Structure for increasing adhesive force of camera module ACF

Abstract

The utility model discloses a kind of structure of increasing camera module ACF adhesion, comprising: PCB, camera component, FPC and ACF layer, the camera component is installed in one side of PCB, the other side of PCB is provided with first rough surface, a plurality of first metal PIN are provided at first rough surface, and the first metal PIN is electrically connected with PCB;The one end of FPC is provided with second rough surface, second metal PIN corresponding with first metal PIN is provided at second rough surface, and the second metal PIN is electrically connected with FPC.The utility model provides a kind of structure of increasing camera module ACF adhesion, the roughness of the bonding surface of PCB and FPC and ACF layer is increased, the increase of roughness can make surface microscopic ravines increase, ACF liquid can better fill these microstructures after fixing, improve adhesion, to improve the pulling force between camera module's FPC and PCB when being forced to pull and displace or separate, there is no problem such as slack, debonding, avoid leading to the conduction failure between FPC and PCB.

Description

Technical Field

[0001] This utility model relates to the field of camera module technology, and in particular to a structure for increasing the adhesion of ACF in a camera module. Background Technology

[0002] In the field of modern electronics manufacturing, as electronic products continue to evolve towards miniaturization, lightweighting, and high performance, the interconnection technology between electronic components faces unprecedented challenges. Anisotropic conductive films (ACFs), as a key electronic interconnection material, play an indispensable role in the manufacturing of devices such as flat panel displays, touch screens, and LEDs due to their unique "adhesive," "conductive," and "insulating" functions. Especially in the connection of flexible printed circuit boards (FPCBs) with other components, they have become the preferred material for achieving precise-pitch electrode conductivity and low-temperature conductivity.

[0003] The ACF (Acoustic Coating Fiber) solution for camera modules involves bonding the PCB and FPC together using ACF. The main working principle of ACF is that conductive particles are uniformly dispersed within a thin-film thermosetting resin. Under the combined action of heat and pressure, these conductive particles are trapped between the upper and lower electrodes, thus achieving conductivity between the PCB and FPC. However, in practical applications, the adhesive strength of ACF is insufficient. If the FPC is subjected to strong pulling, gaps may appear between the FPC and the PCB, potentially causing loosening or detachment at the connection point. This can lead to decreased electrical performance or even failure, affecting the conductivity between the PCB and FPC. Utility Model Content

[0004] Based on this, it is necessary to provide a structure that increases the adhesion of the ACF layer in the camera module to address the aforementioned technical problems. This is achieved by setting a first rough surface on the PCB and a second rough surface on the FPC, with both surfaces being knurled or polished. This increases the roughness of the bonding surfaces between the PCB / FPC and the ACF layer. The increased roughness leads to more micro-grooves on the surface. After the PCB and FPC are bonded and fixed by the ACF layer, the ACF liquid can better fill these micro-structures, increasing the contact area and intermolecular forces between the ACF adhesive and the PCB / FPC, thereby improving the adhesion. This improves the tensile force that prevents the FPC of the camera module from shifting or separating from the PCB when subjected to pulling force, preventing problems such as loosening or detachment, and avoiding the failure of conductivity between the FPC and the PCB.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A structure for increasing the adhesion of ACF in a camera module includes:

[0007] The system comprises a PCB, a camera assembly, an FPC, and an ACF layer. The camera assembly is mounted on one side of the PCB, and the other side of the PCB has a first rough surface with multiple first metal pins electrically connected to the PCB. One end of the FPC has a second rough surface with corresponding second metal pins electrically connected to the first metal pins. The first rough surface is bonded to the second rough surface via the ACF layer.

[0008] Furthermore, the areas of the first roughened surface and the second roughened surface are both the areas where the PCB and the FPC overlap.

[0009] Furthermore, the camera assembly consists of a sensor, electronic components, a base, and a lens.

[0010] Furthermore, the first metal PIN and the second metal PIN are thermally connected through an ACF layer.

[0011] Furthermore, positioning holes are provided on both the left and right sides of the PCB, and the positioning holes are circular.

[0012] Furthermore, the first metal PIN has the same roughness as the first rough surface, and the second metal PIN has the same roughness as the second rough surface.

[0013] Furthermore, the first roughened surface and the second roughened surface are knurled or polished.

[0014] Furthermore, the roughness Ra of the first rough surface and the second rough surface is 2-10.

[0015] Furthermore, the roughness Ra of the first rough surface and the second rough surface is 4-6.

[0016] Furthermore, a reinforcing groove is provided on the first rough surface of the PCB near the FPC connector, and a reinforcing protrusion corresponding to the reinforcing groove is fixedly connected to the FPC.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The structure provided by this utility model for increasing the adhesion of ACF in a camera module is achieved by setting a first rough surface on the PCB and a second rough surface on the FPC. The first and second rough surfaces are knurled or polished, thereby increasing the roughness of the bonding surfaces between the PCB and FPC and the ACF layer. The increased roughness leads to more micro-grooves on the surface. After the PCB and FPC are bonded and fixed by the ACF layer, the ACF liquid can better fill these micro-structures, increasing the contact area and intermolecular forces between the ACF adhesive and the PCB and FPC, thereby improving the adhesion. This improves the tensile force that prevents the FPC of the camera module from shifting or separating from the PCB when subjected to pulling force, preventing problems such as loosening or detachment, and avoiding the failure of conductivity between the FPC and the PCB.

[0019] The structure provided by this utility model for increasing the adhesion of ACF in camera modules not only increases the contact area between the PCB and FPC by setting reinforcing grooves and reinforcing protrusions on the PCB and FPC, but also allows the ACF adhesive to fill the reinforcing grooves during the curing process. Since the reinforcing protrusions extend into the reinforcing grooves, the ACF adhesive can form a tighter mechanical interlocking structure after curing, thereby significantly improving the tensile strength and preventing loosening and detachment between the PCB and FPC. Attached Figure Description

[0020] Figure 1 A PCB schematic diagram of the structure for increasing the adhesion of the ACF in the camera module provided by this utility model;

[0021] Figure 2 A schematic diagram of the FPC structure for increasing the adhesion of the ACF in the camera module provided by this utility model;

[0022] Figure 3 A front view of the PCB and FPC bonding structure for increasing the adhesion of the camera module ACF provided by this utility model;

[0023] Figure 4 A side view of the PCB and FPC bonding structure for increasing the adhesion of the camera module ACF provided by this utility model;

[0024] Figure 5 A schematic diagram of Embodiment 4 of the structure for increasing the adhesion of the ACF in the camera module provided by this utility model;

[0025] Figure 6 The structure provided by this utility model for increasing the adhesion of ACF in the camera module Figure 5 Enlarged diagram of point A in the middle.

[0026] The markings in the diagram are explained as follows:

[0027] 1. PCB; 2. Camera assembly; 3. First rough surface; 4. First metal PIN; 5. FPC; 6. Second rough surface; 7. Second metal PIN; 8. ACF layer; 9. Positioning hole; 10. Reinforcing groove; 11. Reinforcing protrusion. Detailed Implementation

[0028] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0029] As described in the background section, the PCB and FPC of the camera module are bonded together with ACF. In practical applications, the adhesive strength of ACF is insufficient. If the FPC is subjected to strong pulling, gaps may appear between the FPC and the PCB, which may cause the connection to loosen or detach, leading to a decrease in electrical performance or even failure, and affecting the conductivity between the PCB and the FPC.

[0030] To solve this technical problem, this utility model provides a structure to increase the adhesion of ACF in the camera module. By setting a first rough surface 3 on PCB1 and a second rough surface 6 on FPC5, and by knurling or polishing the first rough surface 3 and the second rough surface 6, the surface of bonding PCB1 and FPC5 to ACF layer 8 is roughened. The increase in roughness will increase the number of micro-grooves on the surface. After PCB1 and FPC5 are bonded and fixed by ACF layer 8, ACF liquid can better fill these micro-structures, increase the contact area and intermolecular forces between ACF adhesive and PCB1 and FPC5, and thus improve the adhesion. This improves the tensile force that prevents displacement or separation between FPC5 and PCB1 when the camera module is pulled, and avoids problems such as loosening or debonding, thus preventing the failure of conductivity between FPC5 and PCB1.

[0031] For details, please refer to Figure 1-6 The specific structures that increase the adhesion of the camera module's ACF include:

[0032] PCB1 and camera assembly 2, the camera assembly 2 is installed on one side of PCB1, and a first rough surface 3 is provided on the other side of PCB1. Multiple first metal pins 4 are provided on the first rough surface 3, and the first metal pins 4 are electrically connected to PCB1.

[0033] FPC5 and ACF layer 8, one end of FPC5 is provided with a second rough surface 6, and a second metal PIN7 corresponding to the first metal PIN4 is provided at the second rough surface 6. The second metal PIN7 is electrically connected to FPC5, and the first rough surface 3 is bonded and fixed to the second rough surface 6 through ACF layer 8.

[0034] The structure provided by this utility model for increasing the adhesion of ACF in a camera module has a first rough surface 3 on the PCB1 and a second rough surface 6 on the FPC5. The first rough surface 3 and the second rough surface 6 are knurled or polished, thereby increasing the roughness of the bonding surfaces of the PCB1 and FPC5 with the ACF layer 8. The increase in roughness will increase the number of micro-grooves on the surface. After the PCB1 and FPC5 are bonded and fixed by the ACF layer 8, the ACF liquid can better fill these micro-structures, increase the contact area and intermolecular forces between the ACF adhesive and the PCB1 and FPC5, and thus improve the adhesion. This improves the tensile force that prevents the FPC5 of the camera module from shifting or separating from the PCB1 when subjected to pulling force, and prevents problems such as loosening or detachment.

[0035] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0036] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0037] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0038] Example 1

[0039] Please refer to Figure 1-4 A structure for increasing the adhesion of ACF in a camera module includes a PCB1 and a camera assembly 2. The camera assembly 2 is mounted on one side of the PCB1, and a first rough surface 3 is provided on the other side of the PCB1. A plurality of first metal pins 4 are provided on the first rough surface 3, and the first metal pins 4 are electrically connected to the PCB1.

[0040] FPC5 and ACF layer 8, one end of FPC5 is provided with a second rough surface 6, and a second metal PIN7 corresponding to the first metal PIN4 is provided at the second rough surface 6. The second metal PIN7 is electrically connected to FPC5, and the first rough surface 3 is bonded and fixed to the second rough surface 6 through ACF layer 8.

[0041] The structure provided in this embodiment for increasing the adhesion of the ACF layer in the camera module is achieved by setting a first rough surface 3 on the PCB1 and a second rough surface 6 on the FPC5. The first rough surface 3 and the second rough surface 6 are knurled or polished, thereby increasing the roughness of the bonding surfaces of the PCB1 and FPC5 with the ACF layer 8. The increase in roughness will increase the number of micro-grooves on the surface. After the PCB1 and FPC5 are bonded and fixed by the ACF layer 8, the ACF liquid can better fill these micro-structures, increase the contact area and intermolecular forces between the ACF adhesive and the PCB1 and FPC5, and thus improve the adhesion. This improves the tensile force that prevents the FPC5 of the camera module from shifting or separating from the PCB1 when subjected to pulling force, and avoids problems such as loosening or debonding, thus preventing the failure of conductivity between the FPC5 and the PCB1.

[0042] Example 2

[0043] The structure for increasing the adhesion of the camera module ACF provided in Embodiment 1 is further optimized, specifically, as follows: Figure 1-3 As shown, the areas of the first rough surface 3 and the second rough surface 6 are both the areas where PCB1 and FPC5 overlap. The camera assembly 2 consists of a sensor, electronic components, a base and a lens. In this way, only the areas where PCB1 and FPC5 overlap need to be knurled or polished, without the need to process other areas, which is more convenient.

[0044] The first metal PIN4 and the second metal PIN7 are connected by heat pressing through the ACF layer 8. The ACF layer 8 is an anisotropic conductive adhesive. Its material is an adhesive containing small gold balls. When pressure is applied from above and below, these gold balls will contact each other to form a conductive circuit. The heat pressing conditions of the ACF layer 8 include three aspects: temperature, time and pressure.

[0045] Positioning holes 9 are provided on both the left and right sides of PCB1. The positioning holes 9 are circular and can be used to fix PCB1 on the mounting base.

[0046] Example 3

[0047] The structure for increasing the adhesion of the camera module ACF provided in Embodiment 1 or 2 is further optimized, such as... Figure 1 and Figure 2As shown, the first metal PIN4 has the same roughness as the first rough surface 3, and the second metal PIN7 has the same roughness as the second rough surface 6. The first rough surface 3 and the second rough surface 6 are knurled or polished. Thus, the first metal PIN4 and the second metal PIN7 are also knurled or polished, thereby increasing the roughness of the bonding surfaces of the first metal PIN4 and the second metal PIN7 with the ACF layer 8. The increase in roughness will increase the number of micro-grooves on the surface. After the first metal PIN4 and the second metal PIN7 are bonded and fixed by the ACF layer 8, the ACF liquid can better fill these micro-structures, increase the contact area and intermolecular forces between the ACF adhesive and the first metal PIN4 and the second metal PIN7, thereby improving the adhesion and preventing the conductivity between the first metal PIN4 and the second metal PIN7 from failing when pulled.

[0048] The roughness Ra of the first rough surface 3 and the second rough surface 6 is 2-10; preferably, in order to avoid excessive damage to the first rough surface 3 and the second rough surface 6 when increasing the roughness and to ensure good adhesion, the roughness Ra of the first rough surface 3 and the second rough surface 6 is 4-6.

[0049] Example 4

[0050] The structures for increasing the adhesion of the camera module ACF provided in the above embodiments are further optimized, such as... Figure 5 and Figure 6 As shown, a reinforcing groove 10 is provided on the first rough surface 3 of PCB1 near the FPC5 connector, and a reinforcing protrusion 11 corresponding to the reinforcing groove 10 is fixedly connected to FPC5. With this structural design, the addition of the reinforcing groove 10 and the reinforcing protrusion 11 not only increases the contact area between PCB1 and FPC5, but also allows the ACF adhesive to fill the reinforcing groove 10 during the curing process. Since the reinforcing protrusion 11 extends into the reinforcing groove 10, the ACF adhesive can form a tighter mechanical interlocking structure after curing, thereby significantly improving the tensile strength and preventing loosening and detachment between PCB1 and FPC5.

[0051] The usage process of the structure for increasing the adhesion of the camera module's ACF provided by this utility model is as follows:

[0052] During bonding and fixing, the overlapping areas of PCB1 and FPC5 are knurled or polished, without the need for other treatments. Then, PCB1 and FPC5 are bonded and fixed through ACF layer 8, and finally hot-pressed. Under pressure from above and below, the gold balls in these ACF adhesives will contact each other, forming a circuit. By setting a first rough surface 3 on PCB1 and a second rough surface 6 on FPC5, and by knurling or polishing the first rough surface 3 and the second rough surface 6, the bonding surfaces of PCB1 and FPC5 with ACF layer 8 are roughened. The increase in roughness will increase the number of micro-grooves on the surface. After PCB1 and FPC5 are bonded and fixed through ACF layer 8, ACF liquid can better fill these micro-structures, increase the contact area and intermolecular forces between ACF adhesive and PCB1 and FPC5, and thus improve the adhesion. This improves the tensile force that prevents the FPC5 of the camera module from shifting or separating from PCB1 when subjected to pulling force, and prevents problems such as loosening or detachment, thus avoiding the failure of conductivity between FPC5 and PCB1.

[0053] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0054] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A structure for increasing the adhesion of a camera module ACF, characterized by, It includes: PCB (1) and camera assembly (2), wherein the camera assembly (2) is mounted on one side of PCB (1), and a first rough surface (3) is provided on the other side of PCB (1), wherein a plurality of first metal pins (4) are provided on the first rough surface (3), and the first metal pins (4) are electrically connected to PCB (1); FPC (5) and ACF layer (8), one end of FPC (5) is provided with a second rough surface (6), and a second metal PIN (7) corresponding to the first metal PIN (4) is provided at the second rough surface (6). The second metal PIN (7) is electrically connected to FPC (5), and the first rough surface (3) is bonded and fixed to the second rough surface (6) through ACF layer (8).

2. The structure for increasing the camera module ACF adhesion force according to claim 1, wherein, The areas of the first rough surface (3) and the second rough surface (6) are both the areas of the PCB (1) and the FPC (5) that overlap.

3. The structure for increasing the adhesion of a camera module ACF according to claim 2, wherein The camera assembly (2) consists of a sensor, electronic components, a base, and a lens.

4. The structure for increasing the adhesion of the camera module ACF according to claim 3, characterized in that, The first metal PIN (4) and the second metal PIN (7) are thermally connected through an ACF layer (8).

5. The structure for increasing the adhesion of the camera module ACF according to claim 4, characterized in that, The PCB (1) has positioning holes (9) on both the left and right sides, and the positioning holes (9) are circular.

6. The structure for increasing the adhesion of the camera module ACF according to claim 5, characterized in that, The first metal PIN (4) has the same roughness as the first rough surface (3), and the second metal PIN (7) has the same roughness as the second rough surface (6).

7. The structure for increasing the adhesion of the camera module ACF according to claim 6, characterized in that, The first rough surface (3) and the second rough surface (6) are knurled or polished.

8. The structure for increasing the adhesion of the camera module ACF according to claim 7, characterized in that, The roughness Ra of the first rough surface (3) and the second rough surface (6) is 2-10.

9. The structure for increasing the adhesion of the camera module ACF according to claim 8, characterized in that, The roughness Ra of the first rough surface (3) and the second rough surface (6) is 4-6.

10. The structure for increasing the adhesion of the camera module ACF according to claim 9, characterized in that, The PCB (1) has a reinforcement groove (10) on the side of the first rough surface (3) near the FPC (5) connector, and the FPC (5) has a reinforcement protrusion (11) corresponding to the reinforcement groove (10) fixedly connected.

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