Flexible LED lamp strip circuit board with solder joint compensation circuit

Abstract

The utility model relates to circuit board technical field especially a flexible LED lamp area circuit board with solder point compensation circuit, including flexible substrate layer, the top surface bonding of flexible substrate layer has a plurality of linear array's solder pad, the top surface welding of each solder pad has an LED chip, the bottom surface of solder pad is provided with recess, the inner wall fixed connection of recess has heat conduction strip. The utility model's advantage lies in: through the recess in the bottom surface of solder pad inlaying heat conduction strip (heat conduction silicone grease) and heat dissipation disc (aluminum alloy material), form efficient heat conduction path. The heat generated when LED chip works is passed to heat conduction strip through solder pad, then diffuses to the surrounding environment through heat dissipation disc fast, avoids the heat concentration in the vicinity of solder point. Aluminum alloy heat dissipation disc has high thermal conductivity, cooperates the serpentine conductive circuit design of flexible substrate layer, further optimizes the heat dissipation efficiency, effectively reduces LED junction temperature, improves the light efficiency stability and prolongs the chip life.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a flexible LED light strip circuit board with solder joint compensation circuit. Background Technology

[0002] Flexible LED light strip circuit boards are LED light strips that use flexible circuit boards as a carrier. FPC is a highly reliable and flexible printed circuit board made with polyimide or polyester film as a substrate, featuring high wiring density, light weight, thinness, and good bendability. Due to these characteristics, flexible LED light strip circuit boards are widely used in lighting and decoration fields.

[0003] LED chips generate heat during operation. If this heat cannot be dissipated in time, it will accumulate between the LED chip and the solder pads. This heat accumulation not only causes the LED chip temperature to rise but also accelerates the aging process, leading to problems such as light decay and color shift. Light decay refers to the gradual decrease in LED brightness over time, while color shift refers to a change in the color of the light emitted by the LED, which no longer maintains its original color purity. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to propose a flexible LED light strip circuit board with solder joint compensation circuit to solve the problems mentioned in the background art and overcome the shortcomings of the prior art.

[0006] To achieve the above objectives, one embodiment of this utility model provides a flexible LED light strip circuit board with a solder joint compensation circuit, comprising a flexible substrate layer, a plurality of linear array pads bonded to the top surface of the flexible substrate layer, an LED chip soldered to the top surface of each pad, a groove formed on the bottom surface of the pads, a heat-conducting strip fixedly connected to the inner wall of the groove, a heat sink fixedly connected to both ends of the heat-conducting strip, the bottom surface of the heat sink being bonded to the top surface of the flexible substrate layer with adhesive, a self-adhesive layer bonded to the bottom surface of the flexible substrate layer, a release paper covering the side of the self-adhesive layer away from the flexible substrate layer, two symmetrically arranged magnetic mounting strips bonded to the bottom surface of the flexible substrate layer with adhesive, the self-adhesive layer being located between the two magnetic mounting strips, and two linear array tensile ribs fixedly connected between each magnetic mounting strip and the flexible substrate layer.

[0007] Preferably, the material of the heat-conducting strip is thermal grease, and the material of the heat sink is aluminum alloy.

[0008] Preferably, of any of the above solutions, the magnetic mounting strip is a rubber magnetic strip with a width of 3-5 mm and a magnetic induction intensity of 0.3-0.8 T.

[0009] Preferably, of any of the above embodiments, the self-adhesive layer is an acrylic pressure-sensitive adhesive with an initial tack of ≥10N / 25mm, and the thickness of the self-adhesive layer is equal to that of the magnetic mounting strip.

[0010] Preferably, the tensile reinforcement is made of aramid fiber, as described in any of the above embodiments.

[0011] Preferably, in any of the above embodiments, the flexible substrate layer is a polyimide film, and a serpentine conductive line electrically connected to the pads is provided inside it.

[0012] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows: 1. A highly efficient heat conduction path is formed by embedding a thermally conductive strip (thermal grease) and a heat sink (aluminum alloy) in the grooves on the bottom of the solder pads. The heat generated by the LED chip during operation is transferred from the solder pads to the thermally conductive strip, and then quickly diffused to the surrounding environment through the heat sink, preventing heat from concentrating near the solder joints. The aluminum alloy heat sink has high thermal conductivity, and combined with the serpentine conductive circuit design of the flexible substrate layer, it further optimizes heat dissipation efficiency, effectively reduces the LED junction temperature, improves luminous efficacy stability, and extends chip lifespan.

[0013] 2. This design offers two installation methods: magnetic mounting strips and self-adhesive layers, greatly enhancing its applicability. The magnetic mounting strips (rubber magnetic strips, magnetic induction intensity 0.3-0.8T) can quickly adhere to metal surfaces, facilitating temporary fixing or frequent position adjustments; while the self-adhesive layer (acrylic pressure-sensitive adhesive, initial tack ≥10N / 25mm) is suitable for long-term adhesion to non-metallic surfaces (such as plastic and glass), ensuring firmness. These two methods complement each other, allowing the light strip to be flexibly applied to various scenarios such as advertising lighting, architectural decoration, and industrial equipment.

[0014] 3. This flexible LED light strip circuit board uses tensile ribs to connect the flexible substrate layer and the magnetic mounting strip, significantly enhancing the overall structure's tensile strength. Aramid fibers possess high strength and high modulus, effectively dispersing external tensile forces and preventing the substrate layer from breaking due to repeated bending or pulling. Simultaneously, the rubber magnetic material of the magnetic mounting strip provides a certain degree of elastic cushioning, allowing the light strip to maintain stable operation in dynamic environments (such as automotive or wearable devices), extending its lifespan. Attached Figure Description

[0015] Figure 1 This is a first-view structural schematic diagram of the flexible LED light strip circuit board of this utility model; Figure 2 This is a second-view structural diagram of the flexible LED strip circuit board of this utility model; Figure 3 This is a cross-sectional structural diagram of the flexible LED light strip circuit board of this utility model.

[0016] In the diagram: 1-Flexible substrate layer, 2-Pad, 3-LED chip, 4-Groove, 5-Heat conduction strip, 6-Heat sink, 7-Self-adhesive layer, 8-Release paper, 9-Magnetic mounting strip, 10-Tension brace. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited thereto.

[0018] like Figures 1 to 3 As shown, a flexible LED light strip circuit board with solder joint compensation circuitry includes a flexible substrate layer 1. A plurality of linear array pads 2 are bonded to the top surface of the flexible substrate layer 1. An LED chip 3 is soldered to the top surface of each pad 2. A groove 4 is formed on the bottom surface of the pad 2. A heat-conducting strip 5 is fixedly connected to the inner wall of the groove 4. Heat sinks 6 are fixedly connected to both ends of the heat-conducting strip 5. The bottom surface of the heat sink 6 is bonded to the top surface of the flexible substrate layer 1 with adhesive. A self-adhesive layer 7 is bonded to the bottom surface of the flexible substrate layer 1. Release paper 8 is covered on the side of the self-adhesive layer 7 away from the flexible substrate layer 1. Two symmetrically arranged magnetic mounting strips 9 are bonded to the bottom surface of the flexible substrate layer 1 with adhesive. The self-adhesive layer 7 is located between the two magnetic mounting strips 9. Two linear array tensile ribs 10 are fixedly connected between each magnetic mounting strip 9 and the flexible substrate layer 1.

[0019] As an optional technical solution of this utility model, the heat-conducting strip 5 is made of thermal grease, and the heat sink 6 is made of aluminum alloy. The heat generated by the LED chip 3 when it is working is transferred to the heat-conducting strip 5 through the solder pad 2, and then quickly diffused to the surrounding environment through the heat sink 6, so as to avoid the heat from concentrating near the solder joint.

[0020] As an optional technical solution of this utility model, the magnetic mounting strip 9 is a rubber magnetic strip with a width of 3-5mm and a magnetic induction intensity of 0.3-0.8T. The rubber magnetic strip has good flexibility and can be bent with the flexible substrate layer 1 without affecting the magnetic performance.

[0021] As an optional technical solution of this utility model, the self-adhesive layer 7 is an acrylic pressure-sensitive adhesive with an initial tack of ≥10N / 25mm. The thickness of the self-adhesive layer 7 is equal to that of the magnetic mounting strip 9. The acrylic pressure-sensitive adhesive has good weather resistance and can maintain its bonding performance even in high temperature and high humidity environments. The design that the thickness of the self-adhesive layer 7 is equal to that of the magnetic mounting strip 9 keeps the mounting surface flat and avoids stress concentration.

[0022] As an optional technical solution of this utility model, the tensile rib 10 is made of aramid fiber. Aramid fiber has extremely high tensile strength (>3000MPa), can effectively resist external tensile forces, has excellent fatigue resistance, and can withstand repeated bending without easily breaking.

[0023] As an optional technical solution of this utility model, the flexible substrate layer 1 is a polyimide film, which has a serpentine conductive line that is electrically connected to the pad 2. The polyimide film is heat resistant (can withstand temperatures above 300°C) to ensure the reliability of the reflow soldering process. The serpentine conductive line design improves the ductility of the line and makes the substrate less prone to breakage when bent.

[0024] A flexible LED light strip circuit board with solder joint compensation circuit works as follows: 1): The heat generated by the LED chip 3 during operation is transferred to the heat conduction strip 5 via the solder pad 2, and then quickly diffused to the surrounding environment through the heat sink 6, avoiding heat concentration near the solder joint. The aluminum alloy heat sink 6 has high thermal conductivity, and combined with the serpentine conductive circuit design of the flexible substrate layer 1, it further optimizes the heat dissipation efficiency and effectively reduces the LED junction temperature.

[0025] 2) This flexible LED light strip circuit board is connected to the flexible substrate layer by tensile ribs 10 and magnetic mounting strips 9, which significantly enhances the tensile strength of the overall structure. Aramid fibers have high strength and high modulus, which can effectively disperse external tensile forces and prevent the substrate layer from breaking due to repeated bending or pulling.

[0026] In summary, this flexible LED strip circuit board with solder joint compensation circuitry forms an efficient heat conduction path through the embedded thermal conductive strip 5 (thermal grease) and heat sink 6 (aluminum alloy material) in the groove 4 on the bottom surface of the solder pad 2. The heat generated by the LED chip 3 during operation is transferred to the thermal conductive strip 5 via the solder pad 2, and then quickly diffused to the surrounding environment through the heat sink 6, preventing heat concentration near the solder joints. The aluminum alloy heat sink 6 has high thermal conductivity, and combined with the serpentine conductive circuit design of the flexible substrate layer 1, it further optimizes heat dissipation efficiency, effectively reduces the LED junction temperature, improves luminous efficacy stability, and extends chip lifespan. This design provides two mounting methods: a magnetic mounting strip 9 and a self-adhesive layer 7, greatly enhancing its applicability. The magnetic mounting strip 9 (rubber magnetic strip, magnetic induction intensity 0.3-0.8T) can quickly adhere to metal surfaces, facilitating temporary fixation or frequent position adjustments; while the self-adhesive layer 7 (acrylic pressure-sensitive adhesive, initial adhesion ≥10N / 25mm) is suitable for long-term adhesion to non-metallic surfaces (such as plastic and glass), ensuring firmness. The two complementary methods enable the LED strip to be flexibly applied to various scenarios such as advertising lighting, architectural decoration, and industrial equipment. This flexible LED strip circuit board connects the flexible substrate layer and the magnetic mounting strip 9 via tensile ribs 10, significantly enhancing the overall structure's tensile strength. Aramid fibers, with their high strength and high modulus, effectively disperse external tensile forces, preventing the substrate layer from breaking due to repeated bending or pulling. Simultaneously, the rubber magnetic material of the magnetic mounting strip 9 provides a certain degree of elastic cushioning, allowing the LED strip to maintain stable operation in dynamic environments (such as automotive or wearable devices), extending its lifespan.

Claims

1. A flexible LED strip circuit board with solder joint compensation circuit, characterized in that: The system includes a flexible substrate layer (1), on the top surface of which are bonded a plurality of linear array pads (2). Each pad (2) has an LED chip (3) soldered to its top surface. The bottom surface of the pads (2) has a groove (4). A heat-conducting strip (5) is fixedly connected to the inner wall of the groove (4). Both ends of the heat-conducting strip (5) are fixedly connected to a heat sink (6). The bottom surface of the heat sink (6) is bonded to the top surface of the flexible substrate layer (1) with adhesive. On the bottom surface of the flexible substrate layer (1), a self-adhesive layer (7) is bonded. On the side of the self-adhesive layer (7) away from the flexible substrate layer (1), release paper (8) is covered. Two symmetrically arranged magnetic mounting strips (9) are bonded to the bottom surface of the flexible substrate layer (1) with glue. The self-adhesive layer (7) is located between the two magnetic mounting strips (9). Each magnetic mounting strip (9) is fixedly connected to the flexible substrate layer (1) with two linear array tensile ribs (10).

2. The flexible LED strip circuit board with solder joint compensation circuit according to claim 1, characterized in that: The heat-conducting strip (5) is made of thermal grease, and the heat sink (6) is made of aluminum alloy.

3. A flexible LED strip circuit board with solder joint compensation circuit according to claim 2, characterized in that: The magnetic mounting strip (9) is a rubber magnetic strip with a width of 3-5mm and a magnetic induction intensity of 0.3-0.8T.

4. A flexible LED strip circuit board with solder joint compensation circuit according to claim 3, characterized in that: The self-adhesive layer (7) is an acrylic pressure-sensitive adhesive with an initial tack of ≥10N / 25mm. The thickness of the self-adhesive layer (7) is equal to that of the magnetic mounting strip (9).

5. A flexible LED strip circuit board with solder joint compensation circuit according to claim 4, characterized in that: The tensile reinforcement (10) is made of aramid fiber.

6. A flexible LED strip circuit board with solder joint compensation circuit according to claim 5, characterized in that: The flexible substrate layer (1) is a polyimide film, and a serpentine conductive line is provided inside it, which is electrically connected to the pad (2).

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