication surface 112, the width direction of the second printing hole 220 can be perpendicular to the second fabrication surface 112.

[0037] In a feasible technical solution, there can be multiple first printing areas and multiple second printing areas, multiple first printing holes 210 and multiple second printing holes 220, multiple first printing areas can be connected to multiple second printing areas in a one-to-one correspondence, and multiple first printing holes 210 can be connected to multiple second printing holes 220 in a one-to-one correspondence.

[0038] In the specific working process, when the printing screen 200 covers the first layout surface 111 to print solder paste on the circuit board 100, the multiple first printing holes 210 can be correspondingly aligned with the multiple second printing areas to be printed, so as to construct multiple first pads 120 by printing solder paste on the multiple first printing areas through the multiple first printing holes 210. Specifically, the solder paste can flow through the multiple first printing holes 210 to the multiple first printing areas to be printed, thereby constructing multiple first pads 120 on the multiple first printing areas.

[0039] Multiple second printing holes 220 can be corresponding one-to-one with multiple second printing areas to form multiple second pads 130 by printing solder paste on the multiple second printing areas through the multiple second printing holes 220. Specifically, solder paste can flow through the multiple second printing holes 220 onto the multiple second printing areas to form multiple second pads 130.

[0040] In addition, the multiple first printing holes 210 can be connected one-to-one with the multiple second printing holes 220 to reduce the processing difficulty of the printing screen 200.

[0041] In a further technical solution, there can be multiple circuit boards 100, and the printing screen 200 can have multiple printing areas 230. Each of the multiple printing areas 230 can be provided with a first printing hole 210 and a second printing hole 220.

[0042] In a specific work process, when multiple printing areas 230 of the printing screen 200 cover the first layout surface 111 of multiple circuit boards 100 in a one-to-one correspondence, so as to print solder paste on multiple circuit boards 100 respectively, the first printing holes 210 of the multiple printing areas 230 can be correspondingly aligned with the first printing area of ​​the corresponding circuit board 100, so as to print solder paste on the first printing area of ​​the corresponding circuit board 100 through the first printing holes 210 of the multiple printing areas 230, thereby constructing the first pad 120 of the corresponding circuit board 100.

[0043] Meanwhile, the second printing holes 220 of the multiple printing areas 230 can be correspondingly aligned with the second printing areas of the corresponding circuit boards 100 to print solder paste through the second printing holes 220 of the multiple printing areas 230, thereby constructing the second pads 130 of the corresponding circuit boards 100. This structure allows solder paste to be printed on multiple circuit boards 100 simultaneously using a single printing screen 200, which helps to improve production efficiency.

[0044] In addition, in order to facilitate the simultaneous printing of multiple circuit boards 100, the multiple circuit boards 100 can be interconnected, thereby avoiding the possibility that the multiple circuit boards 100 may easily shift during printing, which would make it difficult for the multiple printing areas 230 to correspond one-to-one and accurately cover the first layout surface 111 of the multiple circuit boards 100.

[0045] Based on the circuit board 100 disclosed in the embodiments of this application, the embodiments of this application further disclose an electronic device, which includes the circuit board 100 described in any of the above embodiments.

[0046] In this embodiment, the circuit board 100 can be a printed circuit board or a rigid-flex circuit board. The material of the printed screen 200 can be stainless steel, nickel, or polyester. The electronic device can be a smartphone or tablet computer, or a wearable device (such as a smartwatch). This embodiment does not limit these aspects.

[0047] The above embodiments of this utility model focus on describing the differences between the various embodiments. As long as the different optimization features of the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0048] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

Claims

1. A circuit board, characterized in that, It includes a circuit board body (110), a first pad (120), and a second pad (130). The circuit board body (110) includes a first layout surface (111) and a second layout surface (112). The first layout surface (111) is connected to the second layout surface (112). The first pad (120) and the second pad (130) are both connected to the circuit board body (110) and are respectively disposed on the first layout surface (111) and the second layout surface (112). The first layout surface (111) and the second layout surface (112) intersect. The first pad (120) and the second pad (130) are connected.

2. The circuit board according to claim 1, characterized in that, There are multiple first pads (120) and multiple second pads (130), and the multiple first pads (120) are connected to the multiple second pads (130) in a one-to-one correspondence.

3. The circuit board according to claim 1, characterized in that, The first layout surface (111) is perpendicular to the second layout surface (112).

4. The circuit board according to claim 1, characterized in that, The area of ​​the first layout surface (111) is greater than the area of ​​the second layout surface (112).

5. A printing screen, characterized in that, For printing solder paste on a circuit board (100) according to any one of claims 1 to 4 to construct the first pad (120) and the second pad (130), wherein the printing screen (200) has a first printing hole (210) and a second printing hole (220), the first fabrication surface (111) has a first printing area, the second fabrication surface (112) has a second printing area, and the first printing area is connected to the second printing area; When the printed mesh (200) covers the first fabrication surface (111) to print solder paste on the circuit board (100), the first printed hole (210) is opposite to the first area to be printed, so as to form the first pad (120) by printing solder paste on the first area to be printed through the first printed hole (210), and the second printed hole (220) is opposite to the second area to be printed, so as to form the second pad (130) by printing solder paste on the second area to be printed through the second printed hole (220).

6. The printing screen according to claim 5, characterized in that, The shape of the first printing hole (210) is adapted to the shape of the first area to be printed.

7. The printing screen according to claim 5, characterized in that, The first printing hole (210) is connected to the second printing hole (220).

8. The printing screen according to claim 7, characterized in that, There are multiple first printing areas and multiple second printing areas, multiple first printing holes (210) and multiple second printing holes (220), multiple first printing areas are connected to multiple second printing areas in a one-to-one correspondence, and multiple first printing holes (210) are connected to multiple second printing holes (220) in a one-to-one correspondence. When the printed mesh (200) covers the first fabrication surface (111) to print solder paste on the circuit board (100), a plurality of first printed holes (210) are correspondingly opposite to a plurality of second printing areas to be printed, so as to construct a plurality of first pads (120) by printing solder paste on the plurality of first printing areas through the plurality of first printed holes (210) in a corresponding manner. A plurality of second printed holes (220) are correspondingly opposite to a plurality of second printing areas to be printed, so as to construct a plurality of second pads (130) by printing solder paste on the plurality of second printing areas through the plurality of second printed holes (220) in a corresponding manner.

9. The printing screen according to claim 5, characterized in that, The circuit board (100) is multiple, and the printing screen (200) has multiple printing areas (230), each of the multiple printing areas (230) is provided with the first printing hole (210) and the second printing hole (220). When the plurality of printing areas (230) of the printing screen (200) are respectively covered on the first layout surface (111) of the plurality of circuit boards (100) to print solder paste on the plurality of circuit boards (100), the first printing holes (210) of the plurality of printing areas (230) are respectively opposite to the first printing area of ​​the corresponding circuit board (100) to be printed, so as to print solder paste on the first printing area of ​​the corresponding circuit board (100) through the first printing holes (210) of the plurality of printing areas (230) to be printed, thereby constructing the first pad (120) of the corresponding circuit board (100). The second printing holes (220) of the plurality of printing areas (230) are respectively opposite to the second printing area of ​​the corresponding circuit board (100) to print solder paste on the second printing area of ​​the corresponding circuit board (100) through the second printing holes (220) of the plurality of printing areas (230) respectively, thereby constructing the second pad (130) of the corresponding circuit board (100).

10. An electronic device, characterized in that, The circuit board (100) includes any one of claims 1 to 4.

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