Low power consumption silicon-based liquid crystal display chip carrier

Abstract

The utility model relates to chip carrier technical field, especially a low -power consumption silicon -based liquid crystal display chip carrier, including circuit board main part and chip main part, the top surface fixed mounting of circuit board main part has the base, the inner wall sliding of base is connected with the adapter bearing plate, the inside embedded type mounting of adapter bearing plate has the conducting column. The utility model has the advantages that when needing to disassemble the chip, only need to unscrew the locking screw, and the adapter bearing plate is extracted from the base, and the chip and adapter bearing plate can be taken down as a whole, and the direct operation to other pads and components on the circuit board main body is avoided. This way does not need to heat, chemical dissolution etc. the means that may damage the surrounding line, reduces the risk of circuit board deformation, soldering point drop etc. caused by disassembly, not only protects the integrity of the circuit board main body, but also can make the chip main body after separating from the carrier to carry out individual repair or replacement, significantly improves the security and convenience of chip maintenance.

Description

Technical Field

[0001] This utility model relates to the field of chip carrier technology, and in particular to a low-power silicon-based liquid crystal display chip carrier. Background Technology

[0002] A silicon-based liquid crystal display (LCOS) chip carrier is a specialized substrate used to support, fix, and electrically connect silicon-based liquid crystal display (LCOS) chips. Its definition can be summarized as follows: through high-precision processing, insulating materials and conductive lines are integrated to provide the core component for the LCOS chip, offering physical support, signal transmission, and heat dissipation. Structurally, this carrier typically uses a silicon wafer or glass substrate as its base, with a multi-layer wiring structure formed on its surface using semiconductor processes such as photolithography and etching. This includes a power layer, a signal transmission layer, and a ground layer, used to connect the chip's pins to external driving circuits. Simultaneously, the carrier surface has a chip bonding area, where the chip is electrically connected and mechanically fixed to the carrier using flip-chip bonding, wire bonding, and other techniques. Furthermore, some high-end carriers also integrate a heat dissipation layer (such as copper foil or metal alloy) and an insulating protective layer to optimize the chip's heat dissipation performance and electrical isolation.

[0003] Currently, silicon-based liquid crystal display chip carriers present a significant problem during chip removal, negatively impacting surrounding components. Existing carriers mostly employ rigid connection methods to secure the chip, such as using epoxy resin adhesive or solder to tightly bond or weld the chip to the carrier, ensuring electrical reliability and mechanical stability. However, this method reveals obvious drawbacks during chip maintenance or replacement: during disassembly, whether softening the connecting materials through heating or chemical dissolution, or forcibly separating the chip through mechanical force, damage may be caused to other components or circuitry on the carrier surface. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this invention is to provide a low-power silicon-based liquid crystal display chip carrier to solve the problems mentioned in the background art and overcome the shortcomings of the existing technology.

[0006] To achieve the above objectives, one embodiment of this utility model provides a low-power silicon-based liquid crystal display chip carrier, including a circuit board body and a chip body. A base is fixedly mounted on the top surface of the circuit board body by bolts. An adapter bearing plate is slidably connected to the inner wall of the base. Conductive pillars are embedded in the interior of the adapter bearing plate. The pins of the chip body are connected to several conductive pillars by solder. Several linear array pads are fixedly connected to the top surface of the circuit board body. The several pads are electrically connected to several conductive pillars respectively. Several symmetrically arranged locking plates are fixedly connected to the outer surface of the bearing plate. A locking screw is rotatably connected to one side of each locking plate. The screws of the several locking screws are threadedly connected to the base.

[0007] Preferably, one side of the circuit board body has a clearance groove, and the bottom surface of the adapter bearing plate is bonded with an aluminum alloy heat sink by thermally conductive adhesive, with the aluminum alloy heat sink located inside the clearance groove.

[0008] Preferably, in any of the above solutions, arc-shaped guide plates are fixedly connected to both the left and right sides of the adapter bearing plate, and several of the arc-shaped guide plates are slidably connected to the base.

[0009] Preferably, in any of the above solutions, the top surface of the circuit board body is fixedly connected to two symmetrically arranged clamping plates, and the base is clamped to the circuit board body through the two clamping plates.

[0010] Preferably, in any of the above embodiments, a conductive elastic sheet is fixedly connected to the bottom end of each conductive post, and the bottom surface of the conductive elastic sheet is in contact with the top surface of the pad.

[0011] Preferably, of any of the above solutions, an L-shaped limiting plate is fixedly connected to the top surface of the adapter bearing plate, and the chip body is slidably connected to the L-shaped limiting plate.

[0012] Preferably, the top surface of the base has a plurality of symmetrically arranged threaded holes, and the screw portions of the plurality of locking screws are threadedly connected to the base through the threaded holes.

[0013] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows: 1. This low-power silicon-based liquid crystal display chip carrier effectively solves the problem of damage to surrounding components during chip removal through a combination design of an adapter carrier plate and locking screws. The chip's pins are connected to conductive posts within the adapter carrier plate via solder, rather than being directly soldered to the circuit board. When chip removal is required, simply loosen the locking screws and pull the adapter carrier plate out of the base to remove the chip and adapter carrier plate as a single unit, avoiding direct manipulation of other pads and components on the circuit board. This method eliminates the need for heating or chemical dissolution, which could damage surrounding circuitry, reducing the risk of circuit board deformation and solder joint detachment during removal. It protects the integrity of the circuit board and allows for individual inspection or replacement of the chip after it is removed from the carrier, significantly improving the safety and convenience of chip maintenance.

[0014] 2. The device significantly improves heat dissipation efficiency and installation reliability through its structural design, including clearance slots, aluminum alloy heat sinks, and arc-shaped guide plates. The clearance slots on the circuit board provide installation space for the aluminum alloy heat sink. The thermally conductive adhesive on the bottom of the adapter plate quickly conducts the heat generated by the chip to the aluminum alloy heat sink, increasing the heat dissipation area while utilizing the high thermal conductivity of aluminum alloy to accelerate heat dissipation. This effectively solves the problem of increased power consumption caused by heat accumulation in silicon-based liquid crystal display chips. Furthermore, the arc-shaped guide plates on both sides of the adapter plate slide against the base, providing precise guidance during installation and ensuring the adapter plate is stably embedded in the base, preventing poor contact between the conductive posts and pads due to misalignment. The locking screws and the threaded holes in the base further enhance the fixing strength of the adapter plate, keeping the chip body stable during operation and ensuring the reliability of electrical connections and the continuous effectiveness of the heat dissipation system. Attached Figure Description

[0015] Figure 1 This is a first-view structural diagram of the assembly of this utility model; Figure 2 This is a second-view structural diagram of the assembly of this utility model; Figure 3 This is an exploded structural diagram of the assembly of this utility model; Figure 4 This is a first-view structural schematic diagram of the adapter bearing plate of this utility model; Figure 5 This is a second-view structural schematic diagram of the adapter bearing plate of this utility model; Figure 6 This is a schematic diagram of the structure of the base of this utility model.

[0016] In the diagram: 1-Circuit board body, 2-Base, 3-Adapter carrier plate, 4-Chip body, 5-Conductive post, 6-Pad, 7-Locking plate, 8-Locking screw, 9-Allowing groove, 10-Aluminum alloy heat sink, 11-Arc-shaped guide plate, 12-Card plate, 13-Conductive elastic sheet, 14-L-shaped limiting plate, 15-Threaded hole. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited thereto.

[0018] like Figures 1 to 6 As shown, a low-power silicon-based liquid crystal display chip carrier includes a circuit board body 1 and a chip body 4. A base 2 is fixedly mounted on the top surface of the circuit board body 1 by bolts. A transfer carrier plate 3 is slidably connected to the inner wall of the base 2. Conductive pillars 5 are embedded inside the transfer carrier plate 3. The pins of the chip body 4 are connected to several conductive pillars 5 by solder. Several linear array pads 6 are fixedly connected to the top surface of the circuit board body 1. The several pads 6 are electrically connected to several conductive pillars 5 respectively. Several symmetrically arranged locking plates 7 are fixedly connected to the outer surface of the carrier plate 3. A locking screw 8 is rotatably connected to one side of each locking plate 7. The screws of the several locking screws 8 are threaded to the base 2.

[0019] As an optional technical solution of this utility model, a clearance groove 9 is provided through one side of the circuit board body 1. An aluminum alloy heat sink 10 is bonded to the bottom surface of the adapter carrier plate 3 with thermally conductive adhesive. The aluminum alloy heat sink 10 is located inside the clearance groove 9 and is tightly connected to the adapter carrier plate 3 through thermally conductive adhesive. It can quickly absorb the heat generated by the chip body 4. The clearance groove 9 provides embedding space for the heat sink 10, which does not occupy other layout space of the circuit board body 1 and allows the heat sink 10 to be closer to the chip heat source. This design shortens the heat conduction path and utilizes the good thermal conductivity of aluminum alloy to efficiently dissipate heat to the external environment, avoiding increased power consumption or performance degradation of the chip due to excessive temperature, and ensuring stable operation of the chip carrier.

[0020] As an optional technical solution of this utility model, arc-shaped guide plates 11 are fixedly connected to both the left and right sides of the adapter bearing plate 3. Several arc-shaped guide plates 11 are slidably connected to the base. When the adapter bearing plate 3 is installed into the base 2, the arc-shaped guide plates 11 can guide it to slide smoothly along a fixed trajectory, preventing the conductive post 5 from failing to accurately connect with the solder pad 6 due to installation angle deviation, or damage to the internal circuit structure.

[0021] As an optional technical solution of this utility model, the top surface of the circuit board body 1 is fixedly connected with two symmetrically arranged clamping plates 12. The base 2 is clamped to the circuit board body 1 through the two clamping plates 12. The two symmetrically arranged clamping plates 12 can be quickly embedded into the corresponding slots of the circuit board body 1. Before using bolts to fix the base 2 to the circuit board body 1, the clamping plates 12 are used to achieve preliminary positioning and fixation to prevent the base 2 from shifting during the installation process.

[0022] As an optional technical solution of this utility model, a conductive elastic sheet 13 is fixedly connected to the bottom end of each conductive post 5. The bottom surface of the conductive elastic sheet 13 is in contact with the top surface of the pad 6. The conductive elastic sheet 13 has a certain elastic deformation capability. When the adapter bearing plate 3 is installed in the base 2, the conductive elastic sheet 13 can be tightly pressed onto the pad 6 to ensure that a stable electrical contact is formed between the two.

[0023] As an optional technical solution of this utility model, an L-shaped limiting plate 14 is fixedly connected to the top surface of the adapter bearing plate 3, and the chip body 4 is slidably connected to the L-shaped limiting plate 14. When the chip body 4 is installed, the chip can be guided to be accurately placed in the predetermined position, ensuring that the chip pins are precisely aligned with the conductive post 5, and avoiding poor soldering due to installation deviation.

[0024] As an optional technical solution of this utility model, the top surface of the base 2 is provided with a number of symmetrically arranged threaded holes 15, and the screws of a number of locking screws 8 are threadedly connected to the base 2 through the threaded holes 15. The number of symmetrically arranged threaded holes 15 provide installation positions for the locking screws 8. When the adapter bearing plate 3 is installed in the base 2, the locking screws 8 are turned so that their screws pass through the threaded holes 15 and are tightened, which can press the locking plate 7 on the adapter bearing plate 3 tightly onto the base 2, thereby securing the adapter bearing plate 3.

[0025] A low-power silicon-based liquid crystal display chip carrier, the working principle of which is as follows: 1): The pins of the chip body 4 are connected to the conductive posts 5 in the adapter carrier board 3 by solder, rather than being directly soldered to the circuit board body 1.

[0026] 2) When it is necessary to remove the chip, simply loosen the locking screw 8 and pull the adapter carrier plate 3 out of the base 2. The chip and the adapter carrier plate 3 can be removed as a whole, avoiding direct operation on other pads 6 and components on the circuit board body 1.

[0027] 3): The clearance groove 9 on the circuit board body 1 provides installation space for the aluminum alloy heat sink 10, and the thermal conductive adhesive on the bottom of the adapter plate 3 quickly conducts the heat generated by the chip to the aluminum alloy heat sink 10.

[0028] In summary, this low-power silicon-based liquid crystal display chip carrier effectively solves the problem of damage to surrounding components during chip removal through the combination design of the adapter carrier plate 3 and the locking screw 8. The pins of the chip body 4 are connected to the conductive posts 5 in the adapter carrier plate 3 via solder, rather than being directly soldered to the circuit board body 1. When chip removal is required, simply loosen the locking screw 8 and pull the adapter carrier plate 3 out of the base 2 to remove the chip and adapter carrier plate 3 as a whole, avoiding direct operation on other pads 6 and components on the circuit board body 1. This method eliminates the need for heating, chemical dissolution, or other methods that may damage surrounding circuits, reducing the risk of circuit board deformation and solder joint detachment caused by removal. It protects the integrity of the circuit board body 1 and allows the chip body 4 to be inspected or replaced separately after being removed from the carrier, significantly improving the safety and convenience of chip maintenance. The structural design of the clearance groove 9, aluminum alloy heat sink 10, and arc-shaped guide plate 11 greatly improves heat dissipation efficiency and installation reliability. The clearance groove 9 on the circuit board body 1 provides installation space for the aluminum alloy heat sink 10. The thermally conductive adhesive on the bottom surface of the adapter carrier plate 3 quickly conducts the heat generated by the chip to the aluminum alloy heat sink 10, increasing the heat dissipation area while utilizing the high thermal conductivity of aluminum alloy to accelerate heat dissipation, effectively solving the problem of increased power consumption caused by heat accumulation in silicon-based liquid crystal display chips. In addition, the arc-shaped guide plates 11 on both sides of the adapter carrier plate 3 slide with the base 2, playing a precise guiding role during installation, ensuring that the adapter carrier plate 3 is stably embedded in the base 2, and avoiding poor contact between the conductive post 5 and the pad 6 due to misalignment; while the engagement of the locking screw 8 with the threaded hole 15 of the base 2 further enhances the fixing strength of the adapter carrier plate 3, keeping the chip body 4 stable during operation, ensuring the reliability of electrical connections and the continuous effectiveness of the heat dissipation system.

Claims

1. A low-power silicon-based liquid crystal display chip carrier, characterized in that: The circuit board includes a main body (1) and a chip body (4). The top surface of the main body (1) is fixedly mounted with a base (2) by bolts. The inner wall of the base (2) is slidably connected with a transfer bearing plate (3). The interior of the transfer bearing plate (3) is embedded with conductive pillars (5). The pins of the chip body (4) are connected to several conductive pillars (5) by solder. The top surface of the main body (1) is fixedly connected with several linear array pads (6). Several pads (6) are electrically connected to several conductive pillars (5) respectively. The outer surface of the bearing plate (3) is fixedly connected with several symmetrically arranged locking plates (7). Each locking plate (7) has a locking screw (8) rotatably connected to one side. The screws of several locking screws (8) are threadedly connected to the base (2).

2. The low-power silicon-based liquid crystal display chip carrier according to claim 1, characterized in that: A clearance groove (9) is provided through one side of the circuit board body (1), and an aluminum alloy heat sink (10) is bonded to the bottom surface of the adapter bearing plate (3) by thermally conductive adhesive. The aluminum alloy heat sink (10) is located inside the clearance groove (9).

3. The low-power silicon-based liquid crystal display chip carrier according to claim 2, characterized in that: The left and right sides of the adapter bearing plate (3) are fixedly connected with arc-shaped guide plates (11), and several of the arc-shaped guide plates (11) are slidably connected to the base.

4. The low-power silicon-based liquid crystal display chip carrier according to claim 3, characterized in that: The top surface of the circuit board body (1) is fixedly connected to two symmetrically arranged clamping plates (12), and the base (2) is clamped to the circuit board body (1) through the two clamping plates (12).

5. A low-power silicon-based liquid crystal display chip carrier according to claim 4, characterized in that: Each of the conductive posts (5) is fixedly connected to a conductive elastic sheet (13) at its bottom end, and the bottom surface of the conductive elastic sheet (13) is in contact with the top surface of the pad (6).

6. A low-power silicon-based liquid crystal display chip carrier according to claim 5, characterized in that: The top surface of the adapter bearing plate (3) is fixedly connected to an L-shaped limiting plate (14), and the chip body (4) is slidably connected to the L-shaped limiting plate (14).

7. A low-power silicon-based liquid crystal display chip carrier according to claim 6, characterized in that: The top surface of the base (2) is provided with a number of symmetrically arranged threaded holes (15), and the screws of the locking screws (8) are threadedly connected to the base (2) through the threaded holes (15).

Images